Make it visible with a Crossbeam Principle and potential in material science
METZ, 12/05/2013
Smail Chalal
Carl ZEISS sas
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Agenda
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Gemini column and final lens principle
Ion Beam column
Détectors
Local charge compensation and Floodgun
Large FOV and Fish eye
AURIGA 40 concept
7 SIMS
8 Milling fonctionnality
Npve, Atlas and Atlas 3D 9
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Concept AURIGA 40
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FIB column
FE-SEM column
Gas injection
system
Specimen
Basic Operation Modes
FIB milling
Sputtering of substrate
atoms with high ion
current
Imaging with SEM or FIB
Chemical processes
(deposition or etching)
AURIGA® Introduction to FIB-SEM technology
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Final lens principle
La combinaison d’une lentille électromagnétique
Et électrostatique crée une lentille achromatique
Connu sous le nom de « Triplet ».
Dans la lentille finale, les électrons incidents sont
Déviés par le champ électromagnétique, puis par
La lentille électrostatique retardatrice.
La lentille électromagnétique axiale
Permet de confiner le champ dans l’entrefer
À l’intérieur de la lentille finale.
6 1500XB, Gnk 6
CrossBeam® Interaction double faisceau
SE
M
Gemini-Lens:
No magnetic field outside the pole piece
Snorkel Type Magnetic Lens:
Strong magnetic field in the specimen chamber
Separation of the
two Gallium
isotopes
SE
M
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8 1500XB, Gnk 8
Sample
Objective Lens
Faraday Cup Blanking
Condenser
Extractor
Variable
apertures
Deflectors
Liquid metal
ion source (LMIS)
UEHT
UC
UObj
UEx USup Suppressor
Ion Optics
Steerer
Double quadrupole
Steerer
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Détectors Secondary electrons, secondary ions
Corrosion inter granulaire dans super alliage Ni Numéro atomique
η d
'ém
issio
n io
niq
ue
se
co
nd
air
e
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Détectors Inlens SE, ESB detectors
Topographical information Compositional contrast
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Détectors QBSD and YAG
Large diode 22mm Ø
Standard diode 10mm Ø
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Detector arrangement in the specimen
chamber
Final Lens
(SEM)
STEM Detector Sample Holder
SE Detector
Echantillon
Détecteurs Détecteurs STEM
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Detectors New STEM design
New det ect or has an annul ar desi gn wi t h 1 BF
ar ea and 3 DF Ri ngs
New detector has an overall larger detection area
~200 mm² (new diode) vs. ~65 mm² (ol d di ode)
0 1 2
3 4
5 6
Ol d STEM det ect or :
Al l f i ve avai l abl e segment s t hat
can be combi ned ar bi t r ar y.
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Stem images Aluminum Foil
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+
+
+
+
-
-
+
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surface discharging with Nitrogen all standard detectors can be used, no
additional detectors required
AURIGA Local Charge Compensation
Sample: ZrO2
EHT = 15kV
CC off
CC on
Analytics Imaging
CC off
CC on
cut-off voltage of bremsstrahlung
(„Duane-Hunt limit“)
shifted down to lower
voltages
Several emission lines show reduced
intensity
Others are not visible at all
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Milling / FIB-imaging of charging materials with Electron Flood Gun
Low energy electron column providing high beam current (µAs) Charge neutralization of positively charging samples (insulators) Useful for FIB-imaging and milling
AURIGA Solutions for Charging Samples | Flood Gun for Milling
+ + + + + +
+
- - - - - - - - - - -
e-Beam
+ + + + + + +
-
- - - - -
- -
-
-
-
- -
- -
- -
- -
- - -
-
- - - - - -
-
- -
- - -
- -
-
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10 x 10 x 5 µm FIB boxes milled
at 1nA on a glass Pyrex® sample
Flood gun on Flood gun off
13nA FIB current
3nA FIB current
Cross sections in Plexiglas®
Milling / FIB-imaging of charging materials with Electron Flood Gun
AURIGA Solutions for Charging Samples | Flood Gun
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AURIGA Ease of Use Large FOV & Fish-Eye Mode
Large FOV:
5 mm for WD of 5 mm and
5kV acceleration voltage
facilitates fast SEM
navigation within one
sample or between samples
Optional: Fish-eye Mode for
complete overview of
chamber
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SIMS
Aim – to collect the sputtered ions from milling and
analyse them by mass spectrometry to provide surface,
image and depth profile information.
Emission is from the upper monolayers of the material.
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Secondary ions mass spectrometer from Hiden Analytical
SIMS Maps of a TiN Electrode Array Copper Titanium Alloy Mass Spectrum
Hiden EQS
Hiden QMS
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Milling fontionnalities
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Milling fonctionnalities
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NPVE, ATLAS and ATLAS 3D (Fibics)
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NPVE, ATLAS and ATLAS 3D (Fibics)
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ATLAS™ Summary
Unique upgrade package to all SEM based Zeiss systems from EVO to CrossBeam®
Full flexibility in choice of detectors for imaging including the STEM and BSE detectors for TEM-like images
Highly automated, multi-site image acquisition process with automated stage motion, focus, stigmation, brightness and contrast adjustment as required
In-built image tiling mechanism for acquiring multiple images at multiple sites to cover large sample areas at highest resolution
Freely configurable individual image size from 1 k x 1 k to 32 k x 32 k pixels, also non-square image formats!
Viewer software tailored to efficiently handle multi-gigabyte images and image mosaics generated by ATLAS™ including semi-automated stitching routines
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ATLAS™
Summary
1. available as upgrade for all SEM based systems
2. hard- and software package with stand-alone PC
3. exclusively available on Zeiss
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ATLAS™ Application Example: Imaging of Brain Tissue
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Extend your AURIGA CrossBeam system:
ATLAS 3D is a package of hard- and software
specifically designed for FIB nanotomography.
Automatically create a 3D data stack at a
resolution up to 32 k x 32 k pixels.
Analyze thousands to millions of cubic
micrometers of volume with nanometer scale
resolution in all three dimensions.
Intelligent software algorithms reduce the
amount of data and the time needed for
acquisition.
Drift correction, autostigmation, autofocus and
adaptive and dynamic 3D tracking support
give you fast and reliable results.
ATLAS 3D Acquire Gigapixel 3D Images with Your AURIGA CrossBeam
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Speed up image acquisition – get cross
sections of your sample with a maximum
resolution of up to 32 k x 32 k pixels in a single
image.
Use XFOV (eXtreme Field Of View)
technology to capture your region of interest in
a single tile, eliminating stage motion delay
and overlap areas due to stitching.
XROI (eXact Region of Interest) allows to
image arbitrary shapes within your field of
view.
Get More Information in Less Time
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Set up the necessary software parameters and
image acquisition will run independently for
hours and days.
Dynamic auto-alignment of your sample,
autostigmation, autofocus and drift
tracking guarantee perfect reconstructions.
Adaptive 3D tracking of both the FIB and the
SEM beam results in an accurate and constant
slice thickness throughout the entire
acquisition process.
Fully automated 3D acquisition
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This 3D image shows a portion of a 22 nm Intel Tri-Gate integrated circuit, acquired with
5 nm voxels.
Sample courtesy of UBM TechInsights.with 5 nm voxels.
ATLAS 3D at Work
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Conclusion
Potential in material science
Many accessories and detectors increase, as well, the potential of CROSSBEAM's:
EVACTRON
Cryo systems
More than 20 sample holders
Automatic Air-locks
GIS, Micromanipulator……………….
Plasma cleaner
Control unit KF40 adapter
flange