European funding opportunies in micro and nanoelectronics Overview and perspecves · 2017. 11. 7. · H2020 – Last call on nanoelectronics ICT-08-2019: Unconvenonal nanoelectronics

Europeanfundingopportuni/esinmicroandnanoelectronics

Overviewandperspec/ves

EricFribourg-BlancCompe//veElectronicsIndustry

DGCONNECT

IUNET workshop – E. Fribourg-Blanc – 22 September 2017

Compe&&veelectronicsindustry

•  Por4olio–  Strategyonelectronics–  Nanoelectronics,integratedsystems&TOLAE–  ECSELJointUndertaking

•  Role:(re)posi&onEuropeinthemapofcompu&ngandintegrateddevices

•  ProjectmappingacrosstheCommissionsincethebeginningofFP7inmul&pleareas


Horizon2020areas


Horizon2020–electroniccomponents

Excellence in Science

Leadership in Enabling and

Industrial Technologies

(LEIT)

Societal Challenges

European Research Council (ERC) grants

Marie Slodowska-

Curie grants

Future and Emerging Technologies

collaborative projects

Electronic components

ENIAC/ECSEL Joint Undertaking


Somegenerali&es

•  Typesofproject–  RIA–ResearchandInnova&onAc&ons–  IA–Innova&onAc&ons–  CSA–Coordina&onandSupportAc&ons

•  Flagships–  Graphene–  HumanBrainProject–  QuantumTechnologies–infinalprepara&on

•  JointUndertakings–  StartedunderFP7–  Currently7JUs–>ECSELinDGCONNECT


Micro-nanoelectronicsWhathasbeenfundedsofar–keyfigures

•  9yearsoffunding–2007-2015•  ProgrammesFP7andH2020(2years),includingENIACandECSELJoint

Undertakings

•  7areasoffundingcoveringthefullspectrumofelectroniccomponenttechnologies

•  143projects•  About2100par&cipa&ons•  Totalcosts:3.6B€•  EUcontribu&on:880M€

0

5

10

15

20

25

30

Num

bero

fprojects

FP7 ENIAC H2020 ECSEL


Micro-nanoelectronicsvaluechain–Par&cipa&ons

Largecompanies37%

SMEs19%

RTOs20%

Universities24%


ECSELJOINTUNDERTAKING


ECSEL Joint Undertaking – objectives

•  Contribute to the development of a strong and globally competitive electronics components and systems industry in the Union;

•  Ensure the availability of electronic components and systems for key markets and for addressing societal challenges, aiming at keeping Europe at the forefront of technology development, bridging the gap between research and exploitation, strengthening innovation capabilities and creating economic and employment growth in the Union;

•  Align strategies with Member States to attract private investment and contribute to the effectiveness of public support by avoiding an unnecessary duplication and fragmentation of efforts and by facilitating the participation of actors involved in research and innovation;

•  Maintain and grow semiconductor and smart system manufacturing capability in Europe, including leadership in manufacturing equipment and materials processing;

•  Secure and strengthen a commanding position in design and systems engineering including embedded technologies;

•  Provide access of all stakeholders to a world-class infrastructure for the design and manufacture of electronic components and embedded/cyber-physical and smart systems; and

•  Build a dynamic ecosystem involving Small and Medium-Sized Enterprises (SMEs), thereby strengthening existing clusters and nurturing the creation of new clusters in promising new areas.


ECSEL Joint Undertaking


ECSEL Strategic Agenda


Projectsfunded

•  StrongfocusonInnova&onAc&ons•  ResearchandInnova&onAc&onsformaturingtechnologies

Evolu&on->LighthouseIni&a&ves•  Fundingin2016:2projects

–  Industry4.E–  Mobility4.E

•  Structuringac&onsforECSELtoreinforcethestrategicmid-termimpact

•  Currentlyunderdiscussionabouttheprojectswhichcouldbesupportedin2017


ECSEL–interimevalua&on

•  ReportwellreceivedintheCommission

•  ECSELrecognisedasastrategicinstrumenttosupportdigitalvaluechainsinEuropeinacoordinatedway

•  Anumberofrecommenda&onsweremadetoimprovethefunc&oning–  Developastrongerstrategyforelectroniccomponentsandsystems–  Engagemoreproac&velytobringthesystemscommunityandactorsinthe

strategy–  Improvetheprocessofmeasuringimpactandsuccessoftheinstrument–  HarmoniseMemberStatepar&cipa&onrulesandreimbursementrates


H2020LASTWORKPROGRAMME


H2020–Lastworkprogramme

LEIT-ICTWP2018-20

•  Unconven&onalNanoelectronics-–  exploringthedevelopmentofpromisingbeyond-CMOSdevices

•  LargeAreaElectronics-–  enhancingmanufacturability,integra&onwithconven&onalelectronic

componentsandtake-upinapplica&ons

•  ElectronicSmartSystems-–  integra&ngsensing,actua&ng,advancedprocessingandwirelesstransmission

–newfunc&onali&es,miniaturisia&onandperformanceimprovement


H2020–Lastcallonnanoelectronics

ICT-08-2019:Unconven/onalnanoelectronicsObjec&ve:accompanyenablingtechnologiesfortheadvancedCMOSandpreparetheroadbeyondCMOSExploratoryResearch

–  Differen&a&ngfactorsfortheIndustry

RIA–ResearchandInnova/on(30M€–100%funding)(Demonstra/onincontrolledenvironmentatalimitedscale)–  Energy-efficientcomputa&ondevicesbeyondthecurrentCMOSparadigm–  Energy-efficientcomputa&oncircuitarchitectures–  3Dandcryogenicelectronics–  Designforadvancednanoelectronicstechnologies


Preparingforproposals

•  Eachcallisunique–  Everywordoftheworkprogrammecountsbutitisusuallyenoughtohookyour

proposal(s)onanumberofthem,notall–  BewareofresubmissionsÄ  Preferablyrestartfromfreshevenifkeepingthesamecoreconcept(s)

•  Excellentproposal–some(non-binding)considera&ons–  Withascoreof13.5(4.5oneachcriteriononaverage)andabove–  Usuallytheminorshortcomingsfromoneevalua&onESRwillnotapplytoanother

call(uniquenessofthecalls)–  Bewareofrankingrules(RIAs)

•  Excellence•  Impact•  SMEbudget•  Genderparity

•  Finetuningofaproposalisessen&altoleavenoroomforshortcomings


Furtherconsidera&ons

•  Providedtheidea/conceptandimpactreasonablyfitwiththecall,thesewillnotbeareasonforlowscore

•  Usualshortcomingswhichcanbeavoided–  Insufficient/nottoorealis&cdescrip&onofimpact–  Languagenotsufficientlyclear–  Insufficientfocusoncoreac&vi&es/developments–  Unbalancedconsor&um–  Insufficientaken&ontorisks,management,dissemina&on


IU.NETINFRAMEWORKPROGRAMMES


IUNETinEUprogrammesonelectroniccomponentsandsystems

0

5

10

15

20

25

30

35

2007 2008 2009 2010 2011 2012 2013 2014 2015 2016

Num

bero

fprojects

ECSELH2020ARTEMISENIACFP7

0

2

4

6

8

10

12

0

10

20

30

40

50

60

2007 2008 2009 2010 2011 2012 2013 2014 2015 2016

Millions€

Num

bero

fparticipation

•  Coverage–  NanoelectronicsandsmartsystemsprojectsunderFPcalls–  JointUndertakings:ENIAC,ARTEMIS,ECSEL


IUNET-Members

0

5

10

15

20

25

30

35

40

Num

bero

fparticipations


0

2

4

6

8

10

12

Millions€


•  Coverage–  NanoelectronicsandsmartsystemsprojectsunderFPcalls–  JointUndertakings:ENIAC,ARTEMIS,ECSEL


IUNETinEUprogrammesonnanoelectronics

•  Coverage–  ICdesign,Nanoelectronics,BeyondCMOS&spintronics,RF&mm-wave

devices,Powerelectronics–  BothunderFPandJUcalls

0

1

2

3

4

5

6

7

8

9

10

2007 2008 2009 2010 2011 2012 2013 2014 2015 2016

Num

bero

fprojects


0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

0

2

4

6

8

10

12

14

16

2007 2008 2009 2010 2011 2012 2013 2014 2015 2016

Millions€

Num

bero

fpartic

ipation


IUNET-Members


devices,Powerelectronics–  BothunderFPandJUcalls

0

2

4

6

8

10

12

14

Num

bero

fparticipations


0.0

0.5

1.0

1.5

2.0

2.5

3.0

Millions€



IUNETinEUprogrammesonnanoelectronicsandsmartsystems

0

2

4

6

8

10

12

14

16

2007 2008 2009 2010 2011 2012 2013 2014 2015 2016

Num

bero

fprojects


0.0

1.0

2.0

3.0

4.0

5.0

6.0

0

5

10

15

20

25

30

2007 2008 2009 2010 2011 2012 2013 2014 2015 2016

Millions€

Num

bero

fpartic

ipation


devices,Powerelectronics,Semiconductorequipment&processes–  MNBSinvitro,MEMS,Packaging&heterogeneousintegra&on,Electric

vehicle,Clinical&healthcarepla4orms–  BothunderFPandJUcalls


IUNET-Members

0

5

10

15

20

25

Num

bero

fparticipations


0.00.51.01.52.02.53.03.54.04.55.0

Millions€



devices,Powerelectronics,Semiconductorequipment&processes–  MNBSinvitro,MEMS,Packaging&heterogeneousintegra&on,Electric

vehicle,Clinical&healthcarepla4orms–  BothunderFPandJUcalls


SMESASPARTNERSINPROJECTS


Impactandexploita&on–SMEsaspartners

Nanoelectronics&ICdesign

Micro-Nano-BioSystems


Impactandexploita&on–SMEsaspartners

RF&mm-wavedevices

Powerelectronics


SMEsfromFP7tonow–4areas

•  Perarea–  60to135SMEs

•  Italy–  10par&cipa&ons–  8SMEsoverall


SPECIFICPORTFOLIOMAPPING


MNBS–mapping

•  From2007to2015•  Focusonsystemintegra&on

•  119projects–  CONNECT2/3–  RTD1/4–  JUs8%

•  1365par&cipa&ons


Micro-Nano-BioSystemsprojects–maps


MNBS–EUcontribu&on

0

50

100

150

200

250

300

350

400

FP7 ENIAC&ARTEMIS H2020 ECSEL

Millions€

Portabledevicesandsystems MNBSanalyticaldetectionplatformsPatient-centreddevicesandimaging Chipsmanufacturing


Horizon2020–Alterna&vecompu&ng

Excellence in Science

Leadership in Enabling and

Industrial Technologies

(LEIT)

Societal Challenges

European Research Council (ERC) grants

Marie Slodowska-

Curie grants

Future and Emerging Technologies

collaborative projects

Electronic components

ENIAC/ECSEL Joint Undertaking


Compu&ngbeyondcurrentnanoelectronics

•  10yearsoffunding–2007-2016•  ProgrammesFP7andH2020

•  6dis&nctareasemerge

•  511projects•  About1650par&cipa&ons•  Totalcosts:950M€•  EUcontribu&on:800M€

0

50

100

150

200

250

Num

bero

fprojects

FP7 H2020


Category Coverage

Quantumcompu&ng Technologiestobuildqubitsandtransportinforma&onbetweenthem,includingalgorithmicandarchitecture

MolecularelectronicsSolid-stateinforma&onprocessingfunc&onsbuiltonorganicmoleculesincludingbiomolecules;molecularspintronics

Spintronics Spin-basedelectronicsandrelatedmaterials

2DmaterialsCarbon-basedandtransi&onmetaldichalcogenides,aswellaselectronicandspintronicfunc&onsbasedonthese

Extended&beyondCMOSNonmainstreamsemiconductortransistors,includingIII-Vmaterials,steep-slopedevices,singleelectrontransistors,etc.

Neuromorphiccompu&ng Hardwareimplementa&onofneuralnetworks,analogueanddigital,architecturesandapplica&ons

Areasofthepor4olio


Typesofprojects

0

50

100

150

200

250

Quantumcomputing

Molecularelectronics

Spintronics 2Dmaterials Extended&beyondCMOS

Neuromorphiccomputing

Num

bero

fprojects

Fundamentalresearch Collaborativefundamental Collaborativeapplied


Par&cipants

0

100

200

300

400

500

600

700

Quantumcomputing




Num

bero

fparticipan

tsFundamentalresearch Collaborativefundamental Collaborativeapplied


Funding

0

50

100

150

200

250

300

350

Quantumcomputing




Millions€

Fundamentalresearch Collaborativefundamental Collaborativeapplied


WhereinEurope?

FundamentalresearchCollabora/vefundamental

Collabora/veapplied


WhereinEurope?

Quantumcompu/ngMolecularelectronics

Spintronics2Dmaterials

Extended&beyondCMOSNeuromorphiccompu/ng


Typesofpar&cipants

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

Quantumcomputing




IND SME RES HES


Countrycoverage

0%

25%

50%

75%

100%

0

20

40

60

80

100

120

140

160

Millions€

Quantumcomputing Molecularelectronics Spintronics2Dmaterials Extended&beyondCMOS Neuromorphiccomputing


Outlook

•  Neuromorphiccompu&ngisprobablythemostmaturecontendertothecurrentnanoelectronicsasitreliesmostlyon–  theexis&ngCMOStechnology–  +ananaloguesynapsewhichs&llneedstobefullyintegrated

•  Europecannotaffordtobelateontheindustrialisa&onofneuromorphiccompu&ng

•  Coordina&onisneededto–  Makesurethehardwaretechnologyroadblocksaretackledquickly–  Stabiliseandreachaconsensusonanarchitectureefficientenoughforreal

lifechallenges,inpar&cularinIoT–  Andarriveatdesignkitsfortheindustryandfablesscommuni&es


Outlookandques&ons

•  Extended&beyondCMOS–  S&lllimitedinterestinEuropeanindustry–  Whataretheprospects?

•  Neuromorphic–  Industrialisa&onhasbegunandfirstdevelopmentsdevelopfast–  Growingnumberoffundedprojectsbuts&llcompara&velylimitedinputfrom

HumanBrainFlagship,especiallyonhardwareandconcretemodelsforrealworldapplica&ons

–  WhereisindustryinEuropebeqnginthisarea?

•  Quantumcompu&ng–  Needfocus(especiallyonintegrated/solid-stateapproach)–  AclearerroadmaptoensuretheFlagshipwilldeliveroutputforLEIT


Outlookandques&ons

•  2Dmaterials–  S&llratherfundamentalfield–  Anumberofexperimentson2Dmaterialsforelectronicsbutalotof

technologicalhurdles

•  Spintronics–  Novisibilityonapplica&onsbeyondMRAM–  Whatarethehurdles?Materials?Foundryservices?Designtools?

•  Molecularelectronics–  Whataretheissues?Whyaretheyblocking?–  DNA-basedcompu&ngisalmostabsentfromEU-fundedprojects


TOWARDSFP9

47


TOWARDSFP9:KeyfindingsfromtheH2020INTERIMEVALUATION

EFFICIENCY

•  ONTRACKTOBEMOREEFFICIENTTHANFP7–  Administra&veexpenditurebelowthe5%legaltarget–  Time-to-grant110daysfasterthanFP7

•  NETWORKSAWIDERANGEOFSTAKEHOLDERS–  Par&cipantsfromover130countries–  52%ofpar&cipantsarenewcomers;moreofthemcomefromEU-13(31.2%)

thanEU-15(19.7%)

•  LARGE-SCALEOVERSUBSCRIPTION–  Successrateonly11.6%(vs.18.4%inFP7)–  ~EUR1.7billionspenttowriteunsuccessfulproposals


TOWARDSFP9:KeyfindingsfromtheH2020INTERIMEVALUATION

EFFECTIVENESS-ECONOMICIMPACT•  PRODUCINGINNOVATIONS&COMPETITIVENESS

–  Moreprivatesectorpar/cipa/ons(33.2%)thanFP7–  Fundedprojects~40%morelikelytobegrantedpatents;patentsareofhigher

commercialvaluethanotherpeers–  70%ofSMEsaimatnew-to-marketinnova/ons

•  GENERATINGJOBS,GROWTH&INVESTMENTS–  EveryeuroinvestedunderHorizon2020bringsanes&matedGDPincreaseof

6to8.5euros(EUR400toEUR600billionby2030)

•  SUPPORTING&NETWORKINGBUSINESS&SMEs–  5,700organisa&onsfundedunderAccesstoRiskFinance–  EUR13billionprivatefundsleveraged


TowardsFP9–Indica&ve&metable

2017Jan Publicstakeholderconsulta&onfortheinterimevalua&on(withsomeforwardlookingques&ons)closedon15January

May Publica&onoftheStaffWorkingDocumentontheInterimEvalua&on(evalua&onresultsbasedonlegalbaserequirements&5mandatoryevalua&oncriteria)

June •  AssessmentofHorizon2020implementa&oninviewofitsinterimevalua&onandtheFrameworkProgramme9proposalbytheEuropeanParliament(EP);

•  ERACOpinionontheinterimevalua&onofH2020andinviewoftheprepara&onsofthenextFP

July •  Publica&onofHighLevelGroupreportandstakeholderconferenceonHorizon2020InterimEvalua&on(3July)•  InformalCompe&&venessCouncil,Tallinn

Q4 •  H2020WorkProgramme2018-2020integra&ngmainfindingsfromtheInterimEvalua&on•  Publica&onofCommissionCommunica&on:

•  Overallconclusionsontheevalua&onresults;•  Stateofimplementa&onoftheFP7ex-postHLEGrecommenda&ons;•  ResponsetoHighLevelGrouprecommenda&ons;•  MessagesonArt.185andArt.187ini&a&ves

2018Mid NextMFFCommissionproposal

CommissionproposaltabledforthenextFrameworkProgramme&accompanyingImpactAssessment

2019EuropeanParliamentelec&ons,appointmentofthenewCommission

2021Launchofthe9thFrameworkProgramme


PREPARINGFORTHEFUTUREOFELECTRONICCOMPONENTSANDSYSTEMS

51


Strategyonelectronics–Preparingforthefuture

•  Workshopon27April2017•  26par&cipantsfromindustryandresearchcommunity•  Objec&ves

1.  facilita&ngtheupdateoftheEuropeanStrategyfortheElectronicsindustryandofECSEL,

2.  wideningtheinvolvementandcommitmentinstrategicpartnershipswithactorsalongthevaluechainwiththeoverarchinggoalofarrivingatasafesupplyofsecureandenergyefficientelectroniccomponentsandsystemsinEurope.

•  Mainmessages

–  Theinterna&onalcontexthaschangedveryfastinthepastfewyears–  ThereisaneedtorenewadialoguewiththeindustryinaformsimilartotheELG–  Toaddresssovereigntyissues,themechanismofcer&fica&oncouldbeused–  TheinvestmentsmadebytheRTOsisnecessarytokeeptheinnova&onecosystem

sustainable–  Essen&altechnologies:Europeneedstoensurethestrategicdevelopmentsof

technologiesandthisgoesbeyondthesupportthroughexis&nginstrumentsbutshouldalsobeaddressedunderECSEL

–  DigitalInnova&onHubsareac&onstocon&nueforsuppor&ngaccesstodigitaltechnologiesforSMEs


EuropeanForumforElectronicComponentsandSystems

•  Co-organisedeventtobringhighadded-valueandraiseittoencompasstherelevantvaluechains

•  Dates:5-7December2017•  Loca&on:Brussels

•  TheCommissionwilltakethisopportunitytoproposeaneventwithCommissionerGabriel(invita&onbased)to–  Ensureawarenessonthestrategicvalueofthesector–  Discussthepossiblefollow-upontheIPCEI–  Launchthenextstepsofthestrategyonelectronics


Follow-upofECSELunderFP9–generalelements

•  ECSELwellposi&onedintheLamyreport–  Open,transparent–  Focused(non-redundantinstrument)

•  Generalobjec&vesforthefollow-upECSEL–  Keepitstripar&testructurewithanobjec&vetoimproveitthrough

•  Harmonisa&onofthefundingratesandoftheeligibilitycriteria;•  Improvedtransparencyinfundingandunifiedrepor&ngmechanisms;•  Mul&annualfinancialcommitmentsbythePar&cipa&ngStates;•  Opera&onalisingAr&cle17.1(entrus&ngtheJUdirectlywiththepaymentofthe

na&onalcontribu&ons)–  Bekerfocusonthestrategicambi&onsoftheJUtobecomeacentral

instrumentsuppor&ngtheEuropeanpoliciesonelectronics,HPC,cybersecurity,AI,etc.

•  Consulta&onswithMemberStatesandIndustryAssocia&onsinvolvedinECSELwillstartquickly


DGCONNECT(Communica/onsNetworks,ContentandTechnology):

hbp://ec.europa.eu/dgs/connect/index_en.htm

Horizon2020ontheweb:hbp://ec.europa.eu/research/horizon2020/index_en.cfm

ThankYou

[email protected]

Documents

European funding opportunies in micro and nanoelectronics Overview and perspecves · 2017. 11. 7. · H2020 – Last call on nanoelectronics ICT-08-2019: Unconvenonal nanoelectronics