DRM-53 -- Electronics Assembly Reference Guide - Sample

8/11/2019 DRM-53 -- Electronics Assembly Reference Guide - Sample

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IPC-DRM-53 1st printing 6.00 5m

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IPC Desk Reference Manual - DRM-53.

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IPC is a not-for-profit association

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Introduction to Electronics Assembly 1

Page

Table of Contents

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Introduct

ion

Components

Inter

connections

Electronics Assembl

y

Industry Over

view

Electrostatic Discharge

Assembly Pr

ocessesIncoming Inspection

Through-Hole Assembly

Automatic Insertion

Manual Insertion

Wave Soldering

Hand Soldering

Surf

ace Mount Assembly

Solder Paste Application

Component Placement

Reflow Soldering

Adhesive Application

Cle

aning

Electr

ical Test

Rewor

k and Repair

Confor

mal Coating

Final System Assembl

y

GLOSSARY


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Introduction to Electronics Assembly2 Introduction to Electronics Assembly 3

Introduction

Look around. Electronic prod-ucts are everywhere. Theyre inour homes, offices, schools,hospitals, airports, banks andstores. And year after year thereare innovations - products getbetter and better, theyre easierto use and their value increasesas they do more for the same orlower cost.

Personal computers are a per-fect example. Ten years agothey were priced high and ranslow. Now theyre a lot fasterand cheaper.

If you were to take the cover offan electronic product youd seecomponents and interconnec-tions.

An inside view of a typicalelectronic device.

An ATM machine is anelectronic device we all use.

A laptop and cell phone atwork in the field.

IntroductiontoElectronicsAssembly

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Training References:IPC-VT-33 Introduction to SurfaceMount Assembly (Video)

IPC-VT-71-75 Surface MountEvaluation Series

Technical References:IPC-TP-1115 Selection andImplementation Strategy for a

Low-Residue, No-Clean ProcessIPC-DRM-SMT Surface MountSolder Joint EvaluationDesk Refernce Manual

Solder Paste Application

Solder paste is a mixture of fluxand tiny balls of solder in pasteform. The application of solderpaste is commonly done usinga stencil printing process.Solder paste is pressed throughopenings in a stencil screenonto the corresponding circuit

board lands with a squeegeemade of hard rubber or stain-less steel. The stencil openingsare called apertures. They aredesigned to make sure the rightamount of solder paste isdeposited onto each land. Theapertures must be in perfectalignment with the surface

mount lands.

Training References:IPC-VT-34 Solder Paste PrintingIPC-VT-35 Solder Paste PrintingDefect Analysis andPrevention (Videos)

Technical References:IPC-7525 Stencil DesignGuidelines

IPC/EIA J-STD-005 Requirementsfor Soldering Pastes

Inspecting a surface mount assemblyafter component placement.

Solder paste printing on adifferent machine.

The solder paste printingprocess.

Hand Soldering

An assembly may also containodd-form and temperature sen-sitive components such as bat-teries, switches, connectors, orunsealed parts that will have to

be manually inserted and handsoldered after the wave solder-ing operation.

Soldering iron selection, tip sizeand desired heat range shouldbe considered for the work athand. An important factor inhand soldering is solder wire

selection.Training References:IPC-VT-42/43 Hand SolderingIPC-VT-49 The Seven Sins ofHand Soldering

IPC-VT-36 Hand Soldering WithLow Residue Fluxes (Videos)

Technical References:IPC-7711 Rework of

Electronic AssembliesIPC/EIA J-STD-001 Requirementsfor Soldered Electrical andElectronic Assemblies

IPC-A-610 Acceptability OfElectronic Assemblies

Surface Mount Assembly

Surface mount technology isnewer than through-hole tech-nology. Rather than beinginserted through holes in thecircuit board, surface mountcomponent leads sit on landson the surface of the board.Surface mount assembly con-sists of three basic processes -

solder paste application, com-ponent placement and reflowsoldering.

Operator at hand solderingworkstation.

Chip component soldered to asurface mount land.

Hand soldering up close.

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Cleaning

Some companies use no-cleansoldering operations that do notrequire any cleaning process tofollow assembly and soldering.Others require a cleaning oper-

ation that removes undesirablecontaminants including any fluxresidues that may be left overfrom the soldering operation.Depending on the type of fluxused, cleaning may be accom-plished using water or a moreactive cleaning agent. If certaintypes of flux residues are not

removed, corrosion and ulti-mately assembly operatingproblems can occur.

Training References:IPC-VT-47 Wave Soldering (Video)IPC-VT-36 Hand Soldering WithLow Residue Fluxes (Video)

Technical References:IPC-TP-1115 Selection andImplementation Strategy for aLow-Resdiue,No-Clean Process

IPC-SC-60 Post Solder SolventCleaning Handbook

IPC-SA-61 Post-SolderSemiaqueous CleaningHandbook

IPC-AC-62 Post-Solder Aqueous

Cleaning HandbookIPC-CH-65 Guidelines forCleaning of Printed Boards andAssemblies

IPC-9201 Surface InsulationResistance Handbook

Hand soldering with alow-residue flux.

A No Clean flux label.

The cleaning operation.

printer. The glue dots areapplied between the chip com-ponent lands, rather than onthe lands themselves. If theadhesive were placed on thelands, the components would-nt be able to be reliably sol-

dered to the lands. In otherwords, the adhesive wouldblock the solder.

After adhesive application, thecomponents are positionedusing automated placementequipment. The adhesive isthen cured. Curing allows the

glue to achieve its full strength.

Next, the required through-holecomponents are inserted fromthe primary side of the board.

The fully assembled circuitboard is then passed through a

wave solder machine. The sol-der wicks up the holes to solder

the through-hole leads. The sur-face mount chip componentsglued to the bottom side of theboard are also soldered at thistime. This completes the mixedtechnology assembly process.

Training References:

IPC-VT-51 Adhesive Applicationfor Surface Mount (Video)

Technical References:IPC-CA-821 GeneralRequirements for ThermallyConductive Adhesives

Applying adhesive using thestencil printing method.

An assembly surfs the solder waveto complete the process.

Placing chip components ontop of adhesive temporarily

holds them in place.

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Documents

DRM-53 -- Electronics Assembly Reference Guide - Sample