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www.linx-consulting.com
Outlook for Cleans in the Semiconductor Industry
Mike Corbett
Business of Cleans, 2019
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Linx Consulting Service Portfolio
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Background & Market Trends
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Industry Has a Strong Growth Outlook
Semiconductor may be
set to capture a larger
share of global GDP.
Connected World Growth Drivers
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Connected World Drives Many Opportunities
Opportunities for Cleans
• Novel Materials
• Cobalt, Mo, Ru, etc.
• Novel Integrations
• Al PERR for 200mm wafers
• Replacement chemistries
• Novel strippers
• Copper compatible products
• Advanced Packaging
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There are Still Many Technical Challenges
Scaling and New Materials
• RC considerations impacting Logic Interconnect
– Limitations of current architectures/materials
• FinFET gate deposition
– GAA Nanowire development
– High mobility materials
• Memory technology extension
– 3D-NAND growth
– DRAM capacitor dielectric
– Novel architectures
• Patterning
– Low temperature spacers
– Lithography aids
– EUV insertion
Challenges
• BEOL
– Novel barriers, Liners
– Novel cleans and CMP
• FEOL/MOL
– WF metals
– Novel MHM
– Cobalt Contacts
– Novel cleans and CMP
– Gap fill
• Memory
– Novel cleans and CMP
– Gap fill
– Horizontal fill
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Cleaning Trends
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PERR - FEOL, MOL and BEOL Materials
• The introduction of new metals for FEOL, MOL and BEOL and novel integration schemes
has led to an increase in the number of unique PERR cleaning steps in advanced logic
• Some new formulations can be utilized/tuned across multiple metals so the number of
cleaning steps is difficult to know exactly
• Above are some of the different potential combinations of metals that may be present on
advanced logic device
Location/
Step
FEOL, MOL and BEOL Metals & Combinations (Illustrative)
Layers
FEOL MHM
FEOL WF
Metals W Co
TiX
Liner/MHM
Al203
Replacemnt
Plug Co SEL/Cap Copper TaN
FEOL/
CleansX X X X X X
MOL/
CleansX X X X X X X X X
BEOL/
CleansX X X X X X X
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FEOL MHM
FEOL WF
Metals W Co
TiX
Liner/MHM
Al203
Replacemnt
Plug Co SEL/Cap Copper TaN
FEOL
MHMFEOL
FEOL WF
MetalsMOL
W BEOL
Co
TiX
Liner/MH
M
Al203
Replacemnt
Plug
Co
SEL/Cap
Copper
TaN
PERR Has Fragmented
• PERR has fragmented. End-users are trying to find
chemicals to control infrastructure and costs.
• End-users need chemistries that solve multiple
problems.
• They cannot afford to have 6 different cleans and are
trying to minimize the number of unique cleans,
however.
• There are some key selectivity including: Copper,
Cobalt, TiN, MHM, W
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PCMP Evolution
Copper
• Memory
• Logic
Copper/Cobalt
• Advanced Logic
• SEL and Cap
Cobalt
• Advanced Logic
• Bulk Metal
Tungsten
• Advanced Logic
• Contacts
• MG
Ceria
• Advanced Logic
• 3DNAND
• STI
• Oxide
• Whereas historically the major home for formulated PCMP cleans was in copper CMP, the
industry is now using advanced formulated products for Cobalt, W and ceria-based polishes,
as shown below
• As the requirements to develop products for these applications becomes increasingly difficult,
the industry is relying more heavily on the larger multi-national chemical companies to develop
technology based solutions
Formulated Post CMP Cleans
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CMP Intensity Continues to Increase
0
5
10
15
20
25
30
35
40
ASIC 10nm DRAM 15nm 2DNAND 3DNAND 96 layers
# CMP Steps per Wafer
ASIC 10nm DRAM 15nm 2DNAND 3DNAND 96 layers
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Highest Growth CMP Segments All Have Cleaning Challenges
2018 2019 2020 2021 2022 2023
Slurry Growth
Cobalt FEOL Ceria
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Outlook & Suppliers
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2,800
2,900
3,000
3,100
3,200
3,300
3,400
17 18 19 20
March 2019 Update
ESF 2019 Q1 (February)
SEMI MSI (History to 18Q4)
Millio
n S
qu
are
In
ch
es
History: Semi.org
Forecasts: Hilltop Economics, LLC
Annual Percent Change In MSI
2016 2017 2018 2019 2020
2.9% 10.0% 7.9% -1.5% 2.9%
Semiconductor MSI Outlook
Latest MSI Forecast by ESF Model
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MSI Vs. All Cleans
$-
$500
$1,000
$1,500
$2,000
$2,500
$3,000
$3,500
0
2,000
4,000
6,000
8,000
10,000
12,000
14,000
16,000
2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023
MSI All Cleans (US$ Million)
All Cleans includes Bulk Wet + Strippers + Formulated Cleans
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Overall Outlook
• The total market size of the segments studied is $2,378 million in 2018 and is expected to
grow to $2,945 million in 2023. Overall AAGR of 4.4% during forecast period driven by new
products.
• Key challenges around metrology, defectivity and particles will lead to increased
management of supply chain.
• There is minimal impact from Chinese suppliers at this time.
$-
$500
$1,000
$1,500
$2,000
$2,500
$3,000
$3,500
2018 2019 2020 2021 2022 2023
US$ Million
Formulated Strip Bulk
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MSI Vs. Formulated Cleans
$-
$100
$200
$300
$400
$500
$600
$700
$800
$900
$1,000
0
2,000
4,000
6,000
8,000
10,000
12,000
14,000
16,000
2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023
MSI Formulated Cleans (US$ Million)
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All Formulated Products
$-
$100
$200
$300
$400
$500
$600
$700
$800
$900
$1,000
2016 2017 2018 2019 2020 2021 2022 2023
US$ Million
Al PERR Cu SAC Co PERR PCMP Ceria PCMP W PCMP Cu PCMP Co
AAGR + 8.8% over the forecast period
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“New” Formulated Products
$-
$100
$200
$300
$400
$500
$600
$700
$800
$900
$1,000
2016 2017 2018 2019 2020 2021 2022 2023
US$ Million
Al PERR Cu SAC PCMP Cu Co PERR PCMP Ceria PCMP W PCMP Co
New Products – Ceria PCMP, W PCMP,
Co PCMP, Co PERR
Existing Products – Cu
PCMP, Cu PERR, Al PERR
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Leading Suppliers Formulated Cleans
EKC Tech
Entegris
Avantor
Versum
FFEMPS / Wako
MCC
BASF
JSR Micro
TOK
Other
2018, US$ Million
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Leading Electronic Materials Suppliers in Semi
$-
$200
$400
$600
$800
$1,000
$1,200
$1,400
$1,600
WF
M R
even
ue
s / $
m 2
01
7 b
asis
CMP Dep Cleans Wet Litho Bulk Gas Spec Gas
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Versum and Entegris Combined Materials Business
Cleans Dep ESG CMP Litho
$M
Entegris Versum
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Versum and Merck Combined Business
Cleans Dep ESG CMP Litho
$M
Versum Merck
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Conclusions
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Conclusions
• Downturn expected in a few years but overall strong outlook for semiconductor
industry
• Still many technical challenges ahead that will drive demand for new cleans in
PERR
• Critical challenges for PCMP will continue and drive needs for more cleans here
as well
• Good growth outlook for cleaning chemicals, which require continuous
investment to meet end-user needs
• Regional suppliers are not meeting leading edge fab needs for innovative
solutions
• M&A will continue to impact cleaning suppliers