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BGA Reballing Micross Components is your single source of high-reliabilty electronics. LOW-COST, QUICK-TURN LOW & HIGH VOLUME PROCESSES SINGLE REFLOW REBALLING MINIMIZES HEAT EXPOSURE TURNKEY PRODUCT PURCHASING PROCESSING OF CERAMIC AND PLASTIC BGAs AND LGAs BALL PITCH FROM 0.40mm Pb-FREE Sn/Pb BALLS Conversion to leaded spheres for Hi-Rel applications. www.micross.com

Micross Components BGA Reballing Flyer · BGAs AND LGAs BALL PITCH FROM 0 ... Micross Components BGA Reballing Flyer Author: Micross Components Subject: Micross Components has developed

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Page 1: Micross Components BGA Reballing Flyer · BGAs AND LGAs BALL PITCH FROM 0 ... Micross Components BGA Reballing Flyer Author: Micross Components Subject: Micross Components has developed

BGA Reballing

Micross Components is your single source of high-reliabilty electronics.

LOW-COST, QUICK-TURNLOW & HIGH VOLUME

PROCESSES

SINGLE REFLOWREBALLING

MINIMIZES HEAT EXPOSURE

TURNKEYPRODUCT PURCHASING

PROCESSING OF CERAMIC AND PLASTIC

BGAs AND LGAs

BALL PITCH FROM 0.40mm

Pb-FREE ↔ Sn/Pb BALLS

Conversion to leaded spheresfor Hi-Rel applications.

www.micross.com

Page 2: Micross Components BGA Reballing Flyer · BGAs AND LGAs BALL PITCH FROM 0 ... Micross Components BGA Reballing Flyer Author: Micross Components Subject: Micross Components has developed

Micross Component Modifications:

BGA ReballingOTHER SERVICES

• RoboticHotSolderDipLeadConversion(Pb-free↔ Sn/Pb)

• Leadattach

• Leadtrim&form

• Leadalignment

• Tape&reel,3Dcomponentscan

• Dry-bake

www.micross.com

MICROSS COMPONENTS OFFERS A WEALTH OF EXPERTISE IN DESIGN, PROCESSING AND PRODUCTION OF SEMICONDUCTORS, AND OTHER ELECTRO-MECHANICAL COMPONENTS WITH THE HIGHEST DEGREE OF QUALITY, HI-RELIABILITY AND PERFORMANCE.

May20,2015•Revision1.6

Automatic Inspection

XRF

Robotic Deballing

LOW & HIGH VOLUME PROCESSESForlowervolumerequirements,Microssoffersauniqueprocessthatdoesnotrequiretheuseofpreformsandeliminatestheneedforcustomtoolingformostcomponents.Benefitsincludeshortenedleadtimes,reducedtotalcost,andnoNREs.

DEBALLOurproprietaryautomatedwavesolderdeballprocesscompletelyremovestheoriginalsoldersphereandpadfinish.Foranultra-controlled,non-contactdeballprocess,ourexclusiveMicrossRoboticHotSolderDipequipmentcanalsobeused.

ELECTRICAL TESTINGStaticelectricaltestingisavailablepost-processtoensuretherearenointernalcomponentissuesorgross/latentESDdamage.TestsincludedetectionofI/Odiodeopens/shortsandconfirmationthatPowerandGNDconsumptionarewithinlimits.

INSPECTING/TESTING

INVENTORY MANAGEMENTFullyautomatedinhouseEDI,inventorymanagementsystemwithprocurementandconsignmentcapabilities.

FACILITIES

• ISO9001andAS9100registered• ESD-safeenvironmentcomplianttoJESD625B

• Temperatureandhumiditycontrols

Before and After BGA Reballing

• Opticalinspectionforspherecondition

• Automatedinspectionforspheresizeandplacement

• Ballshear• XRF• Ioniccleanliness• Solderability

Contact Us Today

Visitwww.micross.comorcontactoursalesdepartmentatsales@micross.comformore

informationonBGAReballing.