Herbert Reichl (Editor)

MICRO SYSTEM Technologies 90 1st International Conference on Micro Electro, Opto, Mechanic Systems and Components Berlin, 10-13 September 1990

With 642 Figures

Springer-Verlag Berlin Heidelberg New York London Paris Tokyo Hong Kong Barcelona

Prof. Dr.-Ing. Herbert Reichl Technische Universitat Berlin Forschungsschwerpunkt Technologie der Mikroperipherik Einsteinufer 17 1000 Berlin 10

Organized by

AMKBerlin Ausstellungs-Messe-Kongref3 GmbH

MESAGO Messe & Kongref3 GmbH Stuttgart

This event is supported by the West-Berlin Senat, Dept. for Economics

ISBN 978-3-642-45680-0 ISBN 978-3-642-45678-7 (eBook) DOl 10.1007/978-3-642-45678-7

This work is subject to copyright. All rights are reserved, whether the whole or part of the material is concerned, specifically those of translation, reprinting, re-use of illustrations, recitation, broadcasti ng, reproduction on microfilms orin otherways,and storage in data banks. Duplication ofthis publication or parts thereof is only permitted under the provisions of the German Copyright Law ofSeptember9, 1965, in its current version and a copyright fee must always be paid. Violations fall under the prosecu­tion act of the German Copyright Law.

© Springer-Verlag Berlin Heidelberg 1990 Softcover reprint of the hardcover 1 st edition 1990

The use of registered names, trademarks, etc. in this pUblication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use.

2161/3020-5432\0 - Printed on acid-free paper

Prof. Dr.-Ing. Herbert Reichl Technische Universitat Berlin Forschungsschwerpunkt Technologie der Mikroperipherik Einsteinufer 17 1000 Berlin 10

Organized by

AMKBerlin Ausstellungs-Messe-Kongref3 GmbH

MESAGO Messe & Kongref3 GmbH Stuttgart

This event is supported by the West-Berlin Senat, Dept. for Economics

ISBN 978-3-642-45680-0 ISBN 978-3-642-45678-7 (eBook) DOl 10.1007/978-3-642-45678-7

This work is subject to copyright. All rights are reserved, whether the whole or part of the material is concerned, specifically those of translation, reprinting, re-use of illustrations, recitation, broadcasti ng, reproduction on microfilms orin otherways,and storage in data banks. Duplication ofthis publication or parts thereof is only permitted under the provisions of the German Copyright Law ofSeptember9, 1965, in its current version and a copyright fee must always be paid. Violations fall under the prosecu­tion act of the German Copyright Law.

© Springer-Verlag Berlin Heidelberg 1990 Softcover reprint of the hardcover 1 st edition 1990

The use of registered names, trademarks, etc. in this pUblication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use.

2161/3020-5432\0 - Printed on acid-free paper

Preface

On September 10-13, 1990, the first international meeting on Microsystem Technologies takes place at the Berlin International Congress Center.

Most of the traditional congresses deal with themes that become more and more specific, and only a small part of the scientific world is reflected.

The Micro System Technologies is attempting to take the opposite direction: During the last two decades the development of microelectronics was characterized by a tremendous increase of complexity of integrated circuits. At the same time the fields of microoptics and micromechanics have been developed to an advanced state of the art by the application of thin film and semiconductor technologies.

The trend of the future development is to increase the integration density by combining the microelectronic, microoptic, and micro mechanic aspects to new complex multifunctional systems, which are able to comprise sensors, actuators, analogue and digital circuits on the same chip or on multichip-modules.

Microsystems will lead to extensions of the field of microelectronic applications with important technical alterations and can open new considerable markets.

For the realization of economical solutions for microsystems a lot of interdisciplinary cooperation and know-how has to be developed.

New materials for sensitive layers, substrates, conducting, semiconducting, or isolating thin films are the basis for the development of new technologies.

The increasing complexity leads to increasing interaction among electrical and non-electrical quantities.

New CAD and simulation tools are to be developed, which are able to take into account thermal, electrical and mechanical properties of the device. Design for reliability and testing becomes an important part of the technological evolution.

I thank all the authors from 15 countries in Europe, USA and Asia for their contributions, the members of the steering committee for their cooperation, the organizers, AMK Berlin and MESAGO Europe, for their engagement and the local organizing committee for doing the hard work of organizing the conference. In the name of all of them I wish you a successful congress.

September 1990 Herbert Reichl

General Chairman

H. Reichl Technische Universitat Berlin

Technical Programme Chairmen

C. Baack Heinrich-Hertz-Institut Berlin A. Heuberger FhG IMT Berlin E. Obermeier Technische Universitat Berlin

Steering Committee

H. DeMan M. Esashi B. Freund W. Kroy W.H.Ko K. Kurzweil J.P. Lazarri C.R. Lowe H. Luginbuhl H. Melchior S. Middelhoek H.Ohnsorge A. Paoletti H.-J. Queisser M. Sage D. Seipler H. Smith S. Sugiyama K.D. Wise H. Wurmus

IMEC Leuven Tohoku University Siemens AG Munich MBB GmbH Munich Case Western Reserve University Bull Les-Clayes-Sous-Bois LETI Grenoble University of Cambridge CSEM Neuchatel ETH ZOrich Delft University of Technology SEL AG Stuttgart Universita degli Studi di Rana MPI Stuttgart BPA Ltd Surrey Robert Bosch GmbH Reutlingen MIT Cambridge Toyota Inc. Aichi-ken University of Michigan, Ann Arbor Technische Hochschule IImenau

Local Organizing Committee

W. Germany

W. Germany W. Germany W. Germany

Belgium Japan W. Germany W. Germany USA France France England Switzerland Switzerland Netherlands W. Germany Italy W. Germany England W. Germany USA Japan USA E. Germany

H. Reichl W.Tornow H.J. Griese G. Zimmer H.-P. Nolting W.D6ldissen W. Benecke S. Jakob

Technische Universitat Berlin Technische Universitat Berlin Technische Universitat Berlin Technische Universitat Berlin Heinrich-Hertz-Institut Berlin Heinrich-Hertz-Institut Berlin FhG IMT Berlin FhG IMT Berlin

Table of Contents

Simulation and Design

Design of Micro Systems

Microsystems : a challenge for CAD development (Plenary Talk) De Man, Hugo. . . . . . • . . . • • . • . • . . . • . . • • . . . . . . . . . • . . . . . . . 3

A specification driven environment for microsystem design (Invited Paper) MOiler-Glaser, Klaus D.; Rauch, H.; Wolz, W.; Bortolazzi, J.; Kuntzsch, C.; Zippelius, R. . . . . • . . . . . . • . . . • . • • . . . • . . . . . . . . . . . 9

Conceptual design of micro-electro-mechanical systems Crary, Selden; Kota, Sridhar. • • • . . . . . • . . . • . . • . . . • • • . . . . . . . .. 17

Intelligent CAD for micro mechanics Amster, Richard; Tavrow, Lee S.; Flynn, Anita M.. • . . • • . • . • • . . • . . . .. 23

CAD of Optical Devices

Computer aided engineering for microsystems - status and trends (Plenary Talk) Marz, Reinhard. • . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Numerical simulation of optical devices Weinert, C.M.; Nolting, H.-P .. .•••..........•................ 38

CAD-tool for integrated optic coupling gratings Sychugov, V.A.; Tishchenko, A. V.; Klimov, M.S.; Parriaux, 0 .. ........... 44

Simulation on lateral detector - optical waveguide coupling Kapser, K.; Deimel, P.P. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 52

Simulation and Design - Electrical and Thermal Properties

Electrical connections through silicon wafer: application to 3D-multichip modules (Invited Paper) Nicolas, Gerard; Dupeux, T. . . . . . • . . • . . • . . . . • . . . . . . . . . . . . . .. 61

Design methods for multichip systems (Invited Paper) DOmcke, Rolf. . . . . • . . . . . . • . . . . . . . • • . . . . . . . . . . . . . . . . . . . 71

A fully-automatic macro modeling procedure for the electrical simulation of integrated circuits Turchetti, C.; V.-Kovacs, Zs.M.; Masetti, G.; Conti, M .................. 79

KOSIM - a multi-level simulator for the design of integrated circuits Schwarz, Peter. . . • . . . • • . . • . . . • . . . • • . . . . . . . . . . . . . . . . . . . 85

Waveform estimation and hazard detection in digital MOS circuits Sass, D.; Warmers, H.; Horneber, E.-H. • • . . . • . . . . . • . . . . . . . . • . . .. 91

Modelling of interconnects by boundary element method Wlodarczyk, W . •...•.••..•.....••.•..•..•.............. 97

VIII

Thermal analysis of integrated circuits Rudolph, H.; Seitzer, Dieter . .•.....•.•..................... 103

Sensitivity analysis in thermal wave measurement Wiedemann, Martin. . . . . . . . . . . . . . . . . . . . • . . . . . . . . . . . . . .. 109

Simulation and Design of Sensors

Design and simulation of sensors (Invited Paper) Baltes, Henry. . • • • • . • • . . • • . • . • • . • . . • . . . . • • • . . . . . . . . .. 117

Finite-element simulation of silicon accelerometers Moser, David; Sigg, Paulo; Ansermet, Stephane; Baltes, Henry. . . . • . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 125

Accelerometer design considerations Dunn, William C.. • . . • . . • . . • • . • . . • . . • . • • . . • . . • . . . . . . . .. 131

Measurement and Testing

Testing

Development of a thermal test chip Helm, Jan. . . . . . . . . . . . . . . . . . . . . . . . . . . . • . . . . . . . . . . . .. 139 Infrared microscopy - contactless temperature measurement on miniaturized electronic components Wallin, Bo. • . • • . . • . . . . . • • . • . . . • . . . . . . . • . . . . . . . . . . . .. 146

Highly sensitive strain sensor for the qualification of epoxy compounds designed for the encapsulation of microsystems Weidner, Hermann; Borner, H.; Villain, J.. . . . . . . . . . . . . . . . . . . . . . . . 153

Material Characterization· Physical Properties

Mechanical reliability of electronic devices Kawai, S.; Nishimura, A.; Kitano, M.; Shimizu, T.. . . . . . . . . . . . . . . . . .. 161

Measurement of internal stress in thin silicon membranes BOttgenbach, S.; Engelhardt, W.; Kulcke, W. . . . . . . . • . . . . . . . . . . . .. 177

Measurement of the thermal diffusivity of electrically nonconducting substrates Drost, A; Hemmetzberger, D.; Emmer, J.. . . . . . . . . . . . . . . . . . . • . .. 183

Characterization of supersmooth surfaces with roughness below 0.1 nm Schmitt, Dirk-Roger. . . . . . . . . . • . • • . . . . . . . . • • . . • . . . . . . . .. 190

Material Characterization· Semiconductor Characteristics

Non-destructive testing of semiconductor materials using microwave photoconductivity Betz, G.; Ploschies, R.; Walk, Ch.; Winter, Ch.; Valldorf. J •. ............ 199

Electrical characterization of IIIN materials for heterostructure devices Bach, H.G .. •...•.•.•...•.......•••••..•.....•....... 205

IX

Material Characterization· Optical Methods

Assessment of III-V epitaxial layers by optical methods Sartorius, B .. ........................................ 213

Ellipsometry for process control in reaktive ion etching MOiler, Roland. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 219

Thin film ellipsometric measurements - a tool for research and production Tamme, M.; Kamifli, R.; Paduschek, P.; StadtmOller, M .•.•..•......... 225

High precision non-contacting metrology based on short coherence interferometry Jones, Robert; Hazell, M.S.; Welford, R .. ....................... 231

VIS-IR-ellipsometry for control and characterization of thin film processes Doi, Bui Dang; Hammann, K.; Roseler, A.; Schneider, U.; Schwiecker, H.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 238

Materials

Materials for Packaging and Passivation

Deposition, patterning, properties, and applications of AI20 3 films Burghardt, H.; Cebulla, H.; Leimbrock, W.; Leyffer, W.; Thess, D.; Drescher, K .. ........................................ 247

PECVD-passivation layers for printheads in micro-syste m-tech nology Unger, E.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 255

Hybrid integrated circuits on polycrystalline aluminium nitride Philippov, Philip; Nicolov, N.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 261

High performance resin system for printed circuit boards Huber, J.; Wilhelm, D. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 267

Z-axis conductive, stress free, thermally conductive adhesive films and pastes for die- and component attach Chung, Kevin K. T.; Dreier, Garrett; Avery, Eldon; Boyle, Andy; Koehn, William; Govaert, Guido; Theunissen, Dirk. . . . . . . . . . . . . . . . . . 273

Integrated Optics Materials and Technologies

Integrated optics in silicon SchOppert, Bernd; Schmidtchen, J.; Splett, A.; Petermann, K. . ......... , 277

Integrated optics on silicon with PECVD-fabricated waveguides Bezzaoui, Hocine; Baus, Andreas; Voges, Edgar . .................. 283

Polymer waveguides in integrated optics Keil, N.; Strebel, B.; Yao, H.H.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 289

x

Technologies

Pattern Generation and Image Transfer

Aspects of patterning inorganic-organic copolymers (ORMOCERs) Popall, Michael; Meyer, H.; Schulz, J . .......................... 297

Photopatternable layers from amorphous, diamond-like carbon - an innovative material for microsystems technology Hammerschmidt, A; Birkfe, S.; Kammermaier, J.; Leuschner, R.; Schmidt, w.; Schulte, R.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 307

Submicrometer photolithography by surface imaging -experiments and simulation Bauch, L.; Jagdhold, U.; Hoppner, w.; Bauer, J.; Klabes, R.; MehfiB, G.; Abraham, W .. ................................ 313

X-ray imaging system Weaver, H. Joseph; Sommargren, Gary E.. . . . . . . . . . . . . . . . . . . . . . . 319

Laser Supported Deposition

Laser induced gold deposition on polyimide layers Metzger, Dieter; Paredes, Alvaro; Kruck, Thomas; Reichl, Herbert. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 325

Selective pattern deposition of Sn02 thin film by laser pyrolysis Zhang, Bingfin; Wenlou, Wei. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 330

Plane surface embedding technique for thin film hybrids MOfler, Heinrich G.; Jassim, Kahtan; Buschick, Klaus; Reichl, Herbert. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 335

Pulsed laser-plasma deposition of polycomponent thin-film structures - a review Metev, S.. . . . . . . . . . . . . . . . . . . . . • . . . . . . . . . . . . . . . . ..... 341

Laser-induced chemical vapour deposition of thin films in microelectronics Reisse, G.; Gansicke, F.; Fischer, A; Zimmer, K.; Zscherpe, G. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 348

Reactive Etching and Deposition

Plasma-assisted etching (Invited Paper) Mader, H.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 357

Reactive etching with ECR plasma source Castrischer, G.; Kretschmer, K.-H.; Lorenz, G.; Kessler, I.. . . . . . . . . . . .. 366

Production of resist masks by means of RIE Hefler, G.; Richter, K.; Kandler, E.; GOntzel A ..................... 372

Contact Methods

A new explanation for the degradation of gold-aluminium bonds

XI

Haag, Jo Frieder 0 0 0 ••••• 0 •••• 0 • • • ••• 0 • • 0 •• 0 • 0 ••• 0 • • • • 0 381

Simulation of the inner lead bonding process Eberle, Arno. . . . ........ 0 • • 0 • • 0 • 0 0 0 0 • • 0 0 • 0 0 0 0 0 0 0 0 0 0 0 0 389

The application of an eutectic Gold-Tin cushion for TAB-inner lead bonding with reduced bonding pressure Zakel, Elke; Schuler, Siegfried; Simon, JOrgen. . . . • . . 0 • 0 • 0 0 0 • 0 0 • o' 400

Bonding techniques on microsystem in cryogenics and microelectronic engineering Howitz, St.; Gerber, Dietrich 0 •••••• 0 •••••••••• 0 ••• 0 • 0 0 0 0 0 • 0 407

Laser soldering of TAB inner lead bonds Azdasht, Ghassem; Zakel, Elke; Reichl, Herbert . ..... 0 •• 0 0 0 0 0 • 0 0 0 0 413

Packaging

Solderable bumps for TAB and flip-chip bonding (Invited Paper) Drescher, Kurt 0 • • 0 0 0 0 0 0 0 0 • 0 • 0 0 0 0 • 0 0 0 • 0 • 0 0 0 0 0 0 0 0 0 0 • 0 0 0 421

Electroless bumping Simon, JOrgen; Zakel, Elke 0 0 0 • 0 0 • 0 • 0 0 • 0 • 0 0 • 0 0 0 0 • 0 0 0 0 0 0 0 0 0 0 423

Hybridization of cooled mosaic sensors by indium-bumps PlOtner, Mathias; Blasek, Go; Sadowski, Go; Rzepka, So 0 0 0 0 0 0 0 0 0 0 • 0 0 0 0 429

Development of a fine pitch bumping process Engelmann, Gunter; Ehrmann, Oswin; Simon, JOrgen, Reichl, Herbert 0 0 0 0 0 0 • 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 • 435

Tape automated bonding for high-density electronic packaging Plite, Gerard Jo. 0 0 0 0 0 0 0 • 0 0 0 0 • • • 0 0 0 •• 0 • 0 0 0 0 0 0 0 0 • 0 0 0 0 0 o. 441

Adhesiveless copper-polyimide laminates for TAB's Fronz, Viktor 0 0 0 • 0 • 0 • 0 • 0 0 0 • 0 0 • 0 0 0 0 0 • 0 • • 0 0 0 0 0 0 0 0 0 0 0 0 0 0 • 447

Optical Assembly and Interconnection Technologies

Application of micro machining and micromechanics to components for optical communication (Invited Paper) Hillerich, Bernd 0 0 0 • 0 0 0 • 0 0 0 0 0 • 0 •• 0 0 0 0 • • 0 0 0 0 • 0 0 0 • 0 0 0 0 0 0 0 457

Thermal tunable minimized semiconductor laser-module GroBmann, E; Hilbk, Uo; Peters, K. 0 0 0 •• 0 0 0 0 • 0 •• 0 0 • 0 0 0 0 0 0 0 0 0 0 • 465

Micro collimated light source using micro fresnel lens Goto, Hiroshi; Ito, Yoshinori; Sekii, Hiroshi; Ogata, Shiro; Imanaka, Koichi 0 0 0 0 0 0 0 0 0 •• 0 0 • 0 0 • 0 • 0 0 • 0 • 0 0 0 •• 0 0 0 0 • 0 0 • 0 0 471

Monomode fused optical system elements Lochmann, S; Labs, JOrgen Mo; Thiel, A; Lang, K.D. 0 0 •• 0 0 0 0 0 • 0 0 0 0 0 • 0 477

XII

Sensor and Actuator Technologies

Sensor packaging (Invited Paper) Esashi, Masayoshi. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 495

A method for thermal insulation of microstructures Stoev, I.; Bogdanova, N.. • . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 503

Machining of metal foils for use in microcompact heat exchangers Friedrich, Craig R.; Warrington, Robert 0.. . . . . . . . . . . . . . . . . . . . . . . 509

Novel stress free assembly technique for micromechanical devices Offereins, H.L.; Sandmaier, H.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 515

The LlGA process for microsystems (Invited Paper) Ehrfeld, Wolfgang. . . . . . . • . . . . . . . . • . . . . . . . . . . . . . . . . . . .. 521

Movable microstructures manufactured by the LlGA process as basic elements for microsystems Mohr, J.; Burbaum, C.; Bley, P.; Menz, Wolfgang; Wallrabe, U.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 529

Ion beam techniques for micro electro mechanical systems (Invited Paper) Kuwano, Hiroki. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 538

A novel mask compensation pattern for etched microstructures with several convex corners Gerlach, Gerald. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 545

Wafer bonding and etch back techniques for silicon-on-insulator systems Harencit, Christine; Appel, Wolfgang; Graf, Heinz-Gerd; H6fflinger, Bernd; Penteker, Elisabeth. . . . . . . . . . . . . . . . . . . . . . . .. 551

Basic Components and Applications

Sensors for Physical Parameters

Silicon microsystems as an industry (Invited Paper) Knutti, James W.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 559

Micromachined silicon devices integrated with standard IC processes RiethmOller, w.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 562

Design of an integrated humidity sensor with digital output in double metal CMOS technology Boltshauser, Thomas; Charbon, Edoardo; Baltes, Henry. . . . . . . . . . . . .. 568

CMOS compatible capacitive pressure sensor with read-out electronics Kandler, Michael; Eichholz, J6rg; Manoli, Yiannos; Mokwa, Wilfried. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 574

Piezoresistive pressure sensors representing the 2nd generation avoid the physical limits based on conventional designs Sandmaier, H.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ... 581

High performance miniaturized piezoresistive pressure transducers

XIII

Whittier, Robert M.. . • . • . • • • . . . • . . . . • • • • . • . . • . . . • . . . • . . . 587

Fully integrated silicon pressure sensor with on-chip CMOS evaluation circuit and on-chip trimming Kress, H.-J.; Bantien, F.; Marek, J.; Willmann, M .• ••••••.•••••..•..• 593

Optimization of bipolar magneto-transistors Kaneko, H.; Muro, H.; French, P.J.. • . • • • . . . . . . • • . . . . . • . . . . . .. 599

Silicon RF power sensor from DC to microwave Kopystynski, P.; Obermeier, E; Delfs, H.; Hohenester, w.; Loser, A.. • . . . . • . . • . • • . . . . • • • • . • . • • • • • . . • . . • . . . . . • . . 605

Self-testable accelerometer microsystem Terry, Stephen C.; Bruin, Diederik W. de; Allen, Henry V . .............. 611

Micromechanical capacitive acceleration sensor with force compensation Schlaak, H.F.; Amdt, F.; Steckenbom, A; Gevatter, H.J.; Kiesewetter, L.; Grethen, H.. . • • . . • . . . • . • . . . . . . . . . . . . . . . . .. 617

Capacitive accelerometer made by silicon micromechanics Gerlach-Meyer, U.E.. . . . . . . . . . . . . . . . . . . . • . . . . . . . . . . . . . . . 623

Micromechanical acceleration sensor Breng, U.; GeBner, T.; Lorenz, P.; Rauch, M.; Leyf/er, W.; Dittmann, M.; Kuttner, B.; Schwenzer, G.; Wetzel, M.; Zichner, N. . • . . . . . . . • . . . • . . • . . . • . . . . . . ..•............ 629

CMOS readout electronics for capacitive acceleration sensors Buckhorst, Rolf; Hosticka, Bedrich J.; Seidel, Helmut. . . . . . . . . . . . . . .. 636

Gas and Ionic Sensors

Development of basic structures for integrated chemical sensors for S02 and NH3 Lin, J.; Moller, S.; Obermeier, E .. ....•.....••......•......... 645

Technology and application of suspended gate field effect transistors for gas detection Lorenz, H.; Peschke, M.; Riess, H.; Eisele, I. . • . . . . . • . . . . . . . . . . • .. 651

Preparation of Ti02 films for oxygen sensors Fischer, D.; Koppen, H .. •..•..•.....••.••....•..•.•...... 657

Solid state chemical sensors in thick film technique Chu, W.F.; Erdmann, H.; IIgenstein, M.; Leonhard, V. . . . • . • • • . . . . . . .. 663

Ionic sensor layers on microelectronic structures for the detection of solvent vapours Dickert, F.L.; Bertlein, G.; Reif, K.; Mages, G.; Kimmel, H.. . . . . . . . . . . .. 669

An integrated ISFET-sensorarray with a CMOS signal-processing circuit Miiller, Eckart; Koch, S.; Woias, P.. . • . . . . • . . • . . • • • . • . . . • . . • .. 675

CVD-AI20 3-layers: applicability in sensor devices Rober, J.; Erben, E; Cebulla, H . .•..••••.••••..•..•.......... 681

XIV

Sensors for Biological and Medical Application

Biochemical sensors for microsystems (Plenary Talk) Scheller, F. W.; Hintsche, R.; Wollenberger, U.. . . . . . . . . . . . . . . . . . " 687

Miniaturised thin-film biosensors (Invited Paper) Pittner, Fritz; Schalkhammer, T.; Mann-Buxbaum, E.; Urban, G. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 699

Chip-biosensors - integration of bioactive components with transducers made in silicon technology Hintsche, Rainer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 706

Smart silicon system for a multi sensor catheter Manoli, Yiannos; Eichholz, Jorg; Kandler, Michael; Kordas, Norbert; Langerbein, Anke; Mokwa, Wilfried . ................ 710

A digital output monolithic temperature sensor for invasive applications Kordas, Norbert; Eichholz, Jorg; Langerbein, Anke; Manoli, Yiannos; Mokwa, Wilfried. . . . . • . . . . . . . . . . . -' . . . . . . . . .. 716

Optical Sensors

New nanomechanical integrated optical devices as modulators, switches, and microphones; integrated optical (bio-)chemical sensors (Invited Paper) Lukosz, W .. ......................................... 725

High resolution interferometric displacement sensor using integrated optics in glass Jestel, D.; Baus, A.; Voges, E. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 733

Integrated optical devices in LiNbOa for sensors Konz, W .. .......................................... 739

Optical Components

Optoelectronic components and modules for multigigabitls fibre optic transmission Spalthoff, Ulrich. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 749

Elements for integrated optics coherent receiver networks Heidrich, H.; Hoffmann, D.; Nolting, H.-P.; Schlak, M.; Weinert, C.M.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 755

Wavelength division multiplexers for optical communication systems Bornholdt, C.; Kappe, F.; Nolting, H.-P.; Stenzel, R.; Venghaus, H.; Weinert, C.M.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 761

Pin photodiodes and field-effect transistors for monolithically integrated InP/lnGaAs optoelectronic circuits Albrecht, H.. . . . • . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 767

Semiconductor laser amplifiers as multifunctional devices Weber, H.G.; GroBkopf, G.; Ludwig, R.; Schnabel, R.; Schunk, N.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 773

Fiber optical amplifiers: technology and system applications Veith, Gustav. . • . . • . . . . . • . . . . . . • • • • . • . . • • . • . • . . . . . . .. 779

Integrated optic polarimetric refractometer Voirin, G.; Debergh, P.; Parriaux, 0.; Zogmal, 0.. . . • . . . . . . . . . . . . . . . 785

Actuators

Integrated fluid control systems on a silicon wafer (Invited Paper) Nakagawa, Shigeru; Shoji, Shuichi; Esashi, Masayoshi. • . • • . • . . • . . • .. 793

Micro liquid-handling devices - a review Pol, F.C.M. van de,· Branebjerg, J . .•.......•••.•..•.....•..... 799

Electrically-activated, micromachined diaphragm valves Jerman, J.HaI. • • . • • . • • . . • • • • • . . • • . • . • . • • . • • . . . . . . . . • . 806 An electro hydrodynamic injection pump - a novel actuator for microsystem technology Richter, Axel; Sandmaier, Hermann; Plettner, Andreas. . . . • . • . . . . . . .. 812

Electrostatic and superconducting microactuators (Invited Paper) Fujita, Hiroyuki. . . . . . . . . • . . • . . • • . • . . • . . . . . . . . . . . • . • . .. 818

Levitational bearing systems by meissner effect Kitamura, Tadashi; Komori, Mochimitsu. . . . . • . . . . . . . . . . . . . . . . .. 826 Rotational behaviour of living cells with reference to micro-motors Fuhr, G.; Hagedom, R.; Gimsa, J . ............................ 832

Magnetically driven microactuators: design considerations Wagner, B.; Benecke, W. . . . . . . . . . . . . • . . . . . . . • . . . . . . . . . . . . 838

Development of micro grippers Ando, Yasuhisa,· Sawada, H.; Okazaki, Y.; Ishikawa, Y.; Kitahara, T.; Tatsue, Y.; Furuta, K.. . . . . . . . . . . • . . . . . . . . . . . . . .. 844

Micro-actuator for micro-particles Nishimura, Kunitoshi. • . . . . . • . . . . . . . . . . . . . . • . . • . . . . . . . . . . 850

Author Index. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 856