Presto Engineering SEMI Europe 2012/01/18

Cédric MAYOR, R&D S. Dir

Presto Engineering © 2011

About Presto Engineering

• Service hubs in Europe,

USA and Israel

• 70+ people expert in Test,

Qualification, Reliability

and Failure Analysis

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Leader in Integrated Test & Product Engineering and

Back-end Production services

More than 100 customers served since 2006

Presto Engineering © 2011

Company History

2011

ISO 9001 Certification

Roos Instrument RF partnership

Acquisition of NXP’s lab assets

Caen Normandy Hub

Common Lab with

CEA-LETI (RF DFT R&D)

Test Services RF collaborations WIN Semi/GaAs, IBM/SiGe

2009 2008 2007 2006

Creation in

California

Acquisition of Cypress’ engineering lab

Silicon Valley Hub

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2010

Series A Series B Series C

ISO 17025 Certification

Creation Presto Israel

ATE Infrastructure

(RF, 10-100G)

Presto Engineering © 2011

Core Differentiating Competence

A global and expert team

Offering single point know-

how for five semiconductor

value segments

Heirs of leading companies in

the industry

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Presto Engineering © 2011

Test Engineering

• Hardware development

– Circuit design, CAD, implementation

– Probe cards and FT loadboards

• Test Program development

– Test plan from datasheet & coverage

– Development and debug on ATE

– Validation, Correlation & Ramp

– Multi-site and transfer to production

– Test time reduction

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Presto Engineering © 2011

Supported Platforms

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Vendor Models RF SOC Dig Mem

Advantest T5593

T5581

T5362

X

X

X

LTX-Credence X-Series MX

D-10 (*)

X X

X

X

Teradyne uFLEX

J750 (*)

U-FLEX (*)

X

X

X

X

X

X

Verigy 93K

Inovys

X X

X

X

X

(*) With test partners

Presto Engineering © 2011

Test Engineering Expertise

• Management background in Automated Test

Equipment (ATE) & NPI

– Schlumberger/ATE, Credence

– Engineering (ATE development) and Applications

– Product introduction & SCM

• Multiple test engineering experts on staff

– Teradyne, Verigy, LTX-Credence

– RF, Analog-Mixed Signal, SOC

• Hardware designers on staff

– Loadboard development, from circuit design to qualification

• Design for Test (DFT) investment to leverage

existing ATE into new applications

– Patent pending in Ultra Wide Band high frequency connectivity

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Presto Engineering © 2011

Market Focus: RF test examples

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40-100G Ethernet

10-50Gbps

LTE wireless Backhaul

infrastructure

20-86GHz RF

UWB Mbps

transmission Mbps

8 GHz RF

NFC Payment

RFID

3G/4G LTE Platform

TX/RX

2.4GHz RF

Working with industry leading edge

customers in key RF market segments

Presto Engineering © 2011

Accelerate Time to Volume

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DESIGN

WAFER

FOUNDRIES

ASSEMBLY & TEST

OSAT (Out-Sourced Assembly & Test)

YOUR

YOUR CUSTOMERS

• Test Engineering

• Characterization

• Qualification

• Failure Analysis

• Test Production

• Assembly Mgmt

• Yield Improvement

• Turn-Key

Presto Engineering © 2011

Capabilities / Cookbook / Knowledge

Prototype testing

Fault localization (Bitmapping / Logic faults)

In house advanced product engineering tools

Non Destructive - PEM

- TIVA/OBIRCH

-SDL

- TRE

- LTP/LVP

Destructive PFA - FIB / TEM

- AFM / SIMS / AFP

- AUGER

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Presto Engineering © 2011

Our Values

CUSTOMER

RESPECT

TEAMWORK

PASSION

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Back-up

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Presto Engineering © 2011

FUSION MX (LTX Credence)

DC

– 16 OVI Pins, 16V, 550mA/1A

– 16 High Current OVI Pins, 8V,1A,

– 32 VI16-B Pins, +42/-4V, 50mA

Analog

– 4 Sequenced Waveform Generator Pins

– 4 Digitizer HSB Pins, 14 Bit, 100Ms/sec

Digital

– 96 FX2 200MHz Digital Pins

– 16 FX High Speed Digital Pins ( 800Mhz)

RF

– 16 RF16D Ports

– 1 Dual Source and LO Generators

– 1 Low Jitter Clock Generator 6GHZ SMA100

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Presto Engineering © 2011

Digital AMS/RF SoC V93K Test Cell

• Large Test Head

• 512 Digital pins (32MB) – 12 x 3.6Gbps (PS3600)

– 84 x 800Mbps (PS3600)

– 128 x 400Mbps (PS800)

– 288 x 200Mbps (PS800)

• Analog – 1 x MBAV8 (4S / 4M)

• RF – 3 RF source, 12 RF ports

• DPS – 4 x MSDPS (32 channels)

– VI32 (16 channels)

• Software – Memory APG

– Multisite

• Prober TEL Precio – 200mm 300mm wafer Probing

– 12” and 9.5” V93K docking

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Presto Engineering © 2011

µFLEX RF (Teradyne)

RF

• 50MHz to 6GHz

• 3 sources -100 to +13 dBm , 11 Ports

• Modulated source. 40MHz Bandwidth

• On board 100MSps digitizer.

• Synchronized with other instruments

Analog

• 2 sources 23 bits 15MHz Bandwidth

• 2 sources 14 bits 400 MSps

• 2 captures 23 bits 15MHz Bandwidth

• 2 captures 14 / 12 bits 125MSps, 300MHz BW

Digital

• 96 channels

• 50 MHz, up to 200MHz

• Per pin programmable edges

• 250ps resolution

DC

• 20 VI “30V / 200mA”, 4 quadrant

• 4 VI “75V / 2A”, 4 quadrant

•Wave source capability, 16 bits

•Capture V or I @ 100kHz, 16 bits

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