Jean-Philippe POLIZZI

MEMS Program Manager

LETI STRATEGY TO ADDRESS KEY MEMS CHALLENGES

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About Leti

Founded in 1967

1,800 researchers

54 start-ups

& 365 industrial partners

2800 patents

318 M€ budget (80% contract R&D)

CEO

Dr. M-N Semeria250 PhD students + 40 post PhD

with 37% foreign students

~ 40M€ CapEx

311 generated in 2014

40% under license

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10’s

00’s

90’s

MEMS MARKETS EVOLUTION

80’s

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$0M

$5.000M

$10.000M

$15.000M

$20.000M

$25.000M

2014 2015 2016 2017 2018 2019 2020

Market share forecast by application market ($ millions)

Aeronautics Automotive Consumer Defense Industrial Medical Telecom

Source: Yole Developpement, 2015

MEMS: A BILLONS DOLLARS INDUSTRY

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Issu

es

Strong cost pressure

Miniaturization

Growing use of Combo sensors

MEMS components

Well established Accelerometer Gyroscope Magnetometer Microphone

Sensor being adopted Pressure Humidity

From IHS / 2014

Average Selling Price erosion by sensor function 2011-2017

ISSUES ON CONSUMER/ IOT /

AUTOMOBILE MARKETS

“Not Enough Money in MEMS”, Says

InvenSense CEO

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Issu

es

Strong cost pressure

Miniaturization

Growing use of Combo sensors

MEMS components

Well established Accelerometer Gyroscope Magnetometer Microphone

Sensor being adopted Pressure Humidity

9-axis MEMS IMU (Bosch BMX055 – 5 dies)

Microphone (Knowles SPA2629LR5H-B)

Pressure sensor (ST LPS25H)

Humidity sensor (Sensirion SHTC1)

No manufacturing standard1 Product = 1 Process

ISSUES ON CONSUMER / IOT /

AUTOMOBILE MARKETS

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CHALLENGES IN MEMS SENSORS

PRODUCT LINE

Reduce NRE and time to market

Ending the « one product one process » rule

Technological platforms

“MEMS platforms are way to go”

Stefan Finkbeiner, CEO of Bosch

Sensortec

From Device to System

The importance of software

“Not Enough Money in MEMS,

Own the Data”

Behrooz Abdi, CEO of InvenSense

INNOVATION

Disruptive solutions: Products/technologies

First product on market

"I want 500, 5,000 different types of sensors in

the next five years”

Sean Ding, chief scientific officer for

sensing solutions at telecom giant

Huawei Technologies

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CHALLENGES IN MEMS SENSORS

INNOVATIONDisruptive solutions: Products/technologies

First product on market

"I want 500, 5,000 different types of sensors in

the next five years”

Sean Ding, chief scientific officer for

sensing solutions at telecom giant

Huawei Technologies

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Thin Film Technology

(Vac.dep. / shadow mask)

Bulk Technology

(Litho / wet etching)

Surface Technology

(Litho / DRIE on SOI)

Nano-scale Technology(DUV litho on thin SOI)

80 90 00

year

10 20

Tran

sfe

rsK

ey d

ate

s

1984 - Comb drive accelero patent

19

81

Hygrometer

Quartz accelerometer

19

87

Weight sensor

19

80

Pacemaker accelerometer

Geophone

19

96

Miniature pressure sensor

19

96

Accelerometer

20

05

2007 - Caltech Alliance

2010 – joint lab.

High perf. pressure sensor

19

98

Inertial platform

20

11

M&NEMS platform

20

13

Above-IC GMR Technology

20

12 XXXXXX

1996 - Startup creation

2013 - Startup

2014 Startup

2011 - Startup

30+ YEARS BACKGROUND IN MEMS SENSORS

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PRESSURE SENSOR

Capacitive pressure sensor Piezoresistive pressure sensor

MAGNETIC SENSOR

3-axis CompassAbove-IC GMR sensor TMR sensor and resonator

INERTIAL SENSOR

3-axis Accelerometer 3-axis Gyroscope

ACOUSTIC SENSOR

Microphone cMUT

A LARGE PANEL OF SENSORS TECHNOLOGIES

pMUT

High Temperature P sensor

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OTHER SENSORS

GAS SENSORS

NEMS-based

µ-TOF Mass-spec

BIO/CHEMICALSENSORS

3-axis force sensor

A LARGE PANEL OF SENSORS TECHNOLOGIES

IMAGING SENSORS

NDIR CO2 sensors Photoacoustic detector

conductivityIonic sensor Multi-parameter Metabolic sensor

IR bolometer Cooled IR MCT PD X-rays VIS CMOS cameras

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CHALLENGES IN MEMS SENSORS

PRODUCT LINE

Reduce NRE and time to market

Ending the « one product one process » rule

Technological platforms

“MEMS platforms are way to go”

Stefan Finkbeiner, CEO of Bosch

Sensortec

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High-SNR Microphone

MEMS size mechanical part

+

Nano-size piezoresistive gauge

3-axis Gyroscope

3-axis Magneto

3-axis Accelero

X

ZY

Pressure sensor

M&NEMS "GENERIC" PLATFORM

Separate optimization

Miniaturized sensors

Generic platform

Not sensitive to parasitics

Well known and robustpiezoresisitive detection

Very short duty cycle and multiplexing

Simple electronicscommon for all the axis

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M&NEMS 6-AXIS COMPASS/ACCELEROMETER

6-axis mechanical footprint ≈ 1,1mm²

Low power consumption (30µW/axis in DC)

1 electronic common for each of the 6 axis

High linearity

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NEMS-BASED SENSORS PLATFORM

FOR GAS AND BIO-SENSING

Mass

loading

Mass

loading 40

2

lM

f

m

f

eff

Responsivity

3

0

2 lMm

Resolution

µbolometer

Freq

uen

cy s

tab

ility

Freq

uen

cy s

tab

ility

Cellular force sensor

Mass-spec for Bio applications

• High resolution• Very short response time• High integration

Gas detection

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LoD ≈ 100’s ppb

Typical VOC chromatogram: environment, air

quality,..

µGC

Air gas carrier

Sensitivity up to sub ppm

Families of gases

Volatile Organic Compounds BTEX; Other aromatics compounds

Permanent gases N2, CO, CO2, H2, He etc…

Light hydrocarbons C1 to C5

Heavy hydrocarbons C6 to C12 and higher

Roadmap for sulfur compounds H2S, COS, THT, CS2, mercaptans etc…

NEMS-based gas

chromatography

systems

Industry

Environment

Security

Medical

APIX : NEMS-BASED GAS SENSOR

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CHALLENGES IN MEMS SENORS

From Device to System

The importance of software

“Not Enough Money in MEMS,

Own the Data”

Behrooz Abdi, CEO of InvenSense

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FROM SENSOR FUSION….

CONTEXT AWARENESS: A REALITY TODAY

WWW …

… TO CONTEXT AWARENESS

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DEVICE

CLASSIFICATION process

LEARNING process

Annotated database

many users

many use cases

many trials

Learning stage

Object ?

Scene ?

Activity ?

Events ?

…

Physical

informationDigital

informationFeatures

Classifier

Tune

I am walking in a mall

Sensor based Processing

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Device

Other device

CLASSIFICATION process

LEARNING process

Headache ?Physical

information

Digital

informationFeatures

Classifier

Adapt

Wellness tips …

Learning stage

User Adaptive Processing

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LETI: THE LEADING R&D INSTITUTE ON

MICROSYSTEMS

• 30 years experience in MEMS

• 200 people involved in MEMS

• 8” MEMS/NEMS technologies

• 330 patents portfolio in the MEMS field

• 25 on-going industrial collaborations

• Addressing the three key challenges

identified by MEMS analysts:

• Innovation

• Technology platform

• Moving from device to microsystem maker:

adding value and functionality with software

Leti, technology research institute

Commissariat à l’énergie atomique et aux énergies alternatives

Minatec Campus | 17 rue des Martyrs | 38054 Grenoble Cedex | France

www.leti.fr

Thank you for your attention

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The innovation premium

-

1 000

2 000

3 000

4 000

5 000

6 000

2 011 2 012 2 013 2 014 2 015 2 016 2 017

Rev

enu

es in

US

$ M

illio

ns

Sensor by function in mobiles and tablets

Gaz

Fingerprint

Microphone

Pressure

Magnetometer

Gyroscope

Accelerometer

from