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1. Introduction Henkel
2. Trends in Printed Electronics
3. Novel materials enabling Printed Electronics
New high speed printable silver inks with very high conductivity
New water based carbon ink for high speed printing
New material set for 3D formed, in-molded electronics
4. Conclusions
Agenda
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Adhesive TechnologiesCosmetics / Toiletries
Three Areas of CompetenceA global leader in Brands and Technologies
Laundry and Home Care
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Adhesive TechnologiesFive market driven business segments
AI
Packaging and
Consumer
Goods
AE
Electronics
AG
General Industry
AT
Transport and Metal
AC
Consumer, Craftsmen
and Building
Leverage expertise, technology platforms, reach across SBUs
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Henkel history in Printed Electronics> 30 years a global leader in material supply for printed electronics
• Conductive inks and coatingsSilver, silver-plated copper, carbon and transparent conductive materials for various applications
• Shielding paintsNickel and Copper filled inks used for EMI shielding applications
• Blendable Resistive (PTC) inksInks with silver / carbon / non conductive pigment blends for printed resistors, potentiometer and heating elements
• Electrode inkSilver / silverchloride based inks for electrodes in biosensors, ECG electrodes and transdermal drug delivery
• Dielectric inksUV-curable materials for dielectric layers
• Electroluminescent inksFor light emitting layers in EL-lamps
• Transparent conductive inksAgNW or nAg based inks
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Trends that favour Printed Electronics
Flexible devices
Now > 2017
ITO as transparent electrode
Printed, transparent electrodes
3D shapedelectronics 3D MID
Printed or formed3D structures
Security and identification
Mainly Al etchedtechnology
High speed printedlabels usingconductive inks
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Non integratedsensors
Integrated smart sensors in textile/wristband
Energy harvesting & storage, smart sensors, heaters/coolers in everyday life
Wearable(medical) sensors
Now > 2015
Smart grid/ e-city
Non communicating, non connected devices
Which Henkel solutions are needed to support these trends and drive PE forward?
Trends that favour Printed Electronic
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How to be successful in Printed Electronics?• Having the right material is not enough to be successfull in PE
• Need to understand each step of the value chain for each application and work with key partners in the value chain
Value chain for printed electronics
• Ink supply• Substrate• Adhesive
Components
1
• Sensor design
Design
2
• Sensor manufacturing
Printing
3
• Side electronics
Assembly
4
• Integration in final application
Integration
5
• End user
End user
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Henkel is working with and bringing together key partnersin the complete value chain to maximise success rate
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1. Introduction Henkel
2. Trends in Printed Electronics
3. Novel materials enabling Printed Electronics
New high speed printable silver inks with very high conductivity
New water based carbon ink for high speed printing
New material set for 3D formed, in-molded electronics
4. Conclusions
Agenda
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Product highlights: summary - overview
Materialname
Sheet resistance(mOhm/sq@25µ
m)Coverage(m²/kg) @
10µm
Times bulkAg resistivity
% Resistance
increase
afterdouble crease
Comments
PET PI
Currentcommercial
materials
Electrodag725A
12 12 11 7,5 26
Standard material for membrane
switch
Electrodag479SS
20 21 14,7 12 30
Standard material for membrane
switch
New materials
ECI1010 4 - 6 4 - 6 10,5 8 20Highly
conductive
ECI1011 2,5 2,8 8,3 3-4 > 200Super highlyconductive
• Comparison between existing commercial Ag inks and new development products
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Detailed technical approach – Flexibility on PET
Double crease test: 1,8 kg rolled over creased foil (both sides)
4mm roll data: roll conductive tracks around 4mm cylinder (both sides)
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1. Introduction Henkel
2. Trends in Printed Electronics
3. Novel materials enabling Printed Electronics
New high speed printable silver inks with very high conductivity
New water based carbon ink for high speed printing
New material set for 3D formed, in-molded electronics
4. Conclusions
Agenda
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NEW!!! ECI7005Water based carbon ink for high speed printing
Property WIK20643-54B
Sheet resistance
(Ohm/sq/25µm)32
Viscosity
(mPa.s @ 15s-1)5400
Solids (%) 36.5
Particle size analysis (D50, μm)
13.6
pH 7.7
Material properties Application technology
Application example: humidity sensor (resistance of material changes when wet)
High speed flexo or rotogravure printing of flex substrates or
textiles
Fully disposable system printed directly on textile (1-layer)
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1. Introduction Henkel
2. Trends in Printed Electronics
3. Novel materials enabling Printed Electronics
New high speed printable silver inks with very high conductivity
New water based carbon ink for high speed printing
New material set for 3D formed, in-molded electronics
4. Conclusions
Agenda
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In-Mold ElectronicsKey applications for in-mold electronics
Interior Automotive Consoles
Appliance control panel Wearable applications
Key drivers for implementation:
Up to 70% weight reduction of control panel
Up to 30% more cost efficient
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In-Mold ElectronicsMaterial opportunities for building
electronic circuit:
1. Formable silver ink (WIK20489-56A)
2. Formable UV-dielectric ink (WCP21280-3A)
3. Transparent conductor (ECI5005)
4. Protection layer for transparent conductor (ECI9001)
5. Conductive adhesive compatible with -56A or low melting solder paste (LM100)
6. Technomelt for protection of flex connector and PCB board
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Conclusions
• Henkel has been providing solutions that enable printed electronicsfor > 30 years
• Henkel has a focus on printed electronics and offers completematerial solutions to its customers
• Value chain is very well understood and key partnerships enableHenkel to be successful in printed electronics
• Novel materials have been developed to allow: • Cost efficient and environmental friendly high speed printing of
conductive circuits• Thermoformed (and in-molded) electronic circuits