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September 25-27, 2017Centre Microélectronique de Provence, Gardanne, Aix en Provence area (France)
PROGRAMME
Leading-EdgeEmbedded NVM
Workshop
e-NVM 2017 ©STMicroelectronics Rousset
Monday, September 25, 2017
8:45am: Registration
9:15am: Workshop opening (Bernard POLI, ARCSIS and Philippe Lale-vée, Ecole des Mines de Saint-Etienne - CMP)
9:30am: Keynote speaker, Betty Prince, Memory Strategies Internatio-nal, USA - «Embedded Non-Volatile Memories for Intelligent IoT»
Session 1 - Embedded flash memories Technology: state of the art and trends - Part 1 Chairman: Didier Nee, WISeKey, France
10:15am: «TSMC eNVM Technology» – Dan Kochpatcharin, TSMC (The Netherlands)
10:40am: Break
11:05am: «A new core transistor equipped with NVM functionality without using any emerging memory materials» – Yasuhiro Taniguchi, Floadia (Japan)
11:30am: «Scaling and Demonstration of 28nm Logic-Process-Compa-tible Split-Gate Flash Memory Technology» – Nhan Do, SST (USA)
11:55am: «A Highly Scalable Floating-Gate Cell for Embedded-Flash Applications» – Weiran Kong, Huahong Grace Semiconductor (China)
12:20pm: Lunch
Session 2 - Emerging and leading edge technologies for embedded NVM - Part 1Chairman: David Naura, INVIA, France
2:00pm: «Embedded charge-trap non-volatile memory tech-nologies at 40-nm node and beyond» – Igor Kouznetsov, Cypress Spansion (USA)
2:25pm: «Non-Volatile Resistive Memory: a Started Revolu-tion Towards the Memory of the Future» – Gabriele Navarro, CEA- LETI, MINATEC Campus (France)
2:50pm: «Leading logic NVM technlogy advancing into 7NM finfet node: Challenges and Solutions» – James Huang, eMe-mory (Taiwan)
3:15pm: «Voltage Compatibility of ReRAM operation with CMOS» – Dirk Wouters, RWTH Aachen University (Germany)
3:40pm: «FeFET - The ideal embedded NVM for the age of IoT» – Stefan Müller, Ferroelectric Memory (Germany)
4:05pm: Break
Session 3 - Device and architecture - Part 3Chairman: Philippe Boivin, STMicroelectronics, France
4:30pm: «SMIC Advanced eNVM Solutions For Security IOT» – Stephen Zhou, SMIC (China)
Programme
4:55pm: «Split-Gate Flash on 28-nm HKMG Logic Process For High-Speed Embedded Secure-Element Chip Applications» – Yong Kyu Lee, Samsung Electronics (Korea)
5:20pm: «SE-RICH GESE-BASED OTS Selector Engineering Targeting High Density Crossbar Resistive Memory» – Anthonin Verdy, CEA-Leti (France)
5:45pm: End of the conference day
Tuesday, September 26, 2017
8:45am: Registration
Session 2 - Emerging and leading edge technologies for embedded NVM - Part 2Chairman: David Naura, INVIA, France
9:00am: «Unleash new system architectures with Crossbar ReRAM for embedded applications and storage class memories» – Sylvain Dubois, Crossbar (USA)
9:25am: «40nm embedded ReRAM platform in foundry with highly reliable TaOx cell technology» – Takumi Mikawa, Panasonic (Japan)
9:50am: «High-performance and Low-power Operations with RRAM-based FPGAs» – Pierre-Emmanuel Gaillardon, Utah University (USA)
10:15am: «High-speed voltage-Control spintronics memory having high-efficiency of writting, a potential of unlimited endurance, and broad design windows» – Hiroaki Yoda, Toshiba (Japan)
10:40am: Break
ProgrammeSession 4 - Users, focus on connected objects, IoTChairman: Philippe Boivin, STMicroelectronics, France
11:05am: «Emerging NVM technologies: toward mass pro-duction in MCU embedded market» – Jérôme Azémar, Yole Developpement (France)
11:30am : «Inkjet - Printed Flexible Conductive Bridge RAM» – Bernhard Huber, Munich University of Applied Sciences (Ger-many) / INRS-EMT (Canada)
11:55am : «NVM technologies: A hardware security point of view» – Franck Courbon, University of Cambridge (U.K)
12:20pm : «Secure Characterisation of the OxRAM Techno-logy» – Alexis Krakovinsky, CEA & IM2NP (France)
12:45pm: Lunch / Poster session
Session 3 - Device and architecture - Part 2Chairman: Romain Wacquez, CEA-EMSE, France
2:00pm: «Multiscale Modeling of RRAM Devices for Memory and Neuromorphic Computing Applications» – Luca Larcher, University of Modena and Reggio Emilia (Italy)
2:25pm: «Toward non-volatile digital flows» – Virgile Javer-liac, eVaderis (France)
2:50pm: «Formal Design Space Exploration for Memristor-based Crossbar Architecture» – Marcello Traiola, LIRMM/ University of Montpellier (France)
3:15pm: «Resistive switching in narrow gap Mott Insulators» – Marie-Paule Besland, IMN Nantes (France)
3:40pm: Break
Session 1 - Embedded flash memories Technology: state of the art and trends - Part 2 Chairman: Didier Nee, WISeKey, France
4:05pm: «High and medium voltage devices integration on advanced eNVM» – Dann Morillon, STMicrolectronics (France)
4:30pm: «Ultra Low Power single poly non volatile memory for passive RFID applications» – Terry Lin, eMemory (Taiwan)
4:55pm: «Anti-Fuse, OTP NVM, the Only Memory Enabled at Every CMOS Process Node to 10nm Providing Code, Encryption Keys, & Confidential Data Storages» – Paolo Piacentini, Kilopass (USA)
5:20pm: «FinFET Split-Gate MONOS for Embedded Flash in 16/14nm-node and beyond» – Tomohiro Yamashita, Renesas Electronics (Japan)
5:45pm: End of the conference day 2
8:30pm: Conference dinner
Wednesday, September 27, 2017 8:45am: Registration
Session 2 - Emerging and leading edge technologies for embedded NVM - Part 3Chairman: Romain Wacquez, CEA-EMSE, France
Programme9:00am: «ESF3 Memory: Endurance Capability and Post-Cy-cling Data Retention» – Viktor Markov, STT (USA)
9:25am: «Overview of Conductive Bridging RAM (CBRAM): an ideal NVM for IoT Applications» - Philippe Blanchard, Adesto Technologies (USA)
9:50am: «Spin Orbit Torque MRAM-based circuits for non-vo-latile logic and memories» - Gregory Di Pendina, University of Grenoble Alpes/CNRS/CEA, INAC - SpintecLab (France)
10:15am: «From material to circuit : lead the embedded NVM to the next stage» - Vincenzo Della Marca, IM2NP (France)
10:40am: Break
Session 3 - Device and architecture - Part 3Chairman : Philippe Boivin, STMicroelectronics, France
11:05am: «Innovative design solutions for emerging NVM tech-nologies» - Gabriele Navarro, CEA-Leti (France)
11:30am: «Unconventional uses of embedded non-volatile memory: toward the “natively intelligent” memory» - Damien Querlioz, Paris-Sud University (France)
11:55am: «NVM chip for Machine Learning Operations» - Dimitrios Rodopoulos, IMEC (Belgium)
12:20pm: Lunch, end of the conference
2:00pm: End of the Conference
Posters
«Resistive Non Volatile Memories Characterization by Conductive Atomic Force Microscopy in Ultra High Vacuum»
A.K. Singh1, 2, 3, 4, S. Blonkowski1, and M. Kogelschatz2, 4
1STMicroelectronics, Crolles (France), 2Laboratoire des Technologies de la Microélectronique (LTM), CNRS & UGA, Grenoble (France), 3CEA-Leti Grenoble (France), 4Université Grenoble Alpes (UGA), Grenoble (France).
«Characterizing embedded device security from the hard-ware»
Dr. Franck Courbon, Computer Laboratory, University of Cambridge (United Kingdom)
Exhibitors
eMemory Technology Inc.
eMemory Technology Inc.8F, No.5, Tai-Yuan 1st St., Jhubei City, Hsinchu County 30288, TAIWAN
Contact name: Viola SUNGE-mail: [email protected]
Tel: +886-3-5601169Fax: +886-3-5601110
www.ememory.com.tw
Floadia
Floadia Corporation.1-30-9, Ogawa-Higashi, Kodaira-Ci-ty, Tokyo,JAPAN 187-0031
Contact name: Shusaku MIYABEE-mail: [email protected]
Tel: +81-42-346-5510
www.floadia.com
Exhibitors
SST (Silicon Storage Technology)
SST Ltd720 Wharfedale RoadWinnersh, RG41 5TPUNITED KINGDOM
Contact name: Chris BROWNE-mail:[email protected]: +44 7785 11 11 10
www.sst.com
Kilopass Technology
Kilopass Technology Inc.2895 Zanker Road San Jose, CA 95134UNITED STATES
Contact name: Jonah MCLEOD E-mail: [email protected]: 408-709-2819Mobile: 510-449-8634
www.kilopass.com
Organizing Committee:Bernard Poli, Director - ARCSIS
Corinne Joachin, Event Manager - ARCSIS Séverine Lémeri, Event Assistant - ARCSIS
+33 (0)4 42 53 81 50email: [email protected]
website: http://www.e-nvm.org
Organized by:
Supported by:
In partnership with: