Printed Electronics - myCMP · 4 printed electronics: why? disclaimer: si-based electronics (“traditional” electronics) still remains unbeaten in terms of:-switching time (very

Printed Electronics

[email protected]

Laboratoire ITODYSUniv. Paris Diderot, Sorbonne Paris Cité, ITODYS,

UMR 7086 CNRS 15 rue J-A de Baïf, 75205 Paris Cedex 13, France

Benoît PIRO, Vincent Noël, Giorgio Mattana, Nicolas Battaglini, Samia Zrig, Guillaume Anquetin, Steeve Reisberg

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2020 Annual Users’ Meeting CMP

Team BIOSS, Bioelectronics& Smart Surfaces

https://www.univ-paris5.fr/

https://www.univ-paris5.fr/

https://www.univ-paris-diderot.fr/


http://www.sorbonne-paris-cite.fr/fr

http://www.sorbonne-paris-cite.fr/fr

mailto:[email protected]

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Ex-

(we moved from Jussieu in 2007)

2020 Annual Users’ Meeting CMP



I. Printed Electronics: Why?II. The Printing ProcessesIII. What to Print? Which substrate?IV. Examples of Printed Electronics

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Summary

Printed Electronics

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Printed Electronics: Why?

DISCLAIMER: SI-BASED ELECTRONICS (“TRADITIONAL”ELECTRONICS) STILL REMAINS UNBEATEN IN TERMS OF:- SWITCHING TIME (VERY HIGH MOBILITY OF SI);- INTEGRATION DENSITY (~ 40 MILLION FETS PER MM2).

PRINTED ELECTRONICS IS NOT A DIRECT COMPETITOR OF SI-BASED

ELECTRONICS, IT RATHER OFFERS COMPLEMENTARY SOLUTIONS

WHENEVER THE FOLLOWING CHARACTERISTICS ARE NEEDED:- LARGE-AREA FABRICATION

- LIGHTWEIGHT;- FLEXIBILITY;- LOW FABRICATION COSTS.

MARKET PREVISIONS: ~ 70 BILLION $ IN 2025!

Source: Printed Electronic World

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CONTACT printing (conventional) vs. CONTACTLESS (numerical)

CONTACT Printing

CONTACTLESS

(conventionnal)

(numerical)

Ink spread over the master

Ink

Master

Contact with the sustrate

Pressure

Withdrawal of the master

Nozzle

InkReservoir

Filling Ejection of the drop Spreading of the drop

Printing techniques:

Printed Electronics: Processes

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Printing techniques:

Conventionalprinting

Digital printing


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Conventional printingPrinting techniques:

Screen -printing

FlexographyOffset,

lithograhy


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Screen-printingConventionnal

printing

Planar screen-printing (sheet) Roll-to-roll screen-printing

Blade

InkScreen

Frame

Substrate HolderPrinting roll

InkBlade

Printing roll with screen

Substrate


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Screen-printing machinesConventionnal

printing


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Screen-printing machinesConventionnal

printing

PRINTEC@BiOSS

PRINTEC@BiOSS


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Digital printingPrinting techniques:

Inkjet


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InkjetDigital

printing inkjet

Jet Drop-on-demand (DOD)

Thermal actuation

Piezzoactuation

Actuation Nozzle Substrate

Waveform

Moving direction

of the substrate

InkPrinting file


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Digital printing Inkjet printers

PRINTEC@BiOSS

PRINTEC@BiOSS

Dimatix 2840, Fujifilm (desktop)


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Inkjet-Printed Electronics

INKJET-PRINTING VS OTHER PRINTING TECHNIQUES

INKJET-PRINTING: ADVANTAGES- NON-CONTACT TECHNIQUE;- DIGITAL TECHNIQUE;- REQUIRES SMALLER AMOUNTS OF INKS;- VERSATILITY: FROM RAPID PROTOTYPING TO LARGE SCALE PRODUCTION.

INKJET-PRINTING: WEAKNESS- VERY STRICT TUNING OF INK PROPERTIES;- LIMITED SPATIAL RESOLUTION (~ 30 μM);- VERY LOW THROUGHPUT SPEED.

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Organic semiconductors

• 1948. First report of an organic semiconductor• 1963. Electroluminescence in anthracene crystals (Pope, Kallmann, Magnante)• 1977. Conducting polymers (Heeger, McDiarmid, Shirakawa)• 1986. Organic transistors (polythiophene) (Koezuka)• 1986. Organic photovoltaic cell• 1987. OLED (Tang & van Slyke)

Polyacetylene

Polyphenylene

Polythiophene

Poly(phenylene-vinylene)

Oligothiophene

Polyacene

What to Print? Which Substrate?

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PCDTBT PBTTT

PTB7

DPP-DTT


P3HT

PBDTT-DPP

PDPP4T

PNDI(2HD)2T

Drop Vol. = 10 pLNo satellite drops

Ejected droplets

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Graphene Aqueous-based Suspension of “nanoflakes” of graphene

oxide (GO)

Surfactant-free ink formulation: water/ethylene glycol/ 1-propanol GO dispersed by ultrasonic fragmentation

print

headsuspension of

GO flakes

Au

substrate

Satisfy the rheological parameters for printing (dynamic viscosity & surface tension)

Ink : Suspension of GO flakes

Dimatix inkjet printer (DMP 2831)

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J. Perelaer et al., J. Mater. Chem. 2008, 18, 3209

Inkjet-printed silver tracks

Before sintering : separate AgNPs.NON CONDUCTING.

After sintering : AgNPs « melted » to forma percolation pathway. CONDUCTING.


Metals !

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Flexible polymer substrates flexibles must present:

• Good dimensional stability,• Good thermal stability, high Tg, low

dilatation coefficient,• Good resistance to solvents,

& be impermeable to O2 and H20


Flexible substrates

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G. Mattana et al. Org. Electron. 2015, 17, 77Example of a printed OFET:OFETs on ultrathin biodegradable PLA (poly lactic acid)

Examples of Printed Electronics

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B.B. Narakathu, et al. IEEE Sensors 2012, 1-4(Capacitive)

Pressure sensors (printed)


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L. Kergoat et al., Advanced Materials 2014, 26, 5658-5664

Neuromediators sensor

Biotransistors (printed): the OECT


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L. Kergoat et al., Advanced Materials 2014, 26, 5658-5664

Glutamate sensor

Acetylcholinesensor

Neuromediators sensor

Biotransistors (printed): the OECT


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Humidity sensors for the detection of R.H. in air

- SUBSTRATE: KAPTON® (POLYIMIDE);- ELECTRODES: Ag;- SENSING LAYER: CELLULOSE ACETATE BUTYRATE (CAB)

- DEVICE ACTIVE AREA: 10 MM × 15 MM

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Everything is possible…Humidity sensors for the detection of R.H. in air


On human

On living plants (e.g. leaves)

Inkjet-printing on Leaves (Eléagnus)Sensor’s Structure: - interdigitated electrodes printed in PEDOT:PSS; - 1 layer of CAB; - response to breath.

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FABRICATION OF ALL-INKJET-PRINTED ELECTROLYTE-GATED FIELD-EFFECT TRANSISTORS (EGOFETS)

- SUBSTRATE: KAPTON® (POLYIMIDE);- ELECTRODES: Au;- ORGANIC SEMICONDUCTOR:

- DEVICE ACTIVE AREA: 5 MM × 5 MM

DPP-DTT5 mm

L = 100 μm

0,0 -0,1 -0,2 -0,3 -0,4 -0,5

0,04

0,02

0,00

-0,02

-0,04 -0,8V

-0,7V

-0,6V

-0,5V

-0,4V

-0,3V

-0,2V

-0,1V

0V

i DS(µA)

VDS(V)

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TODAY IJP IS PRACTICALLY AND SUCCESSFULLY USED FOR THE FOLLOWING PURPOSES:- FABRICATION OF CONDUCTIVE ELECTRODES;- DEPOSITION OF FUNCTIONAL LAYERS (ADHESION LAYERS, DIELECTRIC LAYERS, SENSING LAYERS…).

DEPOSITION OF SEMI-CONDUCTING LAYERS NEEDS STILL OPTIMISATION!

CHALLENGES TO BE FACED- DROPLETS EMISSION AND MANIPULATION, INTERACTION DROPLETS/SUBSTRATE;

- TOWARDS SUB-MICROMETRE RESOLUTION

- IMPROVEMENT OF FUNCTIONAL MATERIALS (SEMICONDUCTORS) STABILITY AND PERFORMANCES;- MULTI-TECHNOLOGY INTEGRATION: SURFACE TREATMENTS, PRINTING, LAMINATION,… ALL INTEGRATED ON

A SINGLE INDUSTRIAL DEVICE.

Conclusions

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Materials(chemistry)

Inks(formulation)

Electronics(physics)

Printing (techniques)

Organic Electronics on Flexible Objects

Conclusions

S. ZrigB. Piro G. AnquetinV. Noël S. ReisbergG. Mattana N. Battaglini

Implanted sensors in

Human / Living organisms

Sensors on Biomedical

devices

4D Printing

(3D + function)

Electrochemical

Systems

Concep. / Fab

Understanding

2D Printing

(inkjet – beyond the limits)

Biosensors

Electroch. /

Sensors /

Elec. Orga

Electroch.

Elec. Orga.

Synthesis Synthesis Inkjet /

Electron.

Semicon. /

Near Field

Imaging

Biotech. /

Med.

Applications

Team BiOSS – Bioelectronics and Smart Surfaces

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SelectedProjects

2

BiOSS / Hôpital Tubingen (DE)

Hydrogel EGOFETs

Applied to Living

Organisms

Dielectrophoresis and

Reverse Osmosis for

Membraneless Sieving

BiOSS / PHENIX /

IFREMER / ENS (FR)

Flexible and Printed

Electronics

(in general)

BiOSS / EPFL (CH)

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2

Printed Gas Sensors

Applied to Dysbiosis

BiOSS / ISEP / IM2NP

Electronic Devices in

Living Plants

BiOSS / U-Norkkoping (SE) /

U-Bari (IT) / U-Bordeaux

Printed Graphene and

Control of its

Electronic Properties

BiOSS / MPQ / PPSM / ICMMO

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SelectedProjects

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On-goingcollaborations

Collab.

• Nationales

• Internationales

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X / ICMMO

ISEP / IM2NP

PHENIX /

IFREMER / ENS

MPQ / PPSM

/ ICMMO

Hopital

Tübingen

EPFL-

Neuchatel

U-Norkkoping /

U-Bari / U-Bordeaux

COBRA

LPL /

LSPM

• Industrielles

ValoTec

Omini lab

Air Liquide

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SomeDedicatedEquipments

4

x 2

Sérigraphie 1

Sérigraphie 2

Jet d’encre

Tapis de séchage

Ozone 1

Ozone 2

Recuit thermique

Recuit photonique

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SomeDedicatedEquipments

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Carac. élec. 1

Carac. élec. 2 + carac. optiques

Potentiostats

Viscosimètre

Tension de surf.

AFM

Angle de contact

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Réunion de Printemps du Club MicroCapteurs

Chimiques

THÈME :

FLEXIBLE ELECTRONICS

Jeudi 26 mars 2020

Laboratoire ITODYS

15 rue Jean-Antoine de Baïf, Paris 13

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AFELIM représente la filière

de l'électronique imprimée, organique ou non organiquehttp://www.afelim.fr/

Paris, mars 2020

Documents

Printed Electronics - myCMP · 4 printed electronics: why? disclaimer: si-based electronics (“traditional” electronics) still remains unbeaten in terms of:-switching time (very