Process Problem Inspection Sheets

7/29/2019 Process Problem Inspection Sheets

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Sr No Date Product Nature of problem Qty Rework done

4/2/2013 Spot LED shift manually inserted.

4/2/2013 Flat Excess paste 18 Manually corrected

flat LED missing 2 Manually inserted.

9/2/2013 Spot Paste shift/short 1 Manually cleaned

10/2/2013 spot LED missing 5 Manually inserted.

Process name: Pick and place

Operator name:


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Suggestion

Pick and place

PCB sticking is done from below side and

Pick and place

Alignment problem at the start of process

LED surface is sticky so it does not seperated


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1 4/2/2013 Spot Tx shifting 8

Flat LED shifting

TX deviating

9/2/2013

10/2/2013

Process name: Reflow

Operator name:


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Suggestion

PCB pad size

PCB pad size


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1 4/2/2013 Spot

reverse mounted 12

with correct polarity

2 5/2/2013 FlatDiode D4/D5/D6touch up re-soldering

Tx soldering 89 Soldering done

Thumb Stoning

R3,R12 5 re-soldering

Diode D5 missing 1 New Diode mounted

3 6/2/2012 Spot

Tx EFD 10 dry

soldering 72 Re-soldering done

Cap 4.7 CE2/CE1

touch up 144 Re-soldering done

4 10/2/2013 All touch up 8 Re-soldering done

Cap 4.7 CE2/CE1

touch up 16 Re-soldering done

Lm1 Tx misplacment 4 Re-soldering done

5 12/2/2013 Spot

Cap 4.7 CE2/CE1

touch up

Lm1 Tx misplacment

15/2/2013 Spot Cap 4.7F missing 20 Re-soldering done

D3 shift 3

4.7 cap shift 4

R12/R15/R18

resistor shift 3

PROCESS PROBLEM INSPECTION SHEETProcess name: MI and

Operator name:


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Suggestion Corrective Actions taken Possible Solution

level.

operator. Instructions given instruction infront of the

Reflow process to be improved by providing

firm holding pallets. Diode length is short ascompared to padding.

Tx soldering is not done in reflow process

yet.

Conveyar speed to be decreased but need to

check cycle time and effect on LED

Pasteheight is not constant

Reflow process to be improved by providing

firm holding pallets

This should have been

screened after reflow

inspection itself. Tighten

inspection after reflow.

Need to do more pasting and reflow processfor Tx to be proper. Pad size is not matching

with Tx pins

Due to manual insertion at SMT level error

occures. Same size feeder not available.

PCB pad should be extra.


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1 4/2/2013 Spot R9(1.5K) Burn 31 R9 replaced.

2 5/2/2012

10/2/2013 Spot PCB off due to Tx dry 2 Re-soldering done

12/2/2013 Spot R9(1.5K) Burn in series 11 R9 replaced

13/2/2013 Spot Wattage is more than 4 Pending

15/2/2013 Spot Blinking failure 3 1.5 K replaced

Off due to Tx reverse 3 Tx correctly re-

Wattage is more due to 1 Cap 4.7 remounted

Process name: Spot testing

Operator name:


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Suggestion

Due to wire cut in testing jig, problem

Actual cause observed is dat, After IPA ok

Manual error at SMT level


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1 4/2/2013 Spot Flickering observed 236 Seperated for analysis and

2 11/2/2013 Spot Flickering observed 6 Seperated for analysis and

12/2/2013 Spot Flickering observed

15/2/2013 Spot Flickering observed 11 Seperated for analysis and

Process name: Spot dimming function checking

Operator name:


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Suggestion Remarks

As per suggested by Has this been

After PQ dimmers , diiming Flickering problem

Flickering observed


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1 8/2/2013 Spot T-connector missing 2 T-connector added

13/2/2013 . Inner box damaged/ 3 Box replaced

2 15/2/2013 Spot T-connector and inst shet 1 Re-inserted.

Process name: Final packing

Operator name:


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Suggestion Remarks

1) Exact packing as per

To be checked before

Exact packing as per picture


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1 12/2/2013 Spot Soldering was not done 1 Resoldering done

Process name: Final packing

Operator name:


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Suggestion Remarks


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Aq Q


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Sr No Date Product Nature of problem Rework done

Process name:

Operator name:


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Suggestion


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Process name:

Operator name:


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Suggestion


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Process name:

Operator name:


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Suggestion


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Documents

Process Problem Inspection Sheets