Large Area, Flexible Electronics TWG

Chair: Dan Gamota, Jabil

09/2005 – iNEMI Stakeholders identify Flexible Electronics as Future Growth Market and authorize formation of TWG

2006 – Flexible Electronics TWG formed

2007 – 1st

Edition iNEMI Roadmap released

2009 – 2nd

Edition iNEMI Roadmap released

2011 – 3rd

Edition iNEMI Roadmap released

2013 – 4th

Edition iNEMI Roadmap released

2015 – 5th

Edition iNEMI Roadmap released1

stEdition Released at APEX 2007

Large Area Flexible Electronics Roadmap History

Large Area Flexible Electronics Roadmap Contents

Roadmap Contents

Roadmap of Quantified Key Attribute Needs, Gaps, and Showstoppers

•Functional Inks: Technology Requirements

•Substrates: Technology Requirements

•Packaging/Barriers: Technology Requirements

•Manufacturing Platforms and Processing Equipment: Technology

Requirements

• In-line Characterization Tools: Technology Requirements

•Off-line Characterization Tools: Technology Requirements

•Devices and Circuits: Technology Requirements

•Flexible Electronics: Technology Requirements

•Reliability: Technology Requirements

•Standards: Technology Requirements

4

iNEMI Large Area Flexible Electronics Roadmap

• TWG Group Participants

– Core group sustaining TWG (participated in multiple chapter

editions)

– Continually seeking new participants

– Engaged

» Singapore representatives

» Germany/EU representatives

» US representatives

» Sought representatives from China

• 2015 Edition – What is new?

– Identification of flexible hybrid electronics (FHE) based products as

near-term commercialization opportunity – medical, automotive,

wearables/consumer.

– Updated sections

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iNEMI Large Area Flexible Electronics Roadmap

Drivers of Change – Market

• Increased consumer demand for novel form factor

wearable and flexible products.

• Growing demand by consumer electronics, automotive,

and aerospace industries for touch control, lighting,

sensors, low-frequency wireless devices, innovative

signage, photovoltaic, and flexible displays.

• Commercialization and near-commercialization of flexible

hybrid electronics (FHE) products which combine ‘printed

electronics’ with conventional electronics.

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iNEMI Large Area Flexible Electronics Roadmap

Drivers of Change – Government

• Singapore, Japan, EU, Korea, and China continue to make well-

publicized commitments by funding multi-million dollar pre-

competitive and competitive technology development efforts.

• US - On February 10, 2015 the US Department of Defense

released a solicitation for proposals to initiate and sustain a

Flexible Hybrid Electronics Manufacturing Innovation Institute

(FHE-MII) as part of the National Network for Manufacturing

Innovation (http://www.manufacturing.gov/fhe-mii.html).

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iNEMI Large Area Flexible Electronics Roadmap

Drivers of Change – Technology

• Flexible Hybrid Electronics - electronics components, modules, and

products that comprise 1) thinned, compliant elements such as but not

limited to electronic, electro-mechanical, electro-optical, electro-chemical,

and electro-biological that are fabricated using traditional processes (e.g.

photolithography, etching, grinding, plasma, vacuum deposition) and 2)

elements that are fabricated using a printing process (e.g. gravure,

flexography, needle dispensing, ink jet) which are integrated on a flexible

substrate (e.g. metal, organic, or inorganic).

• Availability of higher performance OLED, OPV, and semiconductor (p and

n type) materials: solution processable small molecule, inorganic pre-

cursors, nanoscale inorganic semiconductor materials, and other novel

inorganic and organic dispersions.

• Commercialization/near-commercialization of enhanced barrier materials.

• Commercialization/near-commercialization of higher performance

conductive inks, dielectric materials, and substrates.

• Development of large area, lower-cost manufacturing processes

leveraging roll-to-roll equipment infrastructure.

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iNEMI Large Area Flexible Electronics Roadmap

Drivers of Change – Standards

• IPC published two standards:1) IPC/JPCA-4921 Requirements for

Printed Electronics Base Materials and 2) IPC/JPCA-4591

Requirements for Printed Electronics Functional Materials. Also,

a design guideline was published: IPC/JPCA 2291 Design

Guidelines for Printed Electronics.

• IEC TC119 Printed Electronics Standards Technical Committee

has established several Working Groups as well as Ad-hoc

Groups to identify potential standards topics. Also, TC119 has

involved other organizations to act as advisors during the

development of standards e.g. IPC and COLAE.

• IEEE maintains IEEE 1620-2008™ Test Methods for the

Characterization of Organic Transistors and Materials and IEEE

1620.1-2012™ Standard for Test Methods for the Characterization

of Organic Transistor-Based Ring Oscillators.

Processing/

Equipment

Platforms

Applications

– Movement Along Supply Chain

Testing

EquipmentMaterials Substrates Packaging

2007 Roadmap greatest participation in “Materials”.

2009 Roadmap greatest participation in “Substrates” and “Processing Equipment”.

2011 Roadmap greatest participation in “Processing Equipment” and “Applications”.

2013 Roadmap greatest participation in “Applications” and “Standards”.

2015 Roadmap greatest participation in “Applications” and “Standards”.

Shift in Roadmap Topic Participation

Lighting & Displays Sensors Energy

Products and Applications