Qualification Results- PCN14723...Lot ID-(#Rej/SS) NA=Not Applicable Comments or Generic Data WBS AEC Q100-001 Wire Bond shear (WBS) Cpk = or > 1.67 30 bonds from minimum 5 units 1

TM

Freescale Semiconductor Confidential and Proprietary Information. Freescale™ and the Freescale logo are trademarksof Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006.

Qualification Results- PCN14723

1

TMFreescale Semiconductor Confidential and Proprietary Information. Freescale™ and the Freescale logo are trademarksof Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006.

Pg. 2

Products Covered in this Notification:

Qualification Results for the FAB Site Transfer

From Freescale Sendai FabTo Freescale Chandler Fab

For HC908QVY4/Nitron LoftFSL-CHD- Fab/Mask M78Z

Objective:

Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:

See Revision History

Technology:

Package: Design Engr: QUARTZ Tracking #: 203720

Fab / Assembly /

Final Test Sites: Product Engr: (Signature/Date shown below may be electronic)

Maskset#:

Rev#: Prod. Package Engr:

PPE Approval (for

DIM/BOM results)

Signature & Date:

Ziep Tran

May-12-2011

Die Size (in mm)

W x L x T NPI PRQE: NPI PRQE Approval Signature & Date:

Nancy Long

May-12-2011

Part Operating

Temp. Grade: Grade 1 - 40°C to +125 °C Trace/DateCode:

LOT A

ME005HWK00

CTNALF1050A

LOT B LOT C CAB Approval

Signature & Date: 10010077M

Customer Approval

Signature & Date: May be N/A

Stress Test Reference Test ConditionsEnd Point

Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable

Comments or Generic Data

PC

JESD22-

A113

J-STD-020

Preconditioning (PC) :

PC required for SMDs only.

MSL 3 @ 260°C, +5/-0°C (or document

otherwise with justification)

TEST @ RH pass Generic Data:

Q202067, Nitron QC16: 0/693

Q203721, Nitron Classic: 0/693

Q204137, Nitron QB8: 0/77

HAST

JESD22-

A101

A110

Highly Accelerated Stress Test (HAST):

PC before HAST (for SMDs only): Required @

MSL3, 260oC

HAST = 130°C/85%RH for 96 hrs.

Bias = 5V

Timed RO of 48hrs. MAX

TEST @ RH 77 0 0 pass Generic Data:

Q202067, Nitron QC16: 0/231


AC

JESD22-

A102

A118

Autoclave (AC):

PC before AC (for SMDs only): Required @

MSL3, 260oC

AC = 121°C/100%RH/15 psig for 96 hrs

Timed RO of 2-48hrs. MAX

TEST @ R 77 0 0 pass Generic Data:

Q202067, Nitron QC16: 0/231


TC

JESD22-

A104

AEC Q100-

Appendix 3

Temperature Cycle (TC):

PC before TC (for SMDs only): Required

TC = -65°C to 150°C for 500 cycles.

TEST @ H 77 0 0 pass Generic Data:

Q202067, Nitron QC16: 0/231, WP: 0/5

Q203721, Nitron Classic: 0/231, WP: 0/5

Q204137, Nitron QB8: 0/77, WP: 0/5

PC + PTC

JESD22-

A105

Preconditioning plus Power Temperature

Cycle (PC+PTC):

(See AEC-Q100 for test applicability criteria)

PC before PC+PTC (for SMDs only)

PC= MSL @ °C, +5/-0°C

PTC = °C to °C for 1000 cycles;

Bias =

TEST @ RH 0 0 0 Only Required for AEC devices with maximum rated

power > 1 Watt and Delta-Tj > 40C or for devices

designed to drive inductive loads.

PTC

JESD22-

A105

Power Temperature Cycle (PTC):

(See AEC-Q100 for test applicability.)


Bias =




HTSL

JESD22-

A103

High Temperature Storage Life (HTSL):

175oC for 504 hrs

Timed RO = 96hrs. MAX


Q203721, Nitron Classic, 0/77

All surface mount devices prior to THB, HAST, AC, UHST, TC,

PC+PTC and as required per test conditions.

Jim Carlquist - RMSD80

Sun Susan-R66089

M78Z

0

68HC908QVY4/68HC908QVT4

"Nitron LOFT"

Ziep Tran - RSJP50

Tammie Gause - RA7914/Nancy Long - B07252

U050FXXD /85%UDRSST

2003 /SOIC 16W

FSL-CHD-FAB/FSL-TJN-FM /KESC-TJN

This testing is performed by Freescale Reliability Lab (FSL-TJN-FM) unless otherwise noted in the Comments.

2.5330 x 2.3350

Commercial/Industrial Tier Qual Results

"Varies"

"Varies"

GROUP A - ACCELERATED ENVIRONMENTAL STRESS TESTS

TESTS HIGHLIGHTED IN YELLOW WILL BE PERFORMED FOR THIS STUDY

Qualification of 85% UDR SST Nitron LOFT 68HC908QVY4/68HC908QVT4 in CHD

FORMPPAP004XLS 1 of 12 Freescale Rev T

Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:



"Nitron LOFT"

"Varies"

"Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


HTOL

JESD22-

A108

High Temperature Operating Life (HTOL):

Ta = 125°C for 168hrs

Bias = 6V


TEST @ RHC 77 1 77 LOTA:0/77 Generic data:

Q202119, GZ60: 0/231@150C, 6V, 408Hrs

ELFR

AEC Q100-008 Early Life Failure Rate (ELFR):

Ta = 125°C for 48 hrs

Comm/Ind: 1yr lifetime

Bias = 6V

Timed RO of 48 hrs MAX

TEST @ RH 800 0 0 pass Generic data:

Q202119, GZ60: 0/2400

EDR

AEC Q100-005 NVM Endurance, Data Retention, and

Devices incorporating NVM shall receive 'NVM

endurance preconditioning'(W/E cycling). Test

R, H, C after W/E cycling.


TEST @ RHC 77 0 0 pass Q202119, GZ60: 0/231@10k WE at 125C + DRB

150C for 1008Hrs


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


WBS

AEC Q100-001 Wire Bond shear (WBS) Cpk = or > 1.67 30 bonds

from minimum 5 units

1 5 LotA: 0/5, Cpk>1.67

WBP

MilStd883-

2011

Wire Bond Pull (WBP):

Cond. C or D

Cpk = or > 1.67 30 bonds


1 5 LotA: 0/5, Cpk>1.67

SD

JESD22-

B102

Solderability (SD):

8hr.(1 hr. for Au-plated leads) Steam age prior to

test.

If production burn-in is done, samples must also

undergo burn-in prior to SD.

>95% lead coverage

of critical areas

15 0 0 Not required for Fab Site Transfer

PD

JESD22-

B100

Physical Dimensions(PD):

PD per FSL 98A drawing

Cpk = or > 1.67 10 0 0 Not required for Fab Site Transfer

DIM

&

BOM

Dimensional (DIM):

PPE to verify PD results against valid 98A

drawing.

BOM Verification (BOM):

PPE to verify qual lot ERF BOM is accurate.

DIM: Not Required

BOM: Done

SBS

AEC-Q100-010 Solder Ball Shear (SBS):

Performed on all solder ball mounted packages

e.g. PBGA, Chip Scale, Micro Lead Frame (but

NOT Flip Chip).

Two reflow cycles at MSL reflow temperature

before shear.

Cpk = or >1.67 10

(5 balls from a min. of

10 devices)

0 0 For solder ball mounted packages only; NOT for Flip

Chips.

LI

JESD22-

B105

Lead Integrity (LI):

Not required for surface mount devices;

Only required for through-hole devices.

No lead breakage or

cracks

5

(10 leads from each

of 5 parts)

0 0


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable

Comments

EM

Electro Migration (EM) The data, test method, calculations and internal

criteria should be available to the customer upon

request for new technologies.

TDDB

Time Dependent Dielectric Breakdown

(TDDB)

The data, test method, calculations and internal



HCI

Hot Carrier Injection (HCI) The data, test method, calculations and internal



SM

Stress Migration (SM) The data, test method, calculations and internal



NBTI

Negative Bias Temperature Instability (NBTI) The data, test method, calculations and internal



TEST GROUP D - DIE FABRICATION RELIABILITY TESTS

TEST GROUP C - PACKAGE ASSEMBLY INTEGRITY TESTS

TEST GROUP B - ACCELERATED LIFETIME SIMULATION TESTS


Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:



"Nitron LOFT"

"Varies"

"Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


TEST

Freescale 48A Pre- and Post Functional / Parametrics

(TEST):

For AEC, test software shall meet requirements

of AEC-Q100-007.

Testing performed to the limits of device

specification in temperature and limit value.

0 Fails All All All Completed This action refers to Final Testing of all qualification

units.

HBM

AEC-Q100-002 /

JESD22-A114E

Jan 2007

ElectroStatic Discharge/

Human Body Model Classification (HBM):

Test @ 500/1000/1500/2000 Volts

For AEC, see AEC-Q100-002 for classification

levels.

TEST @ RH

2KV min.

3 units per Voltage

level

1 12 LOTA:

0/3@500V

0/3@1000V

0/3@1500V

0/3@2000V

MM

AEC-Q100-003

or JESD22


Machine Model Classification m(MM):

Test @ 50/100/150//200 Volts


levels.

TEST @ RH

200V min.

3 units per Voltage

level

1 12 LOTA:

0/3@50V

0/3@100V

0/3@150V

0/3@200V

CDM

AEC-Q100-011 ElectroStatic Discharge/

Charged Device Model Classification (CDM):

Test @ 250/500/750/1000 Volts


levels.

Timed RO of 96hrs MAX.

TEST @ RH

All pins =/> 500V

3 units per Voltage

level

0 0

LU

JESD78

plus

AEC-Q100-

004 for AEC

Latch-up (LU):

Test per JEDEC JESD78 with the AEC-Q100-

004 requirements for AEC.

Ta= 125oC, 100mA

Vsupply = 5.5V Maximum operating voltage

TEST @ RH 6 1 6 LOTA: 0/6

ED

AEC-Q100-009,

Freescale 48A

spec

Electrical Distribution (ED) TEST @ RHC 5 1 5 Cpmpleted

FG

For AEC, AEC-

Q100-007

Fault Grading (FG) FG shall be = or >

90% for qual units

FG%= No Change

CHAR

For AEC, AEC-

Q003

Characterization (CHAR):

Ony performed on new technologies and part

families per AEC Q003.

GL (for

information

only)

For AEC, AEC-

Q100-006

Electro-Thermally Induced Gate Leakage

(GL):

155°C, 2.0 min, +400/-400 V

Per AEC Q100 Rev G, this test is performed for

information only.

Timed RO of 96 hrs MAX.

For all failures, perform unbiased bake

(4hrs/125°C, or 2hrs/150°C) and retest;

recovered units are GL failures.

TEST @ R 6 0 0

EMC

SAE J1752/3 -

Radiated

Emissions

Electromagnetic Compatibility (EMC)

(see AEC Q100 Appendix 5 for test applicability;

done on case-by-case basis per

customer/Freescale agreement)

<40dBuV

150KHz - 1GHz

1 0 0

Quartz # Mask Set Product-Qual Description / Part Number(s) Technology Fab Die Size(mm2) CAB Number CAB Date

202119/203338 M29Z HC908GZ60 85% UDRSST FSL-CHD-FAB 22.06932484 10181326M203720 M78Z Nitron Loft 85% UDRSST FSL-CHD-FAB 5.914555 10010077M

Quartz# Mask Set Product-Qual Description/Part Number (s) Die Area(mm2) Assembly Site Pkg

Description/Code Mold Description EPOXY Description Wire Description

202065 M80Z HC908QC16 9.61625124 FSL-TJN-FM SOIC 16 W/2003 SUMITOMO G600 ABLEBOND 8290 25 um Au

203722 M05Z HC908QY4(NITRON) 7.3136949 FSL-TJN-FM SOIC 16 W/2003 SUMITOMO G600 ABLEBOND 8290 25 um Au

206298 M81Z HC908QB8_AUTO 7.2336 FSL-TJN-FM SOIC 16 W/2003 SUMITOMO G600 ABLEBOND 8290 25 um Au

Date Author

25-Aug-09 T. Gause

5 Nov. 2009 T. Gause

5 May, 2011 Nancy Long

Rev 1.0 Updated qual plan to reflect Assy Site Change as requested by Brian Drummond. Removed CDM that was never performed previously.

Rev 2.0 Add Qual Result

16 SOIC Pkg Qual Vehicles

Revision

Rev O Generated Plan

Comments

Die Qual Generic Data

TEST GROUP E - ELECTRICAL VERIFICATION TESTS

General Notes:

1 -Nitron Loft Wafer tech code U050FXXD

2 - Nitron Loft BOM: SUMITOMO G600 Mold Compound, ABLEBOND 8290 Die Attach Epoxy, 25um Gold Wire


Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:



"Nitron LOFT"

"Varies"

"Varies"

Objective:

Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


Technology:

Package: Design Engr: QUARTZ Tracking #: NA

Fab / Assembly /


Maskset#:


PPE Approval (for

DIM/BOM results)

Signature & Date:

Ziep Tran

May-12-2011

Die Size (in mm)


Nancy Long

May-12-2011

Part Operating


LOT A

ME005HWL00

CTNAFT1050A



Customer Approval



Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


PC

JESD22-

A113

J-STD-020






Q202067, Nitron QC16: 0/693


Q204137, Nitron QB8: 0/77

HAST

JESD22-

A101

A110



MSL3, 260oC


Bias = 5V



Q202067, Nitron QC16: 0/231


AC

JESD22-

A102

A118

Autoclave (AC):


MSL3, 260oC




Q202067, Nitron QC16: 0/231


TC

JESD22-

A104

AEC Q100-

Appendix 3




For AEC only: WBP after TC on 5 devices from

1 lot; 2 bonds per corner and one mid-bond per

side on each device. Record which pins were

used.

TEST @ H

For AEC: WBP =/> 3

grams

77 0 0 pass Generic Data:

Q202067, Nitron QC16: 0/231, WP: 0/5

Q203721, Nitron Classic: 0/231, WP: 0/5

Q204137, Nitron QB8: 0/77, WP: 0/5

PC + PTC

JESD22-

A105


Cycle (PC+PTC):



PC= MSL @ °C, +5/-0°C


Bias =




PTC

JESD22-

A105




Bias =




HTSL

JESD22-

A103


175oC for 504 hrs


TEST @ RH 77 0 0 pass Q203721, Nitron Classic: 0/77

U050FXXD /85%UDRSST

6117 /TSSOP 16 4.4*5*1.0P0.65 Jim Carlquist - RMSD80

FSL-CHD-FAB/FSL-TJN-FM/KESC-TJN Sun Susan-R66089


Qualification of 85% UDR SST Nitron LOFT 68HC908QVY4/68HC908QVT4 in CHD68HC908QVY4/68HC908QVT4

"Nitron LOFT"

"Varies"

"Varies"


M78Z

0 Ziep Tran - RSJP50/Shong Lee Ming-B21406

2.5330 x 2.3350




All surface mount devices prior to THB, HAST, AC, UHST, TC,

PC+PTC and as required per test conditions.


Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:



"Nitron LOFT"

"Varies"

"Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


HTOL

JESD22-

A108


Ta = 150°C for 168hrs (AEC MC Rd Pt.)


Bias = 6V


TEST @ RHC 77 0 0 pass Generic data:

Q202119, GZ60: 0/231@150C, 6V, 408Hrs

Q203720, Nitron Loft: 0/77@125C, 6V, 168Hrs

ELFR




Bias = 6V



Q202119, GZ60: 0/2400

Q203338, GZ60: 0/2400

EDR







150C for 1008Hrs


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


WBS



0 0 pass Generic Data:

Nitron SOG TSSOP16 Auto Qual: 0/5, Cpk>1.67

WBP

MilStd883-

2011


Cond. C or D



0 0 pass Generic Data:

Nitron SOG TSSOP16 Auto Qual: 0/5, Cpk>1.67

SD

JESD22-

B102

Solderability (SD):


test.



>95% lead coverage

of critical areas


PD

JESD22-

B100




DIM

&

BOM

Dimensional (DIM):


drawing.



DIM: Not Required

BOM: done

SBS




NOT Flip Chip).


before shear.

Cpk = or >1.67 10


10 devices)


Chips.

LI

JESD22-

B105




No lead breakage or

cracks

5

(10 leads from each

of 5 parts)

0 0


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable

Comments

EM




TDDB


(TDDB)




HCI




SM




NBTI








Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:



"Nitron LOFT"

"Varies"

"Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


TEST


(TEST):


of AEC-Q100-007.




units.

HBM

AEC-Q100-002 /

JESD22-A114E

Jan 2007



Test @ 500/1000/1500/2000 Volts


levels.

TEST @ RH

2KV min.

3 units per Voltage

level

0 0 pass Generic data

Q203720, Nitron Loft(16W SOIC):

0/3@500V

0/3@1000V

0/3@1500V

0/3@2000V

MM

AEC-Q100-003

or JESD22



Test @ 50/100/200 Volts


levels.

TEST @ RH

200V min.

3 units per Voltage

level



0/3@50V

0/3@100V

0/3@150V

0/3@200V

CDM



Test @ 250/500/750 Volts


levels.


TEST @ RH

All pins =/> 500V

3 units per Voltage

level

0 0

LU

JESD78

plus

AEC-Q100-

004 for AEC

Latch-up (LU):



Ta= 125oC


TEST @ RH 6 0 0 pass Generic data

Q203720, Nitron Loft(16W SOIC):0/6@100mA

ED

AEC-Q100-009,

Freescale 48A

spec

Electrical Distribution (ED) TEST @ RHC 5 0 0 completed Done on Nitron Loft SOIC16 W

FG

For AEC, AEC-

Q100-007


90% for qual units

FG%= No Change

CHAR

For AEC, AEC-

Q003




GL (for

information

only)

For AEC, AEC-

Q100-006


(GL):

155°C, 2.0 min, +400/-400 V


information only.





TEST @ R 6 0 0

EMC

SAE J1752/3 -

Radiated

Emissions





<40dBuV

150KHz - 1GHz

1 0 0



Quartz# Mask Set Product-Qual Description/Part Number (s) Die Area(mm2) Assembly Site Pkg

Description/Code Mold Description EPOXY Description Wire Description

202067 M80Z HC908QC16 9.61625124 FSL-TJN-FM TSSOP 16/6117 G700K ABLEBOND 8290 25 um Au203721 M05Z HC908QY4(Nitron Classic) 7.3136949 FSL-TJN-FM TSSOP 16/6117 G700K ABLEBOND 8290 25 um Au204137 M81Z HC908QB8_AUTO 7.2336 FSL-TJN-FM TSSOP 16/6117 G700K ABLEBOND 8290 25 um Au

204140 M62Z Nitron ROM 4.420504 FSL-TJN-FM TSSOP 16/6117 G700K ABLEBOND 8290 25 um Au

Date Author

25-Aug-09 T. Gause

25-Aug-09 T. Gause

5-May-11 Nancy Long


General Notes:


2 - Nitron Loft BOM: SUMITOMO G700K Mold Compound, ABLEBOND 8290 Die Attach Epoxy, 25um Gold Wire


Rev 1.0 Reviewed qual plan with H.P. Wang - Reliability Engr, PE and PM team.


16 TSSOP Pkg Qual Vehicles

Revision Comments

Rev2.0 Add qual Result


Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:



"Nitron LOFT"

"Varies"

"Varies"

Objective:

Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


Technology:

Package: Design Engr: QUARTZ Tracking #: 204318 and 212274

Fab / Assembly /


Maskset#:


PPE Approval (for

DIM/BOM results)

Signature & Date:

Lee Ming Shong

Die Size (in mm)

W x L x T NPI PRQE: NPI PRQE Approval Signature & Date: Nancy Long

Part Operating


LOT A

8ENJ05206800

1052 LOT B LOT C CAB Approval


Customer Approval



Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


PC

JESD22-

A113

J-STD-020





TEST @ RH 77 0 0 Not required for PDIP Packages

HAST

JESD22-

A101

A110



MSL3, 260oC


Bias = 5V


TEST @ RH 77 1 77 LOTA: 0/77 Generic data:

Q212342, QY4A(Nitron SOG): 0/77

Q203724, QY4(Nitron): 0/77

AC

JESD22-

A102

A118

Autoclave (AC):


MSL3, 260oC



TEST @ R 77 1 77 LOTA: 0/77 Generic data:


Q203724, QY4(Nitron): 0/77

TC

JESD22-

A104

AEC Q100-

Appendix 3







used.

TEST @ H(C)

For AEC: WBP =/> 3

grams

77 1 77 LotA: 0/77, WP, 0/5, min>3g Generic data:


Q203724, QY4(Nitron): 0/77

PC + PTC

JESD22-

A105


Cycle (PC+PTC):



PC= MSL @ °C, +5/-0°C


Bias =




PTC

JESD22-

A105




Bias =




HTSL

JESD22-

A103


175oC for 504 hrs


TEST @ RH 77 1 77 LOTA: 0/77


"Nitron LOFT"

"Varies"

"Varies"

U050FXXD /85%UDRSST

Pkg Code 3/8 PDIP Jim Carlquist - RMSD80


2.5330 x 2.3350


FSL-CHD-FAB/NFME /KESC-TJN Sun Susan-R66089

M78Z






Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:



"Nitron LOFT"

"Varies"

"Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


HTOL

JESD22-

A108




Bias = 6V



Q202119, GZ60: 0/231@150C, 6V, 408Hrs


ELFR




Bias = 6V



Q202119, GZ60: 0/2400

Q203338, GZ60: 0/2400

EDR







150C for 1008Hrs


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


WBS



1 5 LotA: 0/5, Cpk>1.67

WBP

MilStd883-

2011


Cond. C or D



1 5 LotA: 0/5, Cpk>1.67

SD

JESD22-

B102

Solderability (SD):


test.



>95% lead coverage

of critical areas


PD

JESD22-

B100




DIM

&

BOM

Dimensional (DIM):


drawing.



DIM: Not Required

BOM: Done

SBS




NOT Flip Chip).


before shear.

Cpk = or >1.67 10


10 devices)


Chips.

LI

JESD22-

B105




No lead breakage or

cracks

5

(10 leads from each

of 5 parts)

0 0


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable

Comments

EM




TDDB


(TDDB)




HCI




SM




NBTI








Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:



"Nitron LOFT"

"Varies"

"Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


TEST


(TEST):


of AEC-Q100-007.




units.

HBM

AEC-Q100-002 /

JESD22-A114E

Jan 2007



Test @ 500/1000/1500/2000 Volts


levels.

TEST @ RH

2KV min.

3 units per Voltage

level



0/3@500V

0/3@1000V

0/3@1500V

0/3@2000V

MM

AEC-Q100-003

or JESD22



Test @ 50/100/200 Volts


levels.

TEST @ RH

200V min.

3 units per Voltage

level



0/3@50V

0/3@100V

0/3@150V

0/3@200V

CDM



Test @ 250/500/750 Volts


levels.


TEST @ RH

All pins =/> 500V

3 units per Voltage

level

1 9 LOTA:

0/3@250V

0/3@500V

0/3@750V

LU

JESD78

plus

AEC-Q100-

004 for AEC

Latch-up (LU):



Ta= 125oC




ED

AEC-Q100-009,

Freescale 48A

spec

Electrical Distribution (ED) TEST @ RHC 5 0 0 completed Done on Nitron Loft SOIC16 W: 0/30

FG

For AEC, AEC-

Q100-007


90% for qual units

FG%= No Change

CHAR

For AEC, AEC-

Q003




GL (for

information

only)

For AEC, AEC-

Q100-006


(GL):

155°C, 2.0 min, +400/-400 V


information only.





TEST @ R 6 0 0

EMC

SAE J1752/3 -

Radiated

Emissions





<40dBuV

150KHz - 1GHz

1



8 PDIP Pkg Qual Vehicles

Quartz# Mask Set Product-Qual Description/Part Number (s) Die Area

(mm2)

Assembly Site Pkg Description/Code Mold Description EPOXY Description Wire Description

212342 M82Z 908QY4A(Nitron SOG) 5 NFME PDIP 8/0003 MC_HITACHI_CEL1620HF9DA_YIZTECH_9144 25um Au212274 M78Z 908QVY4(Nitron Loft) 5.90189 NFME PDIP 8/0003 MC_HITACHI_CEL1620HF9DA_YIZTECH_9144 25um Au203724 M05Z 908QY4(Nitron) 7.3136949 NFME PDIP 8/0003 MC_HITACHI_CEL1620HF9DA_YIZTECH_9144 25um Au

Date Author

25-Aug-09 T. Gause

1-Apr-11 Nancy Long

5-May-11 Nancy Long


Rev 1.0 Update Assembly site from ATP to NFME, update BOM, add 1 lot package qual to make total 3 lots qual for 8PDIP


General Notes:


2 - Nitron Loft BOM: HITACHI_CEL1620HF9 Mold Compound, YIZTECH_9144 Die Attach Epoxy, 25um Gold Wire, K11060D025


Revision Comments



Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:



"Nitron LOFT"

"Varies"

"Varies"

Objective:

Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


Technology:


Fab / Assembly /


Maskset#:


PPE Approval (for

DIM/BOM results)

Signature & Date:

Lee Ming Shong

Die Size (in mm)

W x L x T NPI PRQE: NPI PRQE Approval Signature & Date: Nancy Long

Part Operating


LOT A

8ENJ05206K00



Customer Approval



Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


PC

JESD22-

A113

J-STD-020






Q203725, Nitron: 0/231

Q205706, Nitron SOG: 0/462

HAST

JESD22-

A101

A110



MSL3, 260oC


Bias = 5V



Q203725, Nitron: 0/77

Q205706, Nitron SOG: 0/154

AC

JESD22-

A102

A118

Autoclave (AC):


MSL3, 260oC




Q203725, Nitron: 0/77

Q205706, Nitron SOG: 0/154

TC

JESD22-

A104

AEC Q100-

Appendix 3







used.

TEST @ H

For AEC: WBP =/> 3

grams

77 0 0 pass Generic Data:

Q203725, Nitron: 0/77

Q205706, Nitron SOG: 0/154

PC + PTC

JESD22-

A105


Cycle (PC+PTC):



PC= MSL @ °C, +5/-0°C


Bias =




PTC

JESD22-

A105




Bias =




HTSL

JESD22-

A103


150°C for 168hrs, 504hrs and 1000 hrs and

175oC for 168hrs and 500 hrs


TEST @ RH(C) 77+3 0 0 pass Generic Data:

Q203725, Nitron: 0/77

Q205706, Nitron SOG: 0/154


"Nitron LOFT"

"Varies"

"Varies"

U050FXXD /85%UDRSST

6003 /SOEIAJ 8 T2 MFP Jim Carlquist - RMSD80


2.5330 x 2.3350


FSL-CHD-FAB/NFME /KESC-TJN Sun Susan-R66089

M78Z






Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:



"Nitron LOFT"

"Varies"

"Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


HTOL

JESD22-

A108




Bias = 6V



Q202119, GZ60: 0/231@150C, 6V, 408Hrs


ELFR




Bias = 6V



Q202119, GZ60: 0/2400

Q203338, GZ60: 0/2400

EDR







150C for 1008Hrs


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


WBS AEC Q100-001 Wire Bond shear (WBS) Cpk = or > 1.67 30 bonds


1 5 LotA: 0/5, Cpk>1.67

WBP MilStd883-

2011


Cond. C or D



1 5 LotA: 0/5, Cpk>1.67

SD

JESD22-

B102

Solderability (SD):


test.



>95% lead coverage

of critical areas


PD

JESD22-

B100




DIM

&

BOM

Dimensional (DIM):


drawing.



DIM: Not Required

BOM: done

SBS




NOT Flip Chip).


before shear.

Cpk = or >1.67 10


10 devices)


Chips.

LI

JESD22-

B105




No lead breakage or

cracks

5

(10 leads from each

of 5 parts)

0 0


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable

Comments

EM




TDDB


(TDDB)




HCI




SM




NBTI








Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:



"Nitron LOFT"

"Varies"

"Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


TEST


(TEST):


of AEC-Q100-007.



0 Fails All All All completed This action refers to Final Testing of all qualification

units.

HBM

AEC-Q100-002 /

JESD22-A114E

Jan 2007



Test @ 500/1000/1500/2000 Volts


levels.

TEST @ RH

2KV min.

3 units per Voltage

level



0/3@500V

0/3@1000V

0/3@1500V

0/3@2000V

MM

AEC-Q100-003

or JESD22



Test @ 50/100/200 Volts


levels.

TEST @ RH

200V min.

3 units per Voltage

level



0/3@50V

0/3@100V

0/3@150V

0/3@200V

CDM



Test @ 250/500/750 Volts


levels.


TEST @ RH

All pins =/> 500V

3 units per Voltage

level

0 0

LU

JESD78

plus

AEC-Q100-

004 for AEC

Latch-up (LU):



Ta= 125oC




ED

AEC-Q100-009,

Freescale 48A

spec

Electrical Distribution (ED) TEST @ RHC 5 0 0 completed Done with Nitron Loft 16W SOIC:

FG

For AEC, AEC-

Q100-007


90% for qual units

FG%= No Change

CHAR

For AEC, AEC-

Q003




GL (for

information

only)

For AEC, AEC-

Q100-006


(GL):

155°C, 2.0 min, +400/-400 V


information only.





TEST @ R 6 0 0

EMC

SAE J1752/3 -

Radiated

Emissions





<40dBuV

150KHz - 1GHz

1 0 0




(mm2)


203725 M05Z 68HC908QY4 (Nitron) 7.314573 NFME SOEIAJ 8/6003 HITACHI_CEL9210HFVLABLESTIK_ABL8352L 25um Au205706 M82Z 68HC908QY4A (Nitron SOG) 5.516645 NFME SOEIAJ 8/6003 HITACHI_CEL9210HFVLABLESTIK_ABL8352L 25um Au

Revision Date Comments Author

Rev O 25-Aug-09 Generated Plan T. Gause

Rev A 5-May-11 Add Qual Result Nancy Long


General Notes:


2 - Nitron Loft BOM: HITACHI_CEL9210HFVL Mold Compound, ABLESTIK_ABL8352L Die Attach Epoxy, 25um Gold Wire



(Nitron Loft, CHD M78Z) Electrical Distribution Per AEC Q100 Rev G, ED Appendix Rev B; any key datasheet parameter with Cpk < 1.67 will require justification and FSL NPI Quality approval.

Hot

Parameter Name in Datasheet Units Lower Limit Upper Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std CpkLVI_trip V 2.4 2.7 2.5421778 0.0354197 1.6952564 2.5377333 0.0286933 1.88507 2.5341053 0.0261904 1.7068023 2.5411613 0.0283209 1.8695114 PASS PASS

LVI_recover V 2.5 2.8 2.694 0.0362065 1.6768907 2.614 0.0289589 1.7812202 2.6852632 0.0277768 1.6758843 2.6170968 0.029574 1.819815 PASS PASSRIDD_3v mA 0 3.2 2.2314091 0.0354535 7.2262896 2.240631 0.0350298 9.1290839 2.2313351 0.0297604 8.6094934 2.2904065 0.0302815 7.8110758 PASS PASSRIDD_5v mA 0 7 4.6015409 0.076913 3.8938309 4.8201759 0.0808386 8.9883766 4.6128162 0.0657227 4.4996293 4.8820097 0.0712179 2.8924851 PASS PASSWIDD_3v mA 0 1 0.7497838 0.014639 5.6974615 0.7647409 0.0136541 5.743306 0.7505524 0.010793 7.7040052 0.779742 0.010649 6.8944778 PASS PASSWIDD_5v mA 0 1.5 1.2570023 0.0207771 3.8984832 1.3291759 0.0220928 6.3493494 1.2629432 0.0174976 4.5159831 1.3449516 0.0190317 2.7156202 PASS PASSSIDD_3v uA -2 130 94.746002 2.0113143 5.8426137 95.78949 1.9624262 5.8109208 93.771481 1.4270104 8.4625683 96.987777 1.4318388 6.986872 PASS PASSSIDD_5v uA -3 155 111.29645 1.8709252 7.7864421 115.16326 2.015373 6.588812 110.80957 1.5180412 9.7033875 118.65365 1.4921449 8.1194853 PASS PASS

VOH_high_drive_3v V 1.9 2.7 1.928645 0.0157653 2.39 2.1001594 0.0239022 2.7913609 1.9294026 0.011465 3.4715115 2.0904548 0.0283841 2.4917853 PASS PASSVOH_high_drive_5v V 4.7 5.5 5.0743378 0.0122249 6.1169694 5.0815969 0.0192454 4.0113042 5.0848947 0.0114876 6.8158815 5.0600355 0.034437 2.0330419 PASS PASSvoh_max_load_3v V 1.7 2.7 2.356305 0.005304 46.901708 2.4771844 0.0097195 26.653907 2.3640342 0.0042582 59.02642 2.4567968 0.0134748 18.721351 PASS PASSvoh_max_load_5v V 4.2 5.5 5.1253222 0.003872 83.96287 5.1276719 0.0063652 51.19889 5.1219789 0.0061156 52.978457 5.1276129 0.0045596 71.469414 PASS PASS

Untrim_3v V 2.4 4 3.01 0.00468 10.64 2.9863307 0.0522689 4.2 3 0.00568 9.87 2.9733071 0.0502689 4.38 PASS PASSUntrim_5v V 2.4 4 3.012 0.045 9.512 3.01 0.043 4.95 3.01 0.043 11.2 3 0.0425 5.01 PASS PASS

vol_max_load_3v mV N/A 1000 313.36 7.14 31.81 331.878 7.088 35.18 305.46 5.11 45.09 330.568 6.988 39.078 PASS PASSvol_max_load_5v mV N/A 1500 423.33 7.33 48.58 440.31 14.5 38.27 410.22 6.65 54.06 425.69 13.099 41.27 PASS PASS

Room

Parameter Name in Datasheet Units Low Limit Upper Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std CpkLVI trip V 2 4 2 7 2 5413495 0 0367354 1 7395792 2 5370217 0 0335105 1 7711651 2 5406337 0 0364411 1 7577523 2 5392581 0 0333036 1 6888534 PASS PASS

SND L85S Post HTOL

125C

SND L85S Post HTOL25C

CHD M78Z qual lot1 Post HTOL 25C 25C

Report Date: Apr/28/2011Report Revision: 0

125C

SND L85S Pre HTOL25C

CHD M78Z qual lot1 Pre HTOL CHD M78Z qual lot1 Post HTOL

125C 125C

SND L85S Pre HTOL

CHD M78Z qual lot1 Pre HTOL

Comment

Comment

Pre CHD1 mean+-1 SND

sigma or +-10%

Post CHD1 mean+-1 SND

sigma or +-10%


sigma or +-10%


sigma or +-10%

LVI_trip V 2.4 2.7 2.5413495 0.0367354 1.7395792 2.5370217 0.0335105 1.7711651 2.5406337 0.0364411 1.7577523 2.5392581 0.0333036 1.6888534 PASS PASSLVI_recover V 2.5 2.8 2.6951882 0.0378494 1.702306 2.6132609 0.0336025 1.7235349 2.6936634 0.036762 1.6864189 2.6174194 0.0317246 1.7337353 PASS PASS

RIDD_3v mA 0 3.2 2.0562502 0.2983816 2.464 2.0259761 0.2582407 1.8515413 2.069333 0.3243655 1.8429113 1.9511806 0.3318123 1.8753627 PASS PASSRIDD_5v mA 0 7 4.5509952 0.0824677 2.8253685 4.4995 0.0825578 10.095954 4.51842 0.0867643 2.8106028 4.5233065 0.0771885 4.2177831 PASS PASSWIDD_3v mA 0 1 0.7283336 0.0142615 6.349662 0.738716 0.0143487 6.0698541 0.727294 0.0137783 6.5974621 0.7447799 0.0127936 6.6496757 PASS PASSWIDD_5v mA 0 1.5 1.2448391 0.0225798 3.7668047 1.2551174 0.0225629 7.3111546 1.241056 0.0227919 3.7870821 1.2622484 0.0207552 3.8183509 PASS PASSSIDD_3v uA -2 130 86.844754 2.0359572 6.90179 89.883039 1.9135316 6.9882934 86.599869 1.8777232 7.5268691 91.461419 1.6795624 7.6485363 PASS PASSSIDD_5v uA -3 155 105.90892 2.1026866 7.4652247 109.47136 1.80575 8.4043822 105.81291 1.8469526 8.516207 110.67355 1.6669602 8.8637285 PASS PASS


Untrim_3v V 2.4 4 3 0.00467 10.89 3.012 0.0480731 3.7478037 3 0.00487 9.7 3.02 0.0520309 3.1478037 PASS PASSUntrim_5v V 2.4 4 3.01 0.0054 9.36 3.087 0.051 3.4 3.007 0.005 9.6 2.99 0.0508 3.67 PASS PASS

vol_max_load_3v mV N/A 1000 245.3 6 41.56 240.014 6.07634 42.38 245.33 6.08 41.2 239.96014 6.074 42.18 PASS PASSvol_max_load_5v mV N/A 1500 343.9 9.63 39.71 342.988 8.06647 48.36 343.74 9.11 4.13 341.53 7.86647 52.06 PASS PASS

Cold

Parameter Name in DatasheetUnit

s Low Limit Upper Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std CpkLVI_trip V 2.4 2.7 2.5244259 0.0475675 1.6903511 2.5287222 0.0380658 1.6998389 2.5321818 0.040364 1.6858735 2.5259355 0.0373264 1.6944349 PASS PASS

LVI_recover V 2.5 2.8 2.6788889 0.0465134 1.6791534 2.6063889 0.0379588 1.6893425 2.6851515 0.040667 1.6701374 2.6041935 0.0376629 1.6722159 PASS PASSRIDD_3v mA 0 3.2 2.0216519 0.0665299 3.6492289 2.1390111 0.0407399 8.6810037 2.0407255 0.0468156 5.0501291 2.1230667 0.0468077 8.319815 PASS PASSRIDD_5v mA 0 7 4.3602481 0.1392478 2.1299009 4.5554972 0.0851022 9.5747778 4.3493878 0.1090787 2.7521788 4.5261 0.096946 3.3486002 PASS PASSWIDD_3v mA 0 1 0.6878423 0.0241876 4.3018947 0.7255087 0.0151998 6.0196125 0.6941405 0.0162398 6.2779895 0.7205523 0.0163874 5.6842002 PASS PASSWIDD_5v mA 0 1.5 1.1985667 0.0507755 1.9788643 1.2582444 0.0237397 3.394529 1.1965806 0.0277467 3.6451138 1.25208 0.0252628 3.2712108 PASS PASSSIDD_3v uA -2 130 77.766524 2.6881122 6.4770952 84.863981 1.955282 7.6947162 79.884637 2.0051705 8.3310229 84.14231 1.9424422 7.8694216 PASS PASSSIDD_5v uA -3 155 99.10695 2.6119517 7.1329866 106.70846 1.8085326 8.9006847 100.62339 1.8867114 9.6069473 106.15048 1.7978596 9.0569776 PASS PASS


Untrim_3v V 2.4 4 2.96 0.0399 5.72 2.998 0.065 3.134 2.99 0.0354 6.02 2.987 0.045 5.234 PASS PASSUntrim_5v V 2.4 4 2.99 0.06573 3.21 3.01 0.06574 3.21 3.01 0.062 3.79 3 0.0677 3.01 PASS PASS

vol_max_load_3v mV N/A 1000 205.59 3.68 71 225.136 5.016 53.167 218.79 11.21 23.09 220.386 5.01 53.01 PASS PASSvol_max_load_5v mV N/A 1500 295.13 5.02 79.29 315.62 7.1599 523.86 313.22 17.26 22.79 314.78 6.1599 528.37 PASS PASS

SND L85S Post HTOL -40C -40C -40C -40C

SND L85S Pre HTOLCHD M78Z qual lot1 Pre HTOL CHD M78Z qual lot1 Post HTOL

Comment


sigma or +-10%


sigma or +-10%



For HC908GP32FSL-CHD- Fab/Mask M45Z

Objective:

Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


Technology:


Fab / Assembly /

Final Test Sites: Product Engr:

(Signature/Date shown below may be

electronic)

Maskset#:


PPE Approval (for

DIM/BOM results)

Signature & Date:

Ziep Tran

May-12-2011

Die Size (in mm)


Nancy Long

May-12-2011

Part Operating

Temp. Grade: Grade 3 - 40°C to + 85 °C Trace/DateCode:

LOT A

8EME005DU000

CTZA1045A


Signature & Date:

09523616M

May-20-2011

Customer Approval



Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


PC

JESD22-

A113

J-STD-020



MSL 3 @ 260°C, +5/-0°C (or document otherwise

with justification)

TEST @ RH 8EME005DU000: 0/77 Generic data

Q202840, 705C9A: 0/693

HAST

JESD22-

A101

A110



MSL3, 260oC


Bias = 5.5V


TEST @ RH 77 1 77 8EME005DU000: 0/77 Generic data

Q202840, 705C9A: 0/231

AC

JESD22-

A102

A118

Autoclave (AC):

PC before AC (for SMDs only): Required @ MSL3,

260oC



TEST @ R 77 1 77 8EME005DU000: 0/77 Generic data

Q202840, 705C9A: 0/231

TC

JESD22-

A104

AEC Q100-

Appendix 3




TEST @ H 77 1 77 8EME005DU000: 0/80, WP: 0/5, Min>3g Generic data

Q202840, 705C9A: 0/231

PC + PTC

JESD22-

A105

Preconditioning plus Power Temperature Cycle

(PC+PTC):



PC= MSL @ °C, +5/-0°C


Bias =

TEST @ RH 0 0 0 Only Required for AEC devices with

maximum rated power > 1 Watt and Delta-Tj

> 40C or for devices designed to drive

inductive loads.

PTC

JESD22-

A105




Bias =




inductive loads.

HTSL

JESD22-

A103


175oC for 504 hrs

TEST @ RH 77 1 77 8EME005DU000: 0/77




All surface mount devices prior to THB, HAST, AC, UHST, TC, PC+PTC and as required

per test conditions.

Qualification of 85% UDR SST 68HC908GP32 in CHD68HC908GP32

"GP32"

U050FXXD /85%UDRSST

Pkg Code 6016/QFP 44 10*10*2.0P0.8

FSL-CHD-FAB/FSL-TJN-FM /FSL-TJN-FM


"Varies"

"Varies"

Ken Song - R65800

Ziep Tran - RSJP50


M45Z

0


3.6058 X 3.7024

HTSL 175oC for 504 hrs



Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


68HC908GP32

"GP32"

"Varies"

"Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


HTOL

JESD22-

A108


10k Flash W/E Cycling (125oC) + HTOL @


Bias = 6V


TEST @ RHC 77 1 77 8EME005DU000: 0/77 Generic dada:

Q202119, GZ60 Auto

Qual(0M29Z):0/231@150C, 408Hrs

ELFR



Bias = 6V


TEST @ RH 800 0 0 pass Generic dada:

Q203338, GZ60 IMM Qual(0M29Z):0/2400

EDR


Operational Life (EDR):

10K Cycles Flash Endurance @ 125oC followed

by DRB @ 150oC for 1008hrs


endurance preconditioning'(W/E cycling). Test R, H,

C after W/E cycling.


TEST @ RHC 77 0 0 pass Generic dada:

Q202119, GZ60 Auto Qual(0M29Z):0/231


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


WBS



1 5 8EME005DU000: 0/5, Cpk>1.67 Performed by Assembly Site during qual lot

builds - PE to include this requirement in the

qual lot build ERF

WBP

MilStd883-

2011


Cond. C or D



1 5 8EME005DU000: 0/5, Cpk>1.67 Performed by Assembly Site during qual lot


qual lot build ERF

SD

JESD22-

B102

Solderability (SD):

8hr.(1 hr. for Au-plated leads) Steam age prior to test.



>95% lead coverage of

critical areas


PD

JESD22-

B100




DIM

&

BOM

Dimensional (DIM):

PPE to verify PD results against valid 98A drawing.



DIM: Not Required

BOM: Done

SBS


Performed on all solder ball mounted packages e.g.

PBGA, Chip Scale, Micro Lead Frame (but NOT Flip

Chip).

Two reflow cycles at MSL reflow temperature before

shear.

Cpk = or >1.67 10


10 devices)

0 0 For solder ball mounted packages only; NOT

for Flip Chips.

LI

JESD22-

B105




No lead breakage or

cracks

5

(10 leads from each of

5 parts)

0 0

End Point Minimum Sample Total Units Results





Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable

Comments

EM

Electro Migration (EM) The data, test method, calculations and

internal criteria should be available to the

customer upon request for new technologies.

TDDB

Time Dependent Dielectric Breakdown (TDDB) The data, test method, calculations and



HCI

Hot Carrier Injection (HCI) The data, test method, calculations and



SM

Stress Migration (SM) The data, test method, calculations and



NBTI

Negative Bias Temperature Instability (NBTI) The data, test method, calculations and




Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


68HC908GP32

"GP32"

"Varies"

"Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


TEST

Freescale 48A Pre- and Post Functional / Parametrics (TEST):

For AEC, test software shall meet requirements of

AEC-Q100-007.

Testing performed to the limits of device specification

in temperature and limit value.

0 Fails All All All Completed This action refers to Final Testing of all

qualification units.

HBM

AEC-Q100-002 /

JESD22-A114E

Jan 2007



Test @ 500/1000/1500/2000 Volts


levels.

TEST @ RH

2KV min.

3 units per Voltage

level

1 12 8EME005DU000:

0/3@500V

0/3@1000V

0/3@1500V

0/3@2000V

MM

AEC-Q100-003

or JESD22



Test @ 50/100/150/200/400 (FYI) Volts


levels.

TEST @ RH

200V min.

3 units per Voltage

level

1 12 8EME005DU000:

0/3@50V

0/3@100V

0/3@150V

0/3@200V

CDM



Test @ 250/500/750/Volts


levels.


TEST @ RH

All pins =/> 500V

3 units per Voltage

level

1 9 8EME005DU000

0/3@250V

0/3@500V

0/3@750V(CP)

LU

JESD78

plus

AEC-Q100-

004 for AEC

Latch-up (LU):

Test per JEDEC JESD78 with the AEC-Q100-004

requirements for AEC.

Ta= 85oC, 100mA


TEST @ RH 6 1 6 8EME005DU000: 0/6

ED

AEC-Q100-009,

Freescale 48A

spec

Electrical Distribution (ED) TEST @ RHC 5 1 5 Completed

FG

For AEC, AEC-

Q100-007

Fault Grading (FG) FG shall be = or > 90%

for qual units

FG%= No Change

CHAR

For AEC, AEC-

Q003


Ony performed on new technologies and part families

per AEC Q003.

GL (for information

only)

For AEC, AEC-

Q100-006

Electro-Thermally Induced Gate Leakage (GL):

155°C, 2.0 min, +400/-400 V


information only.


For all failures, perform unbiased bake (4hrs/125°C,

or 2hrs/150°C) and retest; recovered units are GL

failures.

TEST @ R 6 0 0

EMC

SAE J1752/3 -

Radiated

Emissions



done on case-by-case basis per customer/Freescale

agreement)

<40dBuV

150KHz - 1GHz

1



202119/203338 M29Z HC908GZ60 85% UDRSST FSL-CHD-FAB 22.061809 10181326M

200122 M45Z HC908GP32 85% UDRSST FSL-CHD-FAB 13.35011392 09523616M

44 QFP Package Generic DataQuartz# Mask Set Product-Qual Description/Part Number (s) Die Area

(mm2)


202840 M30Z HC705C9A 38.11 6016 QFP 44 10*10/6016 MC HITACHI 9200HF10M DA SUMITOMO CRM-1064MBL 25um, Au

200122 M45Z HC908GP32 13.35 6016 QFP 44 10*10/6016 MC HITACHI 9200HF10M DA SUMITOMO CRM-1064MBL 25um, Au

Date Author

4-Aug-09 T. Gause

27-Aug-09 T. Gause

11-Mar-10 Nancy L

28-May-10 NancyL

5-May-11 Nancy Long

Reviewed qual plan with Nancy Long - TJN Reliability, PM and PE team.

Rev 2.0

Rev 3.0 chg EDR to HTSL, EDR can reuse data from HC912DT128A(85%UDRSST, 0L05H)


General Notes:

1 -GP32 Wafer tech code U050FXXD

2 - GP32 BOM: HITACHI 9200HF10M Mold Compound, SUMITOMO CRM-1064MBL Die Attach Epoxy, 25um Gold Wire, K11013D012

Die Qual Generic data

Rev 1.0

Add CDM, control lot for ED, EDR, HTOL

Revision Comments



Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


68HC908GP32

"GP32"

"Varies"

"Varies"

Objective:

Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


Technology:


Fab / Assembly /



electronic)

Maskset#:


PPE Approval (for

DIM/BOM results)

Signature & Date:

Ziep Tran

May-12-2011

Die Size (in mm)


Nancy Long

May-12-2011

Part Operating


LOT A

8EME005DTV00

CTZD1045A


Signature & Date:

09523616M

May-20-2011

Customer Approval



Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


PC

JESD22-

A113

J-STD-020




with justification)


HAST

JESD22-

A101

A110



MSL3, 260oC


Bias = 5.5V


TEST @ RH 77 1 77 8EME005DTV00 : 0/77 Generic data;

Q202624, 705C8A; 0/154

AC

JESD22-

A102

A118

Autoclave (AC):


260oC



TEST @ R 77 1 77 8EME005DTV00 : 0/77 Generic data;

Q202624, 705C8A; 0/154

TC

JESD22-

A104

AEC Q100-

Appendix 3




TEST @ H 77 1 77 8EME005DTV00 : 0/77, WP: 0/5, min>3g Generic data;

Q202624, 705C8A; 0/154

PC + PTC

JESD22-

A105


(PC+PTC):



PC= MSL @ °C, +5/-0°C


Bias =




inductive loads.

JESD22- Power Temperature Cycle (PTC): TEST @ RH 0 0 0 Only Required for AEC devices with



"GP32"

Name or "Varies"

PB or "Varies"

U050FXXD /85%UDRSST

Pkg Code 6013/PSDIP 42 Jim Carlquist - RMSD80

FSL-CHD-FAB/FSL-TJN-FM /FSL-TJN-FM Ken Song - R65800

M45Z

0 Ziep Tran - RSJP50

3.6058 X 3.7024 Tammie Gause - RA7914/Nancy Long - B07252




PTC

JESD22-

A105




Bias =




inductive loads.

HTSL

JESD22-

A103




TEST @ RH 77 1 80 175C, 504Hrs:

8EME005DTV00: 0/80


Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


68HC908GP32

"GP32"

"Varies"

"Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


HTOL

JESD22-

A108




Bias = 6V



Q202119, GZ60 Auto

Qual(0M29Z):0/231@150C, 408Hrs

Q200122, GP32(QFP44 package):

0/77@125C, 168Hrs

ELFR




Bias = 6V


TEST @ RH(C) 800 0 0 pass Generic dada:

Q203338, GZ60 IMM Qual(0M29Z):0/2400

Samples without BI

EDR










Q202119, GZ60 Auto Qual(0M29Z):0/231


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


WBS



1 5 8EME005DTV00 : 0/5, Cpk>1.67 Refer to pkg qual vehicles at the bottom of

the plan.

WBP

MilStd883-

2011


Cond. C or D



1 5 8EME005DTV00 : 0/5, Cpk>1.67 Refer to pkg qual vehicles at the bottom of

the plan.

SD

JESD22-

B102

Solderability (SD):





critical areas


PD

JESD22-

B100




DIM

&

BOM

Dimensional (DIM):




DIM: Not Required

BOM: done

SBS




Chip).


shear.

Cpk = or >1.67 10


10 devices)


for Flip Chips.

LI

JESD22-

B105




No lead breakage or

cracks

5


5 parts)

0 0





Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable

Comments

EM




TDDB




HCI




SM




NBTI






Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


68HC908GP32

"GP32"

"Varies"

"Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


TEST



AEC-Q100-007.





HBM

AEC-Q100-002 /

JESD22-A114E

Jan 2007



Test @ 500/1000/1500/2000 Volts


levels.

TEST @ RH

2KV min.

3 units per Voltage

level

0 0 pass Generic dada:

Q200122, GP32(44QFP):

0/3@500V

0/3@1000V

0/3@1500V

0/3@2000V

MM

AEC-Q100-003

or JESD22



Test @ 50/100/150/200 Volts


levels.

TEST @ RH

200V min.

3 units per Voltage

level


Q200122, GP32(44QFP):

0/3@50

0/3@100

0/3@150V

0/3@200V

CDM



Test @ 250/500/750Volts


levels.


TEST @ RH

All pins =/> 500V

3 units per Voltage

level

1 12 8EME005DTV00:

0/3@250V

0/3@500V

0/3@750V(CP)

LU

JESD78

plus

AEC-Q100-

004 for AEC

Latch-up (LU):



Ta= 125oC



Q200122, GP32(44QFP): 0/6

ED

AEC-Q100-009,

Freescale 48A

spec

Electrical Distribution (ED) TEST @ RHC 5 0 0 Completed Done on GP32 44 QFP

FG

For AEC, AEC-

Q100-007


for qual units

FG%= No Change

CHAR

For AEC, AEC-

Q003



per AEC Q003.

GL (for information

only)

For AEC, AEC-

Q100-006


155°C, 2.0 min, +400/-400 V


information only.




failures.

TEST @ R 6 0 0


failures.

EMC

SAE J1752/3 -

Radiated

Emissions




agreement)

<40dBuV

150KHz - 1GHz

1 0 0

Quartz # Mask Set Product-Qual Description / Part Number(s) Technology Fab Die Size(mm2) CAB Number




(mm2)


203179 M45Z HC908GP32 13.35011392 TJN 42 PSDIP/6013 MC NITTO MP8000CH D/ATCH SMTM CRM-1033B 25um Au

202624 M24Z HC705C8A 23.79 TJN 42 PSDIP/6013 MC NITTO MP8000CH D/ATCH SMTM CRM-1033B 25um Au

Date Author

4-Aug-09 T. Gause

27-Aug-09 T. Gause


11 Mar, 2010 Nancy Long

18-Mar-11 Nancy Long

5-May-11 Nancy Long

General Notes:


2 - GP32 BOM: MC NITTO MP8000CH Mold Compound, SMTM CRM-1033B Die Attach Epoxy, 25um Gold Wire


Revision Comments


Rev 1.0 Reviewed qual plan with Nancy Long - TJN Reliability, PM and PE team.

Package Qual Generic data

Rev 2.0 Added 1-lot pkg qual requirements to replace the GR8 42 SDIP pkg qual that was being removed due to EOL which was approved by June Lewis.

Rev 3.0 Add CDM, HTSL

Rev 4.0 Remove generic data from MR32 56PSDIP for 705C8A and GP32 42PSDIP package, Add additional 1 lot package qual was added on 705C8A 42PSDIP package



Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


68HC908GP32

"GP32"

"Varies"

"Varies"

Objective:

Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


Technology:


Fab / Assembly /



electronic)

Maskset#:


PPE Approval (for

DIM/BOM results)

Signature & Date:

Ziep Tran

May-12-2011

Die Size (in mm)


Nancy Long

May-12-2011

Part Operating

Temp. Grade: Grade 3 - 40°C to + 85 °C Trace/DateCode:

LOT A

8EME005DTZ00

CTQB1045A


Signature & Date:

09523616M

May-20-2011

Customer Approval



Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


PC

JESD22-

A113

J-STD-020




with justification)


HAST

JESD22-

A101

A110



MSL3, 260oC


Bias = 5.5V


TEST @ RH 77 1 77 8EME005DTZ00: 0/77 Generic data;

Q202843, 705C9A: 0/231

AC

JESD22-

A102

A118

Autoclave (AC):


260oC



TEST @ R 77 1 77 8EME005DTZ00: 0/77 Generic data;

Q202843, 705C9A: 0/231

TC

JESD22-

A104

AEC Q100-

Appendix 3




TEST @ H 77 1 77 8EME005DTZ00: 0/77, WP: 0/5, Min>3g Generic data;

Q202843, 705C9A: 0/231

PC + PTC

JESD22-

A105


(PC+PTC):



PC= MSL @ °C, +5/-0°C


Bias =




inductive loads.

PTC

JESD22-

A105




Bias =




inductive loads.

JESD22-

A103


175oC for 504 hrs

TEST @ RH 77 1 77 8EME005DTZ00: 0/77



"GP32"

Name or "Varies"

PB or "Varies"

U050FXXD /85%UDRSST

Pkg Code 149/PDIP 40 Jim Carlquist - RMSD80

FSL-CHD-FAB/FSL-TJN-FM /FSL-KLM-FM Ken Song - R65800

M45Z


3.6058 X 3.7024 Tammie Gause - RA7914/Nancy Long - B07252




HTSLA103 175

oC for 504 hrs



Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


68HC908GP32

"GP32"

"Varies"

"Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


HTOL

JESD22-

A108




Bias = 6V



Q202119, GZ60 Auto

Qual(0M29Z):0/231@150C, 408Hrs

Q200122, GP32(QFP44 package):

0/77@125C, 168Hrs

ELFR



Bias = 6V



Q203338, GZ60 IMM Qual(0M29Z):0/2400

EDR










Q202119, GZ60 Auto Qual(0M29Z):0/231


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


WBS



1 5 8EME005DTZ00: 0/5, Cpk>1.67 Performed by Assembly Site during qual lot


qual lot build ERF

WBP

MilStd883-

2011


Cond. C or D



1 5 8EME005DTZ00: 0/5, Cpk>1.67 Performed by Assembly Site during qual lot


qual lot build ERF

SD

JESD22-

B102

Solderability (SD):





critical areas


PD

JESD22-

B100




DIM

&

BOM

Dimensional (DIM):




DIM: Not Required

BOM: done

SBS




Chip).


shear.

Cpk = or >1.67 10


10 devices)


for Flip Chips.

LI

JESD22-

B105




No lead breakage or

cracks

5


5 parts)

0 0

End Point Minimum Sample Total Units Results





Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable

Comments

EM




TDDB




HCI




SM




NBTI





Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


68HC908GP32

"GP32"

"Varies"

"Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


TEST



AEC-Q100-007.





HBM

AEC-Q100-002 /

JESD22-A114E

Jan 2007



Test @ 500/1000/1500/2000 Volts


levels.

TEST @ RH

2KV min.

3 units per Voltage

level


Q200122, GP32(44QFP):

0/3@500V

0/3@1000V

0/3@1500V

0/3@2000V

MM

AEC-Q100-003

or JESD22



Test @ 50/100/150/200 Volts


levels.

TEST @ RH

200V min.

3 units per Voltage

level


Q200122, GP32(44QFP):

0/3@50

0/3@100

0/3@150V

0/3@200V

CDM



Test @ 250/500/750 Volts


levels.


TEST @ RH

All pins =/> 500V

3 units per Voltage

level

1 12 8EME005DTZ00:

0/3@250V

0/3@500V

0/3@750V(CP)

LU

JESD78

plus

AEC-Q100-

004 for AEC

Latch-up (LU):



Ta= 125oC



Q200122, GP32(44QFP): 0/6

ED

AEC-Q100-009,

Freescale 48A

spec

Electrical Distribution (ED) TEST @ RHC 5 0 0 Completed Done on GP32 44 QFP

FG

For AEC, AEC-

Q100-007


for qual units

FG%= No Change

CHAR

For AEC, AEC-

Q003



per AEC Q003.

GL (for information

only)

For AEC, AEC-

Q100-006


155°C, 2.0 min, +400/-400 V


information only.




failures.

TEST @ R 6 0 0

EMC

SAE J1752/3 -

Radiated

Emissions




agreement)

<40dBuV

150KHz - 1GHz

1 0 0






(mm2)


203182 M45Z HC908GP32 13.35011392 TJN 40 PDIP/419 MC SUMITOMO EME-6300HXL D/ATCH SMTM CRM-1033B 25um Au

202843 M30Z HC705C9A 38.11 TJN 40 PDIP/419 MC SUMITOMO EME-6300HXL D/ATCH SMTM CRM-1033B 25um Au

Date Author

4-Aug-09 T. Gause

27-Aug-09 T. Gause

5 May, 2011 Nancy Long

General Notes:


2 - GP32 BOM: SUMITOMO EME-6300HXL Mold Compound, SMTM CRM-1033B Die Attach Epoxy, 25um Gold Wire, K00035D020

3. - Samples without BI


Revision Comments


Rev 1.0 Reviewed qual plan with Nancy Long - TJN Reliability, PM and PE team.



(0M45Z) Electrical DistributionPer AEC Q100 Rev G, ED Appendix Rev B; any key datasheet parameter with Cpk < 1.67 will require justification and FSL NPI Quality approval.

Hot

Parameter Name in Datashee

t UnitsLower Limit

Upper Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk

ULLUP_5.5 KOHM 2.00E+01 6.50E+01 41.7E+0 281.5E-3 25.67 41.3 4.258 4.696821 42.5E+0 469.2E-3 15.98 38.9 3.611 5.425167 PASS PASSRIDD_5.5V MA 0.00E+00 2.00E+01 10.1E+0 170.1E-3 19.46 10.866 0.108 25.09515 10.2E+0 112.6E-3 29.06 10.865 0.118 22.93717 PASS PASSWIDD_5.5V MA 0.00E+00 8.00E+00 3.0E+0 49.8E-3 20.37 3.228 0.051 21.06302 3.1E+0 20.0E-3 51.00 3.243 0.053 20.47314 PASS PASSSIDD_5.5V UA 0.00E+00 3.00E+00 228.0E-3 50.2E-3 4.83 0.345333 64.527 1.783934 304.0E-3 66.9E-3 4.00 0.815667 147.103 1.848293 PASS PASS

DD_TBM_5. UA 0.00E+00 2.00E+01 388.0E-3 122.1E-3 2.42 0.369333 67.001 1.837439 450.0E-3 167.9E-3 1.79 0.819 139.07 1.963046 PASS PASSRIDD_3.3V MA 0.00E+00 8.00E+00 3.3E+0 24.5E-3 44.91 3.506 0.035 33.87305 3.3E+0 45.6E-3 24.15 3.502 0.036 32.64555 PASS PASSWIDD_3.3V MA 0.00E+00 4.00E+00 1.3E+0 20.0E-3 21.33 1.38 0.028 16.26346 1.3E+0 26.1E-3 16.57 1.386 0.027 17.20126 PASS PASSSIDD_3.3V UA 0.00E+00 2.00E+00 120.0E-3 28.3E-3 7.31 0.207 38.05 1.816315 164.0E-3 35.8E-3 6.19 0.452667 88.12 1.71232 PASS PASS

DD_TBM_3. UA 0.00E+00 1.20E+01 116.0E-3 32.9E-3 6.25 0.208667 37.392 1.860173 188.0E-3 80.7E-3 2.84 0.474667 87.247 1.813508 PASS PASS

Room


t UnitsLow Limit


ULLUP_5.5 KOHM 2.00E+01 6.50E+01 34.6E+0 452.8E-3 10.75 38.52466 3.936 5.062761 38.0E+0 440.3E-3 13.61 38.4713 4.179 4.783414 PASS PASSRIDD 5.5V MA 0.00E+00 2.00E+01 10.1E+0 86.5E-3 38.14 10.860 0.115 23.62888 10.1E+0 47.7E-3 68.94 10.88 0.121 22.4483 PASS PASS

Report Date: 531/Mar/11

CHD Devices Pre HTOL SND Devices Pre HTOL CHD Devices Post HTOL SND Devices Post HTOLPre CHD mean+-1

SND sigma or

+-10%

Post CHD mean+-1

SND sigma or

+-10%Comment

85C 85C 85C 85C


SND sigma or

+-10%

Post CHD mean+-1

SND sigma or

+-10%Comment

25C 25C 25C 25C

RIDD_5.5V MA 0.00E+00 2.00E+01 10.1E+0 86.5E 3 38.14 10.860 0.115 23.62888 10.1E+0 47.7E 3 68.94 10.88 0.121 22.4483 PASS PASSWIDD_5.5V MA 0.00E+00 8.00E+00 3.0E+0 32.9E-3 30.67 3.227 0.056 19.06819 3.1E+0 41.5E-3 24.53 3.239 0.054 20.06514 PASS PASSSIDD_5.5V UA 0.00E+00 3.00E+00 70.0E-3 29.7E-3 6.47 0.389333 74.968 1.731105 76.0E-3 26.1E-3 7.36 0.75 147.602 1.69375 PASS PASS



Cold


t UnitsLow Limit


ULLUP_5.5 KOHM 2.00E+01 6.50E+01 41.9E+0 499.2E-3 14.60 35.3 7.364 1.994663 38.8E+0 333.3E-3 14.85 38.75 3.21 6.028883 PASS PASSRIDD_5.5V MA 0.00E+00 2.00E+01 9.8E+0 128.5E-3 25.54 10.453 0.122 23.39812 10.0E+0 134.5E-3 24.73 10.851 0.113 24.1207 PASS PASSWIDD_5.5V MA 0.00E+00 8.00E+00 3.0E+0 42.4E-3 23.73 3.161 0.06 17.69653 3.0E+0 67.2E-3 15.03 3.234 0.052 20.93139 PASS PASSSIDD_5.5V UA 0.00E+00 3.00E+00 40.0E-3 24.5E-3 7.35 0.392667 134.982 1.852724 64.0E-3 66.9E-3 2.81 0.348667 56.001 2.075366 PASS PASS




SND sigma or

+-10%

Post CHD mean+-1

SND sigma or

+-10%Comment

-40C -40C -40C -40C



For HC908GZ60FSL-CHD- Fab/Mask M29Z

Objective:

Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:Rev 2.0 - Result

Date: May 5, 2011

Technology:


Fab / Assembly /


(Signature/Date shown below may

be electronic)

Maskset#:


PPE Approval (for

DIM/BOM results)

Signature & Date:

Ziep Tran

May-10-2011

Die Size (in mm)


Nancy Long

May-10-2011

Part Operating

Temp. Grade: Grade 1 - 40°C to +125 °C

LOTA:

8EMHA1AP7000

UQQAC1051C

LOTB:

8EMHA1AVA600

UQQAD1052C

LOTC

8EMHA1C0MJ00

UQQAE1101C

CAB Approval

Signature & Date:

10181326M

May-13-2011

LotD:

8EMHA1DAJN00

UQQAA1109A

Customer Approval



Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


PC

JESD22-

A113

J-STD-020




with justification)

TEST @ RH pass Generic data:

Q190677, 68HC908AZ60A: 0/693

HAST

JESD22-

A101

A110



MSL3, 260oC


Bias = 5V



Q190677, 68HC908AZ60A: 0/231

AC

JESD22-

A102

A118

Autoclave (AC):


260oC



TEST @ R 77 0 0 pass Generic data:

Q190677, 68HC908AZ60A: 0/231

TC

JESD22-

A104

AEC Q100-

Appendix 3




For AEC only: WBP after TC on 5 devices from 1

lot; 2 bonds per corner and one mid-bond per side on

each device. Record which pins were used.

TEST @ H

For AEC: WBP =/> 3

grams

77 0 0 pass Generic data:

Q190677, 68HC908AZ60A: 0/231,

WP: 0/15, Min>3

PC + PTC

JESD22-

A105


(PC+PTC):



PC= MSL @ °C, +5/-0°C


Bias =


maximum rated power > 1 Watt and

Delta-Tj > 40C or for devices


PTC

JESD22-

A105




Bias =





Ziep Tran - RSJP50


M29Z

0/1

4.697x4.697


Wang Na-b34501

Qualification of 85% UDR SST 68HC908GZ60 in CHD68HC908GZ60

"GZ60"

U050FXXD /85%UDRSST

Pkg Code 6057/QFP 64 14*14*2.2P0.8

FSL-CHD-FAB/FSL-KLM-FM /FSL-KLM-FM


Name or "Varies"

PB or "Varies"

AEC-Q100F Qual Results

Trace/DateCode:


All surface mount devices prior to THB, HAST, AC, UHST, TC, PC+PTC

and as required per test conditions.

This testing is performed by Freescale Reliability Lab (FSL-KLM-FM) unless otherwise noted in the Comments.

HTSL

JESD22-

A103


150°C for 1000 hrs or 175oC for 168hrs and 500 hrs



Q190677, 68HC908AZ60A:

0/77@150C, 1008Hrs


Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

68HC908GZ60

"GZ60"

Name or "Varies"

PB or "Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


HTOL

JESD22-

A108


10k Flash W/E Cycling (125oC) + HTOL


Bias = 6V


TEST @ RHC 77 3 231 LotA: 0/77

LotB: 0/77

LotC: 0/77

HTOL

JESD22-

A108



Bias = 6V


TEST @ RHC 77 1 77 LotD(1M29Z):0/77 With BI samples

1M29Z with LVI tweak, revision on

CT&M1 layer

ELFR

AEC Q100-008

Early Life Failure Rate (ELFR):


Bias = 6V


TEST @ RH 800 3 2400 LotA: 0/800

LotB: 0/800

LotC: 0/800

EDR



10K Cycles Flash Endurance @ 5V, 125oC

followed by DRB @ 150oC for 504hrs and

1008hrs





TEST @ RHC 77 3 231 LotA: 0/77

LotB: 0/77

LotC: 0/77


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


WBS AEC Q100-001 Wire Bond shear (WBS) Cpk = or > 1.67 30 bonds

from minimum 5

units

3 15 lotA: 0/5, Cpk>1.67

lotB: 0/5, Cpk>1.67

lotC: 0/5, Cpk>1.67

Refer to pkg qual vehicles at the

bottom of the plan.

WBP MilStd883-

2011


Cond. C or D


from minimum 5

units

3 15 lotA: 0/5, Cpk>1.67

lotB: 0/5, Cpk>1.67

lotC: 0/5, Cpk>1.67

Refer to pkg qual vehicles at the

bottom of the plan.

SD

JESD22-

B102

Solderability (SD):





critical areas


PD

JESD22-

B100




DIM

&

BOM

Dimensional (DIM):




DIM: Not Required

BOM: done

SBS




Chip).


shear.

Cpk = or >1.67 10

(5 balls from a min.

of 10 devices)

0 0 For solder ball mounted packages

only; NOT for Flip Chips.



LI

JESD22-

B105




No lead breakage or

cracks

5

(10 leads from each

of 5 parts)

0 0


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable

Comments

EM

Electro Migration (EM) The data, test method, calculations

and internal criteria should be

available to the customer upon


TDDB

Time Dependent Dielectric Breakdown (TDDB) The data, test method, calculations




HCI

Hot Carrier Injection (HCI) The data, test method, calculations




SM

Stress Migration (SM) The data, test method, calculations




NBTI

Negative Bias Temperature Instability (NBTI) The data, test method, calculations






Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

68HC908GZ60

"GZ60"

Name or "Varies"

PB or "Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


TEST



AEC-Q100-007.



0 Fails All All All Completed This action refers to Final Testing of

all qualification units.

HBM

AEC-Q100-002 /

JESD22-A114E

Jan 2007



Test @ 500/1000/1500/2000 Volts


levels.

TEST @ RH

2KV min.

3 units per Voltage

level

1 12 LotD(1M29Z):

0/3@500V

0/3@1000V

0/3@1500V

0/3@2000V

MM

AEC-Q100-003

or JESD22



Test @ 50/100/150/200 Volts


levels.

TEST @ RH

200V min.

3 units per Voltage

level

1 12 LotD(1M29Z):

0/3@50V

0/3@100V

0/3@150V

0/3@200V

CDM



Test @ 250/500/750 Volts


levels.


TEST @ RH

All pins =/> 500V

3 units per Voltage

level

1 9 LotD(1M29Z):

0/3@250V

0/3@500V

0/3@750V

LU

JESD78

plus

AEC-Q100-

004 for AEC

Latch-up (LU):



Ta= 125oC, 100mA


TEST @ RH 6 1 6 LotD(1M29Z): 0/6

ED

AEC-Q100-009,

Freescale 48A

spec

Electrical Distribution (ED)

Pre&Post HTOL

TEST @ RHC 30 3(0M29Z) 90 LotA: Completed, Cpk>1.67

LotB: Completed, Cpk>1.67

LotC: Completed, Cpk>1.67

ED

AEC-Q100-009,

Freescale 48A

spec

Electrical Distribution (ED)

Pre&Post HTOL

TEST @ RHC 30 1(1M29Z) 30 LotD(1M29Z): Completed, Cpk>1.67

FG

For AEC, AEC-

Q100-007


for qual units

FG%= No Change

CHAR

For AEC, AEC-

Q003



per AEC Q003.

GL (for information only)

For AEC, AEC-

Q100-006


155°C, 2.0 min, +400/-400 V


information only.




failures.

TEST @ R 6 1 6 LotA: 0/6

SAE J1752/3 -

Radiated

Emissions




<40dBuV

150KHz - 1GHz

1 0 0 done on GZ60 32LQFP7x7 Package


EMCEmissions done on case-by-case basis per customer/Freescale

agreement)


(mm2)


190677 M73Y 68HC908AZ60A 28.974027 KLM QFP 64 14*14/6057 MC HITACHI 9200HF10M DA SUMITOMO CRM-1064MBL Au 25um

Date Author

4-Aug-09 T. Gause

27-Aug-09 T. Gause

May-5-2011 Nancy LongRev 2.0 Add Qual Result

General Notes:

1 -GZ60 Wafer tech code U050FXXD

2 - GZ60 BOM: HITACHI 9200HF10M Mold Compound, SUMITOMO CRM-1064MBL Die Attach Epoxy, 25um Gold Wire


Revision Comments


Rev 1.0 Reviewed qual plan with H.P. Wang - TJN Reliability Engr, PE and PM team.


Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

68HC908GZ60

"GZ60"

Name or "Varies"

PB or "Varies"

Objective:

Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

Technology:


Fab / Assembly /



be electronic)

Maskset#:


PPE Approval (for

DIM/BOM results)

Signature & Date:

Ziep Tran

May-10-2011

Die Size (in mm)


Nancy Long

May-10-2011

Part Operating


LOTA:

ME005FK200

CTNAZY1047B

LOT B

N/A

LOT C

N/A

CAB Approval

Signature & Date:

10181326M

May-13-2011

Customer Approval



Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


PC

JESD22-

A113

J-STD-020




with justification)

TEST @ RH LotA: 0/231 Generic data:

Q208757, GR8A; 0/693

Q205779, JL16: 0/231

HAST

JESD22-

A101

A110



MSL3, 260oC


Bias = 5.5V


TEST @ RH 77 1 77 LotA: 0/77 Generic data:

Q208757, GR8A; 0/231

Q205779, JL16: 0/77

AC

JESD22-

A102

A118

Autoclave (AC):


260oC



TEST @ R 77 1 77 LotA: 0/77 Generic data:

Q208757, GR8A; 0/231

Q205779, JL16: 0/77

TC

JESD22-

A104

AEC Q100-

Appendix 3





lot; 2 bonds per corner and one mid-bond per side on

each device. Record which pins were used.

TEST @ H

For AEC: WBP =/> 3

grams

77 1 77 LotA: 0/77, WP: 0/5, min>3g Generic data:

Q208757, GR8A; 0/231

Q205779, JL16: 0/77

PC + PTC

JESD22-

A105


(PC+PTC):



PC= MSL @ °C, +5/-0°C


Bias =





PTC

JESD22-

A105




Bias =










FSL-CHD-FAB/FSL-TJN-FM /FSL-TJN-FM Wang Na-b34501

M29Z Ziep Tran - RSJP50

4.697x4.697 Tammie Gause - RA7914/Nancy Long - B07252



"GZ60"

Name or "Varies"

PB or "Varies"

U050FXXD /85%UDRSST

Pkg Code 6300 & 6089/LQFP 48 7*7*1.4P0.5 & LQFP 32 7*7*1.4P0.8 Jim Carlquist - RMSD80

Bias = designed to drive inductive loads.

HTSL

JESD22-

A103


175oC for 504 hrs


TEST @ RH 77 1 77 LotA: 0/77


Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

68HC908GZ60

"GZ60"

Name or "Varies"

PB or "Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


HTOL

JESD22-

A108


Ta = 125°C for 1008hrs or 150°C for 408hrs (MC

Rd Pt.)

Bias = 6V



Q202119, GZ60 Auto

Qual(0M29Z):0/231@150C,

408Hrs

Q202119, GZ60 Auto

Qual(1M29Z):0/77@125C, 168Hrs

ELFR



Bias = 6V



Q202119, GZ60 Auto

Qual(0M29Z):0/2400

EDR










Q202119, GZ60 Auto

Qual(0M29Z):0/231


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


WBS


from minimum 5

units

1 5 LotA: 0/5, Cpk>1.67 Performed by Assembly Site during

qual lot builds - PE to include this

requirement in the qual lot build

ERF

WBP

MilStd883-

2011


Cond. C or D


from minimum 5

units

1 5 LotA: 0/5, Cpk>1.67 Performed by Assembly Site during

qual lot builds - PE to include this

requirement in the qual lot build

ERF

SD

JESD22-

B102

Solderability (SD):





critical areas


PD

JESD22-

B100




DIM

&

BOM

Dimensional (DIM):




DIM: Not Required

BOM: done

SBS




Chip).


shear.

Cpk = or >1.67 10


of 10 devices)



LI

JESD22-

B105




No lead breakage or

cracks

5

(10 leads from each

of 5 parts)

0 0





Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable

Comments

EM





TDDB





HCI





SM





NBTI







Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

68HC908GZ60

"GZ60"

Name or "Varies"

PB or "Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


TEST



AEC-Q100-007.





HBM

AEC-Q100-002 /

JESD22-A114E

Jan 2007



Test @ 500/1000/1500/2000 Volts


levels.

TEST @ RH

2KV min.

3 units per Voltage

level


Q202119, GZ60 Auto

Qual(1M29Z):

0/3@500V

0/3@1000V

0/3@1500V

0/3@2000V

MM

AEC-Q100-003

or JESD22



Test @ 50/100/200 Volts


levels.

TEST @ RH

200V min.

3 units per Voltage

level


Q202119, GZ60 Auto Qual(1M29Z)

0/3@50V

0/3@100V

0/3@150V

0/3@200V

CDM



Test @ 250/500/750 Volts


levels.


TEST @ RH

All pins =/> 500V

3 units per Voltage

level

1 9 LotA:

0/3@250V

0/3@500V

0/3@750V(CP)

Use 48 LQFP Pkg

LU

JESD78

plus

AEC-Q100-

004 for AEC

Latch-up (LU):



Ta= 125oC



Q202119, GZ60 Auto

Qual(1M29Z): 0/6@100mA

ED

AEC-Q100-009,

Freescale 48A

spec

Electrical Distribution (ED) TEST @ RHC AEC: 30 0 0 Completed Done on GZ60 Auto Qual

FG

For AEC, AEC-

Q100-007


for qual units

FG%= No Change

CHAR

For AEC, AEC-

Q003



per AEC Q003.


For AEC, AEC-

Q100-006


155°C, 2.0 min, +400/-400 V


information only.




failures.

TEST @ R 6 1 6 LotA: 0/6

EMC

SAE J1752/3 -

Radiated

Emissions




agreement)

<40dBuV

150KHz - 1GHz

1 1 1 done on LQFP32


Die Qual Vehicles


202119/203338 M29Z HC908GZ60 85% UDRSST FSL-CHD-FAB 22.061809 10181326M May-13-2011

32/48 LQFPQuartz# Mask Set Product-Qual Description/Part Number (s) Die Area

(mm2)


202100 M29Z 908GZ60 22.061809 FSL-TJN-FM LQFP 48 7*7/6089 MC HITACHI 9200HF10M DA SUMITOMO CRM-1064MBL 25um, Au

208757 M70Z 908GR8A 14.007536 FSL-TJN-FM LQFP 32 7*7/6300 MC HITACHI 9200HF10M DA SUMITOMO CRM-1064MBL 25um, Au

205779 M49Z 908JL16 9.66895168 FSL-TJN-FM LQFP 32 7*7/6300 MC HITACHI 9200HF10M DA SUMITOMO CRM-1064MBL 25um, Au

Date Author

4-Aug-09 T. Gause

27-Aug-09 T. Gause

5-May-11 Nancy Long

Rev 1.0 Reviewed qual plan with H.P. Wang - TJN Reliability Engr, PE and PM team.

General Notes:

1 - GZ60 Wafer tech code U050FXXD


Revision Comments




Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

68HC908GZ60

"GZ60"

Name or "Varies"

PB or "Varies"

Objective:

Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

Technology:


Fab / Assembly /



be electronic)

Maskset#:


PPE Approval (for

DIM/BOM results)

Signature & Date:

Ziep Tran

May-10-2011

Die Size (in mm)


Nancy Long

May-10-2011

Part Operating


LOTA:

8EMHA1AP7101

UQQAC1051C

TP71755.1Y

LOTB:

8EMHA1AVA600

UQQAD1052C

TP72259.45A

LOTC:

8EMHA1C0MK00

UQQAE1101C

TP61669.44H

CAB Approval

Signature & Date:

10181326M

May-13-2011

Customer Approval



Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


PC

JESD22-

A113

J-STD-020




with justification)


Q190677, 68HC908AZ60A: 0/693

HAST

JESD22-

A101

A110



MSL3, 260oC


Bias = 5V



Q190677, 68HC908AZ60A: 0/231

AC

JESD22-

A102

A118

Autoclave (AC):


260oC




Q190677, 68HC908AZ60A: 0/231

TC

JESD22-

A104

AEC Q100-

Appendix 3




TEST @ H

For AEC: WBP =/> 3

grams


Q190677, 68HC908AZ60A: 0/231,

WP: 0/15, Min>3

PC + PTC

JESD22-

A105


(PC+PTC):



PC= MSL @ °C, +5/-0°C


Bias =





PTC

JESD22-

A105




Bias =






FSL-CHD-FAB/FSL-KLM-FM /FSL-KLM-FM Wang Na-b34501

M29Z

0/1 Ziep Tran - RSJP50


Qualification of 85% UDR SST 68HC908GZ60 in CHD


68HC908GZ60

"GZ60"

Name or "Varies"

PB or "Varies"

U050FXXD /85%UDRSST

Pkg Code 6057/QFP 64 14*14*2.2P0.8


This testing is performed by Freescale Reliability Lab (FSL-KLM-FM) unless otherwise noted in the Comments.




HTSL

JESD22-

A103


150°C for 1000 hrs or 175oC for 168hrs and 500 hrs



Q190677, 68HC908AZ60A:

0/77@150C, 1008Hrs


Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

68HC908GZ60

"GZ60"

Name or "Varies"

PB or "Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


HTOL

JESD22-

A108



Rd Pt.)

Bias = 6V



Q202119, GZ60 Auto

Qual(0M29Z):0/231@150C,

408Hrs

Q202119, GZ60 Auto

Qual(1M29Z):0/77@125C, 168Hrs

ELFR



Bias = 6V


TEST @ RH 800 3 2400 LotA: 0/800

LotB: 0/800

LotC: 0/800

EDR










Q202119, GZ60 Auto

Qual(0M29Z):0/231


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


WBS


from minimum 5

units

0 0 pass GZ60 64QFP Auto Qual: Cpk>1.67

WBP

MilStd883-

2011


Cond. C or D


from minimum 5

units

0 0 pass GZ60 64QFP Auto Qual: Cpk>1.67

SD

JESD22-

B102

Solderability (SD):





critical areas


PD

JESD22-

B100




DIM

&

BOM

Dimensional (DIM):




DIM: Not Required

BOM: Done

SBS




Chip).


shear.

Cpk = or >1.67 10


of 10 devices)



LI

JESD22-

B105




No lead breakage or

cracks

5

(10 leads from each

of 5 parts)

0 0 `


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable

Comments




spares NA=Not Applicable

EM





TDDB





HCI





SM





NBTI






Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

68HC908GZ60

"GZ60"

Name or "Varies"

PB or "Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


TEST



AEC-Q100-007.





HBM

AEC-Q100-002 /

JESD22-A114E

Jan 2007



Test @ 500/1000/1500/2000 Volts


levels.

TEST @ RH

2KV min.

3 units per Voltage

level


Q202119, GZ60 Auto

Qual(1M29Z):

0/3@500V

0/3@1000V

0/3@1500V

0/3@2000V

MM

AEC-Q100-003

or JESD22



Test @ 50/100/200 Volts


levels.

TEST @ RH

200V min.

3 units per Voltage

level



0/3@50V

0/3@100V

0/3@150V

0/3@200V

CDM



Test @ 250/500/750 Volts


levels.


TEST @ RH

All pins =/> 500V

3 units per Voltage

level


Q202119, GZ60 Auto

Qual(1M29Z):

0/3@250V

0/3@500V

0/3@750V

LU

JESD78

plus

AEC-Q100-

004 for AEC

Latch-up (LU):



Ta= 125oC



Q202119, GZ60 Auto

Qual(1M29Z): 0/6@100mA

ED

AEC-Q100-009,

Freescale 48A

spec

Electrical Distribution (ED) TEST @ RHC 30 0 0 Completed Done on GZ60 Auto Qual

FG

For AEC, AEC-

Q100-007


for qual units

FG%= No Change

CHAR

For AEC, AEC-

Q003



per AEC Q003.


For AEC, AEC-

Q100-006


155°C, 2.0 min, +400/-400 V


information only.




failures.

TEST @ R 6 0 0 AEC Requirement. Not required for

Commercial/Industrial.

EMC

SAE J1752/3 -

Radiated

Emissions




agreement)

<40dBuV

150KHz - 1GHz

1 0 0 done on GZ60 32LQFP7x7 Package



(mm2)


190677 M73Y 68HC908AZ60A 28.974027 KLM QFP 64 14*14/6057 MC HITACHI 9200HF10M DA SUMITOMO CRM-1064MBL Au 25um

Date Author

Apr-19-10 NancyL

Apr-24-2010 NancyL

May-5-2011 Nancy Long

General Notes:




Revision Comments

Rev O Add qual plan for no BI part

Rev 1.0 Add qual plan for no BI part, need 2400 units ELFR



Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

68HC908GZ60

"GZ60"

Name or "Varies"

PB or "Varies"

Objective:

Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

Technology:


Fab / Assembly /



be electronic)

Maskset#:


PPE Approval (for

DIM/BOM results)

Signature & Date:

Ziep Tran

May-10-2011

Die Size (in mm)


Nancy Long

May-10-2011

Part Operating


LOT A LOT B LOT C CAB Approval

Signature & Date:

10181326M

May-13-2011

Customer Approval



Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


PC

JESD22-

A113

J-STD-020




with justification)


Q208757, GR8A; 0/693

Q205779, JL16: 0/231

Q202100; GZ60 48LQFP Auto

qual: 0/231

HAST

JESD22-

A101

A110



MSL3, 260oC


Bias = 5.5V



Q208757, GR8A; 0/231

Q205779, JL16: 0/77


qual: 0/77

AC

JESD22-

A102

A118

Autoclave (AC):


260oC




Q208757, GR8A; 0/231

Q205779, JL16: 0/77


qual: 0/77

TC

JESD22-

A104

AEC Q100-

Appendix 3




TEST @ H

For AEC: WBP =/> 3

grams


Q208757, GR8A; 0/231

Q205779, JL16: 0/77


qual: 0/77

PC + PTC

JESD22-

A105


(PC+PTC):



PC= MSL @ °C, +5/-0°C


Bias =





PTC

JESD22-

A105









"GZ60"

Name or "Varies"

PB or "Varies"


U050FXXD /85%UDRSST

Pkg Code 6300 & 6089/LQFP 48 7*7*1.4P0.5 & LQFP 32 7*7*1.4P0.8 Jim Carlquist - RMSD80

FSL-CHD-FAB/FSL-TJN-FM /FSL-TJN-FM Wang Na-b34501

M29Z

0/1 Ziep Tran - RSJP50






PTCPTC = °C to °C for 1000 cycles;

Bias =



HTSL

JESD22-

A103


150°C for 1008 hrs or 175oC for 504 hrs



Q208757, GR8A; 0/77

Q205779, JL16: 0/77


qual: 0/77


Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

68HC908GZ60

"GZ60"

Name or "Varies"

PB or "Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


HTOL

JESD22-

A108



Rd Pt.)

Bias = 6V



Q202119, GZ60 Auto

Qual(0M29Z):0/231@150C,

408Hrs

Q202119, GZ60 Auto

Qual(1M29Z):0/77@125C, 168Hrs

ELFR




Bias = 6V



Q203338, GZ60 IMM

Qual(0M29Z):0/2400

EDR










Q202119, GZ60 Auto

Qual(0M29Z):0/231


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


WBS


from minimum 5

units

0 0 pass Generic data:

GZ60 32_48LQFP Auto Qual:

Cpk>1.67

WBP

MilStd883-

2011


Cond. C or D


from minimum 5

units


GZ60 32_48LQFP Auto Qual:

Cpk>1.67

SD

JESD22-

B102

Solderability (SD):





critical areas


PD

JESD22-

B100




DIM

&

BOM

Dimensional (DIM):




DIM: Not Required

BOM: Done

SBS




Chip).


shear.

Cpk = or >1.67 10


of 10 devices)



LI

JESD22-

B105




No lead breakage or

cracks

5

(10 leads from each

of 5 parts)

0 0





Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable

Comments

EM





TDDB





HCI





SM





NBTI







Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

68HC908GZ60

"GZ60"

Name or "Varies"

PB or "Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


TEST



AEC-Q100-007.





HBM

AEC-Q100-002 /

JESD22-A114E

Jan 2007



Test @ 500/1000/1500/2000 Volts


levels.

TEST @ RH

2KV min.

3 units per Voltage

level


Q202119, GZ60 Auto

Qual(1M29Z):

0/3@500V

0/3@1000V

0/3@1500V

0/3@2000V

MM

AEC-Q100-003

or JESD22



Test @ 50/100/200 Volts


levels.

TEST @ RH

200V min.

3 units per Voltage

level



0/3@50V

0/3@100V

0/3@150V

0/3@200V

CDM



Test @ 250/500/750 Volts


levels.


TEST @ RH

All pins =/> 500V

3 units per Voltage

level


Q202100, GZ60 48 LQFP Pkg Auto

Qual:

0/3@250V

0/3@500V

0/3@750V

LU

JESD78

plus

AEC-Q100-

004 for AEC

Latch-up (LU):



Ta= 125oC



Q202119, GZ60 Auto

Qual(1M29Z): 0/6@100mA

ED

AEC-Q100-009,

Freescale 48A

spec

Electrical Distribution (ED) TEST @ RHC 30 0 0 Completed Done on GZ60 Auto Qual

FG

For AEC, AEC-

Q100-007


for qual units

FG%= No Change

CHAR

For AEC, AEC-

Q003



per AEC Q003.


For AEC, AEC-

Q100-006


155°C, 2.0 min, +400/-400 V


information only.




failures.



SAE J1752/3 -

Radiated



<40dBuV

150KHz - 1GHz

1 0 0


EMC

Radiated

Emissions



agreement)

150KHz - 1GHz

Die Qual Generic DataQuartz # Mask Set Product-Qual Description / Part Number(s) Technology Fab Die Size(mm2) CAB Number CAB Date

202119/203338 M29Z HC908GZ60 85% UDRSST FSL-CHD-FAB 22.061809 10181326M May-13-2011

32/48 LQFP Package Generic Data

Quartz# Mask Set Product-Qual Description/Part Number (s)Die Area

(mm2)Pkg Code Pkg Description Mold Description EPOXY Description Wire Description




Date Author

24-Apr-10 Nancy Long

4-May-11 Nancy Long

General Notes:



CommentsRevision

Rev O Add qual plan for no BI part



(1M29Z) Electrical DistributionReport Date: 23/Apr/11Report Revision: 0

Per AEC Q100 Rev G, ED Appendix Rev B; any key datasheet parameter with Cpk < 1.67 will require justification and FSL NPI Quality approval.

Hot CHD Devices Pre HTOL SND Devices Pre HTOL CHD Devices Post HTOL SND Devices Post HTOL

Pre CHD mean+-1

SND sigma or +-10%

Post CHD mean+-1

SND sigma or +-10%

Comment

125C 125C 125C 125C

Parameter Name in Datasheet UnitsLower Limit Upper Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk

Run Idd 5.5V mA NA 30.00 17.24431 0.22682 15.80677 15.404 0.150 30.270 16.90303 0.37413 9.88686 15.24431 0.22682 30.80677 PASS PASSWait Idd 5.5V mA NA 12.00 9.40750 0.08106 8.60421 8.395 0.296 4.623 9.35292 0.10079 7.10111 8.40750 0.08106 4.60421 PASS PASSStop Idd 5.5V uA NA 10.00 1.55419 0.48816 4.74281 1.489 0.187 17.939 1.27956 0.18358 14.92611 1.48419 0.48816 17.74281 PASS PASS

Stop Idd TBM 5.5V mA NA 1.25 0.01274 0.54559 7.78158 0.010 0.617 5.566 0.01124 0.42181 8.88345 0.01074 0.54559 5.78158 PASS PASSStop Idd TBM & LVI 5.5V mA NA 1.60 0.19081 3.81749 16.66064 0.203 6.988 9.675 0.19571 5.35486 12.18271 0.20281 3.81749 16.66064 PASS PASS

Reset Pullup kΩ 20.00 65.00 26.31578 2.84790 9.28636 25.641 2.772 8.469 25.00000 1.57779 14.58981 25.64102 2.84790 9.28636 PASS PASSIrq Pullup kΩ 20.00 65.00 26.45502 2.75572 9.67938 25.907 3.200 8.042 25.00000 2.13321 10.81853 25.90673 2.75572 9.67938 PASS PASS

Room CHD Devices Pre HTOL SND Devices Pre HTOL CHD Devices Post HTOL SND Devices Post HTOL

Pre CHD mean+-1

SND sigma or +-10%

Post CHD mean+-1

SND sigma or +-10%

Comment

25C 25C 25C 25C

Parameter Name in Datasheet Units Low Limit Upper Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std CpkRun Idd 5.5V mA NA 30.00 16.86967 0.11262 38.86226 15.235 0.138 35.734 16.85281 0.10941 40.05421 15.91252 0.13633 32.00064 PASS PASSWait Idd 5.5V mA NA 12.00 9.71278 0.07919 9.62745 9.033 0.084 15.737 9.68905 0.07919 9.72719 9.73583 0.08567 8.80970 PASS PASSStop Idd 5.5V uA NA 10.00 0.06472 0.11569 8.16946 0.041 0.113 30.484 -0.02428 0.18538 5.25817 0.11304 0.20788 4.83129 PASS PASS



Cold CHD Devices Pre HTOL SND Devices Pre HTOL CHD Devices Post HTOL SND Devices Post HTOL

Pre CHD mean+-1

SND sigma or +-10%

Post CHD mean+-1

SND sigma or +-10%

Comment

-40C -40C -40C -40C

Parameter Name in Datasheet Units Low Limit Upper Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std CpkRun Idd 5.5V mA NA 30.00 16.91136 0.12018 35.74870 15.137 0.205 23.798 16.87688 0.11387 37.83068 15.79585 0.12703 34.12317 PASS PASSWait Idd 5.5V mA NA 12.00 9.94380 0.08667 7.90834 9.120 0.108 11.964 9.92236 0.07967 8.69216 9.92677 0.08208 8.41921 PASS PASSStop Idd 5.5V uA NA 10.00 0.12477 0.14196 22.95287 0.060 0.330 9.940 0.36990 0.18646 17.03684 0.27788 1.02396 3.13233 PASS PASS





For HC908JL16FSL-CHD- Fab/Mask M49Z

Objective:

Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

Technology:

Package: Design Engr: QUARTZ Tracking #: 205779Fab / Assembly

/


(Signature/Date shown below

may be electronic)

Maskset#:


PPE Approval (for

DIM/BOM results)

Signature & Date:

Ziep Tran

May-10-2011Die Size (in

mm)


Nancy Long

May-10-2011

Part Operating

Temp. Grade: Grade - 40°C to +85 °C Trace/DateCode:

CTCTZQ1050A LOT B LOT C CAB Approval

Signature & Date:

09513599M

May-20-2011

Customer Approval



Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


PC

JESD22-

A113

J-STD-020





TEST @ RH 8EME005J3J00: 0/231 Generic data:

Q208757, QR8A; 0/693


qual: 0/231

HAST

JESD22-

A101

A110

Highly Accelerated Stress Test

(HAST):

PC before HAST (for SMDs only):

Required @ MSL3, 260oC


Bias = 5.5V


TEST @ RH 77 1 77 8EME005J3J00: 0/77 Generic data:

Q208757, QR8A; 0/231


qual: 0/77

AC

JESD22-

A102

A118

Autoclave (AC):

PC before AC (for SMDs only):




TEST @ R 77 1 77 8EME005J3J00: 0/77 Generic data:

Q208757, QR8A; 0/231


qual: 0/77

TC

JESD22-

A104

AEC Q100-

Appendix 3



@ MSL3, 260oC


TEST @ H 77 1 77 8EME005J3J00: 0/77: WP: 0/5, min>3g Generic data:

Q208757, QR8A; 0/231


qual: 0/77



Qualification of 85% UDR SST 68HC908JL16 in CHD68HC908JL16

"JL16"

U050FXXD /85%UDRSST

Pkg Code 6300/LQFP 32 7*7*1.4P0.8




2959.4x3267.2mm



Tao Ren - B01387

Ziep Tran - RSJP50


M49Z

0

Commercial/Industrial Tier Results

Name or "Varies"

PB or "Varies"

PC + PTC

JESD22-

A105

Preconditioning plus Power

Temperature Cycle (PC+PTC):

(See AEC-Q100 for test applicability

criteria)


PC= MSL @ °C, +5/-0°C


Bias =

TEST @ RH 0 0 0 Only Required for AEC devices

with maximum rated power > 1

Watt and Delta-Tj > 40C or for

devices designed to drive

inductive loads.

PTC

JESD22-

A105




Bias =





inductive loads.

HTSL

JESD22-

A103

High Temperature Storage Life

(HTSL):

175oC for 504 hrs


TEST @ RH(C) 77 1 77 8EME005J3J00: 0/77


Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

68HC908JL16

"JL16"

Name or "Varies"

PB or "Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


HTOL

JESD22-

A108

High Temperature Operating Life

(HTOL):

10k WE @125C, 5V+HTOL 6V@


Bias = 6.0V

(Devices incorporating NVM shall

receive 'NVM endurance preconditioning

(10K W/E @ 125oC)' prior to this test,

and special NVM test sequencing after

this test)


TEST @ RHC 77 1 77 8EME005J3J00: 0/77 Generic Data:

Q202069, QC16 Auto:

0/231@125C, 6V, 1008Hrs

ELFR



Bias = 6V



Q202069, QC16: 0/2400

EDR



10K Flash W/E Cycling (125C)+Flash &

EE Erased State DRB @ 150oC for

1008hrs

Devices incorporating NVM shall receive

'NVM endurance preconditioning'(W/E

cycling). Test R, H, C after W/E cycling.


TEST @ RHC 77 0 0 pass Generic Data:

Q202069, QC16: 0/231


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


WBS



1 5 8EME005J3J00: 0/5, Cpk>1.67 Performed by Assembly Site

during qual lot builds - PE to

include this requirement in the

qual lot build ERF

WBP

MilStd883-

2011


Cond. C or D



1 5 8EME005J3J00: 0/5, Cpk>1.67 Performed by Assembly Site



qual lot build ERF

SD

JESD22-

B102

Solderability (SD):

8hr.(1 hr. for Au-plated leads) Steam

age prior to test.

If production burn-in is done, samples

must also undergo burn-in prior to SD.

>95% lead coverage

of critical areas

15 0 0 Not required for Fab Site

Transfer

PD

JESD22-

B100



Cpk = or > 1.67 10 0 0 Not required for Fab Site

Transfer



DIM

&

BOM

Dimensional (DIM):

PPE to verify PD results against valid

98A drawing.


PPE to verify qual lot ERF BOM is

accurate.

DIM: Not Required

BOM: done

SBS

AEC-Q100-

010

Solder Ball Shear (SBS):

Performed on all solder ball mounted

packages e.g. PBGA, Chip Scale, Micro

Lead Frame (but NOT Flip Chip).

Two reflow cycles at MSL reflow

temperature before shear.

Cpk = or >1.67 10


10 devices)

0 0 For solder ball mounted

packages only; NOT for Flip

Chips.

LI

JESD22-

B105




No lead breakage or

cracks

5

(10 leads from each

of 5 parts)

0 0


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable

Comments

EM

Electro Migration (EM) The data, test method,

calculations and internal criteria

should be available to the

customer upon request for new

technologies.

TDDB

Time Dependent Dielectric

Breakdown (TDDB)

The data, test method,




technologies.

HCI

Hot Carrier Injection (HCI) The data, test method,




technologies.

SM

Stress Migration (SM) The data, test method,




technologies.

NBTI

Negative Bias Temperature Instability

(NBTI)





technologies.



Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

68HC908JL16

"JL16"

Name or "Varies"

PB or "Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


TEST

Freescale 48A Pre- and Post Functional /

Parametrics (TEST):

For AEC, test software shall meet

requirements of AEC-Q100-007.


specification in temperature and limit

value.

0 Fails All All All Completed This action refers to Final Testing

of all qualification units.

HBM

AEC-Q100-

002 /

JESD22-

A114E Jan

2007


Human Body Model Classification

(HBM):

Test @ 500/1000/1500/2000 Volts

For AEC, see AEC-Q100-002 for

classification levels.

TEST @ RH

2KV min.

3 units per Voltage

level

1 12 8EME005J3J00:

0/3@500V

0/3@1000V

0/3@1500V

0/3@2000V

MM

AEC-Q100-

003

or JESD22



Test @ 50/100/200 Volts



TEST @ RH

200V min.

3 units per Voltage

level

1 12 8EME005J3J00:

0/3@50V

0/3@100V

0/3@150V

0/3@200V

CDM

AEC-Q100-

011


Charged Device Model Classification

(CDM):

Test @ 250/500/750 Volts




TEST @ RH

All pins =/> 500V

3 units per Voltage

level

1 9 8EME005J3J00:

0/3@250V

0/3@500V

0/3@750V(CP)

LU

JESD78

plus

AEC-Q100-

004 for AEC

Latch-up (LU):

Test per JEDEC JESD78 with the AEC-

Q100-004 requirements for AEC.

Ta= 85oC, 100mA

Vsupply = 5.5V Maximum operating

voltage

TEST @ RH 6 1 6 8EME005J3J00: 0/6

ED

AEC-Q100-

009,

Freescale 48A

spec

Electrical Distribution (ED) TEST @ RHC 5 1 5 Completed

FG

For AEC, AEC-

Q100-007


90% for qual units

FG%= No Change

CHAR

For AEC, AEC-

Q003


Ony performed on new technologies and

part families per AEC Q003.

For AEC, AEC-

Q100-006

Electro-Thermally Induced Gate

Leakage (GL):

TEST @ R 6 0 0


GL (for

information

only)

Q100-006 Leakage (GL):

155°C, 2.0 min, +400/-400 V

Per AEC Q100 Rev G, this test is

performed for information only.





EMC

SAE J1752/3 -

Radiated

Emissions


(see AEC Q100 Appendix 5 for test

applicability; done on case-by-case basis

per customer/Freescale agreement)

<40dBuV

150KHz - 1GHz

1


202069 M80Z HC908QC16 85% UDRSST FSL-CHD-FAB 9.61625124 10272023M

205779 M49Z HC908JL16 85% UDRSST FSL-CHD-FAB 9.54481968 09513599M

32/48 LQFP Qual Vehicle InfoQuartz# Mask Set Product-Qual Description/Part Number (s) Die Area

(mm2)





Date Author

4-Aug-09 T. Gause

17-Sep-09 T. Gause

5-May-11 Nancy LongRev 2.0 Add Qual result

Rev 1.0 Replaced EDR stress with HTSL based on generic data that will be obtained from QC16 that has the same flash array.

General Notes:

1 -JL16 Wafer tech code U050FXXD

2 -JL16 BOM: HITACHI 9200HF10M Mold Compound, SUMITOMO CRM-1064MBL Die Attach Epoxy, 25um Gold Wire

Die Qual Vehicles

Revision Comments



Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

68HC908JL16

"JL16"

Name or "Varies"

PB or "Varies"

Objective:

Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

Technology:


/



may be electronic)

Maskset#:


PPE Approval (for

DIM/BOM results)

Signature & Date:

Shong Lee Ming-B21406

May-11-2011Die Size (in

mm)


Nancy Long

May-11-2011

Part Operating


LOT A

N9NJ05002J00-1

XNXX1050X

LOT B

N9NJ05002J00-2

XNXX1050X

LOT C

N9NJ05002J00-3

XNXX1050X CAB Approval

Signature & Date:

09513599M

May-20-2011

Customer Approval



Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


HAST

JESD22-

A101

A110


(HAST):


Bias = 5.5V


TEST @ RH 77 3 231 N9NJ05002J00-1: 0/77

N9NJ05002J00-2: 0/77

N9NJ05002J00-3: 0/77

AC

JESD22-

A102

A118

Autoclave (AC):



TEST @ R 77 3 231 N9NJ05002J00-1: 0/77

N9NJ05002J00-2: 0/77

N9NJ05002J00-3: 0/77

TC

JESD22-

A104

AEC Q100-

Appendix 3



TEST @ H 77 3 231 N9NJ05002J00-1: 0/77, WP: 0/5, Min>3g

N9NJ05002J00-2: 0/77

N9NJ05002J00-3: 0/77




M49Z


2.9594x3.2672mm Tammie Gause - RA7914/Nancy Long - B07252


Qualification of 85% UDR SST 68HC908JL16 in CHD68HC908JL16

"JL16"

Name or "Varies"

PB or "Varies"

U050FXXD /85%UDRSST

Pkg Code 6125/ 32 PSDIP Jim Carlquist - RMSD80

FSL-CHD-FAB/NFME /FSL-TJN-FM Tao Ren - B01387

PC + PTC

JESD22-

A105




criteria)


PC= MSL @ °C, +5/-0°C


Bias =





inductive loads.

PTC

JESD22-

A105




Bias =





inductive loads.

HTSL

JESD22-

A103


(HTSL):

175oC for 504 hrs


TEST @ RH 77 1 77 N9NJ05002J00-1: 0/77


Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

68HC908JL16

"JL16"

Name or "Varies"

PB or "Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


HTOL

JESD22-

A108


(HTOL):


43hrs=1yr lifetime

Bias = 6.0V



(10K W/E @ 125oC) prior to this test,


this test)



Q202069, QC16 Auto:

0/231@125C, 6V, 1008Hrs

Q205779, JL16: 0/77@125C,

6V, 168Hrs

ELFR



Bias = 6V



Q202069, QC16: 0/2400

EDR





1008hrs






Q202069, QC16: 0/231


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


WBS



1 5 LotA: 0/5, Cpk>1.67 Performed by Assembly Site



qual lot build ERF

WBP

MilStd883-

2011


Cond. C or D



1 5 LotA: 0/5, Cpk>1.67 Performed by Assembly Site



qual lot build ERF

SD

JESD22-

B102

Solderability (SD):


age prior to test.



>95% lead coverage

of critical areas


Transfer

JESD22-

B100




Transfer



PDB100 PD per FSL 98A drawing Transfer

DIM

&

BOM

Dimensional (DIM):


98A drawing.



accurate.

DIM: Not Required

BOM: done

SBS

AEC-Q100-

010







Cpk = or >1.67 10


10 devices)



Chips.

LI

JESD22-

B105




No lead breakage or

cracks

5

(10 leads from each

of 5 parts)

0 0


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable

Comments

EM





technologies.

TDDB


Breakdown (TDDB)





technologies.

HCI





technologies.

SM





technologies.

NBTI


(NBTI)





technologies.



Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

68HC908JL16

"JL16"

Name or "Varies"

PB or "Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


TEST


Parametrics (TEST):





value.

0 Fails All All All completed This action refers to Final Testing


HBM

AEC-Q100-

002 /

JESD22-

A114E Jan

2007



(HBM):

Test @ 500/1000/1500/2000 Volts



TEST @ RH

2KV min.

3 units per Voltage

level


Q205779, JL16 32LQFP Qual :

0/3@500V

0/3@1000V

0/3@1500V

0/3@2000V

MM

AEC-Q100-

003

or JESD22



Test @ 50/100/200 Volts



TEST @ RH

200V min.

3 units per Voltage

level



0/3@50V

0/3@100V

0/3@150V

0/3@200V

CDM

AEC-Q100-

011



(CDM):

Test @ 250/500/750 Volts




TEST @ RH

All pins =/> 500V

3 units per Voltage

level

1 9 N9NJ05002J00-Lot1:

0/3@250V

0/3@500V

0/3@750V(CP)

Levels below 500V for all other

pins require customer approval.

LU

JESD78

plus

AEC-Q100-

004 for AEC

Latch-up (LU):



Ta= 125oC


voltage



0/6@100mA

ED

AEC-Q100-

009,

Freescale 48A

spec

Electrical Distribution (ED) TEST @ RHC AEC: 30 0 0 Completed Done on JL16 32LQFP Qual

FG

For AEC, AEC-

Q100-007


90% for qual units

FG%= No Change


CHAR

For AEC, AEC-

Q003




GL (for

information

only)

For AEC, AEC-

Q100-006


Leakage (GL):

155°C, 2.0 min, +400/-400 V







TEST @ R 6 0 0

EMC

SAE J1752/3 -

Radiated

Emissions





<40dBuV

150KHz - 1GHz

1




32 PSDIP Qual Generic data

Quartz# Mask SetProduct-Qual Description/Part

Number (s)

Die Area

(mm2)Assembly Site Pkg Description/code Mold Description EPOXY Description Wire Description

205998 M49Z 68HC908JL16 9.54 NFME 32 PSDIP/6125 MOLD, EME6300H-6L SUMITOMO CRM-1033BF 25um Au

Date Author

4-Aug-09 T. Gause

5-May-11 Nancy longRev 1.0 Add Qual Result


General Notes:


2 - JL16 BOM: EME6300H-6L Mold Compound, SUMITOMO CRM-1033BF Die Attach Epoxy, 25um Gold Wire


Revision Comments


Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

68HC908JL16

"JL16"

Name or "Varies"

PB or "Varies"

Objective:

Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

Technology:


/



may be electronic)

Maskset#:


PPE Approval (for

DIM/BOM results)

Signature & Date:

Ziep Tran

May-10-2011

Die Size (in

mm)


Nancy Long

May-10-2011

Part Operating


LOT A

8EME005GQ500

CTNAVS1049A


Signature & Date:

09513599M

May-20-2011

Customer Approval



Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


PC

JESD22-

A113

J-STD-020





TEST @ RH 8EME005GQ500: 0/231 Generic data:

Q208461, 705P6E; 0/231

Q207965, 705JP7: 0/231

Q202063, 908QC16: 0/693

Q207962, 908GR8A: 0/77

HAST

JESD22-

A101

A110


(HAST):




Bias = 5.5V


TEST @ RH 77 1 77 8EME005GQ500: 0/77 Generic data:

Q208461, 705P6E; 0/77

Q207965, 705JP7: 0/77

Q202063, 908QC16: 0/231

Q207962, 908GR8A: 0/77

AC

JESD22-

A102

A118

Autoclave (AC):





TEST @ R 77 1 77 8EME005GQ500: 0/77 Generic data:

Q208461, 705P6E; 0/77

Q207965, 705JP7: 0/77

Q202063, 908QC16: 0/231

Q207962, 908GR8A: 0/77

JESD22-

A104



TEST @ H 77 1 77 8EME005GQ500: 0/77, WP: 0/5, Min>3g Generic data:

Q208461, 705P6E; 0/77







U050FXXD /85%UDRSST

Pkg Code 2009/28W SOIC Jim Carlquist - RMSD80

FSL-CHD-FAB/FSL-TJN-FM /FSL-TJN-FM Tao Ren - B01387

M49Z



Qualification of 85% UDR SST 68HC908JL16 in CHD 68HC908JL16

"JL16"

Name or "Varies"

PB or "Varies"

TC

A104

AEC Q100-

Appendix 3


@ MSL3, 260oC


Q208461, 705P6E; 0/77

Q207965, 705JP7: 0/77

Q202063, 908QC16: 0/231

Q207962, 908GR8A: 0/77

PC + PTC

JESD22-

A105




criteria)


PC= MSL @ °C, +5/-0°C


Bias =





inductive loads.

PTC

JESD22-

A105




Bias =





inductive loads.

HTSL

JESD22-

A103


(HTSL):

175oC for 504 hrs


TEST @ RH 77 1 77 8EME005GQ500: 0/77


Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

68HC908JL16

"JL16"

Name or "Varies"

PB or "Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


HTOL

JESD22-

A108


(HTOL):


Bias = 6.0V





this test)



Q202069, QC16 Auto:

0/231@125C, 6V, 1008Hrs

Q205779, JL16: 0/77@125C,

6V, 168Hrs

ELFR



Bias = 6V



Q202069, QC16: 0/2400

EDR



10K Flash (Page) W/E Cycling

(125C)+Flash & EE Erased State DRB

@ 150oC for 1008hrs






Q202069, QC16: 0/231


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


WBS



1 5 8EME005GQ500; 0/5, Cpk>1.67 Performed by Assembly Site



qual lot build ERF

WBP

MilStd883-

2011


Cond. C or D



1 5 8EME005GQ500; 0/5, Cpk>1.67 Performed by Assembly Site



qual lot build ERF

SD

JESD22-

B102

Solderability (SD):


age prior to test.



>95% lead coverage

of critical areas


Transfer

PD

JESD22-

B100




Transfer

DIM

Dimensional (DIM):


DIM: Not Required

BOM: done



DIM

&

BOM


98A drawing.



accurate.

BOM: done

SBS

AEC-Q100-

010







Cpk = or >1.67 10


10 devices)



Chips.

LI

JESD22-

B105




No lead breakage or

cracks

5

(10 leads from each

of 5 parts)

0 0


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable

Comments

EM





technologies.

TDDB


Breakdown (TDDB)





technologies.

HCI





technologies.

SM





technologies.

NBTI


(NBTI)





technologies.



Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

68HC908JL16

"JL16"

Name or "Varies"

PB or "Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


TEST


Parametrics (TEST):





value.



HBM

AEC-Q100-

002 /

JESD22-

A114E Jan

2007



(HBM):

Test @ 500/1000/1500/2000 Volts



TEST @ RH

2KV min.

3 units per Voltage

level



0/3@500

0/3@1000

0/3@1500V

0/3@2000V

MM

AEC-Q100-

003

or JESD22



Test @ 50/100/200 Volts



TEST @ RH

200V min.

3 units per Voltage

level



0/3@50

0/3@100

0/3@150V

0/3@200V

CDM

AEC-Q100-

011



(CDM):

Test @ 250/500/750 Volts




TEST @ RH

All pins =/> 500V

3 units per Voltage

level

1 12 8EME005GQ500:

0/3@250V

0/3@500V

0/3@750V(CP)

LU

JESD78

plus

AEC-Q100-

004 for AEC

Latch-up (LU):



Ta= 125oC


voltage



0/6@100mA

ED

AEC-Q100-

009,

Freescale 48A

spec

Electrical Distribution (ED) TEST @ RHC 5 0 0 Completed Done on JL16 32LQFP Qual

FG

For AEC, AEC-

Q100-007


90% for qual units

FG%= No Change


CHAR

For AEC, AEC-

Q003




GL (for

information

only)

For AEC, AEC-

Q100-006


Leakage (GL):

155°C, 2.0 min, +400/-400 V







TEST @ R 6 0 0

EMC

SAE J1752/3 -

Radiated

Emissions





<40dBuV

150KHz - 1GHz

1




28W SOIC Qual Vehicle Info


Number (s)

Die Area


202620 M49Z HC908JL16 9.54481968 TJN 28W SOIC/2009 SUMITOMO EME-G600 DA SUMITOMO CRM-1064MBL 25um Au

208461/212348 M11Z HC705P6E 20.0566 TJN 28W SOIC/2009 SUMITOMO EME-G600 DA SUMITOMO CRM-1064MBL 25um Au

207965 M41Z HC705JP7 22.3561 TJN 28W SOIC/2009 SUMITOMO EME-G600 DA SUMITOMO CRM-1064MBL 25um Au

202063 M80Z HC908QC16 9.61625124 TJN 28W SOIC/2009 SUMITOMO EME-G600 DA SUMITOMO CRM-1064MBL 25um Au

207962 M70Z HC908GR8A

Date Author

4-Aug-09 T. Gause

5-May-11 Nancy LongRev 1.0 Add Qual Result

General Notes:


2 - JL16 BOM: SUMITOMO EME-G600 Mold Compound, SUMITOMO CRM-1064MBL Die Attach Epoxy, 25um Gold Wire


Revision Comments



Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

68HC908JL16

"JL16"

Name or "Varies"

PB or "Varies"

Objective:

Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: Apr 22, 2011

Technology:


/



may be electronic)

Maskset#:


PPE Approval (for

DIM/BOM results)

Signature & Date:

Ziep Tran

May-10-2011

Die Size (in

mm)


Nancy Long

May-10-2011

Part Operating


LOT A

8EME005GGP00

CTNASK1048A


Signature & Date:

09513599M

May-20-2011

Customer Approval



Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


HAST

JESD22-

A101

A110


(HAST):


Bias = 5V


TEST @ RH 77 1 77 8EME005GGP00: 0/77 Generic data:

Q208462, 705P6E: 0/77

Q207970, 705JP7; 0/154

AC

JESD22-

A102

A118

Autoclave (AC):



TEST @ R 77 1 77 8EME005GGP00: 0/77 Generic data:

Q208462, 705P6E: 0/77

Q207970, 705JP7; 0/154

TC

JESD22-

A104

AEC Q100-

Appendix 3



TEST @ H 77 1 77 8EME005GGP00: 0/77, WP: 0/5, Min>3g Generic data:

Q208462, 705P6E: 0/77

Q207970, 705JP7; 0/154

PC + PTC

JESD22-

A105




criteria)






inductive loads.




FSL-CHD-FAB/FSL-TJN-FM /FSL-TJN-FM Tao Ren - B01387

M49Z




Qualification of 85% UDR SST 68HC908JL16 in CHD 68HC908JL16

"JL16"

Name or "Varies"

PB or "Varies"

U050FXXD /85%UDRSST

Pkg Code 655/28 PDIP Jim Carlquist - RMSD80

PC + PTC PC before PC+PTC (for SMDs only)

PC= MSL @ °C, +5/-0°C


Bias =

inductive loads.

PTC

JESD22-

A105




Bias =





inductive loads.

HTSL

JESD22-

A103


(HTSL):

175oC for 504 hrs


TEST @ RH 77 1 77 8EME005GGP00: 0/80


Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

68HC908JL16

"JL16"

Name or "Varies"

PB or "Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


HTOL

JESD22-

A108


(HTOL):


Bias = 6.0V





this test)



Q202069, QC16 Auto:

0/231@125C, 6V, 1008Hrs

Q205779, JL16: 0/77@125C,

6V, 168Hrs

ELFR



Bias = 6V



Q202069, QC16: 0/2400

EDR





1008hrs






Q202069, QC16: 0/231


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


WBS



1 5 8EME005GGP00: 0/5, Cpk>1.67 Performed by Assembly Site



qual lot build ERF

WBP

MilStd883-

2011


Cond. C or D



1 5 8EME005GGP00: 0/5, Cpk>1.67 Performed by Assembly Site



qual lot build ERF

SD

JESD22-

B102

Solderability (SD):


age prior to test.



>95% lead coverage

of critical areas


Transfer

PD

JESD22-

B100




Transfer



DIM

&

BOM

Dimensional (DIM):


98A drawing.



accurate.

DIM: Not Required

BOM: Done

SBS

AEC-Q100-

010







Cpk = or >1.67 10


10 devices)



Chips.

LI

JESD22-

B105




No lead breakage or

cracks

5

(10 leads from each

of 5 parts)

0 0


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable

Comments

EM





technologies.

TDDB


Breakdown (TDDB)





technologies.

HCI





technologies.

SM





technologies.

NBTI


(NBTI)





technologies.



Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

68HC908JL16

"JL16"

Name or "Varies"

PB or "Varies"


Requirements

Minimum Sample

Size# of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


TEST


Parametrics (TEST):





value.



HBM

AEC-Q100-

002 /

JESD22-

A114E Jan

2007



(HBM):

Test @ 500/1000/1500/2000 Volts



TEST @ RH

2KV min.

3 units per Voltage

level



0/3@500

0/3@1000

0/3@1500V

0/3@2000V

MM

AEC-Q100-

003

or JESD22



Test @ 50/100/200 Volts



TEST @ RH

200V min.

3 units per Voltage

level



0/3@50

0/3@100

0/3@150V

0/3@200V

CDM

AEC-Q100-

011



(CDM):

Test @ 250/500/750 Volts




TEST @ RH

All pins =/> 500V

3 units per Voltage

level

1 9 8EME005GGP00:

0/3@250V

0/3@500V

0/3@750V(CP)

LU

JESD78

plus

AEC-Q100-

004 for AEC

Latch-up (LU):



Ta= 125oC


voltage



0/6@100mA

ED

AEC-Q100-

009,

Freescale 48A

spec

Electrical Distribution (ED) TEST @ RHC AEC: 30 0 0 Completed Done on JL16 32LQFP Qual

FG

For AEC, AEC-

Q100-007


90% for qual units

FG%= No Change


CHAR

For AEC, AEC-

Q003




GL (for

information

only)

For AEC, AEC-

Q100-006


Leakage (GL):

155°C, 2.0 min, +400/-400 V







TEST @ R 6 0 0

EMC

SAE J1752/3 -

Radiated

Emissions





<40dBuV

150KHz - 1GHz

1




28 PDIP Qual Vehicle Info


Number (s)

Die Area


205777 M49Z HC908JL16 9.54481968 TJN 28 PDIP/655 MC SUMITOMO EME-6300HXLD/ATCH SMTM CRM-1033B 25um Au

208462 M11Z HC705P6E 20.0566 TJN 28 PDIP/655 MC SUMITOMO EME-6300HXLD/ATCH SMTM CRM-1033B 25um Au

207970 M41Z HC705JP7 22.3561 TJN 28 PDIP/655 MC SUMITOMO EME-6300HXLD/ATCH SMTM CRM-1033B 25um Au

Date Author

4-Aug-09 T. Gause

17-Sep-09 T. Gause

22-Apr-11 NancyLRev 3.0 add qual result


Revision Comments


Rev 1.0 Replaced EDR stress with HTSL based on generic data that will be obtained from QC16 that has the same flash array.

General Notes:


2 - JL16 BOM: SUMITOMO EME-6300HXL Mold Compound, SMTM CRM-1033B Die Attach Epoxy, 25um Gold Wire


or 10% or 10%

(0M49Z) Electrical DistributionReport Date: 16/May/11Report Revision: 0


Hot CHD Devices Pre HTOL SND Devices Pre HTOL CHD Devices Post HTOL SND Devices Post HTOL

Pre CHD mean+-1

SND sigma or +-10%

Post CHD mean+-1

SND sigma or +-10%

Comment

85C 85C 85C 85C


LVI_TRIP V 3.9 4.5 4.18 0.0434 2.1634 4.19 0.051368 1.8559 4.19 0.051 1.751 4.187 0.0522 1.943 PASS PASSLVI_RECOVER V 4 4.6 4.32 0.04523 2.0805 4.33 0.04693 1.9106 4.32467 0.05847 1.839 4.33 0.0468 2.013 PASS PASS

RIDD_HV mA 0 18 11.2702 0.0865 25.9291 11.5116 0.1406 15.3774 11.92 0.8 21.894 11.54 0.165 14.32 PASS PASSRIDD_LV mA 0 10 3.4703 0.023 50.3371 3.5255 0.0392 29.9817 3.51 0.127 9.635 3.55 0.073 18.36 PASS PASSWIDD_HV mA 0 10 5.0033 0.0608 21.6495 5.1097 0.0982 16.5993 4.95 0.025 62.34 5.11 0.098 16.52 PASS PASSWIDD_LV mA 0 7 1.3577 0.016 28.18 1.3838 0.0212 21.68 1.367 0.063 7.09 1.38 0.021 22.2 PASS PASS

SIDD_LVI_EN_HV uA 0 220 150.4557 3.28 7.06 152.68 4.25 5.28 145.08 3.48 8.03 153.4 4.73 4.39 PASS PASSSIDD_LVI_EN_LV uA 0 200 130.27 3.73 6.24 132.45 4.35 5.18 124.58 3.92 6.37 132.5 4.33 5.23 PASS PASS

PortD_A_PULL_UP_HV KΩ 16 32 25.95 1.05 6.48 25.94 1.31 5.2 25.7 0.95 8.31 26.2 1.36 4.73 PASS PASSPortD_A_PULL_UP_LV KΩ 16 32 26.3 0.72 4.16 26.3 0.75 3.96 25.8 1.165 4.71 26.6 0.74 3.57 PASS PASS

IRST_PULL_UP_HV KΩ 16 32 26.8 2.59 4.4 26.6 2.89 4.07 26.4 1.53 10.07 26.6 2.68 4.48 PASS PASSIRST_PULL_UP_LV KΩ 16 32 29.3 1.14 2.39 29.2 1.22 2.31 29.2 1.14 2.68 29.1 1.27 2.24 PASS PASS

Room CHD Devices Pre HTOL SND Devices Pre HTOL CHD Devices Post HTOL SND Devices Post HTOL

Pre CHD mean+-1

SND sigma or +-10%

Post CHD mean+-1

SND sigma or +-10%

Comment

25C 25C 25C 25C

Parameter Name in Datasheet Units Low Limit Upper Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std CpkLVI_TRIP V 3.9 4.5 4.18 0.0406 2.2765 4.17 0.065 1.8047 4.196 0.0572 1.831 4.176 0.0655 2.012 PASS PASS

LVI_RECOVER V 4 4.6 4.3 0.043 2.2895 4.31 0.055 1.9122 4.3236 0.05786 1.745 4.31 0.059 2.17 PASS PASSRIDD_HV mA 0 18 11.1954 0.0869 26.097 11.3725 0.1427 15.4781 11.14 0.069 36.26 11.38 0.146 14.38 PASS PASSRIDD_LV mA 0 10 3.4369 0.0239 47.9581 3.4658 0.04753 24.3024 3.41 0.034 38.7 3.467 0.047 22.73 PASS PASSWIDD_HV mA 0 10 4.9309 0.06271 26.2094 5.0242 0.0766 21.6494 4.92 0.0435 36.78 5.02 0.076 20.52 PASS PASSWIDD_LV mA 0 7 1.322 0.0153 28.67 1.336 0.0296 15.04 1.3 0.0165 27.91 1.339 0.03 13.4 PASS PASS



IRST_PULL_UP_HV KΩ 16 32 26.2 1.96 6.53 26.2 2.46 5.23 26.3 1.47 9.68 26.2 2.35 5.33 PASS PASSIRST_PULL_UP_LV KΩ 16 32 28.6 0.84 4.13 28.6 1.07 3.2 28.7 0.628 6.13 28.6 0.933 2.68 PASS PASS

Cold CHD Devices Pre HTOL SND Devices Pre HTOL CHD Devices Post HTOL SND Devices Post HTOL

Pre CHD mean+-1

SND sigma or +-10% +-

Post CHD mean+-1

SND sigma or +-10% +-

Comment

-40C -40C -40C -40C

Parameter Name in Datasheet Units Low Limit Upper Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std CpkLVI_TRIP V 3.9 4.5 4.18 0.0413 2.2517 4.19 0.048 1.9955 4.198 0.0558 1.863 4.19 0.0486 1.91 PASS PASS

LVI_RECOVER V 4 4.6 4.31 0.0419 2.3459 4.32 0.0494 1.9105 4.323 0.0571 1.752 4.317 0.0488 1.91 PASS PASSRIDD_HV mA 0 18 11.2507 0.0831 27.0697 11.4268 0.1348 16.2561 11.24 0.19 10.53 11.45 0.158 16.97 PASS PASSRIDD_LV mA 0 10 3.4436 0.0188 60.8027 3.4856 0.0391 29.6955 3.41 0.032 31.78 3.489 0.046 28.64 PASS PASSWIDD_HV mA 0 10 5.0047 0.0673 24.7309 5.0507 0.0956 17.2434 4.926 0.043 37.37 5.05 0.096 18.37 PASS PASSWIDD_LV mA 0 7 1.327 0.0148 29.81 1.3374 0.0207 21.5 1.307 0.017 7.09 1.34 0.0236 22.54 PASS PASS



IRST_PULL_UP_HV KΩ 16 32 26.1 1.99 6.59 25.65 3.55 4.06 26.3 1.49 8.42 25.7 3.69 4.83 PASS PASSIRST_PULL_UP_LV KΩ 16 32 28.5 0.934 3.83 28 1.45 2.83 28.7 0.6 5.22 28 1.48 3.46 PASS PASS



For HC908QB8FSL-CHD- Fab/Mask M81Z

Objective:

Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: Apr 23, 2011

Technology:

Package: Design Engr: QUARTZ Tracking #: 203737(Die)/206298

Fab / Assembly /



may be electronic)

Maskset#:


PPE Approval (for

DIM/BOM results)

Signature & Date:

Ziep Tran

May-12-2011

Die Size (in mm)


Nancy Long

May-12-2011

Part Operating


LOT A

8EME005HRV00

CTNAQB1050A

LOT B

8EME005HRV01

CTNAQB1050A

LOT C

8EME005HRV02

CTNAQB1050A

CAB Approval


Customer Approval



RequirementsMinimum Sample Size # of Lots

Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


PC

JESD22-

A113

J-STD-020





TEST @ RH All surface mount devices

prior to THB, HAST, AC,

UHST, TC, PC+PTC and as

required per test conditions.

ME005HRV00: 0/77

ME005HRV01 : 0/77

ME005HRV02 : 0/77

Generic data:

Q202065, QC16: 0/693

Q203722, QY4: 0/693

HAST

JESD22-

A101

A110





Bias = 5V



Q202065, QC16: 0/231

Q203722, QY4: 0/231

AC

JESD22-

A102

A118

Autoclave (AC):

PC before AC (for SMDs only): Required

@ MSL3, 260oC




Q202065, QC16: 0/231

Q203722, QY4: 0/231

TC

JESD22-

A104

AEC Q100-

Appendix 3




For AEC only: WBP after TC on 5 devices

from 1 lot; 2 bonds per corner and one mid-

bond per side on each device. Record

which pins were used.

TEST @ H

For AEC: WBP =/> 3

grams

77 3 231 ME005HRV00: 0/77, WP: 0/5, Min>3g

ME005HRV01 : 0/77

ME005HRV02 : 0/77

Qualification of 85% UDRSST 68HC908QB8 in FSL-CHD-FAB 68HC908QB8

"QB8"


U050FXXD /85%UDRSST

2003 /SOIC 16W



"Varies"

"Varies"



Jia Qing - B18837

Ziep Tran - RSJP50


0M81Z


2.64x2.74

PC + PTC

JESD22-

A105




criteria)


PC= MSL @ °C, +5/-0°C


Bias =





inductive loads.

PTC

JESD22-

A105




Bias =





inductive loads.

HTSL

JESD22-

A103


175oC for 504 hrs


TEST @ RH 77 1 77 ME005HRV00 : 0/77


Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: Apr 23, 2011

68HC908QB8

"QB8"

"Varies"

"Varies"



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


HTOL

JESD22-

A108


(HTOL):

10k Flash W/E Cycling (125oC) + 1008 hrs

(AEC MC Rd Pt.)

Bias = 6V


'NVM endurance preconditioning' prior to

this test, and special NVM test sequencing

after this test.


TEST @ RHC 77 1 77 8EME005HRV00: 0/77 Generic Data:

Q202069, QC16: 0/231

ELFR



Bias = 6V



Q202069, QC16: 0/2400

EDR



10K W/E Cycling (125C)+Flash DRB @

150oC for 1008hrs





Q202069, QC16: 0/231



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


WBS



1 5 LotB: 0/5, Cpk>1.67 Performed by Assembly Site



qual lot build ERF

WBP

MilStd883-

2011


Cond. C or D



1 5 LotB: 0/5, Cpk>1.67 Performed by Assembly Site



qual lot build ERF

SD

JESD22-

B102

Solderability (SD):

8hr.(1 hr. for Au-plated leads) Steam age

prior to test.

If production burn-in is done, samples must

also undergo burn-in prior to SD.

>95% lead coverage

of critical areas


Transfer

PD

JESD22-

B100




Transfer

DIM

&

BOM

Dimensional (DIM):


drawing.



accurate.

DIM: Not Required

BOM: done



accurate.

SBS







Cpk = or >1.67 10

(5 balls from a min. of 10

devices)



Chips.

LI

JESD22-

B105




No lead breakage or

cracks

5

(10 leads from each of 5

parts)

0 0



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable

Comments

EM





technologies.

TDDB


(TDDB)





technologies.

HCI





technologies.

SM





technologies.

NBTI


(NBTI)





technologies.



Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: Apr 23, 2011

68HC908QB8

"QB8"

"Varies"

"Varies"



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


TEST


(TEST):







HBM

AEC-Q100-002 /

JESD22-A114E

Jan 2007



(HBM):

Test @ 500/1000/1500/2000 Volts



TEST @ RH

2KV min.

3 units per Voltage level 1 12 LotA:

0/3@500V

0/3@1000V

0/3@1500V

0/3@2000V

MM

AEC-Q100-003

or JESD22



Test @ 50/100/150/200 Volts



TEST @ RH

200V min.


0/3@50V

0/3@100V

0/3@150V

0/3@200V

CDM



(CDM):

Test @ 250/500/750 Volts




TEST @ RH

All pins =/> 500V


0/3@250V

0/3@500V

0/3@750V(CP)

LU

JESD78

plus

AEC-Q100-

004 for AEC

Latch-up (LU):



Ta= 125oC


voltage

TEST @ RH 6 1 6 LotA: 0/6

ED

AEC-Q100-009,

Freescale 48A

spec

Electrical Distribution (ED) TEST @ RHC 30 1 30 LotA: 0/30, Cpk>1.67

FG

For AEC, AEC-

Q100-007


90% for qual units

FG%= No Change

CHAR

For AEC, AEC-

Q003




For AEC, AEC-

Q100-006


Leakage (GL):

155°C, 2.0 min, +400/-400 V

TEST @ R 6 1 6 LotA; 0/6


GL (for

information

only)

155°C, 2.0 min, +400/-400 V







EMC

SAE J1752/3 -

Radiated

Emissions





<40dBuV

150KHz - 1GHz

1 0 0



Quartz# Mask SetProduct-Qual Description/Part Number

(s)

Die Area



203722 M05Z HC908QY4 7.3136949 FSL-TJN-FM SOIC 16 W/2003 SUMITOMO G600 ABLEBOND 8290 25 um Au

Date Author

25-Aug-09 T. Gause

26-Aug-09 T. Gause

23-Apr-11 Nancy LongRev 2.0 Add Qual Result

Die Qual Vehicles


Rev 1.0 Reviewed qual plan with H.P. Wang - TJN Reliability, PE and PM team.

General Notes:

1 -QB8 Wafer tech code U050FXXD

2 - QB8 BOM: SUMITOMO G600 Mold Compound, ABLEBOND 8290 Die Attach Epoxy, 25um Gold Wire

Revision Comments



Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: Apr 23, 2011

68HC908QB8

"QB8"

"Varies"

"Varies"

Objective:

Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: Apr 23, 2011

Technology:


Fab / Assembly /



may be electronic)

Maskset#:


PPE Approval (for

DIM/BOM results)

Signature & Date:

Ziep Tran

May-12-2011

Die Size (in mm)


Nancy Long

May-12-2011

Part Operating


8EME005FZ300

4BTVA1052 LOT B LOT C CAB Approval


Customer Approval




Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


PC

JESD22-

A113

J-STD-020





TEST @ RH LJME005FZ300: 0/77 Generic Data:

Q202067, QC16: 0/693

Q203721, QY4(Nitron Classic):

0/693

HAST

JESD22-

A101

A110





Bias = 5V



Q202067, QC16: 0/231


0/231

AC

JESD22-

A102

A118

Autoclave (AC):


@ MSL3, 260oC




Q202067, QC16: 0/231


JESD22-

A104



TEST @ H

For AEC: WBP =/> 3

77 1 77 LJME005FZ300: 0/77, WP: 0/5, min>3g Generic Data:

Q202067, QC16: 0/231, WP: 0/5


All surface mount devices prior to THB, HAST, AC, UHST, TC, PC+PTC and as




FSL-CHD-FAB/FSL-TJN-FM /FSL-TJN-FM Jia Qing - B18837

0M81Z Ziep Tran - RSJP50




"QB8"

"Varies"

"Varies"

U050FXXD /85%UDRSST

6117 /TSSOP Jim Carlquist - RMSD80

TC

A104

AEC Q100-

Appendix 3


@ MSL3, 260oC


For AEC only: WBP after TC on 5 devices

from 1 lot; 2 bonds per corner and one mid-

bond per side on each device. Record

which pins were used.

For AEC: WBP =/> 3

grams

Q202067, QC16: 0/231, WP: 0/5


0/231, WP: 0/5

PC + PTC

JESD22-

A105




criteria)


PC= MSL @ °C, +5/-0°C


Bias =





inductive loads.

PTC

JESD22-

A105




Bias =





inductive loads.

HTSL

JESD22-

A103


150°C for 1000 hrs or 175oC for 500 hrs



Q202069, Nitron QC16, EDR:

0/231@150C, 1008Hrs

Q203721, Nitron Classic:

0/77@175C, 504Hrs


Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: Apr 23, 2011

68HC908QB8

"QB8"

"Varies"

"Varies"



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


HTOL

JESD22-

A108


(HTOL):


Ta = 125°C for 1008 hrs

Bias = 6V




after this test.



Q202069, QC16: 0/231

Q203737, QB8: 0/77

ELFR



Bias = 6V



Q202069, QC16: 0/2400

EDR



10K Flash W/E Cycling (125C)+Flash DRB

@ 150oC for 1008hrs






Q202069, QC16: 0/231



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


WBS



1 5 LJME005FZ300: 0/5, Cpk>1.67 Performed by Assembly Site



qual lot build ERF

WBP

MilStd883-

2011


Cond. C or D



1 5 LJME005FZ300: 0/5, Cpk>1.67 Performed by Assembly Site



qual lot build ERF

SD

JESD22-

B102

Solderability (SD):


prior to test.



>95% lead coverage

of critical areas


Transfer

PD

JESD22-

B100




Transfer

DIM

&

Dimensional (DIM):


drawing.

DIM: Not Required

BOM: Done



&

BOM BOM Verification (BOM):


accurate.

SBS







Cpk = or >1.67 10


devices)



Chips.

LI

JESD22-

B105




No lead breakage or

cracks

5


parts)

0 0



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable

Comments

EM





technologies.

TDDB


(TDDB)





technologies.

HCI





technologies.

SM





technologies.

NBTI


(NBTI)





technologies.



Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: Apr 23, 2011

68HC908QB8

"QB8"

"Varies"

"Varies"



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


TEST


(TEST):







HBM

AEC-Q100-002 /

JESD22-A114E

Jan 2007



(HBM):

Test @ 500/1000/1500/2000 Volts



TEST @ RH

2KV min.

3 units per Voltage level 0 0 pass Generic Data:

Q203737, QB8(SOIC16):

0/3@500

0/3@1000

0/3@1500

0/3@2000

MM

AEC-Q100-003

or JESD22



Test @ 50/100/200 Volts



TEST @ RH

200V min.


Q203737, QB8(SOIC16):

0/3@50

0/3@100

0/3@150

0/3@200

CDM



(CDM):

Test @ 250/500/750 Volts




TEST @ RH

All pins =/> 500V


0/3@250V

0/3@500V

0/3@750V(CP)

Levels below 500V for all other

pins require customer approval.

LU

JESD78

plus

AEC-Q100-

004 for AEC

Latch-up (LU):



Ta= 125oC

Vsupply = TBDV Maximum operating

voltage


Q203737, QB8(SOIC16):

0/6@100mA

ED

AEC-Q100-009,

Freescale 48A

spec

Electrical Distribution (ED) TEST @ RHC 5 0 0 Completed Done on QB8 SOIC16 W

FG

For AEC, AEC-

Q100-007


90% for qual units

FG%= No Change

CHAR

For AEC, AEC-

Q003




For AEC, AEC-

Q100-006


Leakage (GL):

TEST @ R 6 1 6 LJME005FZ300: 0/6


GL (for

information

only)

Q100-006 Leakage (GL):

155°C, 2.0 min, +400/-400 V







EMC

SAE J1752/3 -

Radiated

Emissions





<40dBuV

150KHz - 1GHz

1 0 0



203737 M81Z HC908QB8 85% UDRSST FSL-CHD-FAB 7.2336 10010064M


(s)

Die Area

(mm2)Assembly Site Pkg Description/Code Mold Description EPOXY Description Wire Description

202067 M80Z HC908QC16 9.61625124 FSL-TJN-FM TSSOP 16/6117 G700K ABLEBOND 8290 25 um Au

203721 M05Z HC908QY4(Nitron Classic) 7.3136949 FSL-TJN-FM TSSOP 16/6117 G700K ABLEBOND 8290 25 um Au

Revision Date Author

Rev O 25-Aug-09 T. Gause

Rev 1.0 26-Aug-09 T. Gause

Rev 2.0 23-Apr-11 Nancy Long

Die Qual Vehicles


Comments

General Notes:


2 - QB8 BOM: SUMITOMO G700K Mold Compound, ABLEBOND 8290 Die Attach Epoxy, 25um Gold Wire

Generated Plan

Reviewed qual plan with H.P. Wang - TJN Reliability, PE and PM team.

Add Qual Result


Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: Apr 23, 2011

68HC908QB8

"QB8"

"Varies"

"Varies"

Objective:

Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:Rev A - Result

Date: May 5, 2011

Technology:


Fab / Assembly /



may be electronic)

Maskset#:


PPE Approval (for

DIM/BOM results)

Signature & Date:

Ziep Tran

May-12-2011

Die Size (in mm)


Nancy Long

May-12-2011

Part Operating




Customer Approval




Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


PC

JESD22-

A113

J-STD-020






Q202065, QC16: 0/693

Q203722, QY4: 0/693

Q206298, QB8: 0/231

HAST

JESD22-

A101

A110





Bias = 5V



Q202065, QC16: 0/231

Q203722, QY4: 0/231

AC

JESD22-

A102

A118

Autoclave (AC):


@ MSL3, 260oC



TEST @ R 77 0 0 pass Q202065, QC16: 0/231

Q203722, QY4: 0/231

TC

JESD22-

A104

AEC Q100-

Appendix 3




TEST @ H 77 0 0 pass Generic data:

Q206298, QB8 16TSSOP Auto:

0/231, WP: 0/5, min>3g

PC + PTC

JESD22-

A105




criteria)






inductive loads.









Commercial/Industrial Qual Results


"QB8"

"Varies"

"Varies"

U050FXXD /85%UDRSST

2003 /SOIC 16W Jim Carlquist - RMSD80

PC + PTCPC= MSL @ °C, +5/-0°C


Bias =

PTC

JESD22-

A105




Bias =





inductive loads.

HTSL

JESD22-

A103


175oC for 504 hrs


TEST @ RH 77 0 0 pass Q206298, QB8: 0/77


Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: Apr 23, 2011

68HC908QB8

"QB8"

"Varies"

"Varies"



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


HTOL

JESD22-

A108


(HTOL):


Ta = 125°C for 1008 hrs

Bias = 6V




after this test.



Q202069, QC16: 0/231

Q203737, QB8: 0/77

ELFR



Bias = 6V



Q202069, QC16: 0/2400

EDR



10K Flash W/E Cycling (125C)+Flash @

150oC for 1008hrs






Q202069, QC16: 0/231



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


WBS



0 0 pass QB8 SOIC16 W Auto Qual: 0/5,

Cpk=3.89

WBP

MilStd883-

2011


Cond. C or D



0 0 pass QB8 SOIC16 W Auto Qual: 0/6,

Cpk=3.35

SD

JESD22-

B102

Solderability (SD):


prior to test.



>95% lead coverage

of critical areas


Transfer

PD

JESD22-

B100




Transfer

DIM

&

BOM

Dimensional (DIM):


drawing.



DIM: Not Required

BOM: done



BOMPPE to verify qual lot ERF BOM is

accurate.

SBS







Cpk = or >1.67 10


devices)



Chips.

LI

JESD22-

B105




No lead breakage or

cracks

5


parts)

0 0



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable

Comments

EM





technologies.

TDDB


(TDDB)





technologies.

HCI





technologies.

SM





technologies.

NBTI


(NBTI)





technologies.



Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: Apr 23, 2011

68HC908QB8

"QB8"

"Varies"

"Varies"



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


TEST


(TEST):







HBM

AEC-Q100-002 /

JESD22-A114E

Jan 2007



(HBM):

Test @ 500/1000/1500/2000 Volts



TEST @ RH

2KV min.


Q203737, QB8(SOIC16):

0/3@500V

0/3@1000V

0/3@1500V

0/3@2000V

MM

AEC-Q100-003

or JESD22



Test @ 50/100/200 Volts



TEST @ RH

200V min.


Q203737, QB8(SOIC16):

0/3@50V

0/3@100V

0/3@150V

0/3@200V

CDM



(CDM):

Test @ 250/500/750 Volts




TEST @ RH

All pins =/> 500V

3 units per Voltage level 0 0 pass Generic data

Q203737, QB8(SOIC16 W)

0/3@250V

0/3@500V

0/3@750V

LU

JESD78

plus

AEC-Q100-

004 for AEC

Latch-up (LU):



Ta= 125oC


voltage


Q203737, QB8(SOIC16): 0/6

ED

AEC-Q100-009,

Freescale 48A

spec

Electrical Distribution (ED) TEST @ RHC AEC: 30 0 0 completed Done on QB8 SOIC16 W

FG

For AEC, AEC-

Q100-007


90% for qual units

FG%= No Change

CHAR

For AEC, AEC-

Q003




GL (for

For AEC, AEC-

Q100-006


Leakage (GL):

155°C, 2.0 min, +400/-400 V


TEST @ R 6 0 0


GL (for

information

only)







EMC

SAE J1752/3 -

Radiated

Emissions





<40dBuV

150KHz - 1GHz

1 0 0





(s)

Die Area



203722 M05Z HC908QY4 7.3136949 FSL-TJN-FM SOIC 16 W/2003 SUMITOMO G600 ABLEBOND 8290 25 um Au

206298 M81Z HC908QB8_AUTO 7.126662 FSL-TJN-FM SOIC 16 W/2003 SUMITOMO G600 ABLEBOND 8290 25 um Au

Date Author


5 May. 2011 Nancy LongRev A Update the result

General Notes:


2 - QB8 BOM: SUMITOMO G600 Mold Compound, ABLEBOND 8290 Die Attach Epoxy, 25um Gold Wire

Die Qual Vehicles


Revision Comments

Rev O Generated standalone No BI qual plan.


Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: Apr 23, 2011

68HC908QB8

"QB8"

"Varies"

"Varies"

Objective:

Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:Rev A - Result

Date: May 5, 2011

Technology:


Fab / Assembly /



may be electronic)

Maskset#:


PPE Approval (for

DIM/BOM results)

Signature & Date:

Ziep Tran

May-12-2011

Die Size (in mm)


Nancy Long

May-12-2011

Part Operating




Customer Approval




Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


PC

JESD22-

A113

J-STD-020






Q202067, QC16: 0/693


0/693

Q204137, QB8: 0/77

HAST

JESD22-

A101

A110





Bias = 5V



Q202067, QC16: 0/231


0/231

AC

JESD22-

A102

A118

Autoclave (AC):


@ MSL3, 260oC




Q202067, QC16: 0/231


0/231

TC

JESD22-

A104

AEC Q100-

Appendix 3



@ MSL3, 260°C


TEST @ H 77 0 0 pass Generic Data:

Q202067, QC16: 0/231, WP: 0/5


0/231, WP: 0/5

Q204137, QB8: 0/77, WP: 0/5







U050FXXD /85%UDRSST

6117 /TSSOP16 Jim Carlquist - RMSD80





"QB8"

"Varies"

"Varies"

HTSL

JESD22-

A103


150°C for 168hrs, 504hrs and 1000 hrs

and/or 175oC for 168hrs and 500 hrs



Q202069, Nitron QC16, EDR:

0/231@150C, 1008Hrs


0/77@175C, 504Hrs


Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: Apr 23, 2011

68HC908QB8

"QB8"

"Varies"

"Varies"



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


HTOL

JESD22-

A108


(HTOL):


Ta = 125°C for 1008 hrs

Bias = 6V




after this test.



Q202069, QC16: 0/231

Q203737, QB8: 0/77

ELFR



Bias = 6V



Q202069, QC16: 0/2400

EDR



10K Flash W/E Cycling (125C)+Flash DRB

@ 150oC for 1008hrs






Q202069, QC16: 0/231



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


WBS



0 0 pass QB8 TSSOP16 Auto Qual: 0/5,

Cpk=4.02

WBP

MilStd883-

2011


Cond. C or D



0 0 pass QB8 TSSOP16 Auto Qual: 0/5,

Cpk=3.07

SD

JESD22-

B102

Solderability (SD):


prior to test.



>95% lead coverage

of critical areas


Transfer

PD

JESD22-

B100




Transfer

DIM

&

BOM

Dimensional (DIM):


drawing.


DIM: Not Required

BOM: Done





accurate.

SBS







Cpk = or >1.67 10


devices)



Chips.

LI

JESD22-

B105




No lead breakage or

cracks

5


parts)

0 0



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable

Comments

EM





technologies.

TDDB


(TDDB)





technologies.

HCI





technologies.

SM





technologies.

NBTI


(NBTI)





technologies.



Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: Apr 23, 2011

68HC908QB8

"QB8"

"Varies"

"Varies"



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


TEST


(TEST):







HBM

AEC-Q100-002 /

JESD22-A114E

Jan 2007



(HBM):

Test @ 500/1000/1500/2000 Volts



TEST @ RH

2KV min.


Q203737, QB8(SOIC16):

0/3@500V

0/3@1000V

0/3@1500V

0/3@2000V

MM

AEC-Q100-003

or JESD22



Test @ 50/100/200 Volts



TEST @ RH

200V min.


Q203737, QB8(SOIC16):

0/3@50V

0/3@100V

0/3@150V

0/3@200V

CDM



(CDM):

Test @ 250/500/750 Volts




TEST @ RH

All pins =/> 500V


Q204137: QB8 Auto(TSSOP16)

0/3@250V

0/3@500V

0/3@750V

LU

JESD78

plus

AEC-Q100-

004 for AEC

Latch-up (LU):



Ta= 125oC


voltage


Q203737, QB8(SOIC16):

0/6@100mA

ED

AEC-Q100-009,

Freescale 48A

spec

Electrical Distribution (ED) TEST @ RHC AEC: 30 0 0 completed Done on QB8 SOIC16 W

FG

For AEC, AEC-

Q100-007


90% for qual units

FG%= No Change

CHAR

For AEC, AEC-

Q003




For AEC, AEC-

Q100-006


Leakage (GL):

155°C, 2.0 min, +400/-400 V

TEST @ R 6 0 0


GL (for

information

only)

155°C, 2.0 min, +400/-400 V







EMC

SAE J1752/3 -

Radiated

Emissions





<40dBuV

150KHz - 1GHz

1 0 0





(mm2)


202067 M80Z HC908QC16 9.61625124 FSL-TJN-FM TSSOP 16/6117 G700K ABLEBOND 8290 25 um Au

203721 M05Z HC908QY4(Nitron Classic) 7.3136949 FSL-TJN-FM TSSOP 16/6117 G700K ABLEBOND 8290 25 um Au

204137 M81Z HC908QB8_AUTO 7.126662 FSL-TJN-FM TSSOP 16/6117 G700K ABLEBOND 8290 25 um Au

Date Author


5 May. 2011 Nancy Long

Rev O Generated standalone No BI qual plan.

Rev A Update the result

General Notes:


2 - QB8 BOM: SUMITOMO G700K Mold Compound, ABLEBOND 8290 Die Attach Epoxy, 25um Gold Wire

Die Qual Vehicles


Revision Comments


(Nitron 0M81Z) Electrical DistributionPer AEC Q100 Rev G, ED Appendix Rev B; any key datasheet parameter with Cpk < 1.67 will require justification and FSL NPI Quality approval.

Room

Parameter Name in Datasheet Units Lower Limit Upper Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpkidd_run_5v mA 0 10 4.87247 0.0504723 33.86 4.83073 0.03289 32.12 4.89585 0.0595413 28.57 5.00769 0.03272 50.8528 PASS PASSidd_run_3v mA 0 5 2.50824 0.0195152 42.56 2.52136 0.02202 38.07 2.51257 0.0292038 28.39 2.59781 0.01613 49.6391 PASS PASSidd_wait_3v mA 0 1 0.862396 0.0145848 3.14 0.905 0.01448 20.83 0.850752 0.0110601 4.5 0.91749 0.0094 6.47405 PASS PASSidd_wait_5v mA 0 2 1.40326 0.0185992 10.69 1.4523 0.01544 11.82 1.41143 0.0214279 9.16 1.50746 0.01165 14.0916 PASS PASSidd_stop_MTemp_3v uA 0 0.8 0.28486 0.0946082 3.62 0.27911 0.08438 2.06 0.299154 0.114796 3.19 0.24141 0.04204 1.8964 PASS PASSidd_stop_MTemp_5v uA 0 1 0.390223 0.0944096 4.91 0.35938 0.0068 1.76 0.346032 0.16199 3.86 0.33397 0.035 3.1804 PASS PASS

Hot

Parameter Name in Datasheet Units Low Limit Upper Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpkidd_run_5v mA 0 10 4.96145 0.0395531 42.46 5.01219 0.05758 28.87 4.96976 0.458462 36.57 5.13744 0.05261 30.811 PASS PASSidd_run_3v mA 0 5 2.61336 0.0270699 29.39 2.67104 0.02959 26.24 2.60613 0.0224923 35.48 2.69537 0.02612 29.4091 PASS PASSidd_wait_3v mA 0 1.2 0.522205 0.0123645 18.27 0.56162 0.01423 13.16 0.523355 0.0115446 19.54 0.54885 0.11245 16.3371 PASS PASSidd_wait_5v mA 0 2 1.47485 0.015012 11.66 1.52864 0.01563 10.06 1.47576 0.0164372 10.63 1.56249 0.01412 10.3301 PASS PASSidd_stop_MTemp_3v uA 0 4 1.20134 0.0800364 11.67 1.4424 0.62112 1.87 1.14295 0.0780312 12.2 1.268 0.01168 2.089 PASS PASSidd_stop_MTemp_5v uA 0 5 1.56756 0.147572 7.75 1.7614 0.55643 1.76 1.53072 0.156033 7.41 1.903 0.03836 1.886 PASS PASS

Cold

Parameter Name in Datasheet Units Low Limit Upper Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpkidd_run_5v mA 0 10 4.96808 0.04381693 23.0651 4.83978 0.03834 2.47 4.94136 0.05129269 32.87 4.94801 0.0358 47.04 PASS PASSidd_run_3v mA 0 5 2.53136333 0.03195887 25.7481 2.5223 0.02336 35.99 2.54447 0.03722279 21.99 2.53908 0.03215 25.51 PASS PASSidd_wait_3v mA 0 1 0.49175292 0.01760569 9.31049 0.50028 0.00858 19.41 0.51145 0.0769125 2.12 0.48785 0.01635 12.48 PASS PASSidd_wait_5v mA 0 2 1.48173667 0.01636924 10.5536 1.5123 0.00773 21.03 1.47810 0.01961444 8.87 1.47674 0.01701 10.25 PASS PASSidd_stop_MTemp_3v uA 0 0.8 0.28381557 0.05212473 3.30096 0.22603 0.05361 2.4 0.28999 0.09327858 1.82 0.29651 0.11386 2.06 PASS PASSidd_stop_MTemp_5v uA 0 1 0.38513601 0.06960016 2.94474 0.31001 0.04498 2.3 0.38324 0.0605671 3.39 0.38022 0.09331 3.21 PASS PASS

Comment

Comment

Report Date: 20/Apr/11Report Revision: 0

CHD Devices Pre HTOL CHD Devices Post HTOLSND Devices Pre HTOL SND Devices Post HTOL Pre CHD mean+-1

SND sigma or +-10%

Post CHD mean+-1

SND sigma or +-10%

Comment

25C 25C 25C25C

125C 125C 125C

CHD Devices Pre HTOL CHD Devices Post HTOL SND Devices Post HTOLSND Devices Pre HTOL

125C

-40CSND Devices Post HTOL

Pre CHD mean+-1

SND sigma or +-10%

Post CHD mean+-1

SND sigma or +-10%

Pre CHD mean+-1

SND sigma or +-10%

Post CHD mean+-1

SND sigma or +-10%

CHD Devices Pre HTOL CHD Devices Post HTOL-40C -40C

SND Devices Pre HTOL-40C



For HC908QC16FSL-CHD- Fab/Mask M80Z

Objective:

Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


Technology:

Package: Design Engr: QUARTZ Tracking #: 206280(package)/202069(die)

Fab / Assembly /



electronic)

Maskset#:


PPE Approval (for

DIM/BOM results)

Signature & Date:

Shong Lee Ming

May-6-2011

Die Size (in mm)


Nancy Long

5-May-2011

Part Operating


LOT A(die qual)

LJXE05123K00

5CTQV10511

LOT B(die qual)

LJXE05123L00

5CTQW10512

LOT C(die qual)

LJXE05123M00

5CTQX10513

CAB Approval

Signature & Date:

10272023M

13-May-2011

LOT D

LJXED4827Z00

5CTQQ1048

LOT E

LJXED4828100

5CTQQ1048

LOT F

LJXED4828000

5CTQQ1048

Customer Approval




Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


PC

JESD22-

A113

J-STD-020




with justification)

TEST @ RH LJXED4827Z00: 0/231

LJXED4828100: 0/231

LJXED4828000: 0/231

Use 28 TSSOP Package

Use material that has been Burn-in

HAST

JESD22-

A101

A110



MSL3, 260oC


Bias = 5V


TEST @ RH 77 3 231 LJXED4827Z00: 0/77

LJXED4828100: 0/77

LJXED4828000: 0/77



AC

JESD22-

A102

A118

Autoclave (AC):


260oC



TEST @ R 77 3 231 LJXED4827Z00: 0/77

LJXED4828100: 0/77

LJXED4828000: 0/77



TC

JESD22-

A104

AEC Q100-

Appendix 3





lot; 2 bonds per corner and one mid-bond per side

on each device. Record which pins were used.

TEST @ H

For AEC: WBP =/> 3

grams

77 3 231 LJXED4827Z00: 0/77, WP: 0/5, min>3g

LJXED4828100: 0/77

LJXED4828000: 0/77



PC + PTC

JESD22-

A105Preconditioning plus Power Temperature Cycle

(PC+PTC):



PC= MSL @ °C, +5/-0°C


Bias =



Delta-Tj > 40C or for devices designed

to drive inductive loads.

AEC-Q100/Commercial/Industrial Tier Qual Results

"Varies"

"Varies"

Liu David - R66090

Qualification of 85% UDRSST 68HC908QC16 in CHD 68HC908QC16

QC16

3.546x2.711


U050FXXD /85%UDRSST

20TSSOP Pkg Code 6118 /28 TSSOP Pkg Code 6142

FSL-CHD-FAB/ATP1 /FSL-TJN-FM


Ziep Tran - RSJP50/Shong Lee Ming-B21406


M80Z

0



All surface mount devices prior to THB, HAST, AC, UHST, TC, PC+PTC and

as required per test conditions.

Bias =

PTC

JESD22-

A105Power Temperature Cycle (PTC):



Bias =





HTSL

JESD22-

A103High Temperature Storage Life (HTSL):

150°C for 168hrs, 504hrs and 1000 hrs and/or



TEST @ RH 77 0 0 See EDR


Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


"Varies"

"Varies"

68HC908QC16

QC16



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


HTOL

JESD22-

A108High Temperature Operating Life (HTOL):


Ta = 125°C for 1008 hrs

Bias = 6V


endurance preconditioning' prior to this test, and

special NVM test sequencing after this test.


TEST @ RHC 77 3 231 LJXE05123K00: 0/77

LJXE05123L00: 0/77

LJXE05123M00: 0/77

ELFR



Bias = 6V


TEST @ RH 800 3 2400 LJXE05123K00: 0/800

LJXE05123L00: 0/800

LJXE05123M00: 0/800

Use 28 TSSOP Burn In Material

ELFR



Bias = 6V


TEST @ RH 800 3 2400 LJXE05123K00: 0/800

LJXE05123L00: 0/800

LJXE05123M00: 0/800

Use 28 TSSOP Material that has not

been burned in

EDR



10K Flash W/E Cycling (125oC)+Flash DRB @

150oC for 1008hrs


endurance preconditioning'(W/E cycling). Test R,

H, C after W/E cycling.


TEST @ RHC 77 3 231 LJXE05123K00: 0/77

LJXE05123L00: 0/77

LJXE05123M00: 0/77



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


WBS



1 5 XE04827Z00, 0/5, Cpk>1.67

XE04828000, 0/5, Cpk>1.67

XE04828100, 0/5, Cpk>1.67

Performed by Assembly Site during qual

lot builds - PE to include this

requirement in the qual lot build ERF

WBP

MilStd883-

2011Wire Bond Pull (WBP):

Cond. C or D



1 5 XE04827Z00, 0/5, Cpk>1.67

XE04828000, 0/5, Cpk>1.67

XE04828100, 0/5, Cpk>1.67




SD

JESD22-

B102Solderability (SD):


test.



>95% lead coverage

of critical areas


PD

JESD22-

B100Physical Dimensions(PD):



DIM

&

Dimensional (DIM):


drawing.


DIM: Not Required

BOM: done



&



SBS




NOT Flip Chip).


before shear.

Cpk = or >1.67 10


10 devices)

0 0 For solder ball mounted packages only;

NOT for Flip Chips.

LI

JESD22-

B105Lead Integrity (LI):



No lead breakage or

cracks

5


parts)

0 0



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable

Comments

EM


internal criteria should be available to

the customer upon request for new

technologies.

TDDB




technologies.

HCI




technologies.

SM




technologies.

NBTI




technologies.



Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


"Varies"

"Varies"

68HC908QC16

QC16



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


TEST



AEC-Q100-007.





HBM

AEC-Q100-002 /

JESD22-A114E

Jan 2007



Test @ 500/1000/1500/2000 Volts


levels.

TEST @ RH

2KV min.

3 units per Voltage level 1 12 LJXE05123K00:

0/3@500V

0/3@1000V

0/3@1500V

0/3@2000V

Performed using 28 TSSOP

MM

AEC-Q100-003

or JESD22ElectroStatic Discharge/


Test @ 50/100/150/200 Volts


levels.

TEST @ RH

200V min.


0/3@50V

0/3@100V

0/3@150V

0/3@200V


CDM



Test @ 250/500/750 Volts


levels.


TEST @ RH

All pins =/> 500V


0/3@250V

0/3@500V

0/3@750V


LU

JESD78

plus

AEC-Q100-

004 for AEC

Latch-up (LU):



Ta= 125oC


TEST @ RH 6 1 6 LJXE05123K00:

0/6


ED

AEC-Q100-009,

Freescale 48A

spec

Electrical Distribution (ED) TEST @ RHC 30 3 90 LJXE05123K00: Cpk>1.67

LJXE05123L00; Cpk>1.67

LJXE05123M00; Cpk>1.67

FG

For AEC, AEC-

Q100-007Fault Grading (FG) FG shall be = or >

90% for qual units

FG%= No Change

CHAR

For AEC, AEC-

Q003Characterization (CHAR):



GL (for

information only)

For AEC, AEC-

Q100-006Electro-Thermally Induced Gate Leakage (GL):

155°C, 2.0 min, +400/-400 V


information only.



TEST @ R 6 1 6 LJXE05123K00: 0/6


information only) For all failures, perform unbiased bake

(4hrs/125°C, or 2hrs/150°C) and retest; recovered

units are GL failures.

EMC

SAE J1752/3 -

Radiated

Emissions





<40dBuV

150KHz - 1GHz

1 1 1 Report available upon request.

Date Author

25-Aug-09 T. Gause

27-Apr-11 Nancy LongRev A Add Qual Result

General Notes:

1 -QC16 Wafer tech code U050FXXD

2 -QC16 BOM: SUMITOMO G700K Mold Compound, ABLEBOND 8290 Die Attach Epoxy, 1mil Gold Wire

Generated Plan

Revision Comments

Rev O


Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


"Varies"

"Varies"

68HC908QC16

QC16

Objective:

Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


Technology:


Fab / Assembly /



electronic)

Maskset#:


PPE Approval (for

DIM/BOM results)

Signature & Date:

Ziep Tran

6-May-2011

Die Size (in mm)


Nancy Long

5-May-2011

Part Operating


LOT A

TJEME005F3V00

4YTUA

LOT B

TJEME005F3W00

4YTUB

LOT C

TJEME005F3X00

4YTUD

CAB Approval

Signature & Date:

10272023M

13-May-2011

Customer Approval




Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


PC

JESD22-

A113

J-STD-020




with justification)

TEST @ RH LotA: 0/231

LotB: 0/231

LotC: 0/231

HAST

JESD22-

A101

A110



MSL3, 260oC


Bias = 5V


TEST @ RH 77 3 231 LotA: 0/77

LotB: 0/77

LotC: 0/77

AC

JESD22-

A102

A118

Autoclave (AC):


260oC



TEST @ R 77 3 231 LotA: 0/77

LotB: 0/77

LotC: 0/77

TC

JESD22-

A104

AEC Q100-

Appendix 3



TC = -65°C to 150°C for 500 cycles




TEST @ H

For AEC: WBP =/> 3

grams

77 3 231

LotA: 0/77, WBP: 0/5, min>3g

LotB: 0/77

LotC: 0/77

JESD22- Preconditioning plus Power Temperature Cycle TEST @ RH 0 0 0 Only Required for AEC devices with


QC16

"Varies"

"Varies"

U050FXXD /85%UDRSST

16 TSSOP Pkg Code 6117 Jim Carlquist - RMSD80

FSL-CHD-FAB/FSL-TJN-FM /FSL-TJN-FM Liu David - R66090


M80Z








PC + PTC

JESD22-


(PC+PTC):



PC= MSL @ °C, +5/-0°C


Bias =





PTC

JESD22-




Bias =





HTSL

JESD22-


150oC for 1008 hrs


TEST @ RH 77 1 77 LotC: 0/77


Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


"Varies"

"Varies"

68HC908QC16

QC16



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


HTOL

JESD22-


10k W/E Cycling (125oC) + HTOL

Ta = 125°C for 1008 hrs

Bias = 6V





TEST @ RHC 77 0 0 pass See TSSOP Qual Results

Q202069, QC16(28TSSOP): 0/231

ELFR



Bias = 6V


TEST @ RH 800 0 0 pass See TSSOP Qual Results

Q202069, QC16(28TSSOP): 0/2400

EDR



10K Flash W/E Cycling (125C)+Flash DRB @

150°C for 1008hrs






Q202069, QC16(28TSSOP): 0/231



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


WBS



1 5 LotA: 0/5, Cpk>1.67

LotB: 0/5, Cpk>1.67

LotC: 0/5, Cpk>1.67




WBP

MilStd883-


Cond. C or D



1 5 LotA: 0/5, Cpk>1.67

LotB: 0/5, Cpk>1.67

LotC: 0/5, Cpk>1.67




SD

JESD22-



test.



>95% lead coverage

of critical areas


PD

JESD22-




DIM

&

BOM

Dimensional (DIM):


drawing.



DIM: Not Required

BOM: done

SBS




NOT Flip Chip).


Cpk = or >1.67 10


10 devices)


NOT for Flip Chips.




before shear.

LI

JESD22-




No lead breakage or

cracks

5


parts)

0 0



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable

Comments

EM




technologies.

TDDB




technologies.

HCI




technologies.

SM




technologies.

NBTI




technologies.



Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


"Varies"

"Varies"

68HC908QC16

QC16



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


TEST



AEC-Q100-007.





HBM

AEC-Q100-002 /

JESD22-A114E

Jan 2007



Test @ 500/1000/1500/2000 Volts


levels.

TEST @ RH

2KV min.

3 units per Voltage level 0 0 pass See TSSOP28 Qual Results

Q202069, QC16(28TSSOP):

0/3@500V

0/3@1000V

0/3@1500V

0/3@2000V

MM

AEC-Q100-003



Test @ 50/100/200 Volts


levels.

TEST @ RH

200V min.

3 units per Voltage level 0 0 pass See TSSOP28 Qual Results

Q202069, QC16(28TSSOP):

0/3@50V

0/3@100V

0/3@150V

0/3@200V

CDM



Test @ 250/500/750 Volts


levels.


TEST @ RH

All pins =/> 500V


0/3@250V

0/3@500V

0/3@750V

LU

JESD78

plus

AEC-Q100-

004 for AEC

Latch-up (LU):



Ta= 125oC


TEST @ RH 6 0 0 pass See TSSOP28 Qual Results

Q206280/202069, QC16(28TSSOP):

0/6

ED

AEC-Q100-009,

Freescale 48A

spec

Electrical Distribution (ED) TEST @ RHC 30 0 0 completed Done on QC16 TSSOP28 package

FG

For AEC, AEC-


90% for qual units

FG%= No Change

CHAR

For AEC, AEC-




GL (for

information only)

For AEC, AEC-


155°C, 2.0 min, +400/-400 V


information only.


TEST @ R 6 1 6 LotA: 0/6


information only) For all failures, perform unbiased bake



EMC

SAE J1752/3 -

Radiated

Emissions





<40dBuV

150KHz - 1GHz

1 0 0 Done on TSSOP28 pacakge


202069 M80Z HC908QC16 85% UDRSST FSL-CHD-FAB 9.61625124 10272023M 13-May-11

Date Author

25-Aug-09 T. Gause


General Notes:


2 - QC16 BOM: SUMITOMO G700K Mold Compound, ABLEBOND 8290 Die Attach Epoxy, 25um Gold Wire

Die Qual Vehicles

Revision Comments

Rev A Add Qual Result



Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


"Varies"

"Varies"

68HC908QC16

QC16

Objective:

Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


Technology:


Fab / Assembly /



electronic)

Maskset#:


PPE Approval (for

DIM/BOM results)

Signature & Date:

Ziep Tran

6-May-2011

Die Size (in mm)


Nancy Long

5-May-2011

Part Operating


LOT A

TJEME005GQD00

CTNAQQ1049A

LOT B

TJEME005GQE00

CTNAQQ1049B

LOT C

TJEME005GQC00

CTNAQQ1049D

CAB Approval

Signature & Date:

10272023M

13-May-2011

Customer Approval




Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


PC

JESD22-

A113

J-STD-020




with justification)


LotB: 0/231

LotC: 0/231

HAST

JESD22-

A101

A110



MSL3, 260oC


Bias = 5V


TEST @ RH 77 3 231 LotA: 0/77

LotB: 0/77

LotC: 0/77

AC

JESD22-

A102

A118

Autoclave (AC):


260oC



TEST @ R 77 3 231 LotA: 0/77

LotB: 0/77

LotC: 0/77

TC

JESD22-

A104

AEC Q100-

Appendix 3





TEST @ H

For AEC: WBP =/> 3

grams

77 3 231 LotA: 0/77, WP: 0/5, Min>3

LotB: 0/77

LotC: 0/77







M80Z



Comm/Ind Tier Qual Results


QC16

"Varies"

"Varies"

U050FXXD /85%UDRSST

2003/16W SOIC Jim Carlquist - RMSD80



PC + PTC

JESD22-


(PC+PTC):



PC= MSL @ °C, +5/-0°C


Bias =





PTC

JESD22-




Bias =





HTSL

JESD22-


175oC for 504 hrs


TEST @ RH 77 1 77 LotA: 0/77


Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


"Varies"

"Varies"

68HC908QC16

QC16



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


HTOL

JESD22-



Ta = 125°C for 1008 hrs

Bias = 6V






Q202069, QC16(28TSSOP): 0/231

ELFR



Bias = 6V



Q202069, QC16(28TSSOP): 0/2400

EDR



10K Flash (Page) W/E Cycling (125C)+Flash

DRB @ 150°C for 1008hrs






Q202069, QC16(28TSSOP): 0/231



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


WBS



1 5 LotA: 0/5, Cpk>1.67

LotB: 0/5, Cpk>1.67

LotC: 0/5, Cpk>1.67




WBP

MilStd883-


Cond. C or D



1 5 LotA: 0/5, Cpk>1.67

LotB: 0/5, Cpk>1.67

LotC: 0/5, Cpk>1.67




SD

JESD22-



test.



>95% lead coverage

of critical areas


PD

JESD22-




DIM

&

BOM

Dimensional (DIM):


drawing.



DIM: Not Required

BOM: done

AEC-Q100-010 Solder Ball Shear (SBS): Cpk = or >1.67 10 0 0 For solder ball mounted packages only;



SBS




NOT Flip Chip).


before shear.

Cpk = or >1.67 10


10 devices)


NOT for Flip Chips.

LI

JESD22-




No lead breakage or

cracks

5


parts)

0 0



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable

Comments

EM




technologies.

TDDB




technologies.

HCI




technologies.

SM




technologies.

NBTI




technologies.



Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


"Varies"

"Varies"

68HC908QC16

QC16



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


TEST



AEC-Q100-007.





HBM

AEC-Q100-002 /

JESD22-A114E

Jan 2007



Test @ 500/1000/1500/2000 Volts


levels.

TEST @ RH

2KV min.

3 units per Voltage level 0 0 pass See TSSOP Qual Results

Q202069, QC16(28TSSOP):

0/3@500V

0/3@1000V

0/3@1500V

0/3@2000V

MM

AEC-Q100-003



Test @ 50/100/200 Volts


levels.

TEST @ RH

200V min.


Q202069, QC16(28TSSOP):

0/3@50V

0/3@100V

0/3@150V

0/3@200V

CDM



Test @ 250/500/750 Volts


levels.


TEST @ RH

All pins =/> 500V


0/3@250V

0/3@500V

0/3@750V

CDM will be done in KLM

Levels below 500V for all other pins

require customer approval.

LU

JESD78

plus

AEC-Q100-

004 for AEC

Latch-up (LU):



Ta= 125oC



Q206280/202069, QC16(28TSSOP):

0/6

ED

AEC-Q100-009,

Freescale 48A

spec

Electrical Distribution (ED) TEST @ RHC AEC: 30

Comm/Ind: 5

0 0 completed Done on QC16 TSSOP28 package

FG

For AEC, AEC-


90% for qual units

FG%= No Change

CHAR

For AEC, AEC-




GL (for

information only)

For AEC, AEC-


155°C, 2.0 min, +400/-400 V


information only.





TEST @ R 6 0 0



EMC

SAE J1752/3 -

Radiated

Emissions





<40dBuV

150KHz - 1GHz



202069 M80Z HC908QC16 85% UDRSST FSL-CHD-FAB 9.61625124 10272023M 13-May-11

Date Author

25-Aug-09 T. Gause


General Notes:


2 - QC16 BOM: SUMITOMO G600 Mold Compound, ABLEBOND 8290 Die Attach Epoxy, 25um Gold Wire

Die Qual Vehicles

Revision Comments



Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


"Varies"

"Varies"

68HC908QC16

QC16

Objective:

Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


Technology:


Fab / Assembly /



electronic)

Maskset#:


PPE Approval (for

DIM/BOM results)

Signature & Date:

Ziep Tran

May-6-2011

Die Size (in mm)


Nancy Long

May-5-2011

Part Operating


LOT A

TJEME005F3400

CTNAZM1046A

LOT B

JEME005ERD00

CTNAZM1046D

LOT C

TJEME005EE400

CTNAZM1047D

CAB Approval

Signature & Date:

10272023M

13-May-2011

Customer Approval




Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


PC

JESD22-

A113

J-STD-020




with justification)


LotB: 0/231

LotC: 0/231

HAST

JESD22-

A101

A110



MSL3, 260oC


Bias = 5V


TEST @ RH 77 3 231 LotA: 0/77

LotB: 0/77

LotC: 0/77

AC

JESD22-

A102

A118

Autoclave (AC):


260oC



TEST @ R 77 3 231 LotA: 0/77

LotB: 0/77

LotC: 0/77

TC

JESD22-

A104

AEC Q100-

Appendix 3







TEST @ H(C)

For AEC: WBP =/> 3

grams

77 3 231 LotA: 0/77, WP: 0/5, Min>3

LotB: 0/77

LotC: 0/77







M80Z Ziep Tran - RSJP50


Comm/Ind Tier Qual Results


QC16

"Varies"

"Varies"

U050FXXD /85%UDRSST

2009/28W SOIC Jim Carlquist - RMSD80

PC + PTC

JESD22-


(PC+PTC):



PC= MSL @ °C, +5/-0°C


Bias =





PTC

JESD22-




Bias =





HTSL

JESD22-


175oC for 504 hrs


TEST @ RH 77 1 77 LotC: 0/77


Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


"Varies"

"Varies"

68HC908QC16

QC16



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


HTOL

JESD22-



Ta = 125°C for 1008 hrs

Bias = 6V






Q202069, QC16(28TSSOP): 0/231

ELFR



Bias = 6V



Q202069, QC16(28TSSOP): 0/2400

EDR



10K Flash (Page) W/E Cycling (125C)+Flash

DRB @ 150°C for 1008hrs






Q202069, QC16(28TSSOP): 0/231



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


WBS



1 5 LotA: 0/5, Cpk>1.67

LotB: 0/5, Cpk>1.67

LotC: 0/5, Cpk>1.67




WBP

MilStd883-


Cond. C or D



1 5 LotA: 0/5, Cpk>1.67

LotB: 0/5, Cpk>1.67

LotC: 0/5, Cpk>1.67




SD

JESD22-



test.



>95% lead coverage

of critical areas


PD

JESD22-




DIM

&

BOM

Dimensional (DIM):


drawing.


DIM: Not Required

BOM: done





SBS




NOT Flip Chip).


before shear.

Cpk = or >1.67 10


10 devices)


NOT for Flip Chips.

LI

JESD22-




No lead breakage or

cracks

5


parts)

0 0



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable

Comments

EM




technologies.

TDDB




technologies.

HCI




technologies.

SM




technologies.

NBTI




technologies.



Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:

Revision # & Date:


"Varies"

"Varies"

68HC908QC16

QC16



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


TEST



AEC-Q100-007.





HBM

AEC-Q100-002 /

JESD22-A114E

Jan 2007



Test @ 500/1000/1500/2000 Volts


levels.

TEST @ RH

2KV min.


Q202069, QC16(28TSSOP):

0/3@500V

0/3@1000V

0/3@1500V

0/3@2000V

MM

AEC-Q100-003



Test @ 50/100/200 Volts


levels.

TEST @ RH

200V min.


Q202069, QC16(28TSSOP):

0/3@50V

0/3@100V

0/3@150V

0/3@200V

CDM



Test @ 250/500/750 Volts


levels.


TEST @ RH

All pins =/> 500V

3 units per Voltage level 1 9 LotC:

0/3@250V

0/3@500V

0/3@750V

LU

JESD78

plus

AEC-Q100-

004 for AEC

Latch-up (LU):



Ta= 125oC



Q206280/202069, QC16(28TSSOP):

0/6

ED

AEC-Q100-009,

Freescale 48A

spec

Electrical Distribution (ED) TEST @ RHC 30 0 0 completed Done on QC16 TSSOP28 package

FG

For AEC, AEC-


90% for qual units

FG%= No Change

CHAR

For AEC, AEC-




GL (for

For AEC, AEC-


155°C, 2.0 min, +400/-400 V


information only.




GL (for

information only)Timed RO of 96 hrs MAX.




EMC

SAE J1752/3 -

Radiated

Emissions





<40dBuV

150KHz - 1GHz




Date Author

25-Aug-09 T. Gause


General Notes:


2 - QC16 BOM: SUMITOMO EME-G600 Mold Compound, SUMITOMO CRM-1064MBL Die Attach Epoxy, 25um Gold Wire

Die Qual Vehicles

Revision Comments



(0M80Z, CHD) Electrical DistributionReport Date: Apr/28/2011Report Revision: 0


Hot CHD1 Devices Pre HTOL CHD2 Devices Pre HTOL CHD3 Devices Pre HTOL SND Devices Pre HTOL CHD1 Devices Post HTOL CHD2 Devices Post HTOL CHD3 Devices Post HTOL SND Devices Post HTOL

Comment

130C 130C 130C 130C 130C 130C 130C 130C

Parameter Name in Datasheet Units Lower Limit Upper Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std CpkStop mode VDD supply current,Vdd=3.0V uA 0 5 1.4851968 0.2772625 1.7855482 1.7719258 0.1072874 5.5052291 1.7870355 0.122215 4.87402 3.3836645 0.1165946 4.6209567 1.5608129 0.1828873 2.8447633 1.9430419 0.2951129 2.194688 1.8630774 0.1474566 4.2115824 2.51931 0.1207196 6.8497276Stop mode VDD supply current,Vdd=5.0V uA 0 6.5 1.8724806 0.244345 2.5544218 2.4053935 0.1647558 4.8665829 2.2879613 0.1590007 4.7965422 3.9152452 0.1401464 6.1477502 1.9465935 0.277371 2.339338 2.5327484 0.2160938 3.9068661 2.3795968 0.1875076 4.2302218 2.9718633 0.1473086 6.7248034Run mode VDD supply current,Vdd=3.0V mA 0 4.5 2.5031355 0.0231846 28.709603 2.5216355 0.0207459 31.787286 2.5098355 0.0153448 43.232164 2.608729 0.0282641 22.304766 2.4957903 0.0262236 25.475896 2.5184484 0.0166454 39.681577 2.4997742 0.0145941 45.685765 2.6412533 0.0297552 20.822626Run mode VDD supply current,Vdd=5.0V mA 0 8.5 4.156871 0.0328797 42.142182 4.1899935 0.0285024 49.001672 4.1601839 0.0224722 61.708621 4.3000935 0.0473186 29.586032 4.1661452 0.0371176 37.413946 4.2029581 0.0234534 59.734922 4.1643419 0.0185913 74.664843 4.3512433 0.0452064 30.591221Wait mode VDD supply current,Vdd=3.0V mA 0 2.2 1.2264194 0.0144998 22.38154 1.2305161 0.0157682 20.494525 1.2240516 0.0117922 27.58734 1.2658548 0.0134107 23.218922 1.2139419 0.0155798 21.096919 1.2203161 0.0114975 28.402784 1.2099581 0.011899 27.734697 1.2790867 0.0144112 21.300877Wait mode VDD supply current,Vdd=5.0V mA 0 3.3 1.7405935 0.0151957 34.207237 1.7503323 0.0171186 30.175171 1.7414839 0.0121301 42.827683 1.8184161 0.0161301 30.617298 1.7390355 0.0177886 29.250213 1.7504097 0.0135249 38.191189 1.7372129 0.0122717 42.449452 1.8324067 0.0170188 28.744532

Osc(untrimed) Mhz 2.4 4 2.8909129 0.0694297 2.3568837 3.0118871 0.0803911 2.5371264 3.044729 0.1222903 1.7573734 3.1609774 0.0841881 3.0130038 2.8948452 0.0857472 1.9236585 3.0126581 0.0620458 3.2914283 3.0526 0.1025422 2.1214036 3.1639567 0.0869216 2.9296763Osc(trimed) Mhz 3.04 3.36 3.2259387 0.0055768 8.0130673 3.2122903 0.0120239 4.0948995 3.2053548 0.0098632 5.2263391 3.195329 0.0108434 4.7749015 3.216371 0.0094504 5.0660823 3.2110387 0.0091714 5.4140041 3.2038387 0.0095448 5.4536081 3.1959133 0.0085419 6.084232

Output high voltage, ILoad = –10.0 mA,Vdd=5.0V V 2.8 4.3 3.5175387 0.0093449 25.594571 3.5581452 0.0077322 31.981284 3.5248871 0.0065027 37.158239 3.4312903 0.0177115 11.880956 3.5199258 0.0101608 23.617739 3.5574129 0.0088497 27.970455 3.5225548 0.0053879 44.701989 3.4411867 0.0177746 12.024413Output high voltage, ILoad = –0.6 mA,Vdd=5.0V V 3.9 4.3 4.1552419 0.0018266 26.416477 4.1616968 0.0018892 24.402731 4.1562 0.0015593 30.740815 4.1399097 0.0027142 19.660807 4.1546194 0.0021935 22.092252 4.160729 0.0019863 23.371704 4.1548161 0.0015269 31.694866 4.1419633 0.002821 18.673573Output low voltage, ILoad = 10.0 mA,Vdd=5.0V mV 0 1500 772.84806 9.0551899 26.76741 767.10139 7.279563 33.559643 787.75025 12.683403 18.718682 852.53929 5.837389 36.97205 771.19847 10.329952 23.517423 766.52376 8.4379015 28.97546 786.69863 8.5571776 27.785695 848.67973 5.8498041 37.113509Output low voltage, ILoad = 0.5 mA,Vdd=5.0V mV 0 400 120.52087 1.4232667 28.226349 119.98646 1.1698791 34.187712 122.91605 2.0648499 19.842613 132.63966 0.9945799 44.454167 120.39876 1.6627991 24.135759 119.82825 1.4172542 28.183194 122.91205 1.356176 30.210445 132.00299 0.9653827 45.578813

Pullup resistors,Vdd=3.0V kΩ 16 36 22.964375 0.284175 10.781078 23.718548 0.4890682 5.4150502 24.183166 0.3711016 6.4815765 24.667683 0.7200632 3.002044 23.037784 0.3228469 9.3607394 23.929083 0.5188483 4.8897626 24.166777 0.3895837 6.1956819 24.549733 0.7411498 2.9954702Pullup resistors,Vdd=5.0V kΩ 16 36 25.449938 0.3019313 10.259316 26.297972 0.4849583 5.5164509 26.801576 0.366513 6.6493679 27.285372 0.7277501 3.0457682 25.480442 0.3309076 9.3135648 26.405006 0.4872359 5.3852123 26.744953 0.3990021 6.1739291 27.239507 0.7594233 2.9458245

Room Pre-HTOL Hot (lot1) Pre-HTOL Hot (lot2) Pre-HTOL Hot (lot3) SND Devices Pre HTOL Post-HTOL Hot (lot1) Post-HTOL Hot (lot2) Post-HTOL Hot (lot3) SND Devices Post HTOL

Comment25C 25C 25C 25C 25C 25C 25C 25C

Parameter Name in Datasheet Units Low Limit Upper Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std CpkStop mode VDD supply current,Vdd=3.0V nA 0 1500 240.99258 18.506833 4.3406054 253.8947 44.013543 1.9228528 257.21973 36.724894 2.3346537 230.2277 42.293779 1.814512 202.01176 35.57327 1.8929171 203.23856 33.587792 2.0169884 215.76979 36.813388 1.9537258 224.42293 43.75886 1.7095428Stop mode VDD supply current,Vdd=5.0V nA 0 1500 361.81495 56.533167 2.1333491 360.99641 48.551571 2.4784396 370.31094 44.729748 2.7596172 336.03222 44.31127 2.5278161 320.82208 38.435345 2.7823529 326.04006 63.144773 1.7211246 319.8645 32.752141 3.2554055 304.67326 46.207846 2.1978466Run mode VDD supply current,Vdd=3.0V mA 0 4.5 2.3687419 0.0279366 25.429718 2.3883645 0.0197235 35.687336 2.3651516 0.0191794 37.103088 2.48148 0.0275965 24.381347 2.3719097 0.0252418 28.102674 2.3890419 0.0173564 40.541313 2.369 0.019323 36.760945 2.5085067 0.0271452 24.454823Run mode VDD supply current,Vdd=5.0V mA 0 8.5 3.9784871 0.0364746 36.358471 4.0087452 0.0250126 53.423079 3.9603516 0.0231243 57.087913 4.1156667 0.0405801 33.806974 3.9892 0.033437 39.768302 4.0149194 0.0198562 67.399962 3.9710065 0.0230441 57.440786 4.16186 0.0384867 36.045874Wait mode VDD supply current,Vdd=3.0V mA 0 2.2 1.1504355 0.0181327 19.294152 1.1552968 0.0144254 24.140316 1.1436935 0.0152618 23.070777 1.2083 0.0159706 20.698509 1.1483871 0.0163931 21.383265 1.1528161 0.0141654 24.641854 1.1414839 0.0141119 25.002941 1.20257 0.0155711 21.352212Wait mode VDD supply current,Vdd=5.0V mA 0 3.3 1.6698226 0.0181014 30.019341 1.6790032 0.0155123 34.83249 1.6633226 0.0132498 41.174747 1.75142 0.0168523 30.630424 1.6672871 0.0169169 32.171333 1.6762419 0.0136873 39.544048 1.6616355 0.0132628 41.176802 1.7496533 0.0168395 30.688728




Cold Pre-HTOL Hot (lot1) Pre-HTOL Hot (lot2) Pre-HTOL Hot (lot3) SND Devices Pre HTOL Post-HTOL Hot (lot1) Post-HTOL Hot (lot2) Post-HTOL Hot (lot3) SND Devices Post HTOL

Comment -40C -40C -40C -40C -40C -40C -40C -40C

Parameter Name in Datasheet Units Low Limit Upper Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std CpkStop mode VDD supply current,Vdd=3.0V nA 0 1500 209.96876 38.436846 1.8208983 218.94107 38.356853 1.902668 214.59923 36.030229 1.9853628 213.98729 36.795492 1.9385282 179.82943 31.491381 1.9034778 184.02283 34.487277 1.7786543 205.52546 35.506974 1.9294375 230.17052 40.510931 1.8938964Stop mode VDD supply current,Vdd=5.0V nA 0 1500 345.93994 46.118624 2.5003632 312.91395 60.672884 1.7191312 328.02439 48.076035 2.2743444 309.43623 56.689219 1.819489 296.69714 41.446866 2.3861646 296.69714 41.446866 2.3861646 290.90399 37.803986 2.5650204 382.32314 67.344262 1.8923817Run mode VDD supply current,Vdd=3.0V mA 0 4.5 2.3162484 0.026436 27.535064 2.3220097 0.0215038 33.761319 2.2954 0.0204655 35.907642 2.3864581 0.0295687 23.826309 2.3172742 0.027027 26.920313 2.3172742 0.027027 26.920313 2.291629 0.0195514 37.650743 2.42221 0.032797 21.117679Run mode VDD supply current,Vdd=5.0V mA 0 8.5 3.8925355 0.0324917 39.933668 3.9161387 0.0273344 47.755978 3.8700581 0.0178363 72.325549 4.0086 0.0370896 36.026225 3.9045581 0.0305622 42.585908 3.9045581 0.0305622 42.585908 3.8763355 0.0193449 66.793242 4.0598333 0.0436296 31.017438Wait mode VDD supply current,Vdd=3.0V mA 0 2.2 1.1125387 0.0178563 20.300204 1.1112935 0.0163333 22.218492 1.1007226 0.0165177 22.183771 1.1577161 0.0183468 18.936659 1.1108806 0.0183847 19.746792 1.1108806 0.0183847 19.746792 1.0950871 0.0146858 24.855969 1.1649267 0.0197489 17.470591Wait mode VDD supply current,Vdd=5.0V mA 0 3.3 1.6330581 0.0164169 33.157992 1.6357323 0.0143922 37.884617 1.6216 0.0140057 38.593709 1.7016774 0.018004 29.592 1.6320161 0.0161167 33.754095 1.6320161 0.0161167 33.754095 1.6180097 0.0123024 43.839774 1.7081133 0.0197092 26.922891






For HC908EY16AFSL-CHD- Fab/Mask M51Z

Objective:

Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

Technology:


Fab / Assembly /



may be electronic)

Maskset#:


PPE Approval (for

DIM/BOM results)

Signature & Date:

Ziep Tran

May-12-2011

Die Size (in mm)


Nancy Long

May-11-2011

Part Operating


8EME005KDL00

CTCTZP1052A



Customer Approval




Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


PC

JESD22-

A113

J-STD-020



MSL 3 @ 260°C, +5/-0°C (or

document otherwise with

justification)


Q208757, GR8A; 0/693

Q205779, JL16: 0/231


qual: 0/231

HAST

JESD22-

A101

A110


(HAST):




Bias = 5V



Q208757, QR8A; 0/231

Q205779, JL16: 0/77


qual: 0/77

AC

JESD22-

A102

A118

Autoclave (AC):



AC = 121°C/100%RH/15 psig for

96 hrs



Q208757, GR8A: 0/231

Q205779, JL16: 0/77

Q202100, GZ60 48LQFP Auto

qual: 0/77

TC

JESD22-

A104

AEC Q100-

Appendix 3


PC before TC (for SMDs only):

Required

TC = -65°C to 150°C for 500

cycles.

For AEC only: WBP after TC on 5

devices from 1 lot; 2 bonds per

corner and one mid-bond per side

on each device. Record which pins

were used.

TEST @ H 77 0 0 pass Generic data:

Q208757, QR8A: 0/231, 0/5

Q205779, JL16: 0/77, 0/5


qual: 0/77, 0/5

Tammie Gause/Nancy Long

M51Z


3.414X3.327


Name or "Varies"

PB or "Varies"





Wang Lei-R62080

Cao JianChao-B19433

Qualification of 85% UDR SST 68HC908EY16A in FSL-CHD-FAB68HC908EY16A

"EY16A"

U050FXXD /85%UDRSST

Pkg Code 6300/ LQFP 32 7*7*1.4P0.8


Carlquist Jim-RMSD80

Ziep Tran

were used.

PC + PTC

JESD22-

A105Preconditioning plus Power


(See AEC-Q100 for test

applicability criteria)

PC before PC+PTC (for SMDs

only)

PC= MSL @ °C, +5/-0°C






inductive loads.

PTC

JESD22-

A105Power Temperature Cycle

(PTC):

(See AEC-Q100 for test

applicability.)


Bias =





inductive loads.

HTSL

JESD22-

A103High Temperature Storage Life

(HTSL):

175oC for 504 hrs



Q208757, GR8A; 0/77

Q205779, JL16: 0/77


qual: 0/77


Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

Name or "Varies"

PB or "Varies"

68HC908EY16A

"EY16A"



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


HTOL

JESD22-

A108High Temperature Operating

Life (HTOL):


Bias = 6.0V


receive 'NVM endurance

preconditioning' prior to this test,

and special NVM test sequencing

after this test)


TEST @ RHC 77 1 77 8EME005KDL00: 0/77 Generic dada:

Q202119, GZ60 Auto

Qual(0M29Z):0/231@150C,

408Hrs

ELFR

AEC Q100-

008Early Life Failure Rate (ELFR):



Bias = 6V



Q203338, GZ60 IMM

Qual(0M29Z):0/2400

Q202119, GZ60 Auto

Qual(0M29Z):0/2400

EDR

AEC Q100-

005NVM Endurance, Data

Retention, and Operational Life

(EDR):

10K Cycles Flash Endurance @

125oC followed by DRB @ 150

oC

for 1008hrs

Devices incorporating NVM shall

receive 'NVM endurance

preconditioning'(W/E cycling).

Test R, H, C after W/E cycling.



Q202119, GZ60 Auto

Qual(0M29Z):0/231



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


WBS

AEC Q100-

001Wire Bond shear (WBS) Cpk = or > 1.67 30 bonds


1 5 8EME005KDL00: 0/5, Cpk>1.67 Generic data:

Q208757, GR8A(LQFP32): 0/5,

Cpk>1.67

Q205779, JL16(LQFP32): 0/5,

Cpk>1.67


qual: 0/6, Cpk>1.67

WBP

MilStd883-


Cond. C or D



1 5 8EME005KDL00: 0/5, Cpk>1.67 Generic data:

Q208757, GR8A(LQFP32): 0/5,

Cpk>1.67

Q205779, JL16(LQFP32): 0/5,

Cpk>1.67


qual: 0/6, Cpk>1.67

SD

JESD22-


8hr.(1 hr. for Au-plated leads)

Steam age prior to test.

If production burn-in is done,

samples must also undergo burn-

in prior to SD.

>95% lead coverage

of critical areas




PD

JESD22-




DIM

&

BOM

Dimensional (DIM):

PPE to verify PD results against

valid 98A drawing.



accurate.

DIM: Not Required

BOM: Done

SBS

AEC-Q100-

010Solder Ball Shear (SBS):

Performed on all solder ball

mounted packages e.g. PBGA,

Chip Scale, Micro Lead Frame

(but NOT Flip Chip).



Cpk = or >1.67 10


devices)



LI

JESD22-


Not required for surface mount

devices;

Only required for through-hole

devices.

No lead breakage or

cracks

5


parts)

0 0



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable

Comments

EM





technologies.

TDDB


Breakdown (TDDB)





technologies.

HCI





technologies.

SM





technologies.

NBTI

Negative Bias Temperature

Instability (NBTI)





technologies.



Freescale PN:

Part Name:

Customer Name(s):

PN(s):

Plan or Results:


Date: May 5, 2011

Name or "Varies"

PB or "Varies"

68HC908EY16A

"EY16A"



Total Units

including

spares

Results

Lot ID-(#Rej/SS)

NA=Not Applicable


TEST

Freescale

48APre- and Post Functional /

Parametrics (TEST):



Testing performed to the limits of

device specification in temperature

and limit value.



HBM

AEC-Q100-

002 /

JESD22-

A114E Jan

2007


Human Body Model

Classification (HBM):

Test @ 500/1000/1500/2000 Volts



TEST @ RH

2KV min.

3 units per Voltage level 1 12 8EME005KDL00:

0/3@500V

0/3@1000V

0/3@1500V

0/3@2000V

MM

AEC-Q100-

003

or JESD22


Machine Model Classification

m(MM):

Test @ 50/100/200 Volts



TEST @ RH

200V min.


0/3@50V

0/3@100V

0/3@200V

CDM

AEC-Q100-

011ElectroStatic Discharge/

Charged Device Model

Classification (CDM):

Test @ 250/500/750 Volts




TEST @ RH

All pins =/> 500V


0/3@250V

0/3@500V

0/3@750V

LU

JESD78

plus

AEC-Q100-

004 for AEC

Latch-up (LU):

Test per JEDEC JESD78 with the

AEC-Q100-004 requirements for

AEC.

Ta= 125oC

Vsupply = 5.5V Maximum

operating voltage

TEST @ RH 6 1 6 8EME005KDL00:

0/6@125C, 100mA

ED

AEC-Q100-

009,

Freescale

48A spec

Electrical Distribution (ED) TEST @ RHC 30 1 30 Completed, Cpk>1.67

FG

For AEC,

AEC-Q100-

007


90% for qual units

FG%= No Change

CHAR

For AEC,

AEC-Q003Characterization (CHAR):

Ony performed on new

technologies and part families per

AEC Q003.

For AEC,

AEC-Q100-

006


Leakage (GL):

155°C, 2.0 min, +400/-400 V

TEST @ R 6 1 6 8EME005KDL00: 0/6


GL (for

information only)

006 155°C, 2.0 min, +400/-400 V




For all failures, perform unbiased

bake (4hrs/125°C, or 2hrs/150°C)

and retest; recovered units are GL

failures.

EMC

SAE J1752/3

-

Radiated

Emissions

Electromagnetic Compatibility

(EMC)

(see AEC Q100 Appendix 5 for

test applicability; done on case-by-

case basis per customer/Freescale

agreement)

<40dBuV

150KHz - 1GHz

1 1 1 Report available upon request

Die Qual Generic DataQuartz # Mask Set Product-Qual Description / Part

Number(s)

Technology Fab Die Size(mm2) CAB Number


32/48 LQFP Package Generic Data

Quartz# Mask Set Product-Qual Description/Part Number

(s)

Die Area

(mm2)

Pkg Code Pkg Description Mold Description EPOXY Description Wire Description




Date Author

4-Aug-09 T. Gause

27-Aug-09 T. Gause



Rev 1.0 Reviewed qual plan with H.P. Wang - TJN Reliability, PE and PM team.


General Notes:

1 -EY16A Wafer tech code U050FXXD

2 - EY16A BOM: HITACHI 9200HF10M Mold Compound, SUMITOMO CRM-1064MBL Die Attach Epoxy, 25um Gold Wire

Revision Comments


RIDD HV 0 25 12 9402485 0 177849327 23 2400336 15 4747 0 197484 16 078 13 2681 0 165439 23 638 15 4878 0 196138 16 166

(0M51Z) Electrical DistributionReport Date: 23/Apr/11Report Revision: 0


Hot CHD1 Devices Pre HTOL SND Devices Pre HTOL CHD1 Devices Post HTOL SND Devices Post HTOL

Comment

135C 135C 135C 135C


LVI 3V TRIP V 2.35 2.7 2.547372451 0.037571657 1.75010544 2.54573 0.0410635 1.565252 2.54675 0.0354683 1.74 2.54788 0.0411825 1.6112231LVI 3V REC V 2.45 2.8 2.59910108 0.038161386 1.72185008 2.60646 0.04181 1.5665247 2.608 0.0362015 1.71223655 2.60863 0.0418894 1.2644362LVI 5V TIP V 3.9 4.5 4.22267349 0.060746098 1.76605712 4.20188 0.0566301 1.755 4.205 0.0597654 1.7632445 4.20463 0.0564314 1.745

LVI 5V REC V 4 4.6 4.283271904 0.060638424 1.69138224 4.28208 0.0577697 1.628 4.28563 0.0602503 1.6854225 4.28512 0.0576386 1.649UNTRIM 5V Mhz 4.834 8.064 6.125822595 0.28461826 2.67432432 6.66115 0.368643 1.9666268 6.25455 0.28805 2.6962144 6.67648 0.363991 1.922271UNTRIM 3V Mhz 4.834 8.064 6.123309886 0.280330509 2.69450672 6.64868 0.364956 1.912229 6.25035 0.282992 2.6754368 6.66321 0.361828 1.966529

TRIM 5V Mhz 6.1932 6.7092 6.475757413 0.020981926 3.76099024 6.47154 0.0168546 4.7 6.47261 0.0175846 4.485 6.47046 0.017045 4.669TRIM 3V Mhz 6.1932 6.7092 6.479289333 0.023102289 3.36440608 6.47413 0.0196472 3.988 6.47393 0.0196925 3.982 6.47406 0.0202121 3.878

PULL UP IRQ KΩ 24 48 32.29783173 3.01424144 6.16471408 30.4162 3.1507 5.247 32.35884191 3.70544 4.675 29.3535 0.514157 3.471PULL UP RST KΩ 24 48 30.7653821 2.052146432 9.24959392 31.8116 4.1148 4.684 30.6422049 2.83608 6.759 30.7525 0.743435 3.028

RIDD HV mA 0 25 13.20171149 0.178695979 22.63859808 15.7368 0.200829 15.375 13.5532 0.152152 25.077 15.7501 0.19946 15.458WIDD HV mA 0 7 6.02209515 0.110816513 3.16258208 6.06432 0.126714 2.461 6.18478 0.106526 2.551 6.0677 0.13428 2.314

SIDD LVI ON HV uA 0 300 99.66472768 3.484935373 9.61994096 104.401 2.38253 14.606 102.496 2.48596 13.743 104.561 2.43483 14.315SIDD LVI OFF HV nA 0 30000 492.5211984 83.01828416 1.99603936 1180.12 359.354 1.095 517.76 96.18 1.97432475 1248.63 354.066 1.176

RIDD LV mA 0 8 3.744047115 0.098509285 12.78454128 5.09244 0.106211 9.125 3.7036 0.114133 10.817 5.09717 0.108645 8.906WIDD LV mA 0 3.5 1.79732345 0.077416659 7.53711728 3.17878 0.110021 0.973 1.77436 0.0766604 7.503 3.18687 0.108909 0.958

SIDD LVI ON LV uA 0 200 81.43870862 1.861614485 14.71498784 87.0711 2.35627 12.318 80.1738 1.74618 15.305 87.142 2.40751 12.065SIDD LVI OFF LV nA 0 18000 303.4908218 75.86866896 1.74515696 731.663 198.8 1.7541227 332.975 99.3386 1.7332117 705.437 195.254 1.81223204

Room CHD1 Devices Pre HTOL SND Devices Pre HTOL CHD1 Devices Post HTOL SND Devices Post HTOL

Comment

25C 25C 25C 25C

Parameter Name in Datasheet Units Low Limit Upper Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std CpkLVI 3V TRIP V 2.35 2.7 2.522629966 0.036424691 1.74551584 2.54331 0.0410244 1.65541273 2.53242 0.0325098 1.718 2.54545 0.0411434 1.6112252LVI 3V REC V 2.45 2.8 2.584842214 0.037228455 1.7774488 2.60398 0.0417703 1.6225229 2.59293 0.0328434 1.7451 2.60614 0.0418496 1.6559244LVI 5V TIP V 3.9 4.5 4.203379494 0.059919729 1.67211184 4.19788 0.0565762 1.755 4.19734 0.0587623 1.6871123 4.20063 0.0563778 1.77

LVI 5V REC V 4 4.6 4.274633837 0.060517128 1.754597184 4.27801 0.0577148 1.711606 4.27655 0.0597095 1.7324544 4.28105 0.0575838 1.7223627UNTRIM 5V Mhz 4.834 8.064 6.10761807 0.283770599 2.745716928 6.59454 0.364956 1.9765342 6.20815 0.301212 2.7521 6.60971 0.360351 1.9112345UNTRIM 3V Mhz 4.834 8.064 6.105115453 0.279494957 2.747634256 6.5822 0.361963 1.966565 6.1998 0.296033 2.7532438 6.59657 0.35821 1.922366



RIDD HV mAmA 0 25 12 9402485. 0 177849327. 23 2400336. 15 4747. 0 197484. 16 078. 13 2681. 0 165439. 23 638. 15 4878. 0 196138. 16 166.WIDD HV mA 0 7 5.90284744 0.109630797 3.5621936 5.85021 0.12224 3.135 6.00603 0.090048 3.679 5.85346 0.129539 2.951123




Cold CHD1 Devices Pre HTOL SND Devices Pre HTOL CHD1 Devices Post HTOL SND Devices Post HTOL

Comment

-40C -40C -40C -40C

Parameter Name in Datasheet Units Low Limit Upper Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std CpkLVI 3V TRIP v 2.35 2.7 2.535818786 0.040471565 1.71992896 2.54089 0.0492042 1.711078 2.54025 0.0471333 1.711213 2.53988 0.0502623 1.8122062LVI 3V REC v 2.45 2.8 2.598888786 0.041036571 1.72360064 2.60237 0.047855 1.7061 2.6025 0.046958 1.776083 2.60247 0.0513878 1.722989LVI 5V TIP v 3.9 4.5 4.202521742 0.065464137 1.72578944 4.19623 0.0627862 1.573122 4.19525 0.066905 1.866471 4.19538 0.0669995 1.612227

LVI 5V REC v 4 4.6 4.26550168 0.065724894 1.74279048 4.27881 0.0629265 1.477112 4.277 0.0675007 1.7665368 4.278 0.066894 1.385UNTRIM 5V Mhz 4.834 8.064 6.077939851 0.30616499 2.71791072 6.61029 0.445754 1.68711 6.05986 0.244828 2.1224669 6.67219 0.432966 1.654072UNTRIM 3V Mhz 4.834 8.064 6.068706403 0.301874212 2.7269928 6.57596 0.438569 1.71131111 6.05858 0.239865 2.13321702 6.63514 0.425485 1.721119



RIDD HV mA 0 25 12.63852162 0.277207282 15.27605856 15.2126 0.210827 15.475 13.1073 0.175886 22.539 15.2285 0.208168 15.647WIDD HV mA 0 7 6.005636403 0.104642717 3.40174352 5.63609 0.175011 2.5981122 5.97417 0.111717 3.061 5.65325 0.18764 2.392






For HC908QT/QY4A/Nitron SOGFSL-CHD- Fab/Mask M82Z


Objective:Freescale PN:

Part Name:Customer Name(s):

PN(s):Plan or Results:

Revision # & Date:See Revision History

Technology: Package: Design Engr: QUARTZ Tracking #: 199497

Fab / Assembly/Final Test Sites: Product Engr:

(Signature/Date shown below may be electronic)

Maskset#:Rev#: Prod. Package Engr:

PPE Approval (for DIM/BOM results)Signature & Date:

Ziep TranMay-12-2011

Die Size (in mm)W x L x T NPI PRQE: NPI PRQE Approval Signature & Date:

Nancy LongMay-12-2011

Part OperatingTemp. Grade: Grade 1 - 40°C to +125 °C Trace/DateCode:

LOT AME005EKQ00CTTR1046A

LOT B LOT C CAB Approval Signature & Date:

10020104M May-26-2011

Customer ApprovalSignature & Date: May be N/A

Stress Test Reference Test Conditions End Point Requirements Minimum Sample Size # of Lots

Total Unitsincluding

spares

ResultsLot ID-(#Rej/SS)

NA=Not ApplicableComments or Generic Data

PC

JESD22-A113

J-STD-020

Preconditioning (PC) :PC required for SMDs only.MSL 3 @ 260°C, +5/-0°C (or document otherwise with justification)

TEST @ RH LotA: 0/77Generic data:

Q202065, QC16: 0/693Q203722, QY4: 0/693Q206298, QB8: 0/231

HAST

JESD22-A101A110

Highly Accelerated Stress Test (HAST):PC before HAST (for SMDs only): Required @ MSL3, 260oCHAST = 130°C/85%RH for 96 hrs.Bias = 5V Timed RO of 48hrs. MAX

TEST @ RH 77 0 0 pass Generic Data:Q202065, QC16: 0/231Q203722, QY4(Nitron Classic): 0/231

AC

JESD22-A102A118

Autoclave (AC):PC before AC (for SMDs only): Required @ MSL3, 260oCAC = 121°C/100%RH/15 psig for 96 hrsTimed RO of 2-48hrs. MAX

TEST @ R 77 0 0 pass Generic Data:Q202065, Nitron QC16: 0/231Q203722, QY4(Nitron Classic): 0/231

TC

JESD22-A104

AEC Q100-Appendix 3

Temperature Cycle (TC):PC before TC (for SMDs only): RequiredTC = -65°C to 150°C for 500 cycles. For AEC only: WBP after TC on 5 devices from 1 lot; 2 bonds per corner and one mid-bond per side on each device. Record which pins were used.

TEST @ HFor AEC: WBP =/> 3 grams

77 1 77 LotA: 0/77, WP: 0/5, min>3g Generic Data:Q202065, QC16: 0/231Q203722, QY4(Nitron Classic): 0/231Q206298, QB8: 0/231

PC + PTC

JESD22-A105

Preconditioning plus Power Temperature Cycle (PC+PTC):(See AEC-Q100 for test applicability criteria) PC before PC+PTC (for SMDs only)PC= MSL @ °C, +5/-0°CPTC = °C to °C for 1000 cycles;Bias =

TEST @ RH 0 0 0 Only Required for AEC devices with maximum rated power > 1 Watt and Delta-Tj > 40C or for devices designed to drive inductive loads.

PTC

JESD22-A105

Power Temperature Cycle (PTC):(See AEC-Q100 for test applicability.)PTC = °C to °C for 1000 cycles;Bias =


HTSL

JESD22-A103

High Temperature Storage Life (HTSL):150°C for 168hrs, 504hrs and 1000 hrs or 175oC for 168hrs and 500 hrs


TEST @ RH 77 0 0 pass Generic Data:Q202065, QC16: 0/77Q203722, QY4(Nitron Classic): 0/77Q206298, QB8: 0/77

Qualification of 85% UDR SST HC908QY4A/QT4A in CHDHC908QY4A/QT4A"Nitron SOG"

U050FXXD /85%UDRSST2003 /SOIC 16W Jim Carlquist - RMSD80

"Varies""Varies"

Zhao Rixing-B21624

Ziep Tran - RSJP50


AEC-Q100F/Commercial/Industrial Qual Results

All surface mount devices prior to THB, HAST, AC, UHST, TC, PC+PTC and as required per test conditions.

M82Z0


2.383 x 2.315

FSL-CHD-FAB/FSL-TJN-FM/(FSL-TJN-FM/KESC)




Freescale PN: Part Name:

Customer Name(s): PN(s):

Plan or Results:Revision # & Date:


HC908QY4A/QT4A"Nitron SOG"

"Varies""Varies"



spares



HTOL

JESD22-A108

High Temp Op Life;10K Flash W/E Cycling (125C) +HTOL, 168hr (MC readpoint),Ta = 125°C,Bias =6V


TEST @ RHC 77 1 77 LotA: 0/77 Generic Data:

Q202069, QC16: 0/231@125C, 6V, 1008HrsQ203737, QB8: 0/77@125C, 6V, 1008Hrs

ELFR

AEC Q100-008 Early Life Failure Rate (ELFR):Ta = 125°C for 48 hrs

Bias = 6VTimed RO of 48 hrs MAX


Q202069, QC16: 0/2400

EDR

AEC Q100-005 NVM Endurance, Data Retention, and Operational Life (EDR):

10K W/E cycling @ 175oC for 504 hrs


TEST @ RHC 77 1 77 LotA: 0/77 Generic Data:Q202069, QC16: 0/231@150C, 1008Hrs



spares



WBS

AEC Q100-001 Wire Bond shear (WBS) Cpk = or > 1.67 30 bondsfrom minimum 5 units

1 5 LotA: 0/5, Cpk>1.67 PE to include this requirement in the ERF so that the data is collected during assembly

WBP

MilStd883-2011

Wire Bond Pull (WBP):Cond. C or D

Cpk = or > 1.67 30 bondsfrom minimum 5 units


SD

JESD22-B102

Solderability (SD):8hr.(1 hr. for Au-plated leads) Steam age prior to test.If production burn-in is done, samples must also undergo burn-in prior to SD.

>95% lead coverage of critical areas


PD

JESD22-B100

Physical Dimensions(PD):PD per FSL 98A drawing


DIM&

BOM

Dimensional (DIM):PPE to verify PD results against valid 98A drawing.BOM Verification (BOM):PPE to verify qual lot ERF BOM is accurate.

DIM: Not RequiredBOM: Done

SBS

AEC-Q100-010 Solder Ball Shear (SBS):Performed on all solder ball mounted packages e.g. PBGA, Chip Scale, Micro Lead Frame (but NOT Flip Chip).Two reflow cycles at MSL reflow temperature before shear.

Cpk = or >1.67 10(5 balls from a min. of 10

devices)

0 0 For solder ball mounted packages only; NOT for Flip Chips.

LI

JESD22-B105

Lead Integrity (LI):Not required for surface mount devices;Only required for through-hole devices.

No lead breakage or cracks

5(10 leads from each of 5 parts)

0 0



spares


NA=Not ApplicableComments

EM

Electro Migration (EM) The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies.

TDDB

Time Dependent Dielectric Breakdown (TDDB) The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies.

HCI

Hot Carrier Injection (HCI) The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies.

SM

Stress Migration (SM) The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies.

NBTI

Negative Bias Temperature Instability (NBTI) The data, test method, calculations and internal criteria should be available to the customer upon request for new technologies.










"Varies""Varies"



spares



TEST

Freescale 48A Pre- and Post Functional / Parametrics (TEST):For AEC, test software shall meet requirements of AEC-Q100-007. Testing performed to the limits of device specification in temperature and limit value.

0 Fails All All All Completed This action refers to Final Testing of all qualification units.

HBM

AEC-Q100-002 /JESD22-A114E

Jan 2007

ElectroStatic Discharge/Human Body Model Classification (HBM):

Test @ 500/1000/1500/2000 VoltsFor AEC, see AEC-Q100-002 for classification levels.

TEST @ RH2KV min.

3 units per Voltage level 1 12 LotA:0/3@500V0/3@1000V0/3@1500V0/3@2000V

MM

AEC-Q100-003or JESD22

ElectroStatic Discharge/Machine Model Classification m(MM):Test @ 50/100/150/200 VoltsFor AEC, see AEC-Q100-003 for classification levels.

TEST @ RH200V min.

3 units per Voltage level 1 12 LotA:0/3@50V0/3@100V0/3@150V0/3@200V

CDM

AEC-Q100-011 ElectroStatic Discharge/Charged Device Model Classification (CDM):Test @ 250/500/750 VoltsFor AEC, see AEC-Q100-011 for classification levels.Timed RO of 96hrs MAX.

TEST @ RHAll pins =/> 500V

3 units per Voltage level 1 9 LotA:0/3@250V0/3@500V0/3@750V

LU

JESD78plus

AEC-Q100-004 for AEC

Latch-up (LU):Test per JEDEC JESD78 with the AEC-Q100-004 requirements for AEC.Ta= 125oC, 100mAVsupply = 5.5V Maximum operating voltage

TEST @ RH 6 1 6 LotA: 0/6

EDAEC-Q100-009,Freescale 48A

spec

Electrical Distribution (ED) TEST @ RHC 30 1 30 Completed, Cpk>1.67

FG For AEC, AEC-Q100-007

Fault Grading (FG) FG shall be = or > 90% for qual units

FG%= No Change

CHARFor AEC, AEC-

Q003Characterization (CHAR):Ony performed on new technologies and part families per AEC Q003.


For AEC, AEC-Q100-006

Electro-Thermally Induced Gate Leakage (GL):155°C, 2.0 min, +400/-400 VPer AEC Q100 Rev G, this test is performed for information only.Timed RO of 96 hrs MAX.For all failures, perform unbiased bake (4hrs/125°C, or 2hrs/150°C) and retest; recovered units are GL failures.

TEST @ R 6 1 6 LotA: 0/6

EMC

SAE J1752/3 -Radiated

Emissions

Electromagnetic Compatibility (EMC)(see AEC Q100 Appendix 5 for test applicability; done on case-by-case basis per customer/Freescale agreement)

<40dBuV150KHz - 1GHz

1 1 1 Report available upon request

Quartz # Mask Set Product-Qual Description / Part Number(s) Technology Fab Die Size(mm2) CAB Number202069 M80Z HC908QC16 85% UDRSST FSL-CHD-FAB 9.61625124 10272023M204137 M81Z HC908QB8 85% UDRSST FSL-CHD-FAB 7.2336 10010064M199497 M82Z HC908QY4A 85% UDRSST FSL-CHD-FAB 5.516645 10020104M

Quartz# Mask Set Product-Qual Description/Part Number (s) Die Area(mm2) Assembly Site Pkg Description/Code Mold Description EPOXY Description Wire Description

202065 M80Z HC908QC16 9.61625124 SOIC16 W SOIC 16 W/2003 SUMITOMO G600 ABLEBOND 8290 25 um Au203722 M05Z HC908QY4 7.3136949 SOIC16 W SOIC 16 W/2003 SUMITOMO G600 ABLEBOND 8290 25 um Au206298 M81Z HC908QB8_AUTO 7.2336 SOIC16 W SOIC 16 W/2003 SUMITOMO G600 ABLEBOND 8290 25 um Au

Revision Date Comments AuthorRev O 25-Aug-09 Generated Plan T. GauseRev 1.0 25-Aug-09 Reviewed qual plan with H.P. Wang - TJN Reliability Engr., PE and PM team. T. GauseRev 2.0 2 May, 2011 Add Qual Result Nancy Long

General Notes:1 -Nitron SOG Wafer tech code U050FXXD2 - Nitron SOG BOM: SUMITOMO G600 Mold Compound, ABLEBOND 8290 Die Attach Epoxy, 25um Gold Wire


Die Qual Vehicles








"Varies""Varies"




Revision # & Date:See Revision History


Fab / Assembly /Final Test Sites: Product Engr:




Ziep TranMay-12-2011




LOT AME005ELE00

4STTA LOT B LOT C CAB Approval Signature & Date:

10020104M May-26-2011




spares



PC

JESD22-A113

J-STD-020


TEST @ RH LotA; 0/77 Generic Data:Q202067, Nitron QC16: 0/693Q203721, Nitron Classic: 0/693Q204137, Nitron QB8:0/77

HAST

JESD22-A101A110


TEST @ RH 77 0 0 pass Generic Data:Q202067, Nitron QC16: 0/231Q203721, Nitron Classic: 0/231

AC

JESD22-A102A118


TEST @ R 77 0 0 pass Generic Data:Q202067, Nitron QC16: 0/231Q203721, Nitron Classic: 0/231

TC

JESD22-A104

AEC Q100-Appendix 3

Temperature Cycle (TC):PC before TC (for SMDs only): RequiredTC = -65°C to 150°C for 500 cycles. For AEC only: WBP after TC on 5 devices from 1 lot; 2 bonds per corner and one mid-bond per side on each device. Record which pins were used.

TEST @ HFor AEC: WBP =/> 3 grams

77 1 77 LotA: 0/77, WP: 0/5, Min>3g Generic Data:Q202067, Nitron QC16: 0/231, WP: 0/5, Min>3gQ203721, Nitron Classic: 0/231, WP: 0/5, Min>3gQ204137, Nitron QB8:0/77, WP: 0/5, Min>3g

PC + PTC

JESD22-A105



PTC

JESD22-A105



HTSL

JESD22-A103

High Temperature Storage Life (HTSL):150°C for 1008 hrs or 175oC for 500 hrs


TEST @ RH 77 0 0 pass Generic Data:Q202069, Nitron QC16, EDR: 0/231@150C, 1008HrsQ203721, Nitron Classic: 0/77@175C, 504HrsQ204140, Nitron ROM: 0/77@175C, 504Hrs





AEC-Q100F/Commercial/Industrial Qual Results



"Varies""Varies"

U050FXXD /85%UDRSST6117 /TSSOP 16 4.4*5*1.0P0.65 Jim Carlquist - RMSD80

FSL-CHD-FAB/FSL-TJN-FM/(FSL-TJN-FM/KESC) Zhao Rixing-B21624

M82Z0 Ziep Tran - RSJP50

2.383 x 2.315







"Varies""Varies"



spares



HTOL

JESD22-A108

High Temperature Operating Life (HTOL):Ta = 150°C for 168hrs (AEC MC Rd Pt.)

Bias = 6V



Q202069, QC16: 0/231@125C, 6V, 1008HrsQ203737, QB8: 0/77@125C, 6V, 1008HrsQ199497, QY4A(Nitron SOG): 0/77@125C, 6V, 168Hrs

ELFR

AEC Q100-008 Early Life Failure Rate (ELFR):Ta = 125°C for 48 hrs Comm/Ind: 1yr lifetimeBias = 6VTimed RO of 48 hrs MAX


Q202069, QC16: 0/2400

EDR

AEC Q100-005 NVM Endurance, Data Retention, and Operational Life (EDR):Devices incorporating NVM shall receive 'NVM endurance preconditioning'(W/E cycling). Test R, H, C after W/E cycling.Timed RO of 96hrs. MAX

TEST @ RHC 77 0 0 pass Generic Data:Q202069, QC16: 0/231@150C, 1008Hrs



spares



WBS



WBP

MilStd883-2011




SD

JESD22-B102




PD

JESD22-B100



DIM&

BOM



SBS



devices)


LI

JESD22-B105




0 0



spares



EM


TDDB


HCI


SM


NBTI











"Varies""Varies"



spares



TEST



HBM

AEC-Q100-002 /JESD22-A114E

Jan 2007

ElectroStatic Discharge/Human Body Model Classification (HBM):Test @ 500/1000/1500/2000 VoltsFor AEC, see AEC-Q100-002 for classification levels.

TEST @ RH2KV min.

3 units per Voltage level 0 0 pass Generic dataQ199497, QY4A(Nitron SOG) SOIC16 W: 0/3@500V0/3@1000V0/3@1500V0/3@2000V

MM


ElectroStatic Discharge/Machine Model Classification m(MM):Test @ 50/100/200 VoltsFor AEC, see AEC-Q100-003 for classification levels.

TEST @ RH200V min.

3 units per Voltage level 0 0 pass Generic dataQ199497, QY4A(Nitron SOG) SOIC16 W:0/3@50V0/3@100V0/3@150V0/3@200V

CDM




LU

JESD78plus


Latch-up (LU):Test per JEDEC JESD78 with the AEC-Q100-004 requirements for AEC.Ta= 125oCVsupply = TBDV Maximum operating voltage

TEST @ RH 6 0 0 pass Generic dataQ199497, QY4A(Nitron SOG) SOIC16 W: 0/6@100mA

ED

AEC-Q100-009,Freescale 48A

spec

Electrical Distribution (ED) TEST @ RHC 30 0 0 Completed Done on QY4A(Nitron SOG) SOIC16 W: 0/30

FG



FG%= No Change

CHAR

For AEC, AEC-Q003

Characterization (CHAR):Ony performed on new technologies and part families per AEC Q003.




TEST @ R 6 1 6 LotA: 0/6

EMC


Emissions



1 0 0


Quartz# Mask Set Product-Qual Description/Part Number (s) Die Area(mm2) Assembly Iste Pkg Description/Code Mold Description EPOXY Description Wire Description

202067 M80Z HC908QC16 9.61625124 TJN TSSOP 16/6117 G700K ABLEBOND 8290 25 um Au203721 M05Z HC908QY4(NITRON) 7.3136949 TJN TSSOP 16/6117 G700K ABLEBOND 8290 25 um Au204137 M81Z HC908QB8_AUTO 7.2336 TJN TSSOP 16/6117 G700K ABLEBOND 8290 25 um Au204140 M62Z Nitron ROM 4.420504 TJN TSSOP 16/6117 G700K ABLEBOND 8290 25 um Au

Revision Date AuthorRev O 25-Aug-09 T. GauseRev 1.0 26-Aug-09 T. GauseRev 2.0 23-Apr-11 Nancy LongAdd Qual Result

Generated Plan Reviewed qual plan with H.P. Wang - TJN Reliability, PE and PM team.

Comments



16 TSSOP Pkg Qual Generic Data

General Notes:1 -Nitron SOG Wafer tech code U050FXXD2 - Nitron SOG BOM: SUMITOMO G700K Mold Compound, ABLEBOND 8290 Die Attach Epoxy, 25um Gold Wire







"Varies""Varies"




Revision # & Date:Rev 1.2 - ResultDate: Apr 2, 2011






Shong L.M.May-9-2011




LOT AN9NJ04803700

XNXX1048LOT B LOT C CAB Approval

Signature & Date:10020104M May-26-2011




spares



PC

JESD22-A113

J-STD-020


TEST @ RH Not required for PDIP Packages

HAST

JESD22-A101A110


TEST @ RH 77 0 0 pass Q203723, HC908QY4(Nitron): 0/231

AC

JESD22-A102A118


TEST @ R 77 0 0 pass Q203723, HC908QY4(Nitron): 0/231

TC

JESD22-A104

AEC Q100-Appendix 3

Temperature Cycle (TC):PC before TC (for SMDs only): RequiredTC = -65°C to 150°C for 500 cycles.

TEST @ H 77 1 77 LotA: 0/77 Generic Data:Q203723, HC908QY4(Nitron): 0/231

HTSL

JESD22-A103

High Temperature Storage Life (HTSL):175oC for 504 hrs


TEST @ RH 77 1 77 LotA: 0/77


This testing is performed by Freescale Reliability Lab (FSL-TJN-FM) unless otherwise noted in the Comments.GROUP A - ACCELERATED ENVIRONMENTAL STRESS TESTS


FSL-CHD-FAB/(NFME)/(FSL-TJN-FM/KESC) Zhao Rixing-B21624

M82Z0 Shong Lee Ming-B21406

2.383 x 2.315 Tammie Gause - RA7914/Nancy Long - B07252



"Varies""Varies"

U050FXXD /85%UDRSSTPkg Code 6/16 PDIP Jim Carlquist - RMSD80







"Varies""Varies"



spares



HTOL

JESD22-A108

High Temperature Operating Life (HTOL):Ta = 150°C for 168hrs (AEC MC Rd Pt.)Comm/Ind: 1yr lifetimeBias = 6V




ELFR



Q202069, QC16: 0/2400

EDR





spares



WBS


1 5 LotA: 0/5, Cpk>1.67

WBP

MilStd883-2011



1 5 LotA: 0/5, Cpk>1.67

SD

JESD22-B102




PD

JESD22-B100



DIM&

BOM


DIM: Not RequiredBOM: done

SBS



devices)


LI

JESD22-B105




0 0



spares



EM


TDDB


HCI


SM


NBTI











"Varies""Varies"



spares



TEST



HBM

AEC-Q100-002 /JESD22-A114E

Jan 2007


TEST @ RH2KV min.

3 units per Voltage level 0 0 pass Generic dataQ199497, QY4A(Nitron SOG) SOIC16 W: 0/3@500V0/3@1000V0/3@1500V0/3@2000V

MM



TEST @ RH200V min.

3 units per Voltage level 0 0 pass Generic dataQ199497, QY4A(Nitron SOG) SOIC16 W:0/3@50V0/3@100V0/3@150V0/3@200V

CDM




LU

JESD78plus



TEST @ RH 6 0 0 Generic dataQ199497, QY4A(Nitron SOG) SOIC16 W: 0/6@100mA

ED


spec

Electrical Distribution (ED) TEST @ RHC 5 0 0 Completed Done on QY4A(Nitron SOG) SOIC16 W

FG



FG%= No Change

CHAR

For AEC, AEC-Q003





TEST @ R 6 0 0

EMC


Emissions



1 0 0

Quartz # Mask Set Product-Qual Description / Part Number(s) Technology Fab Die Size(mm2) CAB Number CAB Date202069 M80Z HC908QC16 85% UDRSST FSL-CHD-FAB 9.61625124 10272023M204137 M81Z HC908QB8 85% UDRSST FSL-CHD-FAB 7.2336 10010064M199497 M82Z HC908QY4A 85% UDRSST FSL-CHD-FAB 5.516645 10020104M

16 PDIP Generic Data

Quartz# Mask Set Product-Qual Description/Part Number (s) Die Area(mm2) Assembly Site Pkg Description/code Mold Description EPOXY Description Wire Description

203723 M05Z NITRON 7.3136949 NFME PDIP16/0006 HITACHI_CEL1620HF9_18MMx1YIHUA_9005SP-2 25um, Au

Date Author25-Aug-09 T. Gause25-Aug-09 T. Gause12-Oct-09 T. Gause2-Apr, 11 Nancy LongRev 1.2 Add Qual Result

General Notes:1 -Nitron SOG Wafer tech code U050FXXD2 - Nitron SOG BOM: HITACHI_CEL1620HF9_18MMx10.4G_NFME Mold Compound, YIHUA_9005SP-2 Die Attach Epoxy, 25um Gold Wire

Die Qual Vehicles

Revision CommentsRev O Generated Plan Rev 1.0 Reviewed qual plan with H.P. Wang - TJN Reliability Engr., PE and PM team.Rev. 1.1 Changed Assy Site to NFME at the request of Brian Drummond.








"Varies""Varies"




Revision # & Date:Rev 1.2 - ResultDate: May 2, 2011










LOT ANJ04802K00XNXX1048

LOT B LOT C CAB Approval Signature & Date:

10020104M May-26-2011




spares



PC

JESD22-A113

J-STD-020


TEST @ RH Not required for PDIP Packages

HAST

JESD22-A101A110


TEST @ RH 77 1 77 LotA: 0/77 Generic data:Q212274, QVY4(Nitron Loft): 0/77Q203724, QY4(Nitron); 0/77

AC

JESD22-A102A118


TEST @ R 77 1 77 LotA: 0/77 Generic data:Q212274, QVY4(Nitron Loft): 0/77Q203724, QY4(Nitron); 0/77

TC

JESD22-A104

AEC Q100-Appendix 3


TEST @ H 77 1 77 LotA: 0/77 Generic data:Q212274, QVY4(Nitron Loft): 0/77Q203724, QY4(Nitron); 0/77

PC + PTC

JESD22-A105



PTC

JESD22-A105



HTSL

JESD22-A103

High Temperature Storage Life (HTSL): 175oC for 504 hrs


TEST @ RH 77 1 77 LotA: 0/77





M82Z Shong Lee Ming-B21406




"Varies""Varies"

U050FXXD /85%UDRSSTPkg Code 3/8 PDIP Jim Carlquist - RMSD80







"Varies""Varies"



spares



HTOL

JESD22-A108

High Temperature Operating Life (HTOL):Ta = 150°C for 168hrs

Bias = 6V




ELFR

AEC Q100-008 Early Life Failure Rate (ELFR):Ta = 125°C for 48 hrs

Bias = 6VTimed RO of 48 hrs MAX


Q202069, QC16: 0/2400

EDR





spares



WBS


1 5 LotA: 0/5, Cpk>1.67

WBP

MilStd883-2011



1 5 LotA: 0/5, Cpk>1.67

SD

JESD22-B102




PD

JESD22-B100



DIM&

BOM


DIM: Not RequiredBOM: done

SBS



devices)


LI

JESD22-B105




0 0



spares



EM


TDDB


HCI


SM


NBTI











"Varies""Varies"



spares



TEST



HBM

AEC-Q100-002 /JESD22-A114E

Jan 2007


TEST @ RH2KV min.

3 units per Voltage level 0 0 pass Generic dataQ199497, QY4A(Nitron SOG) SOIC16 W: 0/3@5000/3@10000/3@15000/3@2000

MM



TEST @ RH200V min.

3 units per Voltage level 0 0 pass Generic dataQ199497, QY4A(Nitron SOG) SOIC16 W:0/3@500/3@1000/3@1500/3@200

CDM



3 units per Voltage level 1 9 LotA; LotA:0/3@250V0/3@500V0/3@750V

LU

JESD78plus




ED


spec

Electrical Distribution (ED) TEST @ RHC 5 0 0 Completed Done on QY4A(Nitron SOG) SOIC16 W: 0/5

FG



FG%= No Change

CHAR

For AEC, AEC-Q003





TEST @ R 6 0 0

EMC


Emissions



1 0 0


8 PDIP Pkg Qual VehiclesQuartz# Mask Set Product-Qual Description/Part Number (s) Die Area

(mm2)Assembly Site Pkg Description/Code Mold Description EPOXY Description Wire Description

212342 M82Z 908QY4A(Nitron SOG) 5 NFME PDIP 8/0003 MC_HITACHI_CEL1620HF9 DA_YIZTECH_9144 25um Au212274 M78Z 908QVY4(Nitron Loft) 5.8949 NFME PDIP 8/0003 MC_HITACHI_CEL1620HF9 DA_YIZTECH_9144 25um Au203724 M05Z 908QY4(Nitron) 7.3136949 NFME PDIP 8/0003 MC_HITACHI_CEL1620HF9 DA_YIZTECH_9144 25um Au

Date Author25-Aug-09 T. Gause25-Aug-09 T. Gause16 Oct. 2009 T. Gause2 May, 2011 Nancy LongRev1.2 Add Qual Result

General Notes:1 -Nitron SOG Wafer tech code U050FXXD2 - Nitron SOG BOM: HITACHI_CEL1620HF9 Mold Compound, YIZTECH_9144 Die Attach Epoxy, 25um Gold Wire

Die Qual Vehicles

Revision CommentsRev O Generated Plan Rev 1.0 Reviewed qual plan with H.P. Wang - TJN Reliability Engr., PE and PM team.Rev 1.1 Removed CDM which will be done on 16 PDIP.








"Varies""Varies"




Revision # & Date:Rev 1.2 - ResultDate: May 5, 2011









Part OperatingTemp. Grade: Grade - 40°C to +125 °C Trace/DateCode:

LOT AN9NJ04801X00

XNXX048

LOT BN9NJ04804V00

XNXX048LOT C CAB Approval

Signature & Date:10020104M May-26-2011




spares



PC

JESD22-A113

J-STD-020


TEST @ RH LotA: 0/231LotB: 0/231

Generic dataQ203725, QY4(Nitron): 0/231

HAST

JESD22-A101A110


TEST @ RH 77 2 154 LotA: 0/77LotB: 0/77


AC

JESD22-A102A118


TEST @ R 77 2 154 LotA: 0/77LotB: 0/77


TC

JESD22-A104

AEC Q100-Appendix 3


TEST @ H 77 2 154 LotA: 0/77LotB: 0/77


PC + PTC

JESD22-A105



PTC

JESD22-A105



HTSL

JESD22-A103

High Temperature Storage Life (HTSL):175oC for 504 hrs


TEST @ RH(C) 77 1 77 LotA: 0/77 Generic dataQ203725, QY4(Nitron): 0/77





M82Z0 Shong Lee Ming-B21406




"Varies""Varies"

U050FXXD /85%UDRSST6003 /SOEIAJ 8 T2 MFP Jim Carlquist - RMSD80







"Varies""Varies"



spares



HTOL

JESD22-A108

High Temperature Operating Life (HTOL):Ta = 150°C for 168hrs (AEC MC Rd Pt.)Comm/Ind: 1yr lifetimeBias = 6V




ELFR



Q202069, QC16: 0/2400

EDR





spares



WBS


1 5 LotA: 0/5, Cpk>1.67LotB: 0/5, Cpk>1.67

WBP

MilStd883-2011



1 5 LotA: 0/5, Cpk>1.67LotB: 0/5, Cpk>1.67

SD

JESD22-B102




PD

JESD22-B100



DIM&

BOM



SBS



devices)


LI

JESD22-B105




0 0



spares



EM


TDDB


HCI


SM


NBTI











"Varies""Varies"



spares



TEST



HBM

AEC-Q100-002 /JESD22-A114E

Jan 2007


TEST @ RH2KV min.

3 units per Voltage level 0 0 pass Generic dataQ199497, QY4A(Nitron SOG) SOIC16 W: 0/3@5000/3@10000/3@15000/3@2000

MM



TEST @ RH200V min.

3 units per Voltage level 0 0 pass Generic dataQ199497, QY4A(Nitron SOG) SOIC16 W:0/3@500/3@1000/3@1500/3@200

CDM



3 units per Voltage level 0 0

LU

JESD78plus




ED


spec

Electrical Distribution (ED) TEST @ RHC 5 0 0 Completed Done on QY4A(Nitron SOG) SOIC16 W:

FG



FG%= No Change

CHAR

For AEC, AEC-Q003





TEST @ R 6 0 0

EMC


Emissions



1 0 0


Quartz# Mask Set Product-Qual Description/Part Number (s) Die Area(mm2) Assembly Site Pkg Description/Code Mold Description EPOXY Description Wire Description

203725 M05Z 68HC908QY4 (Nitron) 7.315 NFME SOEIAJ 8/6003 HITACHI_CEL9210HFVL ABLESTIK_ABL8352L 25um Au

Date Author25-Aug-09 T. Gause25-Aug-09 T. Gause29-Sep-09 T. Gause5-May-11 Nancy Long

General Notes:1 -Nitron SOG Wafer tech code U050FXXD2 - Nitron SOG BOM: HITACHI_CEL9210HFVL Mold Compound, ABLESTIK_ABL8352L Die Attach Epoxy, 25um Gold Wire

Die Qual Vehicles

Revision Comments


Rev O Generated Plan Rev 1.0 Reviewed qual plan with H.P. Wang - TJN Reliability Engr., PE and PM team.Rev 1.1 Added pkg qual stress requirements to align to 8 SOEIAJ package qual strategy.


uA N/A 4 0.444052 0.1313 6.4873 0.34174 0.0962 9.2132 0.37122 0.0969 9.0392 0.483944 0.0938 8.94165 PASS PASS

stop_idd_3v uA N/A 4 0.450442 0.1071 7.9361 0.46723 0.0833 10.139 0.42274 0.1175 7.3134 0.481817 0.09265 9.06012 PASS PASS

(Nitron_SOG M82Z) Electrical Distribution

Report Date: 18/May/2011Report Revision: 0


Hot CHD Devices Pre HTOL CHD Devices Post HTOL SND Devices Pre HTOL SND Devices Post HTOL Pre CHD

mean+-1 SND sigma or +-10%

Post CHD


Comment

125C 125C 125C 125C

Parameter Name in Datasheet Units

Lower Limit


voh_min_load_me_5v V 3.9 4.5 4.214009 0.0031 30.302 4.22202 0.0031 29.921 4.23689 0.0026 33.998 4.22006 0.0025 37.3435 PASS PASSvoh_max_load_me_5v V 2.8 5.5 4.014199 0.0051 79.375 4.02317 0.0089 45.558 4.01916 0.009 45.112 4.020913 0.00659 61.7446 PASS PASSvoh_min_load_me_3v V 2.28 2.8 2.548821 0.0045 18.627 2.54713 0.0016 52.39 2.55147 0.0014 57.67 2.54587 0.0014 60.4173 PASS PASSvoh_max_load_me_3v V 1.58 3.3 2.405034 0.0111 24.863 2.41728 0.0047 59.783 2.4104 0.0054 51.021 2.41521 0.00405 68.6886 PASS PASS

vol_min_load_5V_PTA5 V 0 0.4 0.058707 0.002 9.9522 0.05332 0.0021 8.5706 0.05872 0.0015 10.793 0.055244 0.00212 8.66882 PASS PASSvol_max_load_me_5v V 0 1.5 0.30923 0.0079 13.044 0.31389 0.0081 12.938 0.31757 0.0085 12.494 0.321543 0.00823 13.02 PASS PASS

vol_min_load_3V_PTA5 V 0 0.3 0.023691 0.0008 9.437 0.02392 0.0006 13.239 0.02373 0.0007 12.164 0.022205 0.00061 12.0573 PASS PASSvol_max_load_me_3v V 0 1 0.229856 0.0069 11.044 0.23432 0.009 8.6908 0.23692 0.0068 11.571 0.244873 0.00899 9.08216 PASS PASS

run_idd_5v mA 0 7 5.063385 0.0789 6.0727 4.94757 0.0656 7.8831 4.81343 0.0396 14.206 4.94203 0.06799 7.6387 PASS PASSrun_idd_3v mA 0 3.8 2.407038 0.0903 3.7412 2.39873 0.0686 4.9609 2.25651 0.0589 6.5829 2.39719 0.06321 5.39359 PASS PASSwait_idd_5v mA 0 2.5 1.681201 0.0208 5.107 1.70401 0.02 4.9416 1.61881 0.018 7.053 1.701843 0.01885 5.27372 PASS PASSwait_idd_3v mA 0 1.75 1.072752 0.0164 3.6039 1.08795 0.0189 2.8524 1.03571 0.0149 4.8086 1.086707 0.01721 3.16201 PASS PASSstop_idd_5v uA N/A 5 0.72747 0.1332 6.9359 0.60686 0.1298 7.4307 0.46559 0.1301 7.7757 0.546522 0.22631 4.35014 PASS PASSstop_idd_3v uA N/A 4 0.601414 0.1364 5.8631 0.54751 0.1064 7.682 0.48254 0.1474 5.6936 0.584705 0.20047 4.01611 PASS PASS

Cold CHD Devices Pre HTOL CHD Devices Post HTOL SND Devices Pre HTOL SND Devices Post HTOL Pre CHD


Post CHD

mean+-1 SND sigma or +-10% Comment

-40C -40C -40C -40C

Parameter Name in Datasheet Units

Low Limit


voh_min_load_me_5v V 3.9 4.5 4.228732 0.0021 42.913 4.24442 0.0039 22.121 4.24708 0.0022 38.133 4.246643 0.00387 21.8315voh_max_load_me_5v V 2.8 5.5 4.173728 0.0084 52.636 4.29162 0.0069 58.198 4.0734 0.0078 54.074 4.085777 0.00797 53.7931

PASS PASS

voh_min_load_me_3v V 2.28 2.8 2.557023 0.005 16.352 2.55646 0.0018 45.364 2.55615 0.0013 64.84 2.557163 0.00172 46.9877PASS PASS

voh_max_load_me_3v V 1.58 3.3 2.559037 0.0057 43.637 2.58151 0.0041 58.69 2.44452 0.005 57.078 2.455513 0.00494 57.0357PASS PASS

vol_min_load_5V_PTA5 V 0 0.4 0.059823 0.004 5.0404 0.0545 0.0018 10.044 0.04976 0.0013 12.469 0.053036 0.00141 12.562PASS PASS

vol_max_load_me_5vPASS PASS

V 0 1.5 0.285454 0.0074 12.801 0.27984 0.0374 2.4926 0.2665 0.0069 12.863 0.278795 0.00345 26.9327 PASS PASSvol_min_load_3V_PTA5 V 0 0.3 0.021754 0.0008 9.471 0.02135 0.0007 9.5426 0.01944 0.0007 9.5253 0.020955 0.00104 6.70754 PASS PASSvol_max_load_me_3v V 0 1 0.197642 0.0028 23.921 0.21253 0.0028 25.722 0.19363 0.0061 10.537 0.194813 0.00637 10.1879 PASS PASS

run_idd_5vrun_idd_3v

mA 0 7 4.661618 0.0473 12.948 4.78875 0.0603 9.4543 4.634 0.0607 10.245 4.72111 0.05416 10.9489 PASS PASSmA 0 3.8 2.279916 0.1188 3.1976 2.25633 0.0998 3.8879 2.13187 0.0496 8.6649 2.21661 0.09258 4.33295 PASS PASS

wait_idd_5vwait_idd_3v

mA 0 2.5 1.604333 0.0222 5.9452 1.62387 0.0243 5.1666 1.54727 0.0245 6.1585 1.604103 0.02252 5.85903 PASS PASSmA 0

N/A1.75 0.981234 0.0247 3.6235 1.01157 0.0234 3.3934 0.96783 0.0191 4.9293 0.99533 0.02145 3.95796 PASS PASS

stop_idd_5vstop_idd_3v

uA 5 0.40108 0.1107 9.3298 0.40637 0.1121 9.195 0.2206 0.0949 11.52 0.426177 0.1121 9.13983 PASS PASS

RoomPre

CHD mean+-1 SND sigma or +-10%

Post CHD


CHD Devices Pre HTOL CHD Devices Post HTOL SND Devices Pre HTOL SND Devices Post HTOL

Parameter Name in Low Upper

25C 25C 25C 25C

Datasheet Units Limit Limit Avg Std Cpk Avg Std Cpk Avg Std Cpk Avg Std Cpk Commentvoh_min_load_me_5v V 3.9 4.5 4.243411 0.0013 67.399 4.24201 0.0014 60.519 4.24149 0.0029 29.374 4.241067 0.00147 58.668 PASS PASSvoh_max_load_me_5v V 2.8 5.5 4.037608 0.0079 52.499 4.06418 0.0059 71.837 4.04566 0.0142 29.2 4.06548 0.01427 29.5604 PASS PASSvoh_min_load_me_3v V 2.28 2.8 2.557189 0.0017 48.494 2.55541 0.0011 76.936 2.55354 0.0016 49.8 2.55456 0.00165 49.5683 PASS PASSvoh_max_load_me_3v V 1.58 3.3 2.423617 0.0036 77.983 2.4421 0.0038 75.254 2.42687 0.0091 31.146 2.44295 0.02144 13.3248 PASS PASS

vol_min_load_5V_PTA5 V 0 0.4 0.056092 0.0045 4.1754 0.05553 0.0074 2.5176 0.05398 0.0023 7.8209 0.054007 0.00287 6.27416 PASS PASSvol_max_load_me_5v V 0 1.5 0.314327 0.0159 6.6008 0.30231 0.0187 5.385 0.29104 0.0132 7.3463 0.303827 0.01432 7.07036 PASS PASS

vol_min_load_3V_PTA5 V 0 0.3 0.023302 0.0023 3.3582 0.02268 0.002 3.6983 0.02141 0.001 6.9226 0.022683 0.00144 5.23364 PASS PASSvol_max_load_me_3v V 0 1 0.218472 0.0133 5.4808 0.21847 0.0147 4.9431 0.21437 0.011 6.4955 0.203981 0.01327 5.12387 PASS PASS

run_idd_5v mA 0 7 4.707722 0.0557 10.719 4.82517 0.0486 11.476 4.72046 0.0494 11.999 4.786013 0.05043 11.3295 PASS PASSrun_idd_3v mA 0 3.8 2.307017 0.074 5.0155 2.29503 0.0792 4.733 2.19704 0.0588 6.9285 2.282247 0.07961 4.76357 PASS PASSwait_idd_5v mA 0 2.5 1.609556 0.0244 5.3335 1.64419 0.0205 5.7871 1.58247 0.0188 7.413 1.637867 0.02039 5.91984 PASS PASSwait_idd_3v mA 0 1.75 1.020236 0.0197 3.8879 1.03163 0.0199 3.6656 1.00225 0.0152 5.432 1.029347 0.01921 3.82809 PASS PASSstop_idd_5v uA N/A 5 0.447181 0.1068 9.5323 0.44519 0.0995 10.236 0.26192 0.0861 12.539 0.423487 0.08154 12.5769 PASS PASS

FORMPPAP007DOC Freescale Rev K

Gage Study Summary Report

Customer Part Number: Various Q1’2011 Company/Manufacturing Site ID: Freescale/ CHD-Fab Designate only one of the following and enter the appropriate information:

Wafer Fab Process Technology: 908AT60A 85%UDRSST Assembly Process Package Family: Physical Dimensions Package Drawing #: Test

Special/Important

Characteristic Measurement

Gage/Tool/Equipment %R&R

1/ Date Study Performed

Active Area Nitride ACI CD KLA 8100 XP CD SEM 8.91% 13-Nov-10 Floating Gate ACI CD KLA 8100 XP CD SEM 7.10% 13-Nov-10 Gate Poly ACI CD KLA 8100 XP CD SEM 7.57% 13-Nov-10 Gate Poly ACI Overlay KLA 5200 Overlay 7.77% 07-Jul-10 Via 1 ACI CD KLA 8100 XP CD SEM 5.10% 10-Apr-10 Thickness (HTO) ELP & S200 8.54% 22-Oct-10 Thickness (LV Gate Ox, Gate Ox) ELP & S200 7.41% 05-Feb-10 Thickness (Field Ox) ELP & S200 2.83% 05-Feb-10 Thickness (Poly Dep) ELP & S200 7.40% 05-Feb-10 Thickness (Spacer Etch REMOX) Tencor UV1XXX 4.28% 25-Aug-10 POCL Doping Tencor RS75 1.4% 27-Mar-10

1/ If R&R > 10%, attach containment action, corrective action, or justification (as appropriate)

Documents

Qualification Results- PCN14723...Lot ID-(#Rej/SS) NA=Not Applicable Comments or Generic Data WBS AEC Q100-001 Wire Bond shear (WBS) Cpk = or > 1.67 30 bonds from minimum 5 units 1