Green Business Process & Green Products Guide advances make people s lives easier and enrich society. But resource consumption and emissions impact the environment, posing increasingly

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©2009 FUJITSU MICROELECTRONICS LIMITEDAll rights reserved.Printed in JapanAD00-00020-1E February, 2009

Fujitsu Microelectronics' technology and products help to preserve Earth's environment.

Green Business Process &Green Products Guide

FUJITSU MICROELECTRONICS LIMITEDShinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku,Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387http://jp.fujitsu.com/fml/en/

Technological advances make people’s lives easier and enrich society. But

resource consumption and emissions impact the environment, posing increasingly

serious issues for us all, such as global warming.

We are responding to these challenges with world-wide efforts to enhance our

contribution to the protection of the environment, with the goal of "Building a

Sustainable Global Society." We have many and varied environmental projects in

both the industrial and consumer sectors. We believe in the power of the people in

the semiconductor industry to contribute to a sustainable society, so that future

generations can inherit the beauty of Earth’s environment.

Fujitsu Microelectronics Limited was set up in March 2008 to drive the future of

Fujitsu Group's semiconductor business. We aim to nurture the trust we have built up

with existing customers of Fujitsu's electronic devices group, while developing digital

solutions with real value to meet the needs of both customers and society as a whole.

The ‘green’ perspective is becoming ever more vital to the future of business and

the global community. Over recent years, a common international goal has been set

to halve emissions of greenhouse gases, such as CO2, by 2050. At the Toyako

summit in Japan held in July 2008, negotiations made progress towards this aim of

a low-carbon society.

Meanwhile, we have a key mission to develop our electronic business with the

environment firmly in mind: by reducing the environmental impact of our factories, by

using less power, and by manufacturing small and light ICs (Integrated Circuit),

devices and applications. In addition, we ensure strict compliance with international

environmental standards, such as RoHS.

In short, we see it as our social responsibility to maintain our end of our customers’

supply chains, and we will work with them to help protect the world’s environment

towards achieving the day - in about 30 years’ time - of the low-carbon society.

I n t r o d u c t i o n

SEMICONDUCTORE C O i s i n o u r S E M I C O N D U C T O R s .

M a i n M e s s a g e

Working towards a business that delivers device solutions with real value for the needs of the Environmental Age.

Haruki Okada, President

With our customers, we contribute to the protection of a rich global environ-ment, using state-of-the-art technology to provide semiconductor devices with superior environmental characteristics.

By applying the following principles, we work to prevent pollution of the global environment and reduce the environmental burden of our products through-out their life cycles, including development, procurement, manufacture, sales, usage, and disposal:

Operation Principles

Fujitsu Microelectronics Limited Environmental Policy

Through aggressive promotion of Super Green Product development, we improve the environmental characteristics of our products and actively contribute to reduc-ing the burden on the global environment and for our customers.We aggressively promote measures to counteract global warming and reduce emissions of greenhouse gases (e.g. CO2, PFCs).We aggressively promote chemical management and reduced emissions of volatile organic compounds (VOCs).We aggressively promote waste reduction and appropriate recycling.We conform to environmental regulations around the world and keep our promises to customers.We work to improve the individual environmental consciousness of each of our employees, to help them become good environmental citizens.We expand the effectiveness and transparency of our environmental management system, driving continuous improvement and development.

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3.

4. 5.

6.

7.

16 July 2008

Haruki OkadaPresident

Introduction

Main Message

Concept

Green Business Process

2

3

4

6

Green Products ASIC

Microcontrollers

Power Management ICs

Memory

ASSP

Topics

101213141516

18

C o n t e n t s

FU J I TSU MICROE LECTRONICS

Green Business Process & Green Products Guide 2 Fujitsu Microelectronics Limited 3

Green Business Process

Green Products

C o n c e p t

We work to reduce the burden to the environment and prevent

pollution of the global environment throughout the life cycles of our

semiconductor products, from the development and design stages,

through material procurement and manufacture (front-end wafer

manufacturing and back-end assembly processes), to distribution, sales

and usage.

In recent years, we have been increasingly focused on chemical

management. We respond quickly to domestic and international regula-

tions (such as those in Europe and China, including RoHS*1 and

REACH*2), complying with standards on substances prohibited or limited

in products and managing such regulated substances appropriately

through green procurement.

Preventing global warming, now becoming a serious problem, is also

a key aspect of our environmental operating principles. We are making

aggressive efforts to curtail greenhouse gas emissions, including switch-

ing to gases with lower global warming potential; adding equipment to

manufacturing lines to remove harmful gases; and saving energy -- e.g.

by changing boiler fuel from crude oil to gas, introducing Standard

Mechanical Inter Face type clean rooms, and using free cooling*3.

Additionally, in the manufacturing stage - which has the biggest

environmental impact over the life cycle - we are pushing forward with

"green process activities," with the goal of reducing energy consumption,

chemical usage, and waste.

*1 RoHS: A set of directives restricting the use of specified Harmful Substances contained in electric and electronic devices

*2 REACH: A regulation regarding the Registration, Evaluation, Authorisation, and Restriction of Chemicals

*3 Free cooling: A system taking advantage of low outside temperatures during winter to cool water

We are working to reduce the environmental burden across all our business activities

As the digital networked society develops, the performance of electron-

ics, such as communication devices, mobile devices and digital home

appliances, shows an exponential increase, with new products and

features appearing in rapid succession. The proliferation and expansion of

such wide-ranging electronic devices increases the environmental impact

from their use, such as increased power consumption.

Responding to this environment, we are promoting eco-design, commit-

ting ourselves to the development and sale of environmentally conscious

devices and solutions that reduce our customers' environmental impact.

For example, we are driving forward the energy efficiency, compactness,

and lightness of core products such as our ASICs, microcomputers,

power ICs, memory, and ASSPs. We have also been organizing a

framework to support the growth of environmentally conscious electron-

ics through the provision of "embedded system-on-chips." Thus, by

developing a wide variety of devices and unique system-on-chip solutions

with environmental awareness, we provide "eco-device solutions" in

which advanced functionality and reduced environmental impact co-exist.

Providing environmentally-conscious semiconductor solutions to support our customers' business

For our customers,for the environmentAs the digital networked society evolves, the functionality of our electronic devices

(e.g., mobile devices, digital home appliances, PCs, and automobiles)

constantly improves.

Meanwhile, with increased awareness of the need to protect our environment,

the demand for electronic devices that consider the environment has reached

unprecedented levels.

For better device technology, for greater convenience, and for global

environmental protection ----

we work to develop and supply semiconductor products with a low environmental

burden, using manufacturing processes with low environmental impact,

and to pursue higher semiconductor functionality, to build a bridge to a new

era of a "society of plenty."

Reduction of environmental burdenin business activities

A p p r o a c h 1

A p p r o a c h 2

Developing and providing environmentally conscious device solutions


Fujitsu Microelectronics Limited(Akiruno Technology Center)

Fujitsu Electronics Inc.

Fujitsu VLSI Limited

Fujitsu Microelectronics Limited(Mie Plant/Aizu-Wakamatsu Plant/Iwate Plant)

Fujitsu Semiconductor Technology, Inc.

Fujitsu Facilities Engineering Limited

e-Shuttle, Inc.

Fujitsu Integrated Microtechnology Ltd.(Aizu Plant/Miyagi Plant/Kyushu Plant)

Fujitsu LSI Technology Limited

Fujitsu LSI Solutions Limited

Fujitsu Microelectronics Solutions Limited

Multiple power source design technology that reduces power consumption while active

Power gating design technology that reduces power consumption when idle

"RDF V3.0," a development system loaded with the features of multiple power source design and power gating design

Working with our partners to promote green procurement, under the Fujitsu Group green procurement standards

Supporting our partners' construction of CMS (central management systems) based on JGPSSI*1 "Guidelines for the Management of Chemical Substances in Products"

Saving energy to reduce CO2 emissions

Changing from PFC gas*3 to gases of low global warming potential, and installing manufacturing lines equipped with PFC gas harm removal equipment

Curtailing sludge waste emissions with the introduction of a "Fluorine Recovery and Reuse System"

Reducing emissions of VOC (volatile organic compounds)

Process improvement reducing the amount of chemicals and gas used

Reduction of process energy expenditure

Clarification of improvement priorities using the CG index*2

Reducing greenhouse gas emissions

Reducing waste emissions

Reducing emissions of VOC (volatile organic compounds)

Usage of specialized reusable boxes

Application of cobalt-chloride-free humid-ity indicators

Shipping with low CO2 emissions

Terminals installed on vehicles to improve fuel efficiency

Massive time-saving and productivity increases

Cooperation with our "green process activities"

Products adapted to our special environ-mental awareness standards

Products with improved environmental efficiency

Environmental improvement solutions using ICs of superior environmental performance

Akiruno Technology Center Fujitsu Electronics Fujitsu VLSI FujitsuMicroelectronics Solutions

Mie Plant Aizu-Wakamatsu Plant Iwate Plant Aizu Plant Miyagi Plant Kyushu Plant

*1 JGPSSI: Japan Green Procurement Survey Standardization Initiative

*2 Cost Green index. Fujitsu Group's unique index calculated by multiplying the following three factors: material input per unit of product, unit value, and degree of environmental impact.

*3 Perfluorocarbon gas. Used in the manufacturing of semiconductors; it has a global warming potential approximately 10,000 times higher than that of CO2.

Manufacturing bases (back-end)Manufacturing bases (front-end)Development and design bases

Low-power ICs

Green factories

Green processes

Green factories

Packing

Green distributionManufacturing renewal project (Toyota production system)

Green products and Super Green Products

Green procurement

Facilities in Japan

Development and design Material procurement Manufacturing (front-end) Manufacturing (back-end) Distribution and sales Usage

From development and design to manufacture and usage ----constructing a business process with low environmental impact across the whole lifecycle of the semiconductor product

Green BusinessProcess

A p p r o a c h Reduction of environmental burden in business activities1


We have been at the forefront of using humidity indicators

that exclude the harmful substance cobalt chloride, under a

joint design with Kyodo Printing Co., Ltd., since August 2008.

Humidity indicators are used as one part of the packing

material to confirm the preservation state of semiconductor

products (such as IC packages) affected by humidity. We

used to use humidity indicators containing cobalt chloride, but

this is carcinogenic, and its use is restricted by an EU

Directive*. So cobalt-chloride-free humidity indicators were

needed.

Concerned for human health and the environment, we

Until recently, the Mie plant recycled its fluorine-containing

sludge as cement material. However, as the demand for cement

decreased, cement companies began to limit the amount of

sludge they would take in, and it became difficult to recycle.

So, we introduced a "Fluorine Recovery and Reuse System"

at the newly-established second 300mm fab, to reduce the

fluorine-containing sludge that formed most of the waste.

Introducing these facilities allows us to reduce the fluoride-

containing sludge by approximately 30%, recovering the

fluorine from waste hydrofluoric acid to create fluorite. We then

sell the fluorite to hydrofluoric acid manufacturers, who recycle

it as fluorine-based solvents, fluororesin, etc., so making good

use of a valuable resource. We eliminate the remaining

low-concentration fluorine, that we cannot recover, by coagula-

tive precipitation and high-degree adsorption treatments, again

lightening our burden on the environment. Now we have begun

to fluoritize the waste from the first 300mm fab. as well.

made this a top priority and, with Kyodo Printing Co., Ltd., we

helped in the development of HumiJudgeTM, a humidity indica-

tor without cobalt chloride. It is a key part of our mission to

consider the environment - even in the materials we use to

pack our products.* Council Directive 67/548/EEC of 27 June

1967 on “the approximation of laws,

regulations and administrative provisions

relating to the classification, packaging

and labelling of dangerous substances".

We are working hard to manage restricted substances

appropriately. We track changes in domestic and international

legal regulations for substances banned or restricted from

inclusion in products, and decisively eliminate banned

substances through green procurement.

In response to regulations like RoHS, we are perfecting our

chemical management in all processes from design to

shipping. Likewise, for the European Union Regulation REACH,

we promote discussion of the risk potential of chemicals and

the framework for managing them efficiently.

We see REACH's requirement for disclosure of chemicals in

products as a responsibility for the entire supply chain, so we

are participating in related industry groups such as JAMP* and

JGPSSI to discuss the building of the new framework for

chemical management.* JAMP: Japan Article Management Promotion-consortium

To reduce the environmental impact of our manufacturing

activities, we have decided to build "green factories."* These

revolve around the reduction of energy consumption and waste,

the perfection of chemical management, etc. For this purpose

we are driving forward our "green process activities."* This

project involves determining the priority and target values for

such subjects as energy from electricity and other sources,

resources and chemicals, using Fujitsu Group's unique CG

index, in order to reduce our environmental impact and optimize

allocation of such resources. We are also doing all we can to

switch to alternative chemicals for applications such as lithogra-

phy developer fluid, which have a lower-environmental burden.

To further the effectiveness of such activities, our "green

factory system," in effect since 2008, highlights each plant's

eco-friendliness level and independent efforts with comprehen-

sive evaluations. We have made it our goal that all plants reach

at least the 2-star level in this system by the end of FY 2009.

We are pushing through continuous improvements in our

environmental friendliness towards this goal.* The green factory and green process activities are systematized throughout the Fujitsu Group.

Fujitsu Group's framework for conforming to RoHS in procurement

Fujitsu

Confirmation of legality

Shipmentcheckingmeeting

Shipment confirmation

Supplier audit

Acceptance inspection

Cus

tom

er

In-house factory periodic inspection

Quality assurance department

ShippingProductdepartment

Sup

plie

r

Supply

Environmental department Determinationof legality

Exclusion requirement

Conformance verification

Purchasingdepartment

Green factory system (certification level image)

3 stars

2 stars

1 star

Independent workplace accomplishments earn

additional honors

Meets targets and fulfills standard levels for the

required items(Each item is rated

on a scale of 1 to 5.)

Greenfactory

Greenoffice

Independentaccomplishment

examples

Required items

examples

Resource conservation(materials, water, natural energy, paperless)

Local communication

Safe handling (environmental risk)

Environmental education

Green purchasing

Land/groundwatermeasures

Energy conservation, CO2 emission reduction

Waste reduction (zero-emission, recycling)

Chemicals,greenhouse gases

Social contribution projects

Independentmanagement standards

ISO14001 certification(building and carrying out EMS), observance of legal regulations

Confirmation

HumiJudgeTM

G r e e n B u s i n e s s P r o c e s s A p p r o a c h 1

Addressing regulated chemicals in products

Procurement Programs

Fluorine Recovery and Reuse System The fluorite generated (powder)

Introducing a "Fluorine Recovery and Re-use System" -propelling the efficient use of resources

Manufacturing Programs

Driving forward "green process activities" and carrying out "green factory systems"

Manufacturing Programs

Worldwide pioneers in developing cobalt-chloride-free humidity indicators

Distribution Programs

Introducing our environmental protection projects in procurement, manufacturing, and distribution


Putting together design technology with high functionality

that considers the environment, we offer the low-power

consumption ICs suited for customer's needs.

As digital networking technology evolves, the

functionality of electronics devices constantly

improves. As we find more ways to use electronics,

we also increase our power consumption.

In such an environment, we are working hard to

advance the functionality of electronics with device

solutions that conserve energy.

Recent years have seen demand for smaller and

thinner electronics devices, such as mobile devices

and digital home appliances. Shrinking the size of

such devices both makes them more convenient for

users and helps conserve resources.

We help conserve resources and protect the

environment by using our highly functional and

varied semiconductor lineup and unique packaging

technology to advance the functionality of electron-

ics devices and to offer device solutions that lead

the industry in compactness and lightness.

DC brushless motor control MCUFR80 CPU core

Main products

Our abundant product lineup makes high-speed processing

with low power consumption a reality.

Digital television power ICUltra-mobile PC power ICDigital camera power IC

Main products

Discrete FRAM memory ICsConsumer FCRAM

Main products

We respond to our customers' rising performance needs and

make it possible for their products to achieve better power

efficiency and miniaturization.

We offer to minimize the size of PCB in customer's product

to enable flexible and small product design, and to reduce

CO2 emission dramatically.

We offer sophisticated ICs for every application:

automobiles, communications, imaging, office equipment,

and more.

V i s i on1 Contributions to energy-saving

We provide eco-device solutions, combining various devices to help reduce the environmental burden

V i s i on2Contributions to shrinking and lightening

Power Management ICsProducts Category 3

MemoryProducts Category 4

G r e e n P r o d u c t s

ASICProducts Category 1

MicrocontrollersProducts Category 2

ASSPProducts Category 5

A p p r o a c h Developing and providing environmentally conscious device solutions2


VOICE VOICE

"Power gating design" is a design method that vastly reduces power

consumption during idle time by shutting off power supply to resting

circuits in the IC by a switch. Power gating allows idle power consump-

tion to be reduced to as little as 1/1,000*.

"Multiple power source design" is a design method that supplies

power of different voltage to each circuit inside an IC. It reduces

power during active times by supplying a low-voltage power to a

circuit that runs in low frequency and a high-voltage power to a

circuit that runs in high frequency. Power consumption during idle

time is reduced at the same time.

ASICs that are incorporated into rapidly-evolving electronic

devices, need advances both in design efficacy and in

handling increasing functionality. Our ASICs not only

reduce the number of parts by combining multiple semicon-

ductors onto one chip, but also are ready with state-of-the-

art process technology, high-functionality IP and high-

density packaging. We work with IC specification requests

to achieve in full the design services and quality our

customers need.

The "RDF V3.0" development system, loaded with design functionality that reduces power consumption

We have established a unique ASIC development system,

"RDF V3.0," that reduces power consumption both when the

IC is active and when it is idle. This system is packed with

design functions such as "clock gating" and "multiple power

source design" which reduce power consumption when active.

Design functions such as "multi-Vth" and "power gating"

reduce power consumption when idle, thus helping to reduce

the power consumption of ICs.

(For AC power reduction)Effective in reducing power consumption in clock distribution systems and FFs of sophisticated ICs

Placed around macros

Retains FF's memory contents even when power is off

Reduces power noise when turned on or off

Used when signals are distributed through Powered-off domains

(Possible to place power switch in standard cell block)

Power Switch

(For reducing leak power)Three types of thresholds can be used for cellsNo constraints on placement of cells with different thresholds

Low Leak Tr Cell Critical Path Standard Tr Cell

(Multi-Vdd)

(Wide Vdd range)

A high-performance FR80 CPU core in a microcontroller.

Ready for home digital appliances to which new features

are added with each new model, raising the amount of

processing needed. Wide product lineup available.

We have released the MB91480 series, capable of

inverter control of two DC brushless motors*1 with one

chip. It makes the motors of high-performance air condi-

tioners, washer-dryers, etc. smooth and silent.

Fan motor diagram

12

10

8

6

2

4

0

FR60 CPU core(our previous model)

FR80 CPUcore

50% reduction*2 in power consumption!

(Unit: kg/day)

DVD

Fan motor

Digitalcamera

Approx. 30%reduction

Power Switch

Power on/off area

Poweron/off area

Always-on area

D.R.E

CK

Enable

Enable

Retention FF

Leve

l Shi

fter

& ls

olat

ion

9.52

6.61

MicrocontrollersProducts Category 2

"Power gating design" reduces power when idle

Point 2

50% reduction in power consumption*2

"Multiple power source design" reduces power when active

Point 1

Environmental features

ASICProducts Category 1

We develop and provide products that help reduce the environmental impact of electronic devices, through reducing power consumption, size and weight.

G r e e n P r o d u c t s A p p r o a c h 2

Clock gating

Ring PowerSwitch

Retention FF Multiple power source design

Cells for with low voltageLow power SRAM (Multi-mode SRAM)

Rush CurrentControl

Always-OnBuffer

Column PowerSwitch

Level Shifter,lsolation Cell

Multi-Vth

* Compared with circuits without the power gating

*1 Motors with semiconductor switches in place of brushes*2 Reduction in inverter-control microcomputer components*3 Corresponds to the area of one microcontroller

* Compared to our previous products

Point 1

196 mm2 reduction in component mounting surface area*3

Point 2

CO2 emissions

CO2 emissions-reduction effect

Approx. 50%reduction*2


Approx. 30%reduction*

DC brushless motor control MCU[MB91480 series]

FR80 CPU core[MB91635 series] [MB91640/645 series] [MB91660 series]

Demands for IC design to reduce power consumption are becoming

intense. Lately, in addition to companies working to save energy and reduce

CO2 emissions, demands are intensifying - with standards for electrical

products being set by the top-runner system*1.

We developed methods such as "multiple power source design" and "power

gating design" as we drove forward to incorporate CPF*2 into our ASIC

development design system RDF.

We also solved the issues that crop up with these methods such as rush

current*3, so that our customers can use our products without concern.

We hope to continue pushing forward the implementation of power-

consumption reducing technology, such as ASV*4, as we support our custom-

ers' ecology efforts.

*1 The standards for energy conservation in electrical products are being set by the level of the most efficient products*2 An IC power data description format, standardized and promoted by the U.S. EDA (Electronic Design Automation) vendor Cadence Design Systems, Inc.*3 Large current that flows when the power switch is turned on*4 A technology for adjusting power voltage according to variations of device

To limit power consumption while operating at high speeds ---- that was

the task assigned to us for developing the MB91480 series. A major point

regarding power consumption is, "Make the clock tree small." So, to make

the clock tree small, we went through a lot of trial and error with the floorplan

layout (physical placement). Finally, we managed to get that compactness

and hold down the power consumption. We asked the Flash Design

Department if they could bring down the power consumption of the flash

memory used in the chip, and their help also enabled us to control the power

consumed.

Our company has excellent semiconductor design technology and

process technology developed over many years, and we also have excellent

development and design engineers. By combining these resources

organically, we will continue to design and produce quality products - both for

our customers and for the global environment.

Low-Power design system development team Tsutomu Nakamori, Manager(Design Innovation Engineering Dept. ENVM Technology Development & Products Engineering Div.)

DC brushless motor control MCU development team Akio Hara (MCU Design Dept. I Security & Ecology Business Div.)


CPUs enabling high-speed processing, by shortening processing time, reduce power consumption by 30%*

Point 1

The internal circuits, except the I/O pins, operate at 1.8 V for a 20% reduction in power consumption*

Point 2



Administrator

ハイライト表示

VOICEVOICEVOICE

To limit the rise in power consumption accompanying the increased size of flat-screen TVs, components need to be more energy-efficient. We have been able to conserve energy through high conversion efficiency with our 2-channel step-down converter IC*1 "MB39A136."

These ICs are not only highly integrated, but also reduce cross converter*1 power loss. They allow internal power supply to achieve the small size and high efficiency demanded by portable devices such as digital cameras.

FRAM is memory using ferroelectrics*1. It can read and rewrite at high speeds, and can retain data even with the power off. It can also be substituted for BBSRAM*2. It is being used in a wide range of applications, such as in office automation devices.

Consumer FCRAM features high data bandwidth and low power consumption to enable a SiP(System in Package) solution ideal for digital consumer electronics. 256Mbit Consumer FCRAM enables data transfer capabilities equivalent to two DDR2 SDRAM*1 devices, while keeping power consumption low.

We have, for the first time in the industry, consolidated a 6-channel DC/DC converter controller circuit*1 with in-built peripherals into one chip. Now, for ultra-mobile PCs, the long-life battery drive and the miniaturization of power substrate area are possible.

100

80

85

90

95

10 2 3 4 5

15% reduction in CO2 emissions*2

Power circuit

BatteryBBSRAM

FRAM

Digitaltelevision

Personal computer

Digitalcamera

Digitaltelevision

DigitalTV etc.

Digitalcamera

30

20

10

0

UsingSDRAM

UsingFCRAM

(units: kilotons)

27.328

8.064

Approx. 70%reduction

Power Management ICsProducts Category 3

MemoryProducts Category 4

Green P roduc t s A p p r o a c h 2

Digital television power management IC[MB39A136]


4,278 tCO2/year*2







*1 An IC that converts high voltage into low voltage*2 Calculated based on 2007 actual shipping

results of previous similar product (power consumption-emission factor: 0.000407t CO2/kWh)

*3 Compared to our previous IC*4 Microampere ---- One-millionth of an ampere

Conversion efficiency-load current characteristics

Point 1Power consumption when used was reduced 3%*3 by raising the voltage conversion efficiency

Point 2Power consumption when idle was brought to 0 A*4 through creative circuit design

Point 2Halving power loss of cross converter

Digital camera power management IC

*1 Function for raising/lowering voltage*2 Compared to our previous products

Ultra-mobile PC power management IC

*1 Circuit that converts direct-current voltage to a different voltage

*2 Comparison with power consumed when used with the previous UMPC power supply’s substrate area

*3 Comparison with UMPC using single power IC, without using MB39C308

Discrete FRAM memory IC

CO2 emissions

Conversion efficiency (%)

Load current (A)

MB39A116AMB39A136Board miniaturization image

Small form-factor chips for digital cameras

Device design concept is to improve memory performance with low

power consumption considering the reduction of environmental

burden. Since the 64-bit data bus width enables high data bandwidth

at a relatively low operating frequency, termination resistors are not

required. Therefore, this product contributes I/O power saving in

systems level. This 256Mbit FCRAM provides the highest bandwidth

which I've ever evaluated.

The most difficult problem in product evaluation was how to minimize

the variation of setup timing and hold timing of data input and output to

meet the target timing specs. We took as much date as possible to find

the root cause of timing variation and gave feedback the evaluation result

to circuit design team. Finally when we

confirmed the revised circuit design met the

target specs, we got a great sense of accom-

plishment.

We continue to work to meet more difficult

target specs to realize the higher-performance

and lower-power memory products.

The strength of FRAM is that it is a "green" memory. Power is

saved because it can complete write processes in a short time.

Customers can extend the battery life of their products by using

FRAM; so perhaps it would be better called "power-saving

memory."

Every day we consider how we can design FRAM that saves even

more power and how we can reduce the environmental impact,

including in the memory manufacturing process. We also work to

create designs that will open up new applications to our customers.

We shall continue to develop new FRAM with an even smaller

environmental impact. This should allow us both to make life easier

and to hand down the beauty of nature

forever. Please enjoy our FRAM green

memory.

The market for light, easy-to-carry, ultra-mobile PCs is expanding. We

developed the MB39C308 as the power source for the high-efficiency

platform demanded in ultra-mobile PCs.

In development, we wracked our brains to work out how we could

simultaneously achieve miniaturization, higher efficiency, and lower cost

in a power system through which a large current (several amperes)

would flow through multiple channels. After much discussion, we

concluded that the best solution was single conversion - converting six

channels' voltage with one chip.

To do this, we developed an FBGA package capable of low-heat

resistance, and used LDMOS technology to achieve low-temperature

resistance. We also built into the product a

high-performance switching FET that could

drive even at high current.

The result, compared to the previous single

power IC, the mounting footprint has shrunk to

1/3, and the conversion efficiency in total has

increased to over 90% in actual use.

[MB39C309 ]Super Green Product Super Green Product

Consumer FCRAM[MB81EDS256545 ][MB85R2001/2,MB85R1001/2,

MB85R256H,MB85R256S ]

[MB39C308 ]Super Green Product


*1 A type of DRAM (dynamic random access memory); the present mainstream DRAM*2 Compared to two DDR2 SDRAMs with equivalent bandwidth*3 Calculated assuming FCRAM used for 20% of digital TV's worldwide shipments in 2008 (estimated)*4 Compared to conventional on-board solution using two DDR2 SDRAMs

*1 Material whose internal electric polarity changes when voltage is added*2 Battery backup SRAM; saves SRAM data using battery power*3 Comparison with 50% writing and 50% reading

Point 170% reduction in power consumption and CO2 emission (19,264t-CO2 annually*3)

Point 2SiP solution minimizes the number of PCB layers and PCB mounting space*4


Point 1Shrinking of power circuit substrate area

Point 265% reduction in CO2 emissions by not needing a battery


Point 138% reduction in chip area by highly integrated ICs


Point 24% reduction in power consumption from increase in power supply efficiency*2

Point 166% power substrate area reduction, 69% weight reduction*3




256 Mbit FCRAM development teamShinichiro Suzuki (FCRAM Design & Characterization Dept. ASSP Business Unit, Infotainment Solution Div.)

Ultra-mobile PC power management IC MB39C308 development teamAtsushi Tsurumaru (Analog Products Marketing & Application Eng. Dept. Analog Product Division)

Super Green Product

FRAM development teamKathy Shieh(FRAM Product Design Dept. Security & Ecology Business Div.)


The problems of oil energy depletion and the acceleration of

global warming by CO2 from exhaust gas are getting serious,

increasing demand for lighter cars and more energy-efficient

car electronics. We have developed an "IDB1394" IC that

combines the physical and logic layers onto one chip with

Fujitsu Laboratories Limited's unique image compression

technology "SmartCODEC," allowing for fast transmission of

high-quality video and audio on one car LAN. We have also

developed controller ICs with the next-generation car network

protocol FlexRay to replace mechanical controls (such as oil

pressure) with electronic controls. Subsequently, automobile

harnesses* and electronic components can be reduced.

ICs with proprietary technology and next-generation technology reduce automobile components

The fast and stable next-generation wireless broadband

technology, "Mobile WiMAX"*1 is expected to be widely

incorporated into portable devices, such as PCs and portable

game devices. Mobile WiMAX terminal baseband ICs*2 need

to get smaller and reduce power consumption. We have used

65 nm generation CMOS process technology to reduce our

products' active power consumption by approximately 36%

and substrate area by approximately 45%.

65 nm generation CMOS process technology reduces power consumption 36% and chip substrate area 45%

Process technology, power management, and SiP* combine for low power consumption and miniaturized size

Handles security protocols with ultra-high-speed network processing and low power consumption.

ASSPProducts Category 5

Green P roduc t s A p p r o a c h 2

* Bundles of wires to operate an automobile's equipment

For automobiles

Controller ICs with FlexRay automobile network protocol

For imaging

Video and image processing ICs

*1 Mobile wireless standard conforming to IEEE802.16e-2005*2 ICs for communication processing in wireless networks

For communications

Baseband ICs for mobile WiMAX terminals

Ultra-high-speed security processors

For office devices

Video and image processing ICs are constantly expected

to process ever higher-quality video date. It is expected that

the scale of the circuits needed will expand drastically.

However, the needs for miniaturized packages and low

power consumption are also rising. We have applied 90 nm

and 65 nm process technology, while making great use of

our own power management techniques, to achieve low

power consumption. In addition, we have combined that with

SiP to make the package even more compact.

* System in Package, a technology for building systems with various semiconductor devices such as logic ICs and memory all included in one package

Corporate LANS and the Internet now need a security

protocol like IPsec between their bases to guard data using

encryption, along with accelerated communication. Our

MB86C60 is a security processor that allows ultra-high-

speed network processing compatible with numerous

security protocols, including IPsec. With power consump-

tion of only 600 mW while operating, our security processor

brings full wire speed of 1 Gbps in both directions regard-

less of packet length.


Iwate Plant

Green Power Certificate

Award ceremony

PET bottle cap collection promotion posters

In February 2008, the Iwate Plant received the Excellence

Award at the "2007 PRTR* Awards." Held by the Center for

Environmental Information Science, the PRTR Awards serve to

honor companies that take proactive steps in chemical

management and risk communication.

The Iwate Plant was highly praised for reducing chemical use

and waste in manufacturing through the use of the Fujitsu

Group's unique index as part of its green process activities, as

well as for an initiative to explain to local residents what the

plant was doing for the environment.

Iwate Plant wins Excellence Award at "2007 PRTR Awards"

The head office of Fujitsu Microelectronics Europe GmbH

(FME), a design and sales company based in Germany, has been

purchasing green power* with a low environmental impact since

January 2008. They explained: "We want to contribute to the

protection of the environment, for the sake of future genera-

tions." FME is purchasing hydroelectric power from Norway. This

move away from dependence on fossil fuels reduces annual

emissions by 467 tons of CO2.

Germany-based Fujitsu Microelectronics Europe GmbH purchases green power

* Power generated by natural energy such as wind, water, or sunlight

In December 2007, our Chinese subsidiary, Fujitsu

Microelectronics (Shanghai) Co. Ltd., entered the ultra-mobile

PC power IC MB39C308 (see page 14) into the "3rd China

Power Product Design Contest." The IC, which was praised for

its miniaturization and power supply efficiency, won the

"Structural Design First Prize" in the digital product design

solution category. It was a national contest held by the power

specialist committee of the public industrial organization China

Information Industry Department together with the China

Electronic Commerce Chamber and the Beijing Municipal Power

Product Consortium.

Ultra-mobile PC power management IC MB39C308 wins "Structural Design First Prize" at "China Power Product Design Contest"

The Fujitsu Microelectronics Group collects PET bottle caps

and uses the profits earned from recycling to advance our

project for providing vaccines to the children around the world.

Many lives are saved by preventative inoculation of children

who lack adequate medical care.

Recycling caps also means reducing the CO2 emitted in

disposal by burning. Our Group plans to continue expanding

the scope of this project.

The Iwate, Aizu-Wakamatsu, and Mie Plants awarded Director General Prize of Agency of Natural Resources and Energy, and Director General Prize of Regional Bureau of Economy, Trade and Industry

We collect PET bottle caps to fund vaccines for the children of the world

We reduce emissions of PFC gases, which have high global warming potential

The Iwate, Aizu-Wakamatsu, and Mie Plants, receiving praise

for their comprehensive energy efficiency improvements, were

honored as plants of outstanding energy management in the

years 2005 to 2007.

PFC gases, used in cleaning and etching during semiconduc-

tor manufacture, are greenhouse gases, and their global warm-

ing potential is said to be approximately 10,000 times that of

CO2. With assistance from NEDO*, we plan to set up PFC gas

processing equipment to render the gas harmless at the Mie

and Aizu-Wakamatsu plants, as well as to promote the use of

alternatives to PFC.

Also, with assistance from NEDO, we have decided to increase

energy efficiency in the Aizu-Wakamatsu Plant through the

introduction of energy-saving equipment such as high-efficiency

turbo freezers and miniature once-through boilers.

Plant Award

Iwate Plant

Director General Prize of Agency of Natural Resources and Energy for FY 2005 (Thermal Category*)

Director General Prize of Tohoku Bureau of Economy, Trade and Industry for FY 2005 (Electric Category*)

*The thermal and electric categories were merged in FY 2006.

Director General Prize of Agency of Natural Resources and Energy for FY 2006

Director General Prize of Chubu Bureau of Economy, Trade and Industry for FY 2007

Aizu-Wakamatsu Plant

Mie Plant

T o p i c s

* PRTR: Pollutant Release and Transfer Registers (a system for tabulating and publicizing emission rates of harmful chemicals into the environment)

* The New Energy and Industrial Technology Development organization, an independent administrative agency in Japan


Documents

Green Business Process & Green Products Guide advances make people s lives easier and enrich society. But resource consumption and emissions impact the environment, posing increasingly