iCE40 Ultra™ Mobile Development Platform User …...2 iCE40 Ultra Mobile Development Platform User Guide Introduction This platform is designed to develop and demonstrate various

iCE40 Ultra™ Mobile Development Platform User Guide

EB90 Version 1.1, June 2015

2

iCE40 Ultra Mobile Development Platform User Guide

IntroductionThis platform is designed to develop and demonstrate various mobile applications using the iCE40 Ultra device. The board is in the form factor of a bar phone featuring various sensors and connectivity to external mobile soft-ware development platforms.

Kit ContentsThe following items are included in the development kit:

• Main Board – The main board is mounted in lower plastic enclosures.

• Key Set – The key set includes keys A, B, C, and Custom. Key A is installed on the main unit by default.

• DragonBoard Interface Module

• Interconnecting Cables – The cables include USB mini-B cable, DragonBoard interface ribbon cable, and +5 V supply flywire.

VariantsThe unit is built in two variants with different sets of RGB LED and IR LED parts.

Variant A includes the following parts on the board:

• RGB LED used at D12: AEBMT-RGBZ by Advanced Optoelectronics Technology

• IR LED used at D7: SFH 4645 by Osram Opto Semiconductors

Variant B includes the following parts on the board:

• RGB LED used at D13: APTF1616SEEZGQBDC by Kingbright

• IR LED used at D7: VSMB2948SL by Vishay Semiconductor

The variants can be distinguished through the populated status of D12 and D13.

• Variant A: D12 is populated and D13 is not populated

• Variant B: D12 is not populated and D13 is populated

3


Demo Board ArchitectureFigure 1 shows the demo board architecture. The different I2C sensors are split up and wired on two separate I2C buses as Pool A and Pool B. The other sensors that are not I2C are either wired separately or are connected instead of Pool B and other resources on the board. Changes to connectivity are user controllable and achieved by means of changing the keys – a method to replace using multiple jumpers to re-route wiring to different resources.

Figure 1. Block Diagram

MAX44008 (I2C)RGB ALS

APP PROCESSOR (SPI) (10 pin CONN)

3.3v

BMP180 (I2C)Pressure

IR LED (TX)

HIGH POWER WHITE LED

JUMPER SEL

POOL-B I2C

PO

OL-

A I2

C

POWER SUPPLIES(from USB / Battery)

FT2232H

SPI CONFIG FLASH (SPI)

USB

CHEETAH CONN

LSM330DLC (I2C)Accel. & Gyro

HALL SENSOR

THESE CONNECTIONS VIA INTERCONNECT [40 pin FPC connector]

TMD27711 (I2C)Proximity & ALS #2

Key-socket selection

FINGERPRINT SENSOR I2S MIC#2

SP

I

Li-ion BatteryCHARGER

Key-socket selection

RGB LED

I2S MIC#1 SMA CONN

CURRENT MEASURE

CU

RR

EN

TM

EA

SU

RE

BLE Module

IR RX

LSM303DLHC (I2C)Magentometer

SHT20 (I2C)Humidity &Temp.

TMD27711 (I2C)Proximity & ALS #1

POOL-B I2C

PO

OL-

B I2

C

3.3V

3.3V

SMA CONNOperated together

Optional

CONFIG SPI & BANK 1

BANK 2

BANK 0

iCE5LP4KSWG36

SPIUART

4


Figure 2. Top View of Main Unit

BLE Module

External Power and Charging Status Indicator

TMD2711 Proximity Sensor

FPC1080A Fingerprint Sensor

TMD2711 Proximity Sensor

SHT20 Humidity Sensor

ADMP441 I2S Mic

IR Rx (TSMP58000)

J15 (Jumper Pool Header)

Power LED

Barcode LED(Red)

iCE40 Ultra

RGB LED

CDONE LED

BMP180Pressure Sensor

27 MHzOscillator

Power Switch

SMA Footprint

AP Connector

Jumper selection betweenIR and White High Power LEDs

IR LED (Emitter)

MAX4408 RGB ALS Sensor

High Power White LED

CRST Button

USB Port

5


Figure 3. Bottom View of Main Unit

ADMP441 I2S Mic

M25P80SPI Flash

LSM303DLHCMagnetometer Sensor

Connector

Battery

Key Socket

LSM330DLCAccelerometer andGyroscope Sensor

FTDI FT2232H

USB Port

6


Features• Supports BLE (Bluetooth Low Energy) module

• Supports OTA (Over-The-Air) configuration of FPGA

• Form factor similar to mobile phone

Sensor listThe following table lists the different sensors used on the board.

Table 1. Sensor List

Key-socket ArrangementThree predefined keys and one user defined key is provided to allow the user to change the wiring of the board between different sensor sets as described in Table 2. The table also denotes pin assignments to the iCE40 Ultra FPGA on the board. While selecting and inserting a particular key of choice, ensure that you align the aligning arrow on the key and on the main PCB. The keys are mechanically delicate, and hence, you must be careful while inserting and removing the keys. Figure 4 shows the four keys and socket on the main board.

Number Sensor Function Interface Sensor Part Number Manufacturer1 RGB LED (Variant 1) Direct AEBMT-RGBZ AOT

2 RGB LED (Variant 2) Direct APTF1616SEEZGQBDC Kingbright

3 High Current IR Tx LED (Variant A)

Direct SFH4645 Osram Opto

4 High Current IR Tx LED (Variant B)

Direct VSMB2948SL Vishay Semiconductor

5 High Current Visible LED Direct XBDA WT-00-0000-00000LCE3

Cree Inc.

6 IR Rx Direct TSMP58000 Vishay Semiconductor

7 Proximity Sensor (Two numbers)

I2C TMD27711 A MS-TA OS USA Inc

8 RGB Light Sensor I2C MAX44008 Maxim-IC

9 Temperature Sensor I2C BMP180 (integrated) Bosch

10 Barometric Pressure I2C BMP180 Bosch

11 Accelerometer I2C LSM330DLC ST Micro12 Gyroscope I2C

13 Magnetometer I2C LSM303DLHC ST Micro

14 Humidity I2C SHT20 Sensirion

15 Hall Direct BU52051NV X-TR Rohm Semiconductor

16 Fingerprint SPI FPC1080A Fingerprints

17 MEMS Mic (Two numbers) I2S ADMP441 Invensense

7


Figure 4. Key-socket Arrangement

Pin assignments iCE40 Ultra FPGATable 2 lists the complete pin assignments for the iCE40 Ultra FPGA for the different keys and other hard wired peripherals on the board

Table 2. Pin Assignment

Pin Number Pin Name Bank

Pin Assignment for Default Key A

Pin Assignment for Key B

Pin Assignment for Key C

A4 VCCIO_0 Bank 0 3V3 3V3 3V3

B5 IOT_46B_G0 Bank 0 Not used / Optional ext SMA clock

Not used / Optional ext SMA clock

I2S_WS1 (Microphone 1 (DP R51))

A6 RGB2 Bank 0 BLED (RGB LED) BLED (RGB LED) I2S_CE1 (Microphone 1)

B6 RGB1 Bank 0 GLED (RGB LED) GLED (RGB LED) I2S_SCK1 (Microphone 1)

C6 RGB0 Bank 0 RLED (RGB LED) RLED (RGB LED) I2S_SD1 (Microphone 1)

A2 IRLED Bank 0 HPLED (IRLED or VLED) HPLED (IRLED or VLED HPLED (IRLED or VLED

A1 VSSIO_LED Bank 0 GND GND GND

C3 SPI_VCCIO1 Bank 1 3V3 3V3 3V3

D1 IOB_33B_SI_MOSI_SPI1

Bank 1 ICE_SI/FLSH_MOSI ICE_SI/FLSH_MOSI ICE_SI/FLSH_MOSI

F2 IOB_32A_SO_MISO_SPI1

Bank 1 ICE_SO/FLSH_MISO ICE_SO/FLSH_MISO ICE_SO/FLSH_MISO

E1 IOB_34A_SCK_SCK_SPI1

Bank 1 FLSH_SCLK FLSH_SCLK FLSH_SCLK

F1 IOB_35B_SS_MCSNO_SPI1

Bank 1 FLSH_CS FLSH_CS FLSH_CS

E4 IOB_12A_G4_CDONE

Bank 1 CDONE CDONE CDONE

D3 CRESET_B Bank 1 CRESET CRESET CRESET

B2 IOB_31B Bank 1 HALL_OUT/BMP_XCLR HALL_OUT/BMP_XCLR HALL_OUT/BMP_XCLR

C1 IOB_30A Bank 1 PoolA_Sensor_SDA PoolA_Sensor_SDA PoolA_Sensor_SDA

E2 IOB_29B Bank 1 Pool_Sensor_SCL Pool_Sensor_SCL Pool_Sensor_SCL

D2 IOB_27B Bank 1 CLK_STNDBY# (Osc. Standby)

CLK_STNDBY# (Osc. Standby)

CLK_STNDBY# (Osc. Standby)

B1 IOB_26A Bank 1 FP_RSTn (Fingerprint reset)

FP_RSTn (Fingerprint reset)

FP_RSTn (Fingerprint reset)

E3 IOB_20A Bank 1 UART_TX (BLE) UART_TX (BLE) UART_TX (BLE)

Orient the direction of the keyusing these arrows

8


External InterfacingThe board can be interface to external systems by one of two methods:

• SPI based application processor interface via J16 (AP Conn)

• BLE wireless module

For DragonBoard based SPI based application processor interfacing, a DragonBoard interfacing module and a connecting ribbon cable are required (provided). Figure 5 shows the interfacing module, connecting cable, and method to power the module from the DragonBoard.

A BLE module provides a feature on the board for wireless interfacing using Bluetooth Low energy version 4.

F3 IOB_16A Bank 1 UART_RX (BLE) UART_RX (BLE) UART_RX (BLE)

B4 IOB_10A Bank 1 PROC_INTR PROC_INTR PROC_INTR

C2 IOB_25B_G3 Bank 1 PROC_CS PROC_CS PROC_CS

F4 IOB_11B_G5 Bank 1 CLK (27 MHz) CLK (27 MHz) CLK (27 MHz)

C4 VCCIO_2 Bank 2 3V3 3V3 3V3

E5 IOB_7B Bank 2 BAR_LED FP_INTR (Fingerprint) S_LR2 (Microphone 2)

F5 IOB_6A Bank 2 IR_IN (IR Rx) IR_IN (IR Rx) I2S_LR1 (Microphone 1)

D5 IOB_5B_MCSN0_SPI2

Bank 2 Spare GPIO on Exp Header p.16

FP_CS (Fingerprint) I2S_WS2 (Microphone 2)

D6 IOB_4A_SCK_SPI2

Bank 2 PoolB_Sensor_SCL FP_SCK (Fingerprint) I2S_SD2 (Microphone 2)

E6 IOB_3B_G6_MOSI_SPI2

Bank 2 PoolB_Sensor_SDA FP_MOSI (Fingerprint) ISS_SCK2 (Microphone 2)

F6 IOB_2A_MISO_SPI2

Bank 2 Spare GPIO on Exp Header p.20

FP_MISO (Fingerprint) I2S_CE2 (Microphone 2)

D4 VPP_2V5 Power 2V5 2V5 2V5

B3 VCCPLL Power 1V2 1V2 1V2

A5 VCC Power 1V2 1V2 1V2

C5 GND1 Power GND GND GND

A3 GND2 Power GND GND GND

Pin Number Pin Name Bank

Pin Assignment for Default Key A

Pin Assignment for Key B

Pin Assignment for Key C

9


Figure 5. Data and 5 V Wiring from DragonBoard to DB Interface Module

ClockingThe board features an onboard 27 MHz oscillator. When an external clock is required, the SMA footprint can be populated with a suitable SMA SMD connector (such as Molex part # 732511350). You must depopulate R51 on the board.

Daisy Chain Interconnect / Expansion ConnectorDaisy chain interconnect to the iCE FPGA by means of a connecting cable between two boards is possible via J10 on the main board. Refer to the schematics for the pin assignments of J10. All the pins of the FPGA are accessible on this connector – and hence also forms a convenient way to tap into, or expand from any pin on the FPGA.

Basic Usage ProceduresPowering the BoardThe board may be powered using one of three following methods:

• USB cable: USB A to mini B cable (supplied) connected to a PC may be used to power the board

• +5 V supplied to the DragonBoard interface module used to power the board through the provided ribbon cable. The +5 V can be tapped from the DragonBoard as indicated in the Figure 5.

• Internal rechargeable battery not supplied with the kit. It must be procured separately. An example is the Nokia BL-5C Lithium-ion battery shown in Figure 7.

Charging the BatteryThe battery is charged when USB power is applied. Glowing of the green LED D3 (CHG) indicates the charging of the battery. Glowing of the green LED D4 (EPW) indicates that an external charging power (USB) is applied. Glow-ing D3 indicates that charging is in progress. If D3 does not glow and D4 (EPW) glows, it means that charging is complete.

10


Figure 6. USB Socket Located on the Lower Side

Figure 7. Nokia BL-5C Li-ion Battery Mounted Inside Back-cover of the Main Unit

Configuring the FPGAThe iCE40 Ultra can be configured using one of two methods:

• By programming the on-board SPI Flash U3 (ST Micro's M25P80)

• By directly configuring the FPGA using a processor to configure via iCE40 Ultra's SPI

Configuration by Programming SPI FlashThe SPI Flash (M25P80) can be programmed using the on-board FTDI's FT2232H (USB-SPI FIFO) via USB and Lattice Diamond® Programmer.

To program the SPI Flash via USB and Lattice Diamond Programmer:

1. Apply a jumper to FLCS on jumper pool header J15.

2. Connect the USB cable to the demo board.

3. Download the bitstream in SPI Flash (M25P80) using Lattice Diamond Programmer. To download the bitstream:

a. Open Diamond Programmer version 3.2 or above and select Create a new blank project as shown in Figure 8.

11


Figure 8. Diamond Programmer Getting Started Dialog Box

b. The Diamond Programmer main interface opens, as shown in Figure 9.Figure 9. Diamond Programmer Main Interface

c. Select iCE5LP in Device Family and iCE5LP4K in Device, as shown in Figure 10.

12


Figure 10. Device Selection

d. Double-click Fast Program and choose the desired *.bin file.e. In the Device properties dialog box, select the program to be used in programming the device and click

OK, as shown in Figure 11. Figure 11. Device Properties Dialog Box

13


e. Verify that the operation is completed successfully. In the main interface, INFO: Operation: successful is displayed in the Output pane.

Figure 12. Verifying Operation

Alternatively, the SPI Flash can be programmed using Totalphase's Aardvark or Cheetah. Flash Center GUI flash programming utility can be hooked up to the J29 (SPI PGM) header on the DragonBoard interfacing module.

To program the SPI Flash using Aardvark/Cheetah:

1. Apply a jumper on FLCS located on jumper pool header J15.

2. Ensure that the ribbon cable is connected between J16 (AP CONN) on main board and J26 (AP Interconnect) on the DragonBoard interfacing module.

3. Remove shunt on J20 (PGM) header on the DragonBoard interfacing module.

4. Connect Aardvark / Cheetah to the J29 (SPI PGM) header on the DragonBoard interfacing module and its USB to the PC/Laptop running the Flash Center GUI utility.

5. While operating the CRST button or applying the jumper on CRST of J15 (on the main board), use the Flash Center GUI and appropriate bitmap to program the M25P80 SPI Flash.

6. After programming, remove the shunts on CRST and PGM.

Direct Configuration by a Processor (Processor Configuration)The iCE40 Ultra FPGA can be configured directly without using an external SPI Flash. This can be done by the application processor interfacing with the iCE40 Ultra SPI lines. While using this method appropriate software and Android Application is required.

To configure the hardware:

1. Remove the jumper shunt on FLCS located on J15 (jumper pool header).

2. Apply a jumper shunt on FTRST located on J15 (jumper pool header).

3. Remove the jumper shunt on CRST located on J15 (jumper shunt header).

14


4. Using the ribbon cable provided, connect the main PCB and the DragonBoard through the DragonBoard inter-facing module.

5. Run the appropriate software / application to configure iCE40 Ultra directly from the DragonBoard processor.

Current MeasurementsFPGA currents are measured by inserting ammeters in series with the respective current paths. This is achieved by means of removing the jumper shunts on the pooled jumper header J15, and replacing those by ammeters. Note the legends printed across each of the jumpers on the PCB and the corresponding wiring in the schematics around region of J15 to make the desired measurements. Current measurements for the high power LED (IR or white) can be done at J9 (LED selecting 3 pin jumper). Note that RGB LED current measurements on J15 (jumper pool header) is for the common Anode limb of the LED and not individual RGB circuits; Thus appropriate drive must be made to measure individual RG

Technical Support AssistanceSubmit a technical support case via www.latticesemi.com/techsupport

Revision History

© 2015 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

Date Version Change Summary

June 2015 1.1 General update in multiple sections.

Updated Appendix A. Schematic Diagrams section.

Added Appendix B. Bill of Materials section.

June 2014 01.0 Initial release.

http://www.latticesemi.com/corporate/legal/index.cfm

www.latticesemi.com/techsupport

15


Appendix A. Schematic DiagramsFigure 13. Pool-A I2C Sensors

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

PRESSURE SENSOR

LATTICE SEMICONDUCTOR CORPORATION CONFIDENTIAL

Note

s:-

Gyro

and

Acc

eler

omet

er i

nter

face

s ar

e bo

th s

et t

o I2

C-

I2C

addr

ess

LSB

for

both

Gyr

o an

d Ac

cele

rome

ter

is '

1'-

SPI

for

both

Gyr

o an

d Ac

cele

rome

ter

is d

isab

led

ROS

NES

L

LAH

RO

SNE

S

RET

EMO

RE

LEC

CA

&

EPO

CS

ORY

G

RGB ALS SENSOR

PROXIMITY SENSOR-2

iCE5LP Mobile Development Platform Rev B

DEFAULT VCCIO1 IS SET TO 3.3V

pool

A_s

enso

r_S

CL

pool

A_s

enso

r_S

DA

pool

A_s

enso

r_S

DA

pool

A_s

enso

r_S

CL

pool

A_s

enso

r_S

DA

pool

A_s

enso

r_S

CL

Hal

l_ou

t

pool

A_s

enso

r_S

DA

pool

A_s

enso

r_S

CL

VC

CIO

1

VC

CIO

1

VC

CIO

1

VC

C3V

3

VC

CIO

1

VC

CIO

1

VC

CIO

1

VC

CIO

1

pool

A_s

enso

r_S

DA

[Pg7

]po

olA

_sen

sor_

SC

L[P

g7]

Hal

l_ou

t[P

g7]

Title

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N tnemuco

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Wed

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Wed

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R9

DN

P

C25

0.1u

J14

AS

CL

1

J13

AS

DA

1

C79

1u

C57 1u

U18 MA

X44

008

VD

D1

GN

D2

A0

3IN

T4

SC

L5

SD

A6

U22 BM

P18

0NC

11

VD

D2

VD

DIO

3

NC

44

SC

L5

SD

A6

GN

D7

R8

10k

U13 BU

5205

1NV

XOU

T1

GN

D2

NC

3

VD

D4

TPAD5

C14

0.1u

U5

LSM

330D

LC

RE

S0

2

GN

D0

1

RES814

RES713

RES612

RES511

RES410

VDD07

CA

P15

DE

N_G

16

DR

DY

_G/IN

T2_G

17

INT1

_G18

INT2

_A19

INT1

_A20

VDD_IO_021

CS_G22

CS_A23

SCL_A/G24

VDD_IO_125

SDO_G26

RE

S1

3R

ES

24

RE

S3

5G

ND

16

VDD18 VDD29

SDO_A27

SDA_A/G28

C56

1u

R42

4k7

R33

10k

C11

10u

TMD

2771

1

U16

VD

D1

GN

D3

LED

A4

SC

L2

LED

K5

LDR

6

INT

7

SD

A8

C16

10n

R41

4k7

C53

10u

C50

0.1u

C77

0.1u

C59

1u

16


Figure 14. Pool-B I2C Sensors, IR Rx and Clocking

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

Humidity, Temperature Sensor

IR RX MODULE

CLOCK OSCILLATOR


PROXIMITY SENSOR-1

COMPASS SENSOR


DEFAULT VCCIO2 IS SET TO 3.3V

pool

B_s

enso

r_S

DA

pool

B_s

enso

r_S

CL

pool

B_s

enso

r_S

CL

pool

B_s

enso

r_S

DA

GN

D

pool

B_s

enso

r_S

CL

pool

B_s

enso

r_S

DA

VC

CIO

2

VC

CIO

2

VC

CIO

2

VC

CIO

2

VC

C3V

3V

CC

IO2V

CC

IO2

pool

B_s

enso

r_S

DA

[Pg7

]

pool

B_s

enso

r_S

CL

[Pg7

]

IR_I

N[P

g7]

clk

[Pg7

]

clk_

stnd

by#

[Pg7

]

Title

v eR

rebmu

N tnemuco

Dezi

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of

04130-973-2 01P

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Sen

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Rx

& C

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ing

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310

Wed

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Title

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Title

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ing

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310

Wed

nesd

ay, A

pril

22, 2

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R29

10k

AS

FLM

B-2

7.00

0MH

Z-LC

-TU

21GN

D2

VD

D4

STD

BY

#1

OU

T3

R3

4k7

C5

1u

C55

1u

C76

0.1u

C1

0.1u

TMD

2771

1

U15

VD

D1

GN

D3

LED

A4

SC

L2

LED

K5

LDR

6

INT

7

SD

A8

R5

4k7

C49

4.7u

C58

10u

U14

SH

T20

SD

A1

VSS2

NC

13

NC

24

VDD5

SC

L6

PA

D7

C52

0.1u

U11

TSM

P58

000

VD

D3

OU

T1

GN

D2

J2 BS

CL

1

C6

0.1u

R43 10

k

J1 BS

DA

1R

2210

0

C8

0.22

u

C15

4.7u

LSM

303D

LHC

U4 C

16

RE

S1

10

RE

S2

11

SE

TP12

SE

TC13

SC

L2

SD

A3

INT2

4

INT1

5

DR

DY

9

VDDIO1

VDD14

GND7

NC8

C51 1u

17


Figure 15. Interconnects

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

To j

umpe

r po

olDe

faul

t: S

hunt

Note position of pin#1

in reference board

SPI CONFIGURATION / FLASH



SEEED BLE MODULE

AP INTERCONNECT

flsh_

sclk

flsh_

cspr

oc_i

ntr

proc

_cs

CR

STb

ice_

SO

ice_

SI

flsh_

mos

iic

e_S

I

flsh_

mis

oic

e_S

O

flsh_

sclk

flsh_

mis

o

UART_TX

UART_RX

DR

GN

5V

VC

CIO

1

VC

C3V

3

VC

C3V

3

VC

C3V

3

ice_

SO

[Pg4

,7]

proc

_cs

[Pg7

]fls

h_cs

[Pg4

,5,7

]

ice_

SI

[Pg4

,7]

flsh_

sclk

[Pg4

,5,7

]pr

oc_i

ntr

[Pg7

]

CR

STb

[Pg4

,5,7

]

flsh_

mis

o[P

g5]

M25

P80

_CS

n[P

g7]

flsh_

mos

i[P

g5]

UART_TX

[Pg7]

UART_RX

[Pg7]

CD

ON

E[P

g5,7

]

CR

STb

[Pg4

,5,7

]

ice_

SI

[Pg4

,7]

ice_

SO

[Pg4

,7]

flsh_

cs[P

g4,5

,7]

flsh_

sclk

[Pg4

,5,7

]

SW

CLK

[Pg7

]S

WD

IO[P

g7]

Title

v eR

rebmu

N tnemuco

Dezi

S

t eehS

: etaD

of

04130-973-2 01IN

TER

CO

NN

EC

TS

B

410

Wed

nesd

ay, A

pril

22, 2

015

Title

veR

rebmu

N tnemu co

Dezi

S

teehS

:etaD

of

04130-973-2 01IN

TER

CO

NN

EC

TS

B

410

Wed

nesd

ay, A

pril

22, 2

015

Title

veR

rebmu

N tnemu co

Dezi

S

teehS

:etaD

of

04130-973-2 01IN

TER

CO

NN

EC

TS

B

410

Wed

nesd

ay, A

pril

22, 2

015

R2

10k

R13

0

R68

0D

NP

R12

0

R78

820

J16

AP

INTE

RC

ON

NE

CT

2 4 6 8 10

1 3 5 7 9

D14

RE

D

Manufacturer = OsramPART_NUMBER = LS L29K-G1J2-1-Z

DN

P

1 2

R37

0

R35 0

R6

10k

R67

0D

NP

R7

10k

J18

BLE

PR

OG

SE

L

1 2 3

R76 0

DN

P

R45

0D

NP

R48

0D

NP

M25

P80

U3

SD

I5

SC

K6

WP

3

CS

1

SD

O2

HO

LD7

8

VC

C

4

GN

D

R77 0

DN

P

C9

0.1u

C17

0.1u

U30

See

edB

LE

GN

D1

SW

CLK

2

SW

DIO

3

VC

C4

p12

6p1

35

p11

7

p99

p810

p711

p612

p513

p414

p315

p216

p117

p018p2

920

p28

21p2

522

p24

23p2

324

p17

25p1

826

GN

D27

p10

8

p30

19

R4

10k

R75

0D

NP

R40 0

18


Figure 16. USB Programming and Power

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA



FTDI PROGRAMMER

USB - POWER & PROGRAMMING

US

B_D

M

GN

D

FT_C

RS

T

EP_CS

FT_C

RS

T

GND

EP

_DI

GND

EP

_CLK

EP

_CS

GN

D

FT_D

I

FT_D

IFT

_SK

FT_S

K

FT_C

S

EP_DI

FT_D

O

FT_C

S

EP_CLK

GN

D

US

B_D

P

GN

D

FT_D

O

GN

D

GN

D

USB_DP

USB_DM

FT_C

DO

NE

FT_C

DO

NE

VC

C3V

3

VC

C3V

3

VC

C3V

3

FTV

CO

R

VC

C3V

3

FTV

CO

R

VC

C3V

3

FTV

CO

R

FTV

CO

R

VC

C3V

3

VC

C3V

3

VC

C3V

3

US

B5V

CR

STb

[Pg4

,7]

flsh_

mis

o[P

g4]

flsh_

sclk

[Pg4

,7]

flsh_

cs[P

g4,7

]fls

h_m

osi

[Pg4

]

CD

ON

E[P

g4,7

]

FTR

STn

[Pg7

]

Title

veR

r ebmu

N t nemuco

Dez i

S

teehS

:etaD

of

04130-973-2 01U

SB

Pro

gram

min

g &

Pow

er

B

510

Wed

nesd

ay, A

pril

22, 2

015

Title

veR

rebmu

N tnemu co

Dezi

S

teehS

:etaD

of

04130-973-2 01U

SB

Pro

gram

min

g &

Pow

er

B

510

Wed

nesd

ay, A

pril

22, 2

015

Title

veR

rebmu

N tnemu co

Dezi

S

teehS

:etaD

of

04130-973-2 01U

SB

Pro

gram

min

g &

Pow

er

B

510

Wed

nesd

ay, A

pril

22, 2

015

R25

0C

130.

1u

C37

27p

C48

0.1u

C30

4.7u

C22

0.1u

C47

0.1u

Y1

12M

Hz

R21

0

R23

470

5VD-

D+ID

G

US

B P

WR

J5

1

2

3

4

S2

5

S1

S3

S4

R20

1k

R16

10

C23

27p

C21

10u

R11

10k

R26

0

C20

0.1u

L3

600

ohm

, 500

mA

R28

0

R27

0L1

600

ohm

, 500

mA

R18

12k

93LC

56B

T-I/O

TU

6GN

D2

VC

C6

DO

1

DI

3

CLK

4

CS

5

C29

0.1u

L2 600

ohm

, 500

mA

C18

47u

C19

0.1u

R24

0

U9

FT22

32H

Gnd

_11

OS

CI

2

OS

CO

3

VP

HY

4

Gnd

_75

RE

F6

DM

7

DP

8

VP

LL9

AG

nd10

Gnd

11

VC

OR

E_1

12

TES

T13

RE

SE

T#14

Gnd

_215

AD

BU

S0

16

ADBUS117

ADBUS218

ADBUS319

VCCIO20

ADBUS421

ADBUS522

ADBUS623

ADBUS724

Gnd_325

ACBUS026

ACBUS127

ACBUS228

ACBUS329

ACBUS430

VCCIO_331

ACBUS532

AC

BU

S6

33A

CB

US

734

Gnd

_435

SU

SP

EN

D#

36V

CO

RE

37B

DB

US

038

BD

BU

S1

39B

DB

US

240

BD

BU

S3

41V

CC

IO_2

42B

DB

US

443

BD

BU

S5

44B

DB

US

645

BD

BU

S7

46G

nd_5

47B

CB

US

048

VREGOUT49 VREGIN50 Gnd_651 BCBUS152 BCBUS253 BCBUS354 BCBUS455 VCCIO_156 BCBUS557 BCBUS658 BCBUS759 PWREN#60 EEDATA61 EECLK62 EECS63 VCORE_364

R10

2k2

C44

0.1u

C24

0.1u

R17

10

C38

0.1u

C43

4.7u

19


Figure 17. I2S MIC, Fingerprint Sensors and Micro SD

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA


FINGERPRINT SENSOR

I2S MICROPHONES - 2


FP_C

S

I2S_SD1

I2S_SD2

VC

CIO

0V

CC

IO2V

CC

1V8

VC

CIO

2

VC

CIO

2V

CC

IO2

I2S

_LR

1[P

g7]

I2S

_WS

1[P

g7]

I2S

_SD

1[P

g7]

I2S

_SC

K1

[Pg7

]

I2S

_CE

1[P

g7]

I2S

_CE

2[P

g7]

FP_M

ISO

[Pg7

]

FP_C

S[P

g7]

FP_I

NTR

[Pg7

]

FP_S

CK

[Pg7

]

FP_M

OS

I[P

g7]

I2S

_LR

2[P

g7]

I2S

_WS

2[P

g7]

I2S

_SD

2[P

g7]

I2S

_SC

K2

[Pg7

]

FP_R

STn

[Pg7

]

Title

veR

re bmu

N tn emuco

Dez i

S

teehS

:etaD

of

04130-973-2 01I2

S M

IC, F

ING

ER

PR

INT

SE

NS

OR

S a

nd M

ICR

O S

D

B

610

Wed

nesd

ay, A

pril

22, 2

015

Title

veR

rebmu

N tnemu co

Dezi

S

teehS

:etaD

of

04130-973-2 01I2

S M

IC, F

ING

ER

PR

INT

SE

NS

OR

S a

nd M

ICR

O S

D

B

610

Wed

nesd

ay, A

pril

22, 2

015

Title

veR

rebmu

N tnemu co

Dezi

S

teehS

:etaD

of

04130-973-2 01I2

S M

IC, F

ING

ER

PR

INT

SE

NS

OR

S a

nd M

ICR

O S

D

B

610

Wed

nesd

ay, A

pril

22, 2

015

R62

10k

R66

100k

R73

100k

R63

10k

D6

TVS

/VA

R

C66

0.1u

U19 AD

MP

441

SC

K1

SD

2W

S3

LR4

GND5

GN

D1

6

VD

D7

CE

8

GN

D2

9

C60

0.1u

FPC

1080

A

U17

DR

11

DR

213

DR

317

DR

429

TXO

UT1

20

TXO

UT2

21

AN

ATE

ST1

8

AN

ATE

ST2

9

TES

T410

TES

T316

TES

T215

TES

T132

SP

ICLK

24

MIS

O26

MO

SI

25

CS

N6

RS

TN5

IRQ

4

VD

D1

3

VD

D2

19

VD

DA

11

VD

DIO

27

GN

D5

31

GN

D6

30

GND72

GND87

GND912

GND1014

GND118

GND222

GND323

GND428

R30

100

C63

0.1u

R61

10k U

12 AD

MP

441

SC

K1

SD

2W

S3

LR4

GND5

GN

D1

6

VD

D7

CE

8

GN

D2

9

C36

0.1u

R34

10k

C54

0.1u

C46

0.1u

20


Figure 18. iCE5LP4KSWG36 FPGA and LEDs

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

500m

A tr

ack

500m

A tr

ack

500m

A tr

ack

500m

A tr

ack

Defa

ult:

Shu

nt 1

,2 (

for

IR L

ED)

All

500m

A tr

aces

All

500m

A tr

aces

Note:

Place close

to DUT



IR, RGB and HI-POWER LEDs

DAISY CHAIN INTERCONNECT

100m

A tr

ack

De-p

opul

ate

when

usi

ng S

MA C

LK

KEY & SOCKET HEADER

OPTIONAL SMA CLOCK

DNP

JUMPER POOL HEADER

100m

A tr

ack

100m

A tr

ack

DONE

CRST

ALTERNATE RGB LED

Note:

Place close

to DUT

Note:

Place close

to DUT

500m

A tr

ack

500m

A tr

ack

CR

STb

VCC_A5

RLE

D

RG

B_A

node

GLE

D

BLE

D

IRLE

DV

LED

VLE

DH

PLE

DIR

LED

GP

IO_B

2H

all_

out

CD

ON

E

SM

A_C

LK

GP

IO_B

5

BA

R_L

ED

VC

C_A

5V

CC

PLL

_B3

VP

P2V

5_D

4

SP

IVC

CIO

1_C

3V

CC

IO0_

A4

VC

CIO

2_C

4 RG

B_A

node

GP

IO_A

6B

LED

GP

IO_B

6G

LED

GP

IO_C

6R

LED

GP

IO_D

6po

olB

_sen

sor_

SC

L

GP

IO_D

5G

PIO

_E6

pool

B_s

enso

r_S

DA

GP

IO_E

5B

AR

_LE

D

GP

IO_F

6

GP

IO_F

5IR

_IN

flsh_

csC

RS

Tb

GP

IO_E

5

GP

IO_B

6

GP

IO_B

1S

PIV

CC

IO1_

C3

VC

CIO

0_A

4

GP

IO_D

6

GP

IO_F

5

pool

A_s

enso

r_S

DA

proc

_cs

VC

C_A

5

GP

IO_B

2

GP

IO_E

6

GP

IO_A

6

HP

LED

UA

RT_

TX

GP

IO_D

2

flsh_

csC

RS

Tb

UA

RT_

RX

VC

CP

LL_B

3

GP

IO_F

6

GP

IO_C

6

ice_

SO

pool

A_s

enso

r_S

CL

proc

_int

r

GP

IO_D

5

CD

ON

E

flsh_

sclk

VC

CIO

2_C

4

CLK

_F4

ice_

SI

GP

IO_B

5

VP

P2V

5_D

4

GN

DG

ND

GP

IO_D

6

BLE

DG

LED

RG

B_A

node

RLE

D

SP

IVC

CIO

1_C

3

GP

IO_B

1VCCPLL_B3

GN

DG

ND

VC

CIO

2_C

4

GP

IO_B

6

HP

LED

GP

IO_C

6

GP

IO_B

2

pool

A_s

enso

r_S

CL

pool

A_s

enso

r_S

DA

VPP2V5_D4

CD

ON

E

flsh_

csfls

h_sc

lkic

e_S

Oic

e_S

I

CR

STb

GP

IO_E

5G

PIO

_F5

GP

IO_D

5

proc

_cs

proc

_int

r

GP

IO_D

6

GP

IO_D

2

GP

IO_E

6

CLK

_F4

GP

IO_F

6

GP

IO_B

5

GP

IO_A

6

VC

CIO

0_A

4

VC

CIO

1

VC

C3V

3HP

VC

C3V

3HP

VC

CIO

1

VC

C1V

2

VC

C2V

5

VC

CIO

1

VC

CIO

0

VC

CIO

2

VC

C3V

3HP

VC

C3V

3

flsh_

cs[P

g4,5

]

Hal

l_ou

t[P

g2]

CD

ON

E[P

g4,5

]

pool

B_s

enso

r_S

DA

[Pg3

]po

olB

_sen

sor_

SC

L[P

g3]

pool

A_s

enso

r_S

DA

[Pg2

]po

olA

_sen

sor_

SC

L[P

g2]

IR_I

N[P

g3]

flsh_

sclk

[Pg4

,5]

ice_

SI

[Pg4

]pr

oc_i

ntr

[Pg4

]

CR

STb

[Pg4

,5]

ice_

SO

[Pg4

]pr

oc_c

s[P

g4]

I2S

_WS

1[P

g6]

FTR

STn

[Pg5

]

I2S

_CE

1[P

g6]

I2S

_SC

K1

[Pg6

]

I2S

_SD

1[P

g6]

FP_S

CK

[Pg6

]I2

S_S

D2

[Pg6

]FP

_CS

[Pg6

]I2

S_W

S2

[Pg6

]

FP_M

OS

I[P

g6]

I2S

_SC

K2

[Pg6

]

FP_I

NTR

[Pg6

]I2

S_L

R2

[Pg6

]FP

_MIS

O[P

g6]

I2S

_CE

2[P

g6]

I2S

_LR

1[P

g6]

M25

P80

_CS

n[P

g4]

clk_

stnd

by#

[Pg3

]

FP_R

STn

[Pg6

]S

WC

LK[P

g4]

SW

DIO

[Pg4

]U

AR

T_TX

Pg[

4]U

AR

T_R

XP

g[4]

clk

Pg[

3]

Title

veR

rebmu

N tnemuco

Dezi

S

te ehS

:etaD

of

04130-973-2 01iC

E5L

P4K

SW

G36

FP

GA

& L

ED

s

B

710

Wed

nesd

ay, A

pril

22, 2

015

Title

veR

rebmu

N tnemu co

Dezi

S

teehS

:etaD

of

04130-973-2 01iC

E5L

P4K

SW

G36

FP

GA

& L

ED

s

B

710

Wed

nesd

ay, A

pril

22, 2

015

Title

veR

rebmu

N tnemu co

Dezi

S

teehS

:etaD

of

04130-973-2 01iC

E5L

P4K

SW

G36

FP

GA

& L

ED

s

B

710

Wed

nesd

ay, A

pril

22, 2

015

J7

KE

Y

2 4 6 8 10 12 14 16 18 20 22 24 26 28 30

1 3 5 7 9 11 13 15 17 19 21 23 25 27 29

31 32

C70 10

n

C71

10n

C65 10

n

D5

VIS

1K

2A

33

J9

HP

LE

D S

EL

1 2 3

C72 1u

R38

2k2

C64 10

nC

67 1u

C78

0.1u

J10

CO

N40

A

12

34

56

78

910

1112

1314

1516

1718

1920

2122

2324

2526

2728

2930

3132

3334

3536

3738

3940

J17

SM

AA

1S

h12

Sh2

3S

h34

Sh4

5

C75

10n

R47

0 DN

P

D8

BA

R

D13 AP

TF16

16S

EE

ZGQ

BD

C

A1

R2

G3

B4

R44

100

C90

0.1u

J15

A3-

20P

A-2

SV

(71)

1 3 5 7 9 11 13 15 17 19

2 4 6 8 10 12 14 16 18 20

C62 1u

R14

150

R46

2k2

R74

0

R39

0

R49

10k

C61

0.1u

C69

0.1u

C73

0.1u

R51

0

C68

0.1u

Bank 0

Bank 2

CONFIG SPI & Bank 1

iCE5

LP4K

SWG3

6

iCE

5LP

4KS

WG

36

U20

IOB

_2A

_MIS

O_S

PI2

F6IO

B_3

B_G

6_M

OS

I_S

PI2

E6

IOB

_4A

_SC

K_S

PI2

D6

IOB

_5B

_MC

SN

0_S

PI2

D5

IOB

_6A

F5IO

B_7

BE

5

IOB

_29B

E2

IOB

_30A

C1

IOB

_31B

B2

IOB

_32A

_SO

_MIS

O_S

PI1

F2IO

B_3

3B_S

I_M

OS

I_S

PI1

D1

SP

I_V

CC

IO1

C3

IOB

_10A

B4

IOB

_11B

_G5

F4

CR

ES

ET_

BD

3

IOB

_16A

F3IO

B_2

0AE

3

IOB

_25B

_G3

C2

IOB

_26A

B1

IOB

_27B

D2

IOB

_34A

_SC

K_S

CK

_SP

I1E

1

IOB

_35B

_SS

_MC

SN

O_S

PI1

F1

VCCPLLB3

IOT_

46B

_G0

B5

RG

B2

A6

RG

B1

B6

RG

B0

C6

GND2A3

GND1C5

VCCA5

VC

CIO

_0A

4

VC

CIO

_2C

4

VPP_2V5D4

IOB

_12A

_G4_

CD

ON

EE

4

IRLE

DA

2

VS

SIO

_LE

DA

1

SW

3

PB

D9

LED

C74

1u

D12 RG

B

Gre

en1

Red

2

Ano

de3

Blu

e4

D7 IR

21


Figure 19. Power Supplies

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

spread across board, easy access

Defa

ult:

3V3

LDO REGULATORS

CHARGER

3V3 : tluaf eD3 V3 :tl uafeD

YELL

OW

GREE

N

s eca rt Am0 05secart Am 005

500m

A tr

aces



POWER SOURCE SELECTOR

PWR

VC

C3V

3V

CC

2V5

VC

C3V

3V

CC

2V5

VC

C1V

8V

CC

1V8

LDO

_CE

_VD

CLD

O_C

E_V

DC

VC

CIO

0

VD

C

VC

C1V

2V

CC

1V8

VC

CIO

1V

CC

3V3

VC

CIO

2

VC

C1V

8

VC

C2V

5

VC

C2V

5V

CC

3V3

VD

C

VC

C3V

3

US

B5V

VB

AT

VC

C3V

3HP

VD

C

VB

AT

VD

C

VD

C

US

B5V

DR

GN

5V

Title

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04130-973-2 01P

ower

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Wed

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pril

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Title

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ower

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Wed

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Title

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N tnemu co

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04130-973-2 01P

ower

Sup

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s

B

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Wed

nesd

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BC

1

Bat

con

nect

or

VIN

1

GN

D3

NC

25

NC

14

NTC

2

MH

16

MH

27

R59

DN

P

AP

7312

-121

8FM

-7U

10

1.8V

O5

1.8E

N3

1.2E

N2

1.2V

O6

VIN1 GND

4

EPAD7

C2

1u

R60

DN

P

J11

GN

D

1

D1

PM

EG

2010

AE

H

C3

2.2u

R58

0

J12

GN

D

1

C4

10u

C35

10u

R31

1k

R1

5k6

C26

0.1u

C40 10

u

C28

0.1u

C42

10u

C45 10

u

C7 10

u

R32

1k

U1

MC

3467

3AE

PR

2

VIN

1

nPP

R2

nCH

G3

nEN

4

BA

T8

ISE

T7

nFA

ST

6

GN

D5

EPAD9

C31

10u

C41 10

u

D10

LED

U7

LTC

4411

In1

Gnd2

Ctl

3S

tat

4O

ut5

R52

0

U8

XC

6222

B33

1MR

-G

Vin

1

Vss2

CE

3N

C4

Vou

t5

J3 GN

D

1

D4 LE

D

R50

1k

R53

DN

P

C33

0.1u

C12

0.1u

D2

PM

EG

2010

AE

H

R54

DN

P

U2

MIC

5335

-SJY

MT

VIN1

GND2

2V5E

N3

3V3E

N4

2V5V

O5

3V3V

O6

PAD7

D3

LED

SW

2P

WR

C34

10u

R55

0

R19

1k

C10

47u

R56

DN

P

C39

0.1u

C32

0.1u

R57

DN

P

C27

10u

22


Figure 20. Keys (4 Different PCB Modules)

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

KEY-A (DEFAULT)

KEY-B (GETS FP ILO PoolB)

KEY-C (GETS I2S MICs ILO PoolB, IR Rx, RGB)

KEY-D (CUSTOM KEY)



Title

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N tnemuco

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04130-973-2 01K

EY

S (4

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eren

t PC

B m

odul

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B

910

Wed

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pril

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015

Title

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04130-973-2 01K

EY

S (4

diff

eren

t PC

B m

odul

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B

910

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pril

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Title

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B

910

Wed

nesd

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pril

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015

J23

CO

N15

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

J4D

F12B

(3.0

)-30

DP

-0.5

V(8

6)

2 4 6 8 10 12 14 16 18 20 22 24 26 28 30

1 3 5 7 9 11 13 15 17 19 21 23 25 27 29

31 32

J6D

F12B

(3.0

)-30

DP

-0.5

V(8

6)

2 4 6 8 10 12 14 16 18 20 22 24 26 28 30

1 3 5 7 9 11 13 15 17 19 21 23 25 27 2931 32

J8D

F12B

(3.0

)-30

DP

-0.5

V(8

6)

2 4 6 8 10 12 14 16 18 20 22 24 26 28 30

1 3 5 7 9 11 13 15 17 19 21 23 25 27 29

31 32

J21

DF1

2B(3

.0)-

30D

P-0

.5V

(86)

2 4 6 8 10 12 14 16 18 20 22 24 26 28 30

1 3 5 7 9 11 13 15 17 19 21 23 25 27 29

31 32

J22

CO

N15

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

23


Figure 21. DragonBoard VLT Adapter Module

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

DNP

MISO FOR iCE,

MOSI FOR FLASH

MISO FOR iCE,

MOSI FOR FLASH

DNP



SP

I_C

S_1

V8

INTR

V_1

V8

SP

I_C

LK_1

V8

SP

I_M

OS

I_1V

8S

PI_

MIS

O_1

V8

SP

I_C

SS

PI_

MIS

OS

PI_

CLK

SP

I_M

OS

I

VC

C5V

LTIN

TRV

VC

C5V

LT

CR

eset

1V8

GP

IO_C

S_1

V8

CR

eset

3V3

SP

I_M

OS

I_1V

8

VC

CB

VLT

SP

I_C

LK_1

V8

SP

I_M

ISO

_1V

8S

PI_

MIS

OS

PI_

MO

SI

SP

I_C

LKG

PIO

_PR

OC

_CS

GP

IO_P

RO

C_C

SS

PI_

CLK

SP

I_M

ISO

SP

I_M

OS

I

SP

I_C

S_1

V8

CS

CS

GP

IO_C

S_1

V8

CS

VLT

OE

CR

eset

1V8

VC

CB

VLT

SP

I_C

S_1

V8

INTR

V_1

V8

CR

eset

3V3

SP

I_C

SS

PIC

S3V

3IN

TRV

VLT

OE

SP

ICS

3V3

GP

IO_P

RO

C_C

SV

CC

1V8V

VC

C3V

3V

VC

C1V

8V

VC

C1V

8V

VC

C3V

3VV

CC

1V8V

VC

C5V

LT

VC

C1V

8V

VC

C1V

8V

VC

C1V

8V

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U23 74A

VC

4T77

4

DIR

11

DIR

22

A1

3

A2

4

A3

5

A4

6

DIR

37

DIR

48

OE

9G

ND

10B

411

B3

12B

213

B1

14V

CC

B15

VC

CA

16

C84

0.1u

J20

PR

GM

12

C89

0.1u

C88

0.1u

R640

J24

SP

ICS 1

2

C82

10u

R65

DN

P

J26

10p

2mm

2 4 6

1 3 5 78

910

C11

80.

1u

R690

J29

Aar

dvar

k H

eade

r

SS

21

GN

D1

2

SS

33

NC

24

MIS

O5

NC

16

SC

LK7

MO

SI

8

SS

19

GN

D2

10

C80

10u

C85

0.1u

R71

10k

U24

LD11

17-3

V3

GND1

VO

UT

2V

IN3

4

TAB

C86

10u

TP10

+5V

1

R720

C11

90.

1uD

NP

J27

24p

2p54

mm

1 3 5 7 9 11 13 15 17 19 21 23

2 4 6 8 10 12 14 16 18 20 22 24

U29 74A

VC

4T77

4

DIR

11

DIR

22

A1

3

A2

4

A3

5

A4

6

DIR

37

DIR

48

OE

9G

ND

10B

411

B3

12B

213

B1

14V

CC

B15

VC

CA

16

U25

LD11

17-1

V8

GND1

VO

UT

2V

IN3

TAB

4

R70

10k

J28

123

C83

0.1u

C81

10u

U26

SN

74A

UP

1G08

DB

VR

A1

B2

GND3

Y4

VCC5

C87

0.1u

24


Appendix B. Bill of MaterialsItem Reference Quantity Part PCB Footprint Comments Part Number Manufacturer Description

1 BC1 1 Bat connector BATT_009155003301006

— 09155003301006

AVX CONN BATTERY 3 POS RIGHT ANGLE

2 C1,C6,C9,C12,C13,C14,C17,C19,C20,C22,C24,C25,C26,C28,C29,C32,C33,C36,C38,C39,C44,C46,C47,C48,C50,C52,C54,C60,C61,C63,C66,C68,C69,C73,C76,C77,C78,C83,C84,C85,C87,C88,C89,C90,C118

45 0.1 u C0402 — CL05A104MP5NNNC

Samsung CAP CER 0.1UF 10V 20% X5R 0402

3 C2,C5,C51,C55,C56,C57,C59,C62,C67,C72,C74,C79

12 1 u C0402 — CL05A105KP5NNNC

Samsung CAP CER 1UF 10V 10% X5R 0402

4 C3 1 2.2 u C0603 — CC0603ZRY5V6BB225

Yageo CAP CER 2.2UF 10V Y5V 0603

5 C4,C11,C21,C27,C31,C35,C40,C45,C53,C58,C81,C82

12 10 u C0603 — CL10A106MQ8NNNC

Samsung CAP CER 10UF 6.3V 20% X5R 0603

6 C7,C34,C41,C42,C80,C86 6 10 u C0603 — CL10X106MP8NRNC

Samsung CAP CER 10UF 10V 20% X6S 0603

7 C8 1 0.22 u C0603 — CL10B224KO8NNNC


8 C10,C18 2 47 u C3528 — TCJB476M010R0070

AVX CAP TANT 47UF 10V 20% 1210

9 C15,C30,C43,C49 4 4.7 u C0603 — CC0603KRX5R6BB475

Yageo CAP CER 4.7UF 10V 10% X5R 0603

10 C16,C64,C65,C70,C71,C75 6 10 n C0402 — CL05B103KO5NCNC

Samsung CAP CER 10000PF 16V 10% X7R 0402

11 C23,C37 2 27 p C0402 — CL05C270JB5NNNC

Samsung CAP CER 27PF 50V 5% NP0 0402

12 C119 1 0.1 u C0402 DNP CL05A104MP5NNNC


13 D1,D2 2 PMEG2010AEH SOD123F — PMEG2010AEH,115

NXP Semicon-ductor

DIODE SCHOTTKY 20V 1A SOD123F

14 D3 1 LED led0603 — LG L29K-G2J1-24-Z

Osram Opto LED SMARTLED GREEN 570NM 0603

15 D4 1 LED led0603 — LY Q976-P1S2-36

Osram Opto LED CHIPLED 587NM YLW 0603 SMD

16 D5 1 VIS XBDAWT — XBDAWT-00-0000-00000LCE3

Cree Inc LED HIGH BRIGHTNESS

17 D6 1 TVS/VAR R0603 — VC060330A650DP

AVX VARISTOR 36.9V 30A 0603

18 D7 1 IR IRD — VSMB2948SL Vishay IR EMITTER HIGH SPEED 940NM SMD

19 D8 1 BAR LED0805 — APT2012SRCPRV

Kingbright Corp LED 2X1.2MM 640NM RD WTR CLR SMD

20 D9 1 LED led0603 — LG L29K-G2J1-24-Z

Osram Opto LED SMARTLED GREEN 570NM 0603

21 D10 1 LED led0603 — LS Q976-NR-1 Osram Opto LED CHIPLED 633NM RED 0603 SMD

22 D12 1 RGB RGBD DNP AEBMTRGBZ Custom —

23 D13 1 APTF1616SEEZGQBDC

RGBOPT2 — APTF1616SEEZGQBDC

KingbrightCorp LED RED/GREEN/BLUE WTR CLEAR SMD

24 D14 1 RED LED0603 DNP LS L29K-G1J2-1-Z

Osram LED SMARTLED GREEN 570NM 0603

25 J1 1 BSDA TP_TH_40_24_S DNP PCB MDN —

26 J2 1 BSCL TP_TH_40_24_S DNP PCB MDN —

27 J3,J11,J12 3 GND TUR_TH DNP 1573-2 Keystone Elec-tronics

TERMINAL TURRET DBL .082"L

28 J4,J6,J8,J21 4 DF12B(3.0)-30DP-0.5V(86)

HIROSE_DF12B_30_mirror

— DF12B(3.0)-30DP-0.5V(86)

Hirose CONN HEADER 30POS 3MM SMD 0.5MM

29 J5 1 USB PWR CONN_S5P1RMINIUSBB_MOLEX

— 67503-1020 Molex CONN RECEPT MINIUSB R/A 5POS SMD

30 J7 1 KEY HIROSE_DF12B_30

— DF12B(3.0)-30DS-0.5V(86)

Hirose CONN RCPT 30POS 3MM SMD 0.5MM

31 J9 1 HP LED SEL hdr1x3-40_2mm — NRPN031PARN-RC

Sullins Connec-tor Solutions

CONN HEADER 2MM SINGLE R/A 3POS

32 J10 1 CON40A hdr20x2_2mm DNP 0877582016 Molex Inc CONN HEADER 20POS 2MM VERT GOLD

33 J13 1 ASDA TP_TH_40_24_S DNP PCB MDN —

25


34 J14 1 ASCL TP_TH_40_24_S DNP PCB MDN —

35 J15 1 A3-20PA-2SV(71)

hirose_10x2_2mm

— A3-20PA-2SV(71)

Hirose CONN HEADER 20POS 2MM GOLD SMD

36 J16 1 AP INTERCON-NECT

hirose_5x2_2mm — A3-10PA-2SV(71)

Hirose CONN HEADER 10POS 2MM GOLD SMD

37 J17 1 SMA molex_0732511350

DNP 732511350 Molex CONN SMA JACK STR 50 Ohm SMD

38 J18 1 BLE PROG SEL hdr1x3-40_2mm — NRPN031PARN-RC

Sullins Connec-tor Solutions

CONN HEADER 2MM SINGLE R/A 3POS

39 J20 1 PRGM HDR1X2-40 — 77311-801-02LF FCI CONN HEADER .100 SINGL STR 2POS

40 J22,J23 2 CON15 HDR1x15_2mm_TH

DNP PCB MDN —

41 J24 1 SPICS HDR1X2-40 — 77311-801-02LF FCI CONN HEADER .100 SINGL STR 2POS

42 J26 1 10p 2 mm hdr_5x2_2mm — 0877581016 Molex Inc CONN HEADER 10POS 2MM VERT GOLD

43 J27 1 24p 2p 54 mm hdr12x2_TH_2p54_mirror

— M20-7831242 Harwin Inc 12+12 DIL VERT SOCKET L/FREE

44 J28 1 DNP hdr1x3-40 DNP 77311-801-03LF FCI CONN HEADER .100 SINGL STR 3POS

45 J29 1 Aardvark Header hdr5x2 — 77313-801-10LF FCI CONN HEADER .100 SINGL STR 10POS

46 L1,L2,L3 3 600 Ohm, 500 mA

L0603 — MMZ1608R601A TDK Corp FERRITE CHIP 600 Ohm 500MA 0603

47 R1 1 5k6 R0402 — RC1005F562CS Samsung RES 5.6 kOhm 1/16W 1% 0402

48 R2,R4,R6,R7,R8,R11,R29,R33,R34,R43,R49,R61,R62,R63,R70,R71

16 10k R0402 — RC1005J103CS Samsung RES 10 kOhm 1/16W 5% 0402

49 R3,R5,R41,R42 4 4k7 R0402 — RC1005J472CS Samsung RES 4.7 kOhm 1/16W 5% 0402

50 R9 1 DNP R0402 DNP WR04X000PTL Walsin —

51 R10,R38,R46 3 2k2 R0402 — RC1005J222CS Samsung RES 2.2 kOhm 1/16W 5% 0402

52 R12,R13,R35,R40 4 0 R0402 — RC1005J000CS Samsung RES 0.0 Ohm 1/16W JUMP 0402

53 R14 1 150 R0402 — RMCF0402JT150R

Stackpole Elec-tronics

RES 150 Ohm 1/16W 5% 0402

54 R16,R17 2 10 R0402 — RC1005J100CS Samsung RES 10 Ohm 1/16W 5% 0402

55 R18 1 12k R0402 — RC1005F123CS Samsung RES 12 kOhm 1/16W 1% 0402

56 R19,R20,R31,R32,R50 5 1k R0402 — RC1005J102CS Samsung RES 1 kOhm 1/16W 5% 0402

57 R21,R24,R25,R26,R27,R28,R37,R39,R51,R52,R55,R58,R64,R69,R72,R74

16 0 R0402 — RC1005J000CS Samsung RES 0.0 Ohm 1/16W JUMP 0402

58 R22 1 100 R0603 — RC1608J101CS Samsung RES 100 Ohm 1/10W 5% 0603

59 R23 1 470 R0402 — RC1005J471CS Samsung RES 470 Ohm 1/16W 5% 0402

60 R30,R44 2 100 R0402 — RC1005J101CS Samsung RES 100 Ohm 1/16W 5% 0402

61 R45,R47,R48,R67,R68,R75,R76,R77

8 0 R0402 DNP RC1005J000CS Samsung RES 0.0 Ohm 1/16W JUMP 0402

62 R53,R54,R56,R57,R59,R60,R65

7 DNP R0402 DNP RC1005J000CS Samsung RES 0.0 Ohm 1/16W JUMP 0402

63 R66,R73 2 100k R0402 — RC1005J104CS Samsung RES 100 kOhm 1/16W 5% 0402

64 R78 1 820 R0402 — RC1005F821CS Samsung RES SMD 820 Ohm 1% 1/16W 0402

65 SW2 1 PWR EG1218O_switch — EG1218 E-Switch SWITCH SLIDE SPDT 30V.2A PC MNT

66 SW3 1 PB 2psmd_eswitch — TL1015AF160QG

E-Switch SWITCH TACTILE SPST-NO 0.05A 12V

67 TP10 1 +5 V HDR1 — 77311-801-01LF FCI HEADER BERGSTIK

68 U1 1 MC34673AEPR2

8-UDFN — MC34673AEPR2

Freescale Semi-conductor

IC SGL CELL BATTERY CHRGR 8-UDFN

69 U2 1 MIC5335-SJYMT

6TMLF — MIC5335-SJYMT

Micrel IC REG LDO 3.3 V/2.5 V 0.3A 6TMLF

70 U3 1 M25P80 SOIC8-W — M25P80-VMW6G

Numonyx/ST Micro

IC FLASH 8MBIT 75MHZ 8SO

71 U4 1 LSM303DLHC LGA14_LSM303 — LSM303DLHC ST Micro ACCELEROMETER/MAGNETOME-TER 14LGA

72 U5 1 LSM330DLC LGA-28 — LSM330DLC ST Micro ACCELEROMETER/MAGNETOME-TER 28LGA

73 U6 1 93LC56BT-I/OT SOT23-6 — 93LC56BT-I/OT Microchip Tech-nology

IC EEPROM 2KBIT 2MHZ SOT23-6

Item Reference Quantity Part PCB Footprint Comments Part Number Manufacturer Description

26


74 U7 1 LTC4411 TSOT23-5 — LTC4411ES5#TRMPBF

Linear Technol-ogy

IC OR CTRLR SRC SELECT TSOT23-5

75 U8 1 XC6222B331MR-G

SOT25 — XC6222B331MR-G

Torex Semicon-ductor Ltd

IC REG LDO 3.3 V 0.7A SOT25

76 U9 1 FT2232H LQFP64 — FT2232HL FTDI IC USB HS DUAL UART/FIFO 64-LQFP

77 U10 1 AP7312-1218FM-7

AP7312_6DFN — AP7312-1218FM-7

Diodes Inc IC REG LDO 1.2 V/1.8 V 0.15A 6DFN

78 U11 1 TSMP58000 TSOPIRx3P — TSMP58000 Vishay 3 V PH.MODULE S.VIEW

79 U12,U19 2 ADMP441 ADMP441 — INMP441ACEZ Invensense Omnidirectional Microphone with bot-tom port and I2S digital port

80 U13 1 BU52051NVX SSON004X1216 — BU52051NVX ROHM Semicon-ductor

IC LATCH SENSOR BIPO CMOS 4SSON

81 U14 1 SHT20 DFN6 — SHT20 Sensirion Humidity and Temperature Sensor IC

82 U15,U16 2 TMD27711 DFNL8 — TMD27711 AMS-TAOS USA Inc

IC PROXIMITY DETECTOR DGTL 8-MOD

83 U17 1 FPC1080A FPC1080A — FPC1080A Fingerprints Swipe Sensor Package

84 U18 1 MAX44008 OTDFN-6 — MAX44008EDT+ Maxim Inte-grated

IC AMBIENT/PROXIMITY SENS TDFN

85 U20 1 iCE5LP4KSWG36

36WLCSP Customer Supplied

iCE5LP4K-SWG36CTR

Lattice Semicon-ductor

—

86 U21 1 ASFLMB-27.000MHZ-LC-T

osc_5x3p2 — ASFLMB-27.000MHZ-LC-T

ABRACON OSC MEMS 27.000MHZ CMOS SMD

87 U22 1 BMP180 BMP180 — BMP180 Bosch SENSOR PRESSURE ABS

88 U23,U29 2 74AVC4T774 16TSSOP — SN74AVC4T774PWR

Texas Instru-ments

IC BUS TRANSCVR 4BIT DL 16TSSOP

89 U24 1 LD1117-3V3 sot223_ns — LD1117S33CTR ST Micro IC REG LDO 3.3 V 0.8A SOT223

90 U25 1 LD1117-1V8 SOT223_NS — LD1117AS18 ST Micro IC REG LDO 1.8 V 1A SOT223

91 U26 1 SN74AUP1G08DBVR

SOT23-5 DNP SN74AUP1G08DBVR

Texas Instru-ments

IC GATE AND 1CH 2-INP SOT-23-5

92 U30 1 SeeedBLE SeeedBLE — 113050012 Seeed Low cost ARM cortex-m0 based mod-ule for Bluetooth module

93 Y1 1 12 MHz 5x3p2mm2p — ABM3-12.000MHZ-B2-T

Abracon Corp CRYSTAL 12MHZ 18PF SMD

94 iCE40 Ultra MDP BOARD PCB 1 — — — 305-PD-15-0056 PACTRON —

BAG and TAG

Item Reference Qty Part PCB Footprint Comments PART_NUMBER Manufacturer Description

1 Battery 1 Li-ion Battery Battery unit - BL-5C Nokia From Amazon or other Nokia vendor

2 Plastic Enclosure 1 Plastic enclosure Plastic Enclosure Customer Supplied

Enclosure / full housing set used for Nokia 1110 **

Nokia or OEM From ebay or other Nokia accessory vendor ** see note in comments

3 SPI cable assembly 1 SPI cable assembly

SPI cable assem-bly

Customer Supplied

Custom made or Samtech part # TCSD-05-D-06.00-01-N

Custom made or equivalent Sam-tec Inc

2 mm pitch, dual row, 5x2 FRC / IDC female terminated, 15 cms ribbon cable

4 Fasteners / screws 2 PCB-Plastic fas-tening screws

PCB-Plastic fas-tening screws

BAG and TAG

SMPPS0003 - #0 x 3/16 - Pan Head Sheet Metal Screws – Phillips

Micro Fasteners SMPPS0003 - #0 x 3/16 - Pan Head Sheet Metal Screws – Phillips

5 2 mm jumper shunts for J15 7 2 mm jumper shunts for J16

2 mm jumper shunts for J17

BAG and TAG

SPN02SYBN-RC

Sullins 2 mm jumper shunts for J15

6 2 mm jumper shunts with grip for J15 & J9, J18

3 2 mm jumper shunts with grip for J15 and J10

2 mm jumper shunts with grip for J15 and J11

BAG and TAG

NPN02SXLN-RC

Sullins 2 mm jumper shunts with grip for J15 & J9

7 2.54 mm jumper shunt for J20 1 2.54 mm jumper shunt for J21

2.54 mm jumper shunt for J22

BAG and TAG

STC02SYAN Sullins 2.54 mm jumper shunt for J20

8 Jumper / Flywire for DB +5 V 1 Jumper / Flywire for DB +5 V

4” Jumper / Fly-wire for DB +5 V

Customer Supplied

— Custom made or equivalent

One side bare wire (28 or 26 AWG), one side female header (single socket, for 2.54 pitch type header)

Item Reference Quantity Part PCB Footprint Comments Part Number Manufacturer Description

Documents

iCE40 Ultra™ Mobile Development Platform User …...2 iCE40 Ultra Mobile Development Platform User Guide Introduction This platform is designed to develop and demonstrate various