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Electron Probe Microanalyzer (EPMA) Fabrication area: Lithography Electron-beam Lithography System: Raith e-Line Dual Beam System (Focused Ion Beam/Electron beam): JEOL SMI-3050SE Nanoimprint Lithography System: Molecular Imprints Imprio 55 DipPen Lithography System: Nanoink Nscriptor Mask Aligner: Neutronix/Quintel Q-4000-4 with IR backside alignment; Karl Suss MJB3 with IR backside alignment Surface Profiler: KLA-Tencor Alpha-Step IQ Inspection Microscope: Carl Zeiss Axio Imager M1m Thin film deposition Plasma-enhanced Chemical Vapor Deposition System (PECVD): Trion Orion II Multi-Source Electron-beam Evaporation System: Thermionics VE-180 Dry etching Reactive Ion Etching System (RIE): Trion Phantom LT Ion Beam Etching/Deposition System: Veeco ME-301 Plasma Cleaner: South Bay Technology PC-2000 RF Wet processing Dedicated wet benches for wafer cleaning and chemical processing Characterization area: Electron microscopy Transmission Electron Microscope: JEOL JEM-2100F Scanning Electron Microscope: JEOL JSM-6510LV/LGS Electron Probe Micro Analyzer: JEOL JXA-8530F Scanning probe microscopy Multifunctional Scanning Probe Microscopy Station: Veeco Dimension V and MultiMode V; Scanning Capacitance, Scanning Spreading Resistance, and Tunneling/conductive AFM Application Modules X-ray Diffraction High-Sensitivity Modular X-ray Diffraction System: Bruker D8 Discover with GADDS Spectroscopy Spectroscopic Ellipsometer: Horiba Jobin Yvon UVISEL: Phase modulated, Variable angle, 190-2100 nm Microspectrophotometer: CRAIC QDI 2010 UV-Vis-NIR: 200-2100 nm FTIR: Bruker VERTEX 70-LS FTIR with HYPERION 2000 Imaging Microscope Dilution Refrigerator Dilution Refrigerator: Oxford DR200 Characterization TEM: JEOL JEM-2100F The JEOL JEM-2100F is a modern computer-controlled high- resolution transmission electron microscope (HR-TEM) with excellent analytical performance for daily use in a multi-user environment. The configuration of the instrument combines ease of use with capability for routine atomic resolution imaging of crystal lattices by coherent electron scattering or phase contrast (TEM) and by incoherent electron scattering or Z-contrast in the scanning transmission electron microscopy (STEM) mode. For analytical TEM, it offers routinely local spatial resolution at 2nm or better. When operated in STEM mode, the instrument offers electron probes as small as 0.16nm for incoherent imaging and 0.5nm for analytical purposes of XEDS and EELS. The JEM-2100F is equipped with attachments for XEDS analysis from Oxford Instruments (Inca platform) and a GIF TRIDIEM post-column energy filter (Gatan Inc.) for acquisi- tion of energy-filtered images and diffraction. Hence, atomic column resolution imaging, elemental composition, and local electronic structure measurement are enabled with this modern field-emission TEM/STEM. Electron Probe Microanalyzer (EPMA): JEOL JXA-8530F The EPMA is a field emission electron probe microanalyzer combining high SEM resolution with high-quality composition analysis of submicron areas. The JEOL JXA-8530F instrument is equipped with 6 WDS detectors (3 for heavy elements and 3 for light elements) and an energy dispersive X-ray spectrometer (EDS). This combination can simultaneously analyze 3 elements WDS, 16 elements EDS, and collect image signals from back- scatter and secondary electron detectors. High detection sensitivity for trace elements; High accuracy of quantitative analysis; High resolving power for adjacent X-ray spectra; High accuracy of light element analysis 3nm secondary electron resolution Minimum probe size: 40nm (at 10 kV, 10 nA) a bi-layer lithography technique in which a low viscosity, UV-curable liquid is dispensed in droplets onto an underlying standard organic planarization layer, enabling imprinting on a wide range of semiconductor device layers. The Imprio 55’s step-and-repeat process has the flexibility to support up to 8 inch wafers with a low-cost single-size template. Fragile substrates like GaAs, InP, or glass can also be imprinted. The Imprio 55 can imprint up to a 10mm square field or a 14mm diameter round field during its step-and-repeat process. Electron Beam Lithography: Raith “E-Line” The ultra-high-resolution electron beam Lithography and Nano Engineering workstation e_LiNE is the most versatile e-beam system for uncompromised nanostructuring, pattern inspection, dimensional metrology, and nano engineering. The state-of-the-art e_LiNE electron column matches perfectly with a number of key applications in nanoscale device fabrication, thin film engineering, photonic crystals, and EBID. Filament type Schottky thermal field emission Stage travel range 100 x 100 x 30 mm Beam Size 2nm @ 20 keV Beam energy 100eV–30 keV; Current density 7.500 A/cm² Beam resolution 2 nm @ 20 KeV, 4 nm @ 1 KeV Minimum line width 20 nm guaranteed Stitching accuracy 60nm; Overlay accuracy 40nm Import file formats GDSII, DXF, CIF, ASCII, BMP Optical Lithography: Mask Aligner Quintel “Q4000 MA” and Karl Suss MJB3 The Q4000 Mask Alignment System is an integrated optical- mechanical, pneumatic-electrical system which allows accurate alignment of sensitized semiconductor wafers or substrates with a mask and exposes them to ultraviolet radiation to transfer the pattern of the mask to the substrate for further processing on the way to producing a semicon- ductor or other microelectronic device. Nanoscale Fabrication and Characterization Facility DipPen Nanolithography: Nanoink Nscriptor The DipPen method turns an atomic force microscope (AFM) into a nanofabrication platform. An AFM probe tip coated with “ink” contacts a surface and deposits ink on it, enabling the user to write nanoscale patterns of molecular “ink” onto a sample substrate. The Nanoink Nscriptor system is a fully integrated hardware and software system that is optimized for the DipPen process. • Nanotechnology Multi-component nanofabrication; silicon-etch nanostructures; directed assembly of nanotubes; and templated nanoparticle assembly • Biotechnology Protein nanoarrays; ultra-high-density DNA arrays; large-area biological patterning; and biosensor prototyping • Molecular Electronics Functionalized nanowires Dual Beam System: Seiko “SMI3050SE FIB-SEM” with Oxford Instruments “Inca XEDSThe Seiko Instruments SMI3050SE FIB-SEM instrument com- bines a Ga + focused ion beam column for nanoscale fabrication and a field emission SEM for observation during FIB process- ing. The specified image resolution is 4nm. The common applications of this instrument are for nanoscale patterning/ fabrication or TEM sample preparation. The ion beam can be used to remove regions of a sample or to deposit W metal in specified locations and patterns. Bitmap files or vector scans can be used to create complex patterns and shapes. For TEM sample preparation, an attached microprobe is used to “pick- up” cross-sectional samples in-situ and transfer them to grids. The instrument also is equipped with an Oxford Instruments XEDS system for elemental identification and quantification. Nano Imprint Lithography: Molecular Imprints Imprio 55 The MII Imprio 55 is a nano-imprint lithography tool with proven resolution down to 30nm. The Imprio 55 utilizes S-FIL, Fabrication XRD: Bruker D8 Discover with GADDS The D8 DISCOVER brings innovative thin film solutions from the forefront of research to quality control, product and process development. Based on the D8 platform with reliable mechan- ics and ergonomic design the D8 DISCOVER includes unique advantages: Third-generation Göbel Mirrors providing the highest X-ray flux density—essential for all thin film applications. The entire system is designed for easy and fail-safe opera- tion. Tools like the motorized absorber allow fully automatic operation without user intervention. High-performance optics are selected and exchanged to provide the optimum resolution for each application and sample. Optimal sample handling takes advantage of the new UMC stages as well as different types of Eulerian cradles such as, for example, residual stress, texture, and micro- diffraction investigations. For X-ray reflectometry on coatings or semiconductors dedicated stages allow for even temperature studies. Shortest measurement times are achieved using Ultra GID for nanometer layers and the VANTEC-1 detector for reciprocal space maps. XRD Wizard and XRD Commander support the user in the most intuitive creation of comprehensive measurements; intelligent scripts take care of the routine work. The evalu- ation programs LEPTOS and MULTEX Area guarantee that you stay on the forefront of science. (Cleanroom class 100 and 1,000 areas) Five Different Types of Lithography Electron Beam Lithography Raith “E-Line” Nano Imprint Lithography Dual Beam System: Seiko “SMI3050SE FIB-SEM” XRD: Bruker D8 Discover with GADDS DipPen Nanolithography TEM: JEOL JEM-2100F Optical Lithography

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Page 1: Five Different Types of Lithography and Characterization ... · Quintel “Q4000 MA” and Karl Suss MJB3 The Q4000 Mask Alignment System is an integrated optical-mechanical, pneumatic-electrical

Electron Probe Microanalyzer (EPMA)

Fabrication area:LithographyElectron-beam Lithography System: Raith e-LineDual Beam System (Focused Ion Beam/Electron beam): JEOL SMI-3050SENanoimprint Lithography System: Molecular Imprints Imprio 55DipPen Lithography System: Nanoink Nscriptor Mask Aligner: Neutronix/Quintel Q-4000-4 with IR backside alignment; Karl Suss MJB3 with IR backside alignment Surface Profiler: KLA-Tencor Alpha-Step IQInspection Microscope: Carl Zeiss Axio Imager M1m

Thin film depositionPlasma-enhanced Chemical Vapor Deposition System (PECVD): Trion Orion II Multi-Source Electron-beam Evaporation System: Thermionics VE-180

Dry etchingReactive Ion Etching System (RIE): Trion Phantom LTIon Beam Etching/Deposition System: Veeco ME-301Plasma Cleaner: South Bay Technology PC-2000 RF

Wet processingDedicated wet benches for wafer cleaning and chemical processing

Characterization area:Electron microscopyTransmission Electron Microscope: JEOL JEM-2100F Scanning Electron Microscope: JEOL JSM-6510LV/LGSElectron Probe Micro Analyzer: JEOL JXA-8530F

Scanning probe microscopyMultifunctional Scanning Probe Microscopy Station: Veeco Dimension V and MultiMode V; Scanning Capacitance, Scanning Spreading Resistance, and Tunneling/conductive AFM Application Modules

X-ray Diffraction High-Sensitivity Modular X-ray Diffraction System: Bruker D8 Discover with GADDS

SpectroscopySpectroscopic Ellipsometer: Horiba Jobin Yvon UVISEL: Phase modulated, Variable angle, 190-2100 nmMicrospectrophotometer: CRAIC QDI 2010 UV-Vis-NIR: 200-2100 nmFTIR: Bruker VERTEX 70-LS FTIR with HYPERION 2000 Imaging Microscope

Dilution RefrigeratorDilution Refrigerator: Oxford DR200

Characterization TEM: JEOL JEM-2100FThe JEOL JEM-2100F is a modern computer-controlled high-resolution transmission electron microscope (HR-TEM) with excellent analytical performance for daily use in a multi-user environment. The configuration of the instrument combines ease of use with capability for routine atomic resolution imaging of crystal lattices by coherent electron scattering or phase contrast (TEM) and by incoherent electron scattering or Z-contrast in the scanning transmission electron microscopy (STEM) mode. For analytical TEM, it offers routinely local spatial resolution at 2nm or better. When operated in STEM mode, the instrument offers electron probes as small as 0.16nm for incoherent imaging and 0.5nm for analytical purposes of XEDS and EELS. The JEM-2100F is equipped with attachments for XEDS analysis from Oxford Instruments (Inca platform) and a GIF TRIDIEM post-column energy filter (Gatan Inc.) for acquisi-tion of energy-filtered images and diffraction. Hence, atomic column resolution imaging, elemental composition, and local electronic structure measurement are enabled with this modern field-emission TEM/STEM.

Electron Probe Microanalyzer (EPMA): JEOL JXA-8530FThe EPMA is a field emission electron probe microanalyzer combining high SEM resolution with high-quality composition analysis of submicron areas. The JEOL JXA-8530F instrument is equipped with 6 WDS detectors (3 for heavy elements and 3 for light elements) and an energy dispersive X-ray spectrometer (EDS). This combination can simultaneously analyze 3 elements WDS, 16 elements EDS, and collect image signals from back-scatter and secondary electron detectors.

• Highdetectionsensitivityfortraceelements;Highaccuracyof quantitative analysis; High resolving power for adjacent X-ray spectra; High accuracy of light element analysis

• 3nmsecondaryelectronresolution• Minimumprobesize:40nm(at10kV,10nA)

a bi-layer lithography technique in which a low viscosity, UV-curable liquid is dispensed in droplets onto an underlying standard organic planarization layer, enabling imprinting on a wide range of semiconductor device layers. The Imprio 55’s step-and-repeat process has the flexibility to support up to 8 inch wafers with a low-cost single-size template. Fragile substrates like GaAs, InP, or glass can also be imprinted. The Imprio 55 can imprint up to a 10mm square field or a 14mm diameter round field during its step-and-repeat process.

Electron Beam Lithography: Raith “E-Line” The ultra-high-resolution electron beam Lithography and Nano Engineering workstation e_LiNE is the most versatile e-beam system for uncompromised nanostructuring, pattern inspection, dimensional metrology, and nano engineering. The state-of-the-art e_LiNE electron column matches perfectly with a number of key applications in nanoscale device fabrication, thin film engineering, photonic crystals, and EBID. • FilamenttypeSchottkythermalfieldemission• Stagetravelrange100x100x30mm• BeamSize≤ 2nm @ 20 keV • Beam energy 100eV–30 keV; Current density ≥ 7.500 A/cm² • Beamresolution2nm@20KeV,4nm@1KeV• Minimumlinewidth20nmguaranteed• Stitchingaccuracy60nm;Overlayaccuracy40nm• ImportfileformatsGDSII,DXF,CIF,ASCII,BMP

Optical Lithography: Mask Aligner Quintel “Q4000 MA” and Karl Suss MJB3 The Q4000 Mask Alignment System is an integrated optical-mechanical, pneumatic-electrical system which allows accurate alignment of sensitized semiconductor wafers or substrates with a mask and exposes them to ultraviolet radiation to transfer the pattern of the mask to the substrate for further processing on the way to producing a semicon-ductor or other microelectronic device.

Nanoscale Fabrication and Characterization Facility DipPen Nanolithography: Nanoink Nscriptor

The DipPen method turns an atomic force microscope (AFM) into a nanofabrication platform. An AFM probe tip coated with “ink” contacts a surface and deposits ink on it, enabling the user to write nanoscale patterns of molecular “ink” onto a sample substrate. The Nanoink Nscriptor system is a fully integrated hardware and software system that is optimized for the DipPen process.•Nanotechnology Multi-component nanofabrication; silicon-etch

nanostructures; directed assembly of nanotubes; and templated nanoparticle assembly

•Biotechnology Protein nanoarrays; ultra-high-density DNA arrays; large-area biological patterning; and biosensor prototyping•MolecularElectronics Functionalized nanowires

Dual Beam System: Seiko “SMI3050SE FIB-SEM” with Oxford Instruments “Inca XEDS” The Seiko Instruments SMI3050SE FIB-SEM instrument com-bines a Ga+ focused ion beam column for nanoscale fabrication and a field emission SEM for observation during FIB process-ing. The specified image resolution is 4nm. The common applications of this instrument are for nanoscale patterning/fabrication or TEM sample preparation. The ion beam can be used to remove regions of a sample or to deposit W metal in specified locations and patterns. Bitmap files or vector scans can be used to create complex patterns and shapes. For TEM sample preparation, an attached microprobe is used to “pick-up” cross-sectional samples in-situ and transfer them to grids. The instrument also is equipped with an Oxford Instruments XEDS system for elemental identification and quantification.

Nano Imprint Lithography: Molecular Imprints Imprio 55The MII Imprio 55 is a nano-imprint lithography tool with proven resolution down to 30nm. The Imprio 55 utilizes S-FIL,

Fabrication XRD: Bruker D8 Discover with GADDSThe D8 DISCOVER brings innovative thin film solutions from the forefront of research to quality control, product and process development. Based on the D8 platform with reliable mechan-ics and ergonomic design the D8 DISCOVER includes unique advantages:

• Third-generationGöbelMirrorsprovidingthehighestX-rayflux density—essential for all thin film applications.

• Theentiresystemisdesignedforeasyandfail-safeopera-tion. Tools like the motorized absorber allow fully automatic operation without user intervention.

• High-performance optics are selected and exchanged to provide the optimum resolution for each application and sample.

• Optimalsamplehandlingtakesadvantageofthenew UMC stages as well as different types of Eulerian cradles such as, for example, residual stress, texture, and micro- diffraction investigations. For X-ray reflectometry on coatings or semiconductors dedicated stages allow for even temperature studies.

• ShortestmeasurementtimesareachievedusingUltraGIDfor nanometer layers and the VANTEC-1 detector for reciprocal space maps.

• XRDWizardandXRDCommandersupporttheuserinthemost intuitive creation of comprehensive measurements; intelligent scripts take care of the routine work. The evalu-ation programs LEPTOS and MULTEX Area guarantee that you stay on the forefront of science.

(Cleanroom class 100 and 1,000 areas) Five Different Types of Lithography

Electron Beam Lithography Raith “E-Line” Nano Imprint LithographyDual Beam System: Seiko “SMI3050SE FIB-SEM”XRD: Bruker D8 Discover with GADDS DipPen NanolithographyTEM: JEOL JEM-2100F Optical Lithography

Page 2: Five Different Types of Lithography and Characterization ... · Quintel “Q4000 MA” and Karl Suss MJB3 The Q4000 Mask Alignment System is an integrated optical-mechanical, pneumatic-electrical

The University of Pittsburgh is an affirmative action, equal opportunity institution. Published in cooperation with the Department of University Marketing Communications. UMC79843-1011

Nanoscale Fabrication and Characterization Facility (NFCF)

An integral part of the

Petersen Institute of NanoScience and Engineering (PINSE)

PINSE supports the Nanoscale Fabrication and Characterization Facility (NFCF), a 4,000 ft2 cleanroom user facility located in the sub-basement of Benedum Hall. The NFCF was inaugurated on September 29, 2006. This facility houses state-of-the-art equipment with core nano-level fabrication/analysis capability. There are several features that make the capabilities of NFCF unique, including 5 different types of Lithography (Optical, EBL, Dual Beam, DipPen, and Imprint), a Field-Emission Microprobe (EPMA), and a TEM. The NFCF is open to both internal and external users, and this interdisciplinary user facility will act as a catalyst for further collabora-tions among the different departments and schools at the University of Pittsburgh. The NFCF is organized to provide training of graduate students in applications of advanced nanoscience fabrication and characterization techniques. The dedicated staff also is available to instruct, assist, and provide service to occasional users. With these state-of-the-art resources available on campus, PINSE is the leading center for advancing the field of nanoscience and engineering.

The NFCF is designed to support fabrication and characterization of nanoscale materials and structures as well as integration of devices down to <10nm length scales. At this “essentially nano” dimension of material synthesis and integration, the greatest breakthroughs in nanoscience are expected to occur.

Work by PINSE researchers has resulted in:• developingspecialcoatingswithnanoparticlesthatpreventsurfaces

from icing;• investigatingmaterialscontainingnanosizebitsofsemiconductormaterialto

solve one of the chief problems standing in the way of making paint convert sunlight into electricity;

• integratingbiologyandnanotechnologiestodevelophighlysensitive, easy-to-use biosensors that push the boundaries of diagnostic medicine;

• identificationofahumanenzymethatcanbiodegradecarbonnanotubes and could open the door for the use of carbon nanotubes as a safe drug delivery tool; and

• developmentofanelectronmicroscopymethodforrecordingmovies of optical and electronic excitations on a 50nm spatial scale and a 10 femtosecond temporal scale.

If you wish to become an external user of the NFCF, please e-mail [email protected].

PINSE uses Facilities Online Management (FOM) software for the NFCF to track users and instrumentation. Features include individual instrument calendars for easy time-slot reservations, sign-up lists for instrument training, and organized billing abilities.

Contact Us:Hong Koo Kim, PhDCo-Director of [email protected]

Hrvoje Petek, PhDCo-Director of [email protected]

Susheng Tan, PhDResearch Assistant Professor, [email protected]

Mike McDonaldManager, [email protected]

NFCF OfficesM 104 Benedum [email protected]

How do I become a user?

Gertrude E. and John M. Petersen Institute of NanoScience and Engineering