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Futurrex NR9-3000PY Lift-Off Ph i Photoresist Exposure Characterization

Futurrex NR9-3000PY Lift-Off Ph i Photoresist

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Futurrex NR9-3000PY Lift-Off Ph iPhotoresistExposure Characterization

product overview

Negative Resist NR9-3000PY is a negative tone photoresist designed for 365 nm wavelength exposure, using tools such as wafer steppers, scanning projection aligners, proximity printers

d i and contact printers.

After resist development NR9-3000PY exhibits a negative-sloping resist sidewall profile, which facilitates a simple resist lift-off process.

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facilitates a simple resist lift off process.

These are advantages of NR9-3000PY over other resists:

superior resolution capability

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fast develop time

easy adjustment of the degree of resist undercut as a function of exposure energy

temperature resistance of up to 100°C

i t l i R i t R RR5

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– easy resist removal in Resist Remover RR5

shelf life exceeding 3 years at room temperature storage

The formulation and processing of NR9-3000PY were designed with regard to occupational and

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The formulation and processing of NR9-3000PY were designed with regard to occupational and environmental safety. The principal solvent in NR9-3000PY is cyclohexanone and development of NR9-3000PY is accomplished in a basic water solution.

application(s)

Futurrex NR9-3000PY is used for lift-off purposes for any metallization deposition process below 100°C.

The following SEM image is of NR9-3000PY geared for thicker lift-off applications at approximately 5µm thickness:

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characterization test conditions

Futurrex Negative Lift-Off Photoresist NR9-3000PY 3 thi k3 µm thickness

Spin Coat at 3000 rpm

Post Coat Bake 120°C / 60 s

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ASML / 80 i-line Stepper at 0.48 NAEnergy – 0 to 1000 mJ, steps 100 mJ

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e Focus – 0.0 µm, constant

Futurrex RD6 DeveloperPost Exposure Bake 120°C / 60 s

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Develop time 30 s, immersion with mild agitation

DI rinse & air dry

B Sili W f

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Bare Silicon Wafers

NR9-3000PY exposure matrix

5 µm 5 µm 5 µm

3 µm 3 µm

5 µm

3 µm

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220mj 240mj 260mj 280mj

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5 µm

3 µm

5 µm5 µm

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5 µm

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– 3 µm3 µm3 µm3 µm

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300mj 360mj320mj 340mj

linewidth control

Futurrex Negative Lift-Off Photoresist NR9-3000PY

Li idth C t l 360 J/ ² t 280 J/ ²Linewidth Control: 360mJ/cm² to 280mJ/cm²

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