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PERSISTENT SURVEILLANCE FOR PIPELINE PROTECTION AND THREAT INTERDICTION
H. Huang, H.W. Xu, K.P. Youngblood, D.R. Wall, R.B. Stephens, K.A. Moreno, A. Nikroo of General Atomics
K.J. Wu, M. Wang of LLNL
2012 TFSM Conference Santa Fe, NM
May 21-24, 2012
Work supported by U.S. Department of Energy under Contract DE-AC52-06NA27279
Inhomogeneous Cu Diffusion in NIF Beryllium Ablator Capsules
IFT\P2011-037
Unlike GDP, beryllium is heterogeneous at micron scale
• Process/structure interactions critical to performance
Micro-structure
Target performance
Fabrication process
• This talk presents a Cu-Be case study • Same methodology applicable to other NIF dopants Introduction
NIF Be capsules have step-wise dopant profiles; diffusion during pyrolysis blurs the steps
• Interfaces become diffused after mandrel removal − Measured non-destructively by contact radiography
Cu/Be
• NIF design uses 5 distinctive layers to optimize shock timing
Need quantification to estimate the impact on implosion
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 20 40 60 80
Cu (a
t%)
Be Thickness (um)
S6NIF165 Before and After Pyro
Before Pyro
After Pyro
SEM Backscattered Electron (BSE) contrast reveals dramatic difference in pre- and post-pyro samples
• Post-pyro interfaces become diffused and heterogeneous
• Heterogeneity length scale: 0.5-5 µm radial, 0.5-10 µm lateral − >10x larger than bulk diffusion behavior (Butrymowicz 1975)
Pre-pyro
Layer #3: 0.70 at% Cu
Layer #4: 0.35 at% Cu
Layer #5: 0.00 at% Cu
Post-pyro Higher Ar
5keV field emission SEM on ion polished Be cross-section
Energy-Dispersive Spectroscopy (EDS) unambiguously identified Cu variations as the cause of BSE contrast
EDS Cu Map BSE Image
Post-pyro: Diffuse Interface
Pre-pyro: Sharp Interface
Need to distinguish two scenarios: (1) polishing smear (2) Cu diffusion
~5 um
Electron interaction
volume
Sample surface
20 keVelectron beam
4um
BSE Detector
backscattered electrons
35°
~2 um
~0.05 um
secondary electrons
Measuring Cu from outside, through undoped Be layer, eliminates the possibility of polishing smear
5.3um
• 20keV e-beam probes <5 µm depth into bulk beryllium − Can’t see through 5.3 µm undoped buffer layer unless Cu diffuse
1 at% Cu
0 at% Cu Outside
e-beam probes outside surface
Test suggested by J. Edwards @ LLNL
Copper diffused into the undoped buffer layer in highly heterogeneous manner during pyrolysis
Line is where EDS scan was performed
• BSE contrast invisible on pre-pyro surface
• BSE contrast conspicuous on post-pyro surface
• Post-pyro contrast: “super nodules” on textured background
This nodule was FIB Lifted for TEM
EDS element line-scans provide further validation
0
200
400
600
800
1000
1200
0 20 40 60 80 100 120 140 160
Cu-L
X-ra
y (C
ount
)
Distance (um)
Post-pyro GA226-05 outer surface
Cu-L Count (20KeV e-beam)
Bsd Image Intensity
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
0 20 40 60 80 100 120 140 160Co
pper
(at%
)Distance (um)
Post-pyro GA226-05 outer surface
Cu at% (20KV)Cu at% (15KV)Cu at% (10KV)Cu at% (5KV)
• BSE contrast agrees with Cu profile measured by EDS linescan − Establish BSE as quick semi-quantitative Cu mapping technique
• Varying e-beam energy proves Cu from an internal source − Higher energy probes deeper and measures higher Cu at%
Max depths: 20KeV: 5.0um 15KeV: 3.0um 10KeV: 1.5um 05KeV: 0.4um
This nodule was FIB Lifted for TEM
X
Y FIB Slice
Nodule center location On FIB slice
White ring, due to oxide, marks the “super nodule” growth column boundary
White dot due to enhanced Cu diffusion ~130 nm thin FIB slice
shows porous structures near nodule center
FIB slice was lifted-out from the “super nodule” on post-pyro sample to study structural-composition correlation
Top-down SEM image (BSE contrast)
Lots of voids near nodule center
Lack of voids outside nodule
Scale bar: 1 µm Composite TEM Image
TEM shows nodule center having finer, heterogeneous, and porous structures, which can enhance Cu diffusion
Nano-voids present mostly near nodule center
Grain sizes vary greatly: 50-200nm near nodule center 500-1000nm outside nodule
TEM Black represents disorder
~20 µm “super nodules” are growth columns induced by mandrel defects, terminating as surface bumps
Large bumps on outside surface
SEM image of a bump cross-section
Abnormal growth initiated by mandrel contaminant
FIB through the nodule
X-ray imaging confirms strong correlation between “super nodules” and mandrel surface contaminants
X-ray tomography slices
“Super nodules” strings
Mandrel surface defects
Two features parallel to each other
X-ray transmission
Inhomogeneous background Cu diffusion produces atomic Z contrast on both cross-section and OD
(1) Cross-section view (2) Top surface view
• Pattern length scales match between two BSE views of the same post-pyro sample
Background Cu diffusion produced ±0.06 at% 1-σ variations, which is unwanted by target designers
0
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0.6
0.8
1
0 5 10 15 20 25 30 35 40 45 50 55
Cu (a
t%)
Lateral Distance (um)
Copper Distribution (Estimate from BSE Image Contrast)
D=-1.5um
D=-1.0um
D=-0.5um
D=0.0um
D=0.5um
D=1.0um
D=1.5um
“D” indicates distance to the original Cu interface
GA226-05 post-pyro BSE contrast line-outs
• Copper profiles near interface are anti-phased, expected if a conserved total quantity is redistributed
A phenomenological description of Cu diffusion in beryllium
85um
Sputtered beryllium grow in vertical columns, capped at the surface as nodules. Each column is a cluster of submicron columnar grains
Cu: 0.0 at%
Cu: 1.0 at%
There are ~25um “super” nodules embedded inside a sea of 5um regular nodules.
5.7um
25um 5um
Pre-pyro
Post-pyro Cu diffuses faster toward center of each nodule, even faster for “super” Nodules
See Poster P-28 by H. Huang for metrology technique details
Oxide provides an effective diffusion barrier
Thermal oxide stopped Cu diffusion
Strong Cu diffusion where no oxide was introduced
• Oxide idea evolved – ALD Al2O3 – Thermal oxide – In-situ oxide
See Oral Tue. AM1-4 by K. Youngblood
Cu diffuses inhomogeneously in sputtered beryllium
• Cu structure length scale varies: – 0.5 to 5 µm radially, – Minimum 10x larger than bulk prediction
• Two types of Cu structures: – background variations & “super nodules”
• Background Cu varies by ~+/-0.06 at% (1-σ) • “Super nodules” correlates to mandrel contamination
– Nodule centers are porous, with smaller grains which enhanced diffusion
• Cu diffusion, uniform or not, can be stopped by oxide barriers – Beryllium can remain to be an ablator choice
Summary
Same methodology can be applied to other dopants, Work in progress on W, Zr, Al, Si
Summary
• Dopant behaviors vary greatly − Uniform and stays uniform: W and Zr − Uniform and becomes non-uniform: Cu − Non-uniform but doesn’t further evolve: Si − Non-uniform and worsens upon pyro: Al
• Different physical processes in the play − Solubility => phase segregation − Mobility => diffusion
• Same measurement strategy apples