Embed Size (px)
Citation preview
CCTC Tech RoadmapPlant 1 and Plant 2 (HDI)
FeaturesStandard, currently
available, no added costAvailable, slightly more expensive,
possibly longer lead timeAvailable, more expensive, possibly longer lead time
Not available today, R&D only
Minimum Dielectric
Core
Outer layer 5 mil 4 mil 3 mil 2 milInner layer 5 mil 4 mil 3 mil 2 milMinimum Dielectric
Preg
Outer layer 4 mil 3 mil 2 mil 1 milInner layer 4 mil 3 mil 2 mil 1 milDielectric Multi-Function FR4 135Tg Multi-Function FR4 150Tg Multi-Function FR4 180Tg 250TgMaterial
Metal Hasl CU106A,OSP Enig,Tin,Silver Electrolytic AU contacts 30mi Electro AU>30miFinishes
Soldermask Thickness on Traces
0.4 0.8
Maximum 7:01 8:01 10:01 13:01Aspect Ratio
Working Panel Sizes
18x24 20x24 24x24 24x36
X-Outs Allowed 10% Not Allowed
Features Standard, currently available, no added cost
Available, slightly more expensive, possibly longer lead time
Available, more expensive, possibly longer lead time
Not available today, R&D
only
Minimum line width
Outer layer 5 mil 4 mil 3 mil 2 milInner layer 5 mil 4 mil 3 mil 2 milMinimum finished
via diameter 13 mil 10 mil 8 mil 6 mil(after copper
plating)Drill size 0.4 mm Drill size 0.35 mm Drill size 0.3 mm Drill size 0.25
mmMinimum 23 mil 20 mil 16 mil 12 mil (VIP)via pad
diameterMinimum Drill size +24 mils Drill size + 20 mil Drill size + 18 mil Drill size + 15
milplane clearance diameterMinimum
soldermask clearance diameter
Drill size +13 mils Drill size + 12 mil Drill size + 10 mil Drill size + 9 mil
Minimum 4 mil 3 mil 2.5 mil 2 milsoldermask
damMax./Min. plugged
soldermask via
(drill size) 26mil/13mil 26mil/12mil 26mil/10mil 26mil/8milMaximum 93 mil 125 mil 250 mil 300 mil
board thicknessMinimum 20 mil 18 mil 16 mil 10 mil
board thicknessMaximum 16” * 20” 19" * 23" 22" * 23" --
board dimension
Surface Finishes Offered
◆ HASL
◆ OSP
◆ ENIG
◆ Selective ENIG+OSP ◆ Flash Gold ◆ Gold contacts
◆ Immersion Tin
◆ Immersion Silver
◆ Lead Free HASL
◆ Carbon Print
◆ Peelable mask
Production flow chart of Conventional Product
ShearingInner layer image
Inner layer punching
Lamination
Brown Oxide
Inner layer AOI
Drilling
De-smearThru Hole Plating
Outer layer Image
Pattern Plating
Alkaline Etching
Outer layer AOI Soldermask
Legend Routing Electrical Test
Final Inspection
Inner layer dev. etch strip
Panel Plating
Drilling X-Ray
De-burring
ENIG
Immersion Tin
HASL or LF HASL
Contact Plating
Immersion Silver
OSP
Packaging
Material
CCTC Process Capability (Standard Technology-P1)
STD Technology Roadmap 2011
Surface Item UnitMass Production
CapabilityR&D
HAL Tin/lead Thk MI Avg ≥100 Avg ≥ 300
OSP Coating Thk MI 0.15≤X≤0.30
ENIG Min. Ni MI 100≤X≤160 160 ＜ X≤200
Min Au MI 2.0≤X ＜ 3.2 3.2 ＜ X≤3.5
Selective ENIG+OSP Same as ENIG or OSP
Flash Gold Min. Ni MI ≤150 ＞ 150
Min Au MI Etch resist or 1≤X≤2 ≤3
Gold Contacts Min. Ni MI ≤160 160 ＜ X≤200
Min Au MI ≤30 35 ＜ X≤70
Immersion Tin Sn Thickness MI 0.8≤X≤1.0 1.0≤X≤1.2
Immersion Silver Ag thickness MI6≤X≤18
Carbon Print Thickness MI 15±5 20±5
Peelable mask Thickness MI ≤0.2 0.2 ＜ X≤0.3
STD Technology Roadmap 2011
Item Mass Capability R&D Remarks
Layers 28 36
Layer to layer alignment ± 4mil ± 3mil
Min. Dielectric Thickness 3mil
Inner layer Cu ≤ 1OZ
Core thickness 4mil - 63mil 3mil - 98mil
Finished board thickness 16mil - 236mil 250mil
Thickness Tolerance
≤31mil ± 3mil ± 2mil
31mil - 47mil ± 4mil ± 3mil
47mil - 63mil ± 10% ± 8%
＞ 1.6mm ± 10% ± 8%
Material Type
Standard LaminateFR-4 , CEM-3 , Halogen-Free, High Tg , CAF material, High CTI
High frequency Laminate
Rogers , Arlon , PI , BT , PTFE
STD Technology Roadmap 2011
Items Mass Capability R&DRemarks
Panel Dimension
T ＞ 1.0mm 26×20″ 28×24″
T ≤1.0mm 20×16″-24×18″
Warp & twist
T ＞ 1.0mm ≤ 0.5% ≤ 0.4% Exclude unbalance layout or stackup. T ≤1.0mm ≤ 0.75% ≤ 0.5%
Aspect Ratio ＜ 8 ： 1 ≤ 12 ： 1
Hole wall Cu (Avg.) ≤ 0.98mil ≤ 1.2mil
Innerlayer base Cu thickness .33oz, 0.5oz, 1oz, 2oz, 3oz, 4oz, 5oz
Outelayer Cu thickness .33oz, 0.5oz, 1oz, 2oz, 3oz, 4oz,5oz
STD Technology Roadmap 2011Item Mass Capability R&D Remarks
Line width tolerance
Line width≥10mil ±1.5 mil ±1.0 mil
5mil≤ Line width ＜ 10 mil
±1.0 mil ±0.8 mil
Line width <5mil ±0.8 mil ±0.6 mil
Single-ended impedance
28≤ impedance < 50Ω ± 10% ± 8%
50≤ impedance ≤90Ω ± 10% ± 8%
>90Ω ± 8% ± 6%
Differential impedance
impedance < 50Ω ± 15% ± 12%
50≤ impedance ≤90Ω ± 15% ± 10%
>90Ω ± 12% ± 8%
STD Technology Roadmap 2011Item Mass Capability R&D Remarks
Process Method (Soldermask) Screen Printing
Alignment ±2 mil
Thickness
On Surface ≥0.40 mil
On Laminate≤1.60 mil
Developing capability (drill)≥ 16mil
With S/M clearance
Soldermask
Type
Taiyo PSR4000 Tamura DSR 2200 Halogen Free
Soldermask
Huntsman
Color Green, blue, red, black Matte
Board thickness for plug via requirement
24mil - 95mil 20mil - 98mil
Plug via size (drill size)10mil - 22mil 6mil - 31mil
STD Technology Roadmap 2011Item Mass Cap. R&D Remarks
Hole Size tol.
NP round hole ±2mil ±1mil
NP slot ±3mil ±2mil
PTH round hole ±3mil ±2mil
PTH slot ±4mil ±3mil
Slot Location
Slot width≤87mil Len./wid≥2 Len./wid ≥1.5
87mil ＜ slot width ≤118mil
Len./wid ≥2 Len./wid ≥1.3
slot width ＞ 118mil Len./wid ≥1.3 Len./wid ≥1.2
Hole Registration tol. ±3mil ±2mil
width
length
STD Technology Roadmap 2011Item Mass Cap. R&D Remarks
Routing
Tolerance ±4mil ≥ ±3mil
Hole to outline tolerance ±5mil ≥ ±3mil
V-CUT
Thickness 20mil - 98mil 138mil
Angle 30° 、 45° 60°
Core Thickness ±2mil ±1mil
Alignment of upper and lower cuts
±4mil ≥ ±3mil
Chamfer
Thickness 31mil - 98mil 138mil
Angle 20 – 60° 60 – 90 °
Depth Range 20mil - 79mil
Depth tol. ±8mil ≥ ±6mil
Tg 140 FR-4Rigid Laminate
for Double Side Rigid Board (Not for lead free assy)
Pro
duct
Shengyi 1141Application
Approved Laminates
*Isola -FR-226
*Shengyi 1141 KFfor Low to Medium Layer Count Multilayer, Anti-CAF (Not for lead free assy)
for High Frequency/ Low Signal Loss
Tg 150 Multifunction Laminate
Tg 170 Td Stable Laminate
Tg 175 Td 330
Tg 180 Td 340Tg 180 Td 350
Tg 210 Low Dk & Df
Tg >280 Low LossHydrocarbon/ceramic
Halogen Free Green Material
for Medium to High (Not for lead free assy)Layer Count Multilayer, low CTE
for Medium to High Layer Count Multilayer
for High Layer Count/Dimensional Stable Back Panels ,Lead-free applications
for Thermal Reliable IC Substrate, Multilayer & Telecom PWB
for Environment Friendly PWB
for High Signal Speed/ Signal Integrity Electronics
*Shengyi 1141 150
*Shengyi 1141 170
*Shengyi S1000-2
*Isola -370HR
*Isola FR408
* Rogers 4350 O/L only
*Shengyi 1155
*Panasonic
Tg 140 MultifunctionLaminate
PTFE Microwave Laminate
Rogers UL22Taconic RF35
Isola IS410
for High Frequency/ Low Signal Loss
*UL Approved
R&D
Laminate Type
LF
HF
Tg (℃) /DSC
Td-5% (℃)
/TGA
IPC-4101B
Z-CTE/TMA
T-260 (min)/TM
A
T-288 (min)/TMA
Dk/1MH
z
Df/1MHz
Fill
AntiCAF
Res sys
a1/a2 ppm /℃)
50-260℃
IsolaPCLFR-370-HR
Y N 180 350IPC-
4101B/12645/220 2.6% 60 20 4.8
0.015
Y Y PN
Isola FR408 Y N 185 350IPC-
4101B/99 19/230 3.3% 60 60 3.60.01
2N Y MF
Shengyi S1000 Y N 150 335IPC-
4101B/9948/250 3.3% 60 10 4.7
0.011
Y Y PN
Shengyi S1000-2 Y N 180 340IPC-
4101B/12645/220 2.8% 60 20 4.8
0.013
Y Y PN
ITEQ IT158TC Y N 150 340IPC-
4101B/9940/250 3.3% 60 20 4.8
0.016
Y Y PN
ITEQ IT180ATC Y N 180 340IPC-
4101B/12645/240 2.8% 60 20 4.7
0.017
Y Y PN
According to our experiments on lead free material, the experience during
the PCB manufacturing and also the feedback from our customers during
their assembly, we compared the general property parameters of various
lead free material. Please refer to below table:
Basic Property Comparison for Various Material
CCTC Process Capability (HDI Technology-P2)
Item
Current 2012 2013
Mass Production
R&DMass
ProductionR&D
Mass Production
R&D
Resin System
FR-4 Normal Tg Yes --- Yes --- Yes ---
FR-4 Middle Tg -150 Yes --- Yes --- Yes ---
FR-4 High Tg -180 Yes --- Yes --- Yes ---
Halogen Free FR-4 Yes --- Yes --- Yes ---
Rogers 4350 2lyr Yes --- Yes --- Yes ---
BT Limited --- Yes --- Yes ---
Polyimide Limited --- Yes --- Yes ---
RCC and Prepreg
RCC Yes --- Yes --- Yes ---
Prepreg (recommended ） Yes --- Yes --- Yes ---
Current Supplier1. Shengyi ； 2. Panasonic ； 3. Goworld ； 4. ITEQ ； 5. Grace;
6. Rogers ； 7. Arlon 8. MGC ； 9.LG;
HDI Technology Roadmap 2011
HDI Technology Roadmap 2011
Item
Current 2012 2013
Mass Production
R&DMass
ProductionR&D
Mass Production
R&D
HDI N+C+N 3 4 3 4 4 6
Any layer 4+2+4 5+2+5 4+2+4 6+2+6 5+2+5 6+2+6
Any layer min. core (mm/mil) .075/3 .05/2 .075/3 .05/2 .05/2 .035/1.4
Max. board thickness2.4/95 3.2/126 2.4/95 3.2/126 2.4/95 3.2/126
( mm/mil )
Min. board thickness
0.2/8 0.2/8 0.2/8 0.2/8 0.2/8 0.2/8
( mm/mil )
Warp & Twist tolerance 0.75% --- 0.75% --- 0.75% ---
HDI Technology Roadmap 2011
Item
Current 2012 2013
Mass Production
R&DMass
ProductionR&D
Mass Production
R&D
Min. core thickness (mm/mil)0.1/4 0.075/3 0.1/4 0.075/3 0.1/4 .075/3
（ include copper ）Min. dielectric thickness
.05/2 .05/2 .05/2 .04/1.6 .05/2 .03/1.5(mm/mil )
Min. line width/space.075/3 .05/2 .05/2 .03/1.5 .04/1.6 .03/1.5
(mm/mil)
Tol. of W ＜ 4mil/ .1mm ± 35% ± 20% ± 35% ± 20% ± 35% ± 20%
line width W ≥4mil/ .1mm ± 20% ± 10% ± 20% ± 10% ± 20% ± 10%
Min. annular ring (mil) 5 4 4 3 3 2
Min. Clearance (mil) 6.5 5 6 5 6 5
Min. hole to trace (mil) 6.5 5 6 5 6 5
HDI Technology Roadmap 2011
Item
Current 2012 2013
Mass Production
R&DMass
ProductionR&D
Mass Production
R&D
Min. drill hole diameter (mm/mil) 0.2/8 0.2/8 0.15/6 0.15/6 0.15/6 0.15/6
PTH Tolerance (mil) 2 --- 2 --- 2 ---
NPTH Tolerance (mil) 2 1 2 1 2 1
Aspect ratio of PTH 8:01 10:01 8:01 10:01 8:01 10:01
Hole location accuracy ( mil ) 3 2 3 2 3 2
HDI Technology Roadmap 2011
Item
Current 2012 2013
Mass Production
R&DMass
ProductionR&D
Mass Production
R&D
Min. Laser Drill diameter (mil) 4 3 3 2 3 2
Aspect ratio of Microvia 1:01 1:01 1:01 1:01 1:01 1:01
Plate Filling Microvia (if required) Yes --- Yes --- Yes ---
Stacked via & via on hole Yes --- Yes --- Yes ---
Min. Capture Pad annular ring ( mil ) 12 10 10 10 8 8
Min. Target Pad annular ring (mil ) 12 10 10 10 8 8
Laser drill method Large Window, Conformal Mask and Copper Direct Drill
HDI Technology Roadmap 2011
Item
Current 2012 2013
Mass Production
R&DMass
ProductionR&D
Mass Production
R&D
Plug hole board thickness (mm/mil) min/max .5-2.4/20-94 .4-3.2/16-126 .4-2.4/16-94 .4-3.2/16-126 .4-2.416/94
.4-3.2/16-126
Plug hole diameter( mil ) 8-31 6-8 8/31 6-8 8/31 6-8
Solder Mask registration tolerance ( mil )
±1.5 --- ±1.5 --- ±1.5 ---
Min. Solder dam ( mil ) 3 1.5 3 1.5 1.5 ---
Min. SMT Pitch ( mm/mil ) 0.3/12 --- 0.3/12 --- 0.3/12 ---
Min. BGA Pitch ( mm/mil ) 0.4/16 0.3/12 0.4/16 0.3/12 0.4/16 0.3/12
HDI Technology Roadmap 2011
Item
Current 2012 2013
Mass Production
R&DMass
ProductionR&D
Mass Production
R&D
Routing Tolerance ( mm/mil ) ± 0.1/4 ± 0.075/3 ± 0.1/4 ± 0.075/3 ± 0.1/4 ± 0.075/3
Punching Tolerance ( mm/mil ) ± 0.1/4 --- ± 0.1/4 --- ± 0.1/4 ---
Step Milling Tolerance （ mm/mil ） ± 0.1/4 ± 0.075/3 ± 0.1/4 ± 0.075/3 ± 0.1/4 ± 0.075/3
Min. Hole to board edge (mil)10 8 10 8 10 8
Impedance control
28≤ Z ＜ 50Ω ± 20% --- ± 20% --- ± 20% ---
50≤ Z ≤100Ω ± 10% --- ± 10% --- ± 10% ---
Z ＞ 100Ω ± 8% --- ± 8% --- ± 8% ---
Surface ProcessHASL, ENIG, OSP, ENIG+OSP, Electrolytic Ni/Au, Immersion-Silver,
Immersion-Tin, Gold finger, Peelable blue mask, Carbon ink
HDI Technology Roadmap 2011
Item
Current 2012 2013
Mass Production
R&DMass
ProductionR&D
Mass Production
R&D
Max. layer count 22 24 22 24 18 24
HDI N+C+N 3 4 3 4 4 6
Max. panel size (inch/mm)24x 18 24x 18 24x 18 24x 18 24x 18 24x 18
610x460 610x460 610x460 610x460 610x460 610x460
Max. board thickness (mm/mil)2.4/94 3.2/126 2.4/94 3.2/126 2.4/94 3.2/126
Min. board thickness (mm/mil)0.25/10 0.2/8 0.25/10 0.2/8 0.25/10 0.2/8
Tolerance of T ＜ 0.5 mm ± 0.05mm --- ± 0.05mm --- ± 0.05mm ---
thickness T ≥ 0.5 mm ± 10% --- ± 10% --- ± 10% ---
Warp & Twist tolerance 0.75% --- 0.75% --- 0.75% ---
HDI Technology Roadmap 2011
Item Mass Production R&D
HASL ( mi) Average Thickness ＞ 100 ＞ 300
ENIGMin Ni ( µ″) 100≤X≤150 X ＞ 150
Min Au ( µ″) 1.2≤X≤2.0 2.0 ＜ X≤4.0
OSP ( µm ) 0.25≤X≤0.5 0.35≤X≤0.5
Immersion-Silver ( µ″) 6≤X≤18
Immersion-Tin( µm ) 0.8≤X ≤ 1.0 1.0≤X ≤ 1.2
Gold Finger
Min Ni ( µ″) ≤160 160 ＜ X≤200
Min Au ( µ″) ≤35 35 ＜ X≤70
Peelable blue Mask ( mm ) ≤0.2 0.2 ＜ X≤0.3
Carbon ink ( mm) .15± 5 .20± 5
Thank You!
