Make it visible with a Crossbeam Principle and potential in material science

METZ, 12/05/2013

Smail Chalal

Carl ZEISS sas

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Agenda

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2

3

4

5

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Gemini column and final lens principle

Ion Beam column

Détectors

Local charge compensation and Floodgun

Large FOV and Fish eye

AURIGA 40 concept

7 SIMS

8 Milling fonctionnality

Npve, Atlas and Atlas 3D 9

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Concept AURIGA 40

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FIB column

FE-SEM column

Gas injection

system

Specimen

Basic Operation Modes

FIB milling

Sputtering of substrate

atoms with high ion

current

Imaging with SEM or FIB

Chemical processes

(deposition or etching)

AURIGA® Introduction to FIB-SEM technology

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Final lens principle

La combinaison d’une lentille électromagnétique

Et électrostatique crée une lentille achromatique

Connu sous le nom de « Triplet ».

Dans la lentille finale, les électrons incidents sont

Déviés par le champ électromagnétique, puis par

La lentille électrostatique retardatrice.

La lentille électromagnétique axiale

Permet de confiner le champ dans l’entrefer

À l’intérieur de la lentille finale.

6 1500XB, Gnk 6

CrossBeam® Interaction double faisceau

SE

M

Gemini-Lens:

No magnetic field outside the pole piece

Snorkel Type Magnetic Lens:

Strong magnetic field in the specimen chamber

Separation of the

two Gallium

isotopes

SE

M

7

8 1500XB, Gnk 8

Sample

Objective Lens

Faraday Cup Blanking

Condenser

Extractor

Variable

apertures

Deflectors

Liquid metal

ion source (LMIS)

UEHT

UC

UObj

UEx USup Suppressor

Ion Optics

Steerer

Double quadrupole

Steerer

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Détectors Secondary electrons, secondary ions

Corrosion inter granulaire dans super alliage Ni Numéro atomique

η d

'ém

issio

n io

niq

ue

se

co

nd

air

e

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Détectors Inlens SE, ESB detectors

Topographical information Compositional contrast

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Détectors QBSD and YAG

Large diode 22mm Ø

Standard diode 10mm Ø

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Detector arrangement in the specimen

chamber

Final Lens

(SEM)

STEM Detector Sample Holder

SE Detector

Echantillon

Détecteurs Détecteurs STEM

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Detectors New STEM design

New det ect or has an annul ar desi gn wi t h 1 BF

ar ea and 3 DF Ri ngs

New detector has an overall larger detection area

~200 mm² (new diode) vs. ~65 mm² (ol d di ode)

0 1 2

3 4

5 6

Ol d STEM det ect or :

Al l f i ve avai l abl e segment s t hat

can be combi ned ar bi t r ar y.

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Stem images Aluminum Foil

+

+

+

+

+

-

-

+

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surface discharging with Nitrogen all standard detectors can be used, no

additional detectors required

AURIGA Local Charge Compensation

Sample: ZrO2

EHT = 15kV

CC off

CC on

Analytics Imaging

CC off

CC on

cut-off voltage of bremsstrahlung

(„Duane-Hunt limit“)

shifted down to lower

voltages

Several emission lines show reduced

intensity

Others are not visible at all

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Milling / FIB-imaging of charging materials with Electron Flood Gun

Low energy electron column providing high beam current (µAs) Charge neutralization of positively charging samples (insulators) Useful for FIB-imaging and milling

AURIGA Solutions for Charging Samples | Flood Gun for Milling

+ + + + + +

+

- - - - - - - - - - -

e-Beam

+ + + + + + +

-

- - - - -

- -

-

-

-

- -

- -

- -

- -

- - -

-

- - - - - -

-

- -

- - -

- -

-

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10 x 10 x 5 µm FIB boxes milled

at 1nA on a glass Pyrex® sample

Flood gun on Flood gun off

13nA FIB current

3nA FIB current

Cross sections in Plexiglas®

Milling / FIB-imaging of charging materials with Electron Flood Gun

AURIGA Solutions for Charging Samples | Flood Gun

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AURIGA Ease of Use Large FOV & Fish-Eye Mode

Large FOV:

5 mm for WD of 5 mm and

5kV acceleration voltage

facilitates fast SEM

navigation within one

sample or between samples

Optional: Fish-eye Mode for

complete overview of

chamber

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SIMS

Aim – to collect the sputtered ions from milling and

analyse them by mass spectrometry to provide surface,

image and depth profile information.

Emission is from the upper monolayers of the material.

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Secondary ions mass spectrometer from Hiden Analytical

SIMS Maps of a TiN Electrode Array Copper Titanium Alloy Mass Spectrum

Hiden EQS

Hiden QMS

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Milling fontionnalities

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Milling fonctionnalities

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NPVE, ATLAS and ATLAS 3D (Fibics)

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NPVE, ATLAS and ATLAS 3D (Fibics)

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ATLAS™ Summary

Unique upgrade package to all SEM based Zeiss systems from EVO to CrossBeam®

Full flexibility in choice of detectors for imaging including the STEM and BSE detectors for TEM-like images

Highly automated, multi-site image acquisition process with automated stage motion, focus, stigmation, brightness and contrast adjustment as required

In-built image tiling mechanism for acquiring multiple images at multiple sites to cover large sample areas at highest resolution

Freely configurable individual image size from 1 k x 1 k to 32 k x 32 k pixels, also non-square image formats!

Viewer software tailored to efficiently handle multi-gigabyte images and image mosaics generated by ATLAS™ including semi-automated stitching routines

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ATLAS™

Summary

1. available as upgrade for all SEM based systems

2. hard- and software package with stand-alone PC

3. exclusively available on Zeiss

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ATLAS™ Application Example: Imaging of Brain Tissue

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Extend your AURIGA CrossBeam system:

ATLAS 3D is a package of hard- and software

specifically designed for FIB nanotomography.

Automatically create a 3D data stack at a

resolution up to 32 k x 32 k pixels.

Analyze thousands to millions of cubic

micrometers of volume with nanometer scale

resolution in all three dimensions.

Intelligent software algorithms reduce the

amount of data and the time needed for

acquisition.

Drift correction, autostigmation, autofocus and

adaptive and dynamic 3D tracking support

give you fast and reliable results.

ATLAS 3D Acquire Gigapixel 3D Images with Your AURIGA CrossBeam

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Speed up image acquisition – get cross

sections of your sample with a maximum

resolution of up to 32 k x 32 k pixels in a single

image.

Use XFOV (eXtreme Field Of View)

technology to capture your region of interest in

a single tile, eliminating stage motion delay

and overlap areas due to stitching.

XROI (eXact Region of Interest) allows to

image arbitrary shapes within your field of

view.

Get More Information in Less Time

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Set up the necessary software parameters and

image acquisition will run independently for

hours and days.

Dynamic auto-alignment of your sample,

autostigmation, autofocus and drift

tracking guarantee perfect reconstructions.

Adaptive 3D tracking of both the FIB and the

SEM beam results in an accurate and constant

slice thickness throughout the entire

acquisition process.

Fully automated 3D acquisition

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This 3D image shows a portion of a 22 nm Intel Tri-Gate integrated circuit, acquired with

5 nm voxels.

Sample courtesy of UBM TechInsights.with 5 nm voxels.

ATLAS 3D at Work

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Conclusion

Potential in material science

Many accessories and detectors increase, as well, the potential of CROSSBEAM's:

EVACTRON

Cryo systems

More than 20 sample holders

Automatic Air-locks

GIS, Micromanipulator……………….

Plasma cleaner

Control unit KF40 adapter

flange