How Do i Plan to Power My Fpga

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    How Do I Plan to Power My FPGA?

    Xilinx Training

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    Objectives

    After completing this module, you will be able to:

    Explain how static power is different from dynamic power

    Describe the impact a smaller device geometry has on static

    power consumption

    Define the relationship between leakage current and junction

    temperature

    Describe some of the device data sheet information that pertains

    to power consumption

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    Total Power = Static + Dynamic

    Once the device has powered up, there are two maincomponents to power consumption

    Static power

    Primarily transistor leakage current

    Source to Drain leakage IS D Gate to substrate leakage IGATE

    Some current from special circuits (DCM, etc)

    Dynamic power

    Switching in the FPGA core and I/O

    Determined by CV2f node capacitance,

    supply voltage

    switching frequency

    source drain

    gate

    IGATE

    IS

    D

    Buf Buf

    C

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    The Industry Trend in Leakage Current

    New Technologies Smallertransistor length Higher IS D

    Faster transistors (lower Vt )Smaller Gate Oxide thicknessHigher (IGATE)

    The total leakage for alltransistors in the device

    ICCINTQ = IS D + IGATE

    Even when the device is notdoing a task it still draws somepower

    This leads to the development ofnew features such as Suspend andHibernate mode

    Smaller process geometrieslead to higher static power

    Low

    VT

    Regular VT

    220 180 150 130 90 75 650.1

    1

    10

    100

    100

    0

    Transistor Ileakage

    Trend

    Ileakage

    (nA/um)

    Technology Node

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    Properties of Leakage Current

    Junction Temp

    C

    LeakageCurrent

    0 20 40 60 80 100 120 140-20-40

    25 C

    50 C

    85 C

    100 C

    ICCINTQJunctionTemperature

    (TJC)

    Normalized

    ICCINTQTypical

    25 1.00

    50 1.46

    85 2.50

    100 3.14

    Leakage current increases dramatically with Junction

    Temperature

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    Data Sheet Specifications

    Iccintq, Iccoq, Iccauxq These are the bare minimum currents (quiescent) required for

    your power supply to operate the device Does not guarantee that your design is going to work, just that

    this is the minimum current

    Dynamic power requirements will increase the requiredcurrent during operation

    Refer to the Spartan-6 FPGA Data Sheet or the Virtex-6FPGA Data Sheet

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    Data Sheet Specifications

    Power-On requirements are greater than the operating

    current requirements These are the bare minimum currents (quiescent) required for

    your power supply to power up the device This is used for picking out a sufficient power supply

    Does not guarantee that your design is going to work, just thatthe device will configure

    Refer to the Spartan-6 FPGA Data Sheet or the Virtex-6FPGA Data Sheet

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    Design-Dependent Power

    It is up to the user to plan on how much current their systemcan use This is dependent on the design, FPGA, and other devices used in

    your system

    It is also up to you to anticipate how much your worst case

    power consumption might be Xilinx provides descriptions of the current draw your

    FPGA might have at power-up, during minimal operation,but not for worst-case conditions Too much is design dependent (resources used, clock

    frequency, etc.)

    To get the best power estimate we offer a couple of powerestimation tools Please refer to the Power Estimation Video for more information

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    Estimating Power Consumption

    Power calculations can be performed at three distinct phases of

    the design cycle

    Concept phase: A rough estimate of power can be calculated based on

    estimates of logic capacity and activity rates

    Use the Xilinx Power Estimator spreadsheet Design phase: Power can be calculated more accurately based on detailed

    information about how the design is implemented in the FPGA

    Use the XPower Analyzer

    System Integration phase: Power is calculated in a lab environment

    Use actual instrumentation

    Accurate power calculation at an early stage in the design cycle

    will result in fewer problems later

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    Summary

    Static power is dependent on the transistor leakage current

    Dynamic power is dependent on the switching of the logic in the

    CLB array and IOB resources

    Smaller device geometry increases the static power consumption

    of all devices

    Newer devices have a higher static power consumption

    An increase in junction temperature dramatically increases the

    leakage current and your static power

    The minimum current required to operate and configure theFPGA is provided in your FPGAs data sheet

    But the best way to estimate your power consumption is with either the

    Xilinx Power Estimator spreadsheet or the XPower Analyzer utility

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    Where Can I Learn More?

    Xilinx online documents

    www.support.xilinx.com

    Spartan-6 FPGA Power Management User Guide, UG394

    Introduces the Suspend and Hibernate modes

    Describes the necessary voltage supplies

    Introduces the low-power (-1L) devices

    Describes the Power-On and Power-Down behavior

    Power Estimation options are discussed

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    Where Can I Learn More?

    Xilinx Education Services courseswww.xilinx.com/training

    Designing with Spartan-6 and Virtex-6 Device Families course

    How to get the most out of both device families

    How to build the best HDL code for your FPGA design

    How to optimize your design for Spartan-6 and/or Virtex-6

    How to take advantage of the newest device features

    Free Video Based Training How Do I Plan to Power My FPGA?

    Power Estimation

    What are the Spartan-6 Power Management Features?

    What are the Virtex-6 Power Management Features?

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