Embed Size (px)
Citation preview
Workshop Flexible
Electronics
IITC / MAM conference
Claire TROADEC
From Technologies to Market
© 2015© 2015
2
FIELDS OF EXPERTISE
Yole Développement’s 30 analysts operate in the following areas
MEMS &
Sensors
LED
Compound
Semi.
Imaging Photonics
MedTech
Manufacturing
Advanced
PackagingPV
Power
Electronics
©2015 | www.yole.fr | IITC/MAM Workshop Flexible Electronics
3
4 BUSINESS MODELS
• Consulting and Analysis• Market data & research, marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering & costing
• Patent analysis
• www.yole.fr
• Reports• Market & Technology reports
• Patent Investigation and patent infringement risk analysis
• Teardowns & Reverse Costing Analysis
• Cost Simulation Tool
• www.i-Micronews.com/reports
• Financial services• M&A (buying and selling)
• Due diligence
• Fundraising
• Maturation of companies
• IP portfolio management & optimization
• www.yolefinance.com
• www.bmorpho.com
• Media• i-Micronews.com website
• @Micronews e-newsletter
• Technology magazines
• Communication & webcast services
• Events
• www.i-Micronews.com
©2015 | www.yole.fr | IITC/MAM Workshop Flexible Electronics
5
MARKET DRIVERS DIFFERENCES FOR FLEXIBLE AND PRINTED ELECTRONICS…
…even though manufacturing processes and end applications share similarities
Main market drivers for flexible electronics are:The possibility to add new functionalities:
Conformability for OLED lighting (for the automotive industry),
Conformability for OPV (energy harvesting),
Robustness for small OLED displays (for smart phones & tablets)
The possibility to create new applications:
Wearable electronics
Flexible electronics is NOT meant to be low-cost, and usually uses expensive processes(MOCVD, evaporation)
The main market driver for printed electronics is:Cost reduction due to high volume (roll-to-roll) manufacturing or by using fewer expensivemanufacturing processes (MOCVD, evaporation):
Potentially lower cost OLED TVs could be built if solution-based manufacturing is mastered and potentially low cost OPV could appear if technical challenges are leveraged
Up to 30% cost reduction©2015 | www.yole.fr | IITC/MAM Workshop Flexible Electronics
6
MAIN FLEXIBLE/PRINTED ELECTRONICS APPLICATIONS
5 main application families
Displaying
Sensing
Lighting
Energy generation
« Smart systems »
©2015 | www.yole.fr | IITC/MAM Workshop Flexible Electronics
7
FUNCTIONS VS FLEXIBILITY DEGREE OF FREEDOM
Applications listed by functions and Flexibility DoF
©2015 | www.yole.fr | IITC/MAM Workshop Flexible Electronics
8
FUNCTIONS VS FLEXIBILITY DEGREE OF FREEDOM
Techno Push vs. Market Pull applications
©2015 | www.yole.fr | IITC/MAM Workshop Flexible Electronics
9
APPLICATION LANDSCAPE 2014 - 2020+
In the next several years, the number of applications using printing processes for Flexible Electronics will grow…
©2015 | www.yole.fr | IITC/MAM Workshop Flexible Electronics
2014
Flexible Electronics
Application enabling /
Function enabling
Flexible
PV
Electronic
Paper
Non printed
Printed
Small
OLED
displays
Large
OLED
displays
Small OLED
Displays
Flexible PV
Electronic
PaperLarge
OLED
Displays
OLED
General
Lighting
Conformable
OLED Lighting
Sensors
2020+
Systems on
Foil
Touch
screens
Flexible Electronics
Application enabling /
Function enabling
10
Either the deposition technique causes material waste (coating then etching for example), or they have slow
throughput (inkjet printing).
In any case, equipment dedicated to large volume printed electronics is still expensive and not completely adapted
(nozzle clogging in inkjet, low resolution in screen printing etc.).
SOLUTION PRINTING – DEPOSITION METHODS
Most common deposition techniques… but none yet fits low-cost large volume production
Description of various solution deposition methodsSource: Chem. Soc. Rev., 2011, 40, 5406–5441
©2015 | www.yole.fr | IITC/MAM Workshop Flexible Electronics
11
PRODUCTION PROCESS THROUGHPUT & RESOLUTION
No clear winning technology yet…
Th
rou
gh
pu
t (
m²/
s)
Maximum Resolution (µm)
1 µm 10 µm 100 µm > 500 µm
Lo
w (
< 0
.01
)M
ed
ium
(0.0
1-1
)H
igh
(>
1)
FlexographyInk viscosity: 0.01 – 0.5 Pa.s
Layer thickness: 0.4-8 µm
GravureInk viscosity: 0.01 – 0.2 Pa.s
Layer thickness: 0.1-12 µm
Screen printingInk viscosity: 0.1-50 Pa.s
Layer thickness: 3-100 µm
Slot coatingLayer thickness:
Down to 0.2 µm
Source: CEA Liten / OE-A / Yole Développement
InkjetInk viscosity: 0.001-0.03 Pa.s
Layer thickness: 0.01-0.5 µm
Nano Imprint
Ultrasonic spray
R2R Photolithography
Laser ablation
©2015 | www.yole.fr | IITC/MAM Workshop Flexible Electronics
12
MAIN PLAYERS IN MATERIALS
Worldwide players
©2015 | www.yole.fr | IITC/MAM Workshop Flexible Electronics
13
MAIN PLAYERS IN EQUIPMENT
Worldwide players
©2015 | www.yole.fr | IITC/MAM Workshop Flexible Electronics
14
FLEXIBLE
Application enabling / Function enabling
Small OLED
DisplaysConformable
Organic PV
Conformable
OLED Lighting
PRINTED
(Potentially) Large volume / Low cost
Large OLED
Displays
Large / high
volume
Organic PVOLED Lighting
Sensors
PLAYERS LANDSCAPE - EXAMPLES (NON EXHAUSTIVE LIST)
Examples of industrial players developing Flexible and/or Printed products
Systems on foil /
polytronicsElectronic
paper
©2015 | www.yole.fr | IITC/MAM Workshop Flexible Electronics
15
FLEXIBLE AND PRINTED MARKET FOR THE DIFFERENT FUNCTIONS (IN US $M)
©2015 | www.yole.fr | IITC/MAM Workshop Flexible Electronics
$
$100
$200
$300
$400
$500
$600
$700
$800
$900
$1000
2012 2013 2014 2015 20162017
20182019
2020
Flexible Applications based on PE Technologies Forecast
Smart Systems
Sensing
Display
Lighting
Energy
generation
In U
S $
MIf we
consider the sensors and
smart systemsto be fully
manufacturedwith a printed
process…
~$1B in
2020 !
16
FLEXIBLE AND PRINTED MARKET FOR THE DIFFERENT FUNCTIONS
Picture differ if we consider that part of the manufacturing process is done with printed electronics technologies…
• If we consider the few dedicated process steps performed by printedelectronics technology within a complete device manufacturing process, thepicture is different:• Glucose sensors already on the market where more than 50% have printed electrodes
• RFID tags could potentially have printed antennas this could represent billion’s of units
©2015 | www.yole.fr | IITC/MAM Workshop Flexible Electronics
Courtesy of DropSens
17
THE INTERNET OF THINGS ROADMAP: SENSORS’ SWARM…
Printed electronics as a possible low cost solution to achieve GEN7 products…
©2015 | www.yole.fr | IITC/MAM Workshop Flexible Electronics
18
PRINTED AND FLEXIBLE ELECTRONICS MAIN CHALLENGES
Challenges are mainly present at material level…
Flexible substrate, encapsulation andanode compatible with processingconditions
Cost-effective barrier material forencapsulation
Low-cost R2R manufacturing
Scalability to large size (PV, largeOLEDs)
Adhesion on substrate (thermalcycling, roll/unroll, ageing…)
Reliability over time
©2015 | www.yole.fr | IITC/MAM Workshop Flexible Electronics
Development of Novel Materials (Absorber, Electrodes…)
Ink formulation
Interfacial engineering
Low-cost R2R manufacturing“All-by-printing” manufacturing process is hard to achieve to
date (vacuum process steps are sometimes a must).
The advantages of printing process are often less pronounced,
because of the need for subsequent heat treatment and other
non-printing steps.
Scalability to Large Size
Lifetime and stability
Low efficiency (for OPV modules: 15-20% lab results)
Improvement in the amount of wasted ink during printing
processesShorten production line processes
Smaller dosage systems
Effective filter before the dies
FLEXIBILITY PRINTABILITY
19
PRINTED AND FLEXIBLE ELECTRONICS CONCLUSIONS
Breakthrough expected within the next 3 years…
We believe Printed & Flex Electronics market could boost to be close to $1B by 2020
with a 27% CAGR if we consider sensors and smart systems fully manufactured by
printed electronic process
On the equipment side, the industry starts from zero and future production will have
to be handled by tools bought over the 6 next years.
Industry is looking for a high throughput, high resolution deposition techniques to lower costs
On the material side, having the right material as replacement to ITO and finding a
good barrier technology are short-tem technical challenges.
No technology (Material/Deposition process) has taken an advantage over others so
far and a breakthrough is expected within the next 3 years (mass production for cost
decrease)
©2015 | www.yole.fr | IITC/MAM Workshop Flexible Electronics
20
RELATED REPORT
Information in this presentation is extracted from the following reports:
Flexible Applications based on Printed Electronics TechnologiesReleased in May 2013 – www.i-micronews.com
Materials and Equipment for Printed & Flexible ElectronicsReleased in Feb. 2014 – www.i-micronews.com
©2015 | www.yole.fr | IITC/MAM Workshop Flexible Electronics
Annexes
©2015 | www.yole.fr | IITC/MAM Workshop Flexible Electronics
22
A GROUP OF COMPANIES
Market,
technology and
strategy
consulting
www.yole.fr
M&A operations
Due diligences
www.yolefinance.com
Fundraising
Maturation of companies
IP portfolio management & optimization
www.bmorpho.com
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
IP analysis
Patent assessment
www.knowmade.fr
©2015 | www.yole.fr | IITC/MAM Workshop Flexible Electronics
23
OUR GLOBAL ACTIVITY
©2015 | www.yole.fr | IITC/MAM Workshop Flexible Electronics
