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ITS SSD in 2003. SSD modules on ladder. highlights in 2003. start of module production assembly robot for ladders control, read-out, DAQ beam test. HAL25 status. Design parameters ‘on the edge’ -> highly sensitive to process parameters -> MPW yield 50, 98, 8 % - PowerPoint PPT Presentation
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17 december 2003 Gert-Jan Nooren 1
17 december 2003 Gert-Jan Nooren 2
ITS SSD in 2003
17 december 2003 Gert-Jan Nooren 3
SSD modules on ladder
17 december 2003 Gert-Jan Nooren 4
start of module production
assembly robot for ladders
control, read-out, DAQ
beam test
highlights in 2003
17 december 2003 Gert-Jan Nooren 5
• Design parameters ‘on the edge’ -> highly sensitive to process parameters -> MPW yield 50, 98, 8 % • Improved process control -> Engineering run yield 85 - 95 %• Thinning down to 150µm for better radiation length in progress
HAL25 status
55
45
35
25
95
85
75
65
15
05
54
44
34
24
94
84
74
64
14
04
57
47
37
27
97
87
77
67
17
07
56
46
36
26
96
86
76
66
16
06
51
41
31
21
91
81
71
61
11
01
50
40
30
20
90
80
70
60
10
00
53
43
33
23
93
83
73
63
13
03
52
42
32
22
92
82
72
62
12
02
59
49
39
29
99
89
79
69
19
09
58
48
38
28
98
88
78
68
18
08
NO DIGITAL
00 01 02 03 04 05 06 07 08 09 0A 0B
10 11 12 13 14 15 16 17 18 19 1A 1B
20 21 22 23 24 25 26 27 28 29 2A 2B
30 31 32 33 34 35 36 37 38 39
40 41 42 43 44 45 46 47 48 49
50 51 52 53 54 55 56 57 58 59 5A
60 61 62 63 64 65 66 67 68 69 6A 6B
70 71 72 73 74 75 76 77 78 79 7A 7B
80 81 82 83 84 85 86 87 88 89 8A 8B
90 91 92 93 94 95 96 97 98 99 9A 9B
3A 3B
4A
17 december 2003 Gert-Jan Nooren 6
components of the modules
1. HAL25-chip TAB-bonded on its Al chipcable (6 chips/hybrid)
3.sensor (768 strips/side)
2.Hybrids (2 hybrids/mod)
17 december 2003 Gert-Jan Nooren 7
ALICE SSD Module
17 december 2003 8
Module scanner• laser 1.06 m wavelength• positioning ~1.5 m• spot diameter < 20 m
Aleksey Sokolov
17 december 2003 Gert-Jan Nooren 9
Readout of the modules
P-Hybrid
N-Hybrid
control
ALCAPONE
ALCAPONE
ALCAPONE
EndCap
ALABUF
analog out
SensorVbias
FEROM
17 december 2003 Gert-Jan Nooren 10
Assembly robot
Pick & place robot for modulesAutomatic positioning to a few
micrometersAcceptance test 19 December
17 december 2003 Gert-Jan Nooren 11
September 2003 beam testPrototype 4-module EndCap
17 december 2003 Gert-Jan Nooren 12
September 2003 beam test5 module telescope
17 december 2003 Gert-Jan Nooren 13
September 2003 beam testsS/N for 4 modules
N
P
N
P
N
P
N
P
Very preliminary - provided by Trieste team
Module SN0002 Module SN0003 Module HN0001 Module HN0002
Canberra sensor ITC sensor
17 december 2003 Gert-Jan Nooren 14
Beam tests• Integration in real Cern environment: read-out chain proven up to ADC• Sensor quality problem revealed: Canberra takes action• ITS = SPD + SDD + SSD beamtest end 2004
Status and plans
17 december 2003 Gert-Jan Nooren 15
Beam tests• Integration in real Cern environment: read-out chain proven up to ADC• Sensor quality problem revealed: Canberra takes action• ITS = SPD + SDD + SSD beamtest end 2004Module production• Helsinki is bonding chips at production speed• 2 + 7 modules produced, yield and speed ‘unknown’• Testing infrastructure for chips and hybrids fully operational• Strasbourg and Trieste (MIPOT) starting in Q1
Status and plans
17 december 2003 Gert-Jan Nooren 16
Beam tests• Integration in real Cern environment: read-out chain proven up to ADC• Sensor quality problem revealed: Canberra takes action• ITS = SPD + SDD + SSD beamtest end 2004Module production• Helsinki is bonding chips at production speed• 2 + 7 modules produced, yield and speed ‘unknown’• Testing infrastructure for chips and hybrids fully operational• Strasbourg and Trieste (MIPOT) starting in Q1Read-out• EndCap ready for mass production• FEROM design ready, first prototype Q2• Patchpanels and cables layout almost frozen
Status and plans
17 december 2003 Gert-Jan Nooren 17
Beam tests• Integration in real Cern environment: read-out chain proven up to ADC• Sensor quality problem revealed: Canberra takes action• ITS = SPD + SDD + SSD beamtest end 2005Module production• Helsinki is bonding chips at production speed• 2 + 7 modules produced, yield and speed ‘unknown’• Testing infrastructure for chips and hybrids fully operational• Strasbourg and Trieste (MIPOT) starting in Q1Read-out• EndCap ready for mass production• FEROM design ready, first prototype Q2• Patchpanels and cables layout almost frozenAssembly• First ladder Q1/Q2• Module testing with laser set-up
Status and plans
17 december 2003 Gert-Jan Nooren 18
June 2003 beam testsmodule SN0003
Charge matching
N
P
