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“Industrial Solutions for
a volatile and rapidly
changing marketplace”
Leading for
Optimization & Excellent
We are a trade organization serving global semiconductor industries.
We strive to foster significant growth opportunities, sustainable development and synergistic benefits with our strategic business partners.
We have established a number of excellent product lines agencies in Singapore, Malaysia, Philippines, Thailand, Indonesia and Europe to better serve our customer internationally.
Our mission is to achieve and enhance clear leadership, in the existing and new core industrial product categories in which we choose to compete.
We meet our customers’ needs by providing value and satisfactory product and services.
With our strong customer focus, we have achieved an excellent track record of proven sales and services, satisfying customers’ requirements and expectations at all times.
Who are we… Our Mission… Our Commitment…
We are committed to deliver Total Customer Satisfaction by providing:
Excellent products’ quality Competitive pricing On-time delivery Prompt response
Guided by these principals, we strive continuously for improvement in all levels of excellences to satisfy our business partners.
Company Profile
Organization Chart
Director
Business Development
Manager
Product
DevelopmentAdministrator
Regional
Sales Manager
Sales Engineers
Financial
Controller
Product Range
Front of Line (FOL)
• Hub Dicing Blade (Wafer Saw)
• Diamond Back Grinding Wheels
• Capillary with Colour Code
• Wafer Dicing Cleaner
End of Line (EOL)
• Resin Bond Dicing Blades (For QFN Packages)
• Metal Bond Dicing Blades (For BGA Packages)
• Rubber Cleaning & Waxing Sheet (RESOLVE® & RECOVER®)
• Melamine Cleaning Compound
• Molding Compound & T/F Conditioning Compound
• Paper Frame
• Mold Release Plus
• Silstrip NHLO Liquid (Silicon Adhesive Remover)
Test Area (TA)
• POGO Pins
• Test Socket
• Interposer for Probe Card
FOL - Hub Dicing Blade
Advantages:
Maximum cutting performance
No glazing
Faster cutting action
Improve surface finish quality
Better coolant retention
No material deformation
No contamination
Typical Operating Conditions For Wafer Dicing:
RPM: 25,000 -40,000
Maximum blade operating speed: 45,000 RPM’s
Feed rate: 50-200mm/s [2-8 in./sec.]
Materials: Silicon, GaAs, SiGe, etc.
Depth of cut: 100μm to 1mm (0.004" to 0.040")
Mounting: Tape.
Machine: Disco, K&S, TSK, etc.
Features / Benefits:
Increase blade life
Reduce chipping
Reduce blade wear
Increase process consistency
Maintain consistent cutting speed
Reduce blade change and mounting cost
FOL - Diamond Back Grinding Wheels
Application:
Used on back grinding machines for
thinning and flattening silicon wafers,
glass products, ceramic products.
Sizes range from 8” to 14” O.D.
Used on machines manufactured by
Disco, Okamoto, Strasbaugh, and many
others.
Features / Benefits:
Grind all types of wafers with less sub-surface
damage
Combine diamond abrasives and bond matrix in
meeting requirements
Specification:
Available in large variety of bond such as sintered
(metal bond), resin bond, vitrified bond, plated
(nickel bond).
Specification of diamond back grinding wheel can
be optimized to fit your particul arapplication/
material
FOL - Capillary
Item Data
Density (g/cm³) 4.2
Vickers Hardness (Hv) Avg. 1,750
Grain Size (µm) 0.9 µm
Forming Press
Application:
Various tip finish solution
(Pol /Matte/MIRUCA)
Consistent life time.
Stable bond-ability
High productivity
CPM is formed out of a AI2O3 powder and
ZrO2 composite material with special additives by
ceramic press molding technology.
Specification:
FOL - Wafer Dicing Cleaner CA3000
Features:
Low surface tension to provide a stable film on the
wafer surface
Remove silicon chips and dust
Clean the silicon wafer surface.
Anti-corrosion property to prevent the galvanic
corrosion on Al/Cu bonding pads
Environmental-friendly solutions, bio-degradable
Neozol CA is mixed with DI water in dispensing
equipment and fed into sawing machine through
existing
DI water line. Neozol CA substantially reduces surface
tension of the water, wetting well over wafer surface so
that sawing dust hardly stick to the wafer surface.
Hydrophobic functional groups of Neozol CA
surrounds the dust particles, and the contact angle
between
dust particles and the wafer surface increases that
dust particles being separated from wafer surface and
swept away with DI water.
Along with technological advance, wafer
sizes are getting bigger and chip sizes are
getting smaller, which result longer dicing
time, consequently cause several problems;
silicone dust adhere to wafer surface
corrosion on Al/Cu bonding pad
Neozol CA is mixed with DI water in
dispensing equipment and fed into sawing
machine through existing
DI water line. Neozol CA substantially
reduces surface tension of the water, wetting
well over wafer surface so that sawing dust
hardly stick to the wafer surface.
Cleaning Additive for Wafer Dicing Process
FOL - Wafer Dicing Cleaner CA3000
Cleaning Mechanism
Cleaning Mechanism
Sawing Particle
Separate sawing particles from the Wafer
Water attracts the hydrophilic groupof Neozol.
Separated sawing particles doesn’t re-deposit on the wafer surface and disperseinto DI water.
Wafer
The hydrophobic group of Neozol surrounds sawing particles, increase contact angle.
Separation of dust particles from Wafer surface & Saw Blades Prevent sawing dusts sticking on wafer
surface
Minimize friction heat of saw blades
CA-3000 reduces surface tension of DI water and let water easily wet on wafer surface. Much more efficient than CO2 bubbling equipment. Surface tension of DI water plus CO2: 72 dyne/cmSurface tension of DI water plus CA: 33 dyne/cm
Water
Water
Wafer surface
Wafer surface
EOL - Resin Bond Dicing Blades
Application:
Carbide Tool Grinding
CRT Panel & Funnel Grinding
Glass Finish-Grinding
Ceramic Finish-Grinding
Specification:
Good free-cutting
Good abrasion resistance
Available in a broad range of applications both in dry
and wet condition
Improved heat resistance (Polyimide Series)
Excellent cut quality and dicing blade life
Resin-bond blades wear off faster and create less heat
& friction. Therefore it is suited for hard, brittle and
composite materials such as QFN/MLF, alumina, glass
/and quartz.
EOL - Metal Bond Dicing Blades
Application:
Flat & Safety Glass Edge Grinding and
Drilling
Optical Lens Grinding, Cystal Grinding
Tungsten Carbide, Cermet, Cast Alloy,
Ferrite,
Quartz Grinding,Engine Parts Honning
Features / Benefits:
Excellent form-holding capability
High abrasion and heat resistance
Excellent for interrupted grinding application
Excellent for glass drilling and edging
Long tool life
Metal-bond (Sintered) Blades is an excellent
choice for softer materials substrates such as
PCB, Silicon and BGA. It has excellent form
holding and corner characteristics, provide very
long life, high level of consistency.
Recommended for users requiring very straight
cuts and larger blade exposures.
EOL - Rubber Cleaning & Waxing Sheet (RESOLVE® & RECOVER® )
Features / Benefits:
No mold abrasion and corrosion by using
selective inorganic filler
Pleasure scent provided and less smoke
Great flow characteristic enables to clean
the mold corner
No residues on air ventilation
Able to apply to complex mold cavities
Economical Efficiency and Productivity
Improvement:
No dummy lead frame require
No preheating require
Less inventory management (one size
covers to many packages)
Shorter cleaning time
Might prolong the product sustainabilityRESOLVE® and RECOVER® is a compression type
mold cleaning material (Synthetic Rubber).
RESOLVE® can effectively eliminate the pollutants and
stains formed on mold surface while RECOVER®protects mold surface and provides good releasing after
cleaning.
EOL - Rubber Cleaning & Waxing Sheet (RESOLVE® & RECOVER® )
1st shot 2nd shot 3rd shot 5th shot
Stain on
mold tool
Mold tool stain was able to remove 100% even on the 3rd shot
0
20
40
60
80
100
120
BeforCleaning
1st 2nd 3rd 4th 5th 6th 7th 8th 9th 10th
Transfer & Compression
Melamine Compound
Transfer & Compression
Melamine Compound
EMC
(Epoxy Molding Compound)
CMC
(Clear Molding Compound)
WEMC
(White Epoxy Molding Compound)
EOL - Paper Frame
An unique product specially designed to substitute conventional
metal lead frames or substrate for cost-reduction in mold cleaning
process.
Intentionally developed for melamine cleaning used in transfer
encapsulating of electric and electronics components by means of
epoxy molding compounds as well as dummy molding.
Available in the form of single strip and multiple strips.
Features / Benefits:
No need to change molding temperature and parameters
Can be used in both auto and manual mold
Air-vent cleaning design increase cleaning effectiveness in hard-
to-reach area
Easy removal (time saving) from mold surface particularly the
multiple strips type
Safe to use as it is non-corrosive
More economical value than metal lead frame
Material are in compliance with RoHS standard
EOL - Paper Frame
Melamine Cleaning Shot
Transfer Conditoner Shot
Paperframe TQFP 10x10
EOL - Paper Frame
Melamine Cleaning Shot
Paperframe TQFP 7x7
Transfer Conditoner Shot
EOL – Auto Mold Machine Brush
The brush in each auto molding machine is very important for
removing the dirt and debris of compound from the mold cavities thus
to minimize and eliminate the quality issue such as foreign object and
contamination on the package, etc.
We are able to supply all kind of brushes such as rotary brush to suit
to all type of molding machines. Reverse engineering is possible for
some special or non standard brushes.
EOL - Mold Release Plus
Mold Release Plus is a non silicon mold releasing agent.
Suitable for molding which requires minimum transfer of
releasing agent on to the molded plastic parts.
It is economical and convenient to use with new mold
break-in, incomparable part release and excellent rust
proofing characteristics.
Release Plus gives excellent paintability and rust
proofing quality.
FREE from:
Trichloroethane CAS: 71-55-6
Dichloromethane CAS: 7-09-2
EOL - Silstrip NHLO Liquid
(Silicon Adhesive Remover)
Silstrip NHLO chemically digests cured and uncured
silicone elastomers and polymers, making them easily
water or solvent rinse-able.
It readily digests silicone. Does not contain
halogenated solvents, heavy metal, cyanide or water.
Silstrip NHLO can be used for:
a) Immersion for recovery of expensive metallic
components
b) Equipment cleaning
c) Removal of excess or over-sprayed masonry
treatment
d) Removal of silicone oil stains
Features / Benefits:
Ready-to-use, no diluting or heating is required.
Safe, low odour, low evaporation, high flash point,
minimal hazard rating and has biodegradable
actives
TA – POGO Pins
Types:
General Pin (ICT, BBT, Harness..)
Semiconductor Pin (Memory, Logic I.C Test)
Mobile Test, Contact (Camera Module)
Section Semiconductor General Hinge Charger
Min O.D Φ0.11 O.D Φ0.20 Single, Dual O.D Φ1.50
Application
I.C Device,
Connector,
Glass Pad Test
Bare PCB,
In-Circuit PCB,
Harness Test
Slide PhoneWireless Phone,
PDA, Walkie-Talkie
TA – POGO Pins
General Charger Hinge Customizing
In-circuit, Bare PCB Test
Connector, Component Test
Function Test
Cellular Phone, PDA
Two-way Radio Charger
Special Connecting
Hinge for Slide –
Phone
Dual, Single Type
Special Contact
Mechanical Specifications
Application Pitch Total Length Life Span Material
0.5 ~ 5.0mm
Etc.
7.5~ 57.5mm
Customized Spec.
Over than 100K
Cycles
Plunger : BeCu, SK-4
Barrel : PbT, BsT, Ni. Alloy
Spring : Music, SUS Wire
Finish : Ni. Au. Rh.
Receptacle : BsT(Wrapping, Solder, Terminal..)
TA – Test Socket
Double Ended Single Ended Interface Customizing
Logic, Memory IC Test : Normal
Speed
(for Handler or Manual Test)
BGA, QFP, QFN, TSOP, LGA…
Logic, Memory IC Test : High
Speed
(for Handler or Manual Test)
BGA, QFP, QFN, TSOP, LGA…
Image Test for CCD
Interposer for Probe
Card
(PCB to PCB, Device to
PCB)
Manual Test
Socket
Mechanical Specifications
Application Pitch Total Length Life Span Material
0.20 ~ 1.27mm,
Etc.
2.0~ 18.5mm,
Customized Spec.
Over than 100K
Cycles
Plunger : BeCu, SK-4, Pd. Alloy
Barrel : PbT, BsT, Ni. Or Gold Alloy
Spring : Music, SUS Wire
Finish : Ni. Au. Rh. Natural
Thank you!
33 Ubi Avenue 3
#08-15 Vertex (Tower B)
Singapore 408868
Tel: +65 6509 7212
Fax: +65 6316 2295
Email: [email protected]
