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Micross Americas 1.855.426.6766 • Micross EMEA & ROW +44 (0) 1603 788967 • [email protected] • www.micross.com
BGA Reballing
One Source. One Solution.
LOW-COST, QUICK-TURNLOW & HIGH VOLUME
PROCESSES
SINGLE REFLOWREBALLING
MINIMIZES HEAT EXPOSURE
TURNKEYPRODUCT PURCHASING
PROCESSING OFCERAMIC AND PLASTIC
BGAs AND LGAs
BALL PITCH FROM 0.40mm
Pb-FREE ↔ Sn/Pb BALLS
Conversion to leaded spheresfor Hi-Rel applications.
Micross Americas 1.855.426.6766 • Micross EMEA & ROW +44 (0) 1603 788967 • [email protected] • www.micross.com
Automatic Inspection
XRF
Robotic Deballing
LOW & HIGH VOLUME PROCESSES
For lower volume requirements, Micross offers a unique process that does not require the use of preforms and eliminates the need for custom tooling for most components. Benefi ts include shortened lead times, reduced total cost and no NREs.
DEBALLOur proprietary automated wave solder deball process completely removes the original solder sphere and pad fi nish. For an ultra-controlled, non-contact deball process, our exclusive Micross Robotic Hot Solder Dip equipment can also be used.
ELECTRICAL TESTINGStatic electrical testing is available post-process to ensure there are no internal component issues or gross/latent ESD damage. Tests include detection of I/O diode opens/shorts and confi rmation that power and GND consumption are within limits.
INSPECTING/TESTING• Optical inspection for sphere condition• Automated inspection for sphere size and placement• Ball shear• XRF• Ionic cleanliness• Solderability
INVENTORY MANAGEMENTFully automated in-house EDI, inventory management system with procurement and consignment capabilities.
QUALITY• Quality system is AS9100 certifi ed• Full ESD environment (JESD625B compliant)• Temperature and humidity controls• Fully traceable documentation• Integrated production control system
OTHER SERVICES• Robotic Hot Solder Dip Lead Conversion
(Pb-free Sn/Pb)• Lead attach• Lead trim & form• Lead alignment• Tape & reel, 3D component scan• Dry-bake
ABOUT MICROSSMicross is the leading one-source, one-solution provider of Bare Die & Wafers, Advanced Interconnect Technology, Custom Packaging & Assembly, Component Modifi cation Services, Electrical & Environmental Testing and Hi-Rel Products to manufacturers and users of semiconductor devices. In business for more than 35 years, our comprehensive array of high-reliability capabilities serve the global Defense, Space, Medical, Industrial and Fabless Semiconductor markets. Micross possesses the sourcing, packaging, assembly, test and logistics expertise needed to support an application throughout its entire program cycle.
February 21, 2017 • Rev is ion 1.8
BGA Reballing
