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06/04/2017 V3.01
Features:> High brightness surface mount LED.> Based on InGaN technology.> 120° viewing angle.> Small package outline (LxWxH) of 2.0 x 1.4 x 1.3mm.> Qualified according to JEDEC moisture sensitivity Level 2.> Compatible to both IR reflow soldering.> Environmental friendly; RoHS compliance.> Compliance to automotive standard; AEC-Q101.> Passed Corrosion Resistant Test. Appx. 4.1
Mini DomiLEDWith the intense colors that seem to glow with energy and its significant brightness, Mini DomiLED white LED is a highly reliable design device. Its dynamic nature makes it perfect choice for lighthing applications, office and home applications and standard industrial applications.
DATA SHEET:
Mini DomiLEDInGaN : DNZP-DJG-I1
© 2005 DomiLED is a trademark of DOMINANT Opto Technologies.All rights reserved. Product specifications are subject to change without notice.
Applications:> Automotive: interior applications, eg: switches, telematics, climate control system, dashboard, etc.> Communication: indicator and backlight in mobilephone.> Display: full color display video notice board.> Industry: white goods (eg: Oven, microwave, etc.).
DOMINANTOpto TechnologiesInnovating Illumination
TM
06/04/2017 V3.02
InGaN : DNZP-DJG-I1
Part OrderingNumber
Color ViewingAngle˚
Luminous Intensity @ IF = 10mA IV (mcd) Appx. 1.1
DNZP-DJG-RS1-1-I1 InGaN Pure Green 120 112.5
Electrical Characteristics at Tj=250CVf @ If = 10 mA Appx. 3.1
3.0
Part NumberMin. (V) Typ. (V) Max. (V)
DNZP-DJG 2.7 3.5
Optical Characteristics at Tj=250C
Min. Typ. Max.
180.0 224.0
Unit
Absolute Maximum RatingsMaximum Value
DC forward current
Peak pulse current; (tp ≤ 10µs, Duty cycle = 0.005)
Reverse voltage
ESD threshold (HBM)
LED junction temperature
Operating temperature
Storage temperature
Power dissipation (at room temperature)
Thermal resistance- Junction / ambient, Rth JA- Junction / solder point, Rth JS(Mounting on FR4 PCB, pad size >= 5 mm2 per pad)
20
100
5
2000
110
-40 … +100
-40 … +100
70
530280
mA
mA
V
V
˚C
˚C
˚C
mW
K/WK/W
DOMINANTOpto TechnologiesInnovating Illumination
TM
Vr @ Ir = 10 µA
5.0
Min. (V)
06/04/2017 V3.03
InGaN : DNZP-DJG-I1DOMINANTOpto TechnologiesInnovating Illumination
TM
CharacteristicsSymbol Part Number Value Unit
Temperature coefficient of VF (typ)IF = 10mA; 0 ˚C <= T <= 100 ˚C
Temperature coefficient of IV (typ)IF = 10mA; 0 ˚C <= T <= 100 ˚C
Temperature coefficient of Cx (typ)IF = 10mA; 0 ˚C <= T <= 100 ˚C
Temperature coefficient of Cy (typ)IF = 10mA; 0 ˚C <= T <= 100 ˚C
TCV
TCIV
TCCx
TCCy
DNZP-DJG
DNZP-DJG
DNZP-DJG
DNZP-DJG
-2.0
-0.28
0.00002
-0.00003
mV / K
% / K
Cx / K
Cy / K
06/04/2017 V3.04
InGaN : DNZP-DJG-I1DOMINANTOpto TechnologiesInnovating Illumination
TM
DNZP, Color Grouping Appx. 2.1
Bin
A
B
0.35170.64520.37310.6245
Cx Cy Cx Cy
0.34890.59830.36710.5804
0.36710.58040.38510.5620
0.37310.62450.39450.6036
Color Bin Structure
1 2 3 4
InGaN wavelength is very sensitive to drive current. Operating at lower current is not recommended and may yield unpredictable performance. Current pulsing should be used for dimming purposes.
0.500
0.550
0.600
0.650
0.700
0.300 0.350 0.400 0.450
A
B
21/04/2014 V2.04
InGaN : DNZP-DJG-I1DOMINANTOpto TechnologiesInnovating Illumination
TM
DNZP, White Color Grouping
Bin
A
B
0.35170.64520.37310.6245
Cx Cy Cx Cy
0.34890.59830.36710.5804
0.36710.58040.38510.5620
0.37310.62450.39450.6036
Dominant White Bin Structure
Chromaticity coordinate groups are measured with an accuracy of ± 0.01.
1 2 3 4
Dominant color coordinate is measured with an accuracy of ± 0.01.
R1R2S1
112.50 ... 140.00140.00 ... 180.00180.00 ... 224.00
Brightness Group Luminous Intensity Appx. 1.1
IV (mcd)
Luminous Intensity Group at Tj=25˚C
InGaN : DNZP-DJG-I1DOMINANTOpto TechnologiesInnovating Illumination
TM
06/04/2017 V3.05
06/04/2017 V3.06
InGaN : DNZP-DJG-I1DOMINANTOpto TechnologiesInnovating Illumination
TM
Relative Intensity Vs Forward Current Forward Current Vs Forward Voltage
Forward Current; mA Forward Voltage; V
Rel
ativ
e In
tens
ity; N
orm
aliz
ed a
t 10m
A
Forw
ard
Cur
rent
; mA
Maximum Current Vs Ambient Temperature Relative Intensity Vs Wavelength
Forw
ard
Cur
rent
; mA
Rel
ativ
e In
tens
ity
Ambient Temperature Wavelength; nm
Radiation Pattern
21/04/2014 V2.06
InGaN : DNZP-DJG-I1
Relative Luminous Intensity Vs Forward Current
Forward Current, mA
Rel
ativ
e In
tens
ity
0 10 20 30 40 50
0
0.4
0.8
1.2
1.6
2
2.4
Forward Current Vs Forward Voltage
Forward Voltage, V
Forw
ard
Cur
rent
, mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Maximum Current Vs Ambient Temperature
Ambient temperature
Forw
ard
Cur
rent
, If
0 10 20 30 40 50 60 70 80 90 100
5
10
15
20
25
Relative Intensity Vs. Wavelength
Wavelength, nm
Rel
ativ
e In
tens
ity
400 450 500 550 600 650 700 750 800
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Radiation Pattern
0.270°
90°
80°
0
60°
50°
40°
30° 20°
0.6
0.4
1.0
0.8
10° 0°
DOMINANTOpto TechnologiesInnovating Illumination
TM
Relative Intensity Vs Forward Current
Forward Current; mA
Rel
ativ
e In
tens
ity; N
orm
aliz
ed a
t 5m
A
0 10 20 30 40 50
0
1
2
3
4
5
6
7
8
Forward Current Vs Forward Voltage
Forward Voltage; V
Forw
ard
Cur
rent
; mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Maximum Current Vs Ambient Temperature
Ambient Temperature
Forw
ard
Cur
rent
; mA
0 10 20 30 40 50 60 70 80 90 100
5
10
15
20
25
Relative Intensity Vs Wavelength
Wavelength; nm
Rel
ativ
e In
tens
ity
400 450 500 550 600 650 700 750 800
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Relative Luminous Intensity Vs Forward Current
Forward Current, mA
Rel
ativ
e In
tens
ity
0 10 20 30 40 50
0
0.4
0.8
1.2
1.6
2
2.4
Forward Current Vs Forward Voltage
Forward Voltage, V
Forw
ard
Cur
rent
, mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Maximum Current Vs Ambient Temperature
Ambient temperature
Forw
ard
Cur
rent
, If
0 10 20 30 40 50 60 70 80 90 100
5
10
15
20
25
Relative Intensity Vs. Wavelength
Wavelength, nm
Rel
ativ
e In
tens
ity
400 450 500 550 600 650 700 750 800
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Rel
ativ
e In
tens
ity; N
orm
aliz
ed a
t 20m
ARelative Intensity Vs Forward Current
Forward Current; mA
Rel
ativ
e In
tens
ity; N
orm
aliz
ed a
t 10m
A
0 10 20 30 40 50
0
1
2
3
4
Forward Current Vs Forward Voltage
Forward Voltage; V
Forw
ard
Cur
rent
; mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Maximum Current Vs Ambient Temperature
Ambient Temperature
Forw
ard
Cur
rent
; mA
0 10 20 30 40 50 60 70 80 90 100
0
5
10
15
20
25
Dominant Wavelength Shift Vs Forward Current
Forward Current, mA
0 5 10 15 20 25 30
-4
-2
0
2
4
6
8
10
12
Relative Intensity Vs Wavelength
Wavelength, nm
400 450 500 550 600 650 700 750 800
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Forward Current Vs Forward Voltage
Forward Voltage, V
Variables
IF mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Relative Intensity Vs Wavelength
Wavelength, nm
Variables
Relative Intensity
350 400 450 500 550 600 650 700 750 8000
0.10.20.30.40.50.60.70.80.9
1
21/04/2014 V2.06
InGaN : DNZP-DJG-I1
Relative Luminous Intensity Vs Forward Current
Forward Current, mA
Rel
ativ
e In
tens
ity
0 10 20 30 40 50
0
0.4
0.8
1.2
1.6
2
2.4
Forward Current Vs Forward Voltage
Forward Voltage, V
Forw
ard
Cur
rent
, mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Maximum Current Vs Ambient Temperature
Ambient temperature
Forw
ard
Cur
rent
, If
0 10 20 30 40 50 60 70 80 90 100
5
10
15
20
25
Relative Intensity Vs. Wavelength
Wavelength, nm
Rel
ativ
e In
tens
ity
400 450 500 550 600 650 700 750 800
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Radiation Pattern
0.270°
90°
80°
0
60°
50°
40°
30° 20°
0.6
0.4
1.0
0.8
10° 0°
DOMINANTOpto TechnologiesInnovating Illumination
TM
Relative Intensity Vs Forward Current
Forward Current; mA
Rel
ativ
e In
tens
ity; N
orm
aliz
ed a
t 5m
A
0 10 20 30 40 50
0
1
2
3
4
5
6
7
8
Forward Current Vs Forward Voltage
Forward Voltage; V
Forw
ard
Cur
rent
; mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Maximum Current Vs Ambient Temperature
Ambient Temperature
Forw
ard
Cur
rent
; mA
0 10 20 30 40 50 60 70 80 90 100
5
10
15
20
25
Relative Intensity Vs Wavelength
Wavelength; nm
Rel
ativ
e In
tens
ity
400 450 500 550 600 650 700 750 800
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Relative Luminous Intensity Vs Forward Current
Forward Current, mA
Rel
ativ
e In
tens
ity
0 10 20 30 40 50
0
0.4
0.8
1.2
1.6
2
2.4
Forward Current Vs Forward Voltage
Forward Voltage, V
Forw
ard
Cur
rent
, mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Maximum Current Vs Ambient Temperature
Ambient temperature
Forw
ard
Cur
rent
, If
0 10 20 30 40 50 60 70 80 90 100
5
10
15
20
25
Relative Intensity Vs. Wavelength
Wavelength, nm
Rel
ativ
e In
tens
ity
400 450 500 550 600 650 700 750 800
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Rel
ativ
e In
tens
ity; N
orm
aliz
ed a
t 20m
ARelative Intensity Vs Forward Current
Forward Current; mA
Rel
ativ
e In
tens
ity; N
orm
aliz
ed a
t 10m
A
0 10 20 30 40 50
0
1
2
3
4
Forward Current Vs Forward Voltage
Forward Voltage; V
Forw
ard
Cur
rent
; mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Maximum Current Vs Ambient Temperature
Ambient Temperature
Forw
ard
Cur
rent
; mA
0 10 20 30 40 50 60 70 80 90 100
0
5
10
15
20
25
Dominant Wavelength Shift Vs Forward Current
Forward Current, mA
0 5 10 15 20 25 30
-4
-2
0
2
4
6
8
10
12
Relative Intensity Vs Wavelength
Wavelength, nm
400 450 500 550 600 650 700 750 800
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Forward Current Vs Forward Voltage
Forward Voltage, V
Variables
IF mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Relative Intensity Vs Wavelength
Wavelength, nm
Variables
Relative Intensity
350 400 450 500 550 600 650 700 750 8000
0.10.20.30.40.50.60.70.80.9
1
21/04/2014 V2.06
InGaN : DNZP-DJG-I1
Relative Luminous Intensity Vs Forward Current
Forward Current, mA
Rela
tive
Inte
nsity
0 10 20 30 40 50
0
0.4
0.8
1.2
1.6
2
2.4
Forward Current Vs Forward Voltage
Forward Voltage, V
Forw
ard
Curr
ent,
mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Maximum Current Vs Ambient Temperature
Ambient temperature
Forw
ard
Curr
ent,
If
0 10 20 30 40 50 60 70 80 90 100
5
10
15
20
25
Relative Intensity Vs. Wavelength
Wavelength, nm
Rela
tive
Inte
nsity
400 450 500 550 600 650 700 750 800
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Radiation Pattern
0.270°
90°
80°
0
60°
50°
40°
30° 20°
0.6
0.4
1.0
0.8
10° 0°
DOMINANTOpto TechnologiesInnovating Illumination
TM
Relative Intensity Vs Forward Current
Forward Current; mA
Rela
tive
Inte
nsity
; Nor
mal
ized
at 5
mA
0 10 20 30 40 50
0
1
2
3
4
5
6
7
8
Forward Current Vs Forward Voltage
Forward Voltage; V
Forw
ard
Curr
ent;
mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Maximum Current Vs Ambient Temperature
Ambient Temperature
Forw
ard
Curr
ent;
mA
0 10 20 30 40 50 60 70 80 90 100
5
10
15
20
25
Relative Intensity Vs Wavelength
Wavelength; nm
Rela
tive
Inte
nsity
400 450 500 550 600 650 700 750 800
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Relative Luminous Intensity Vs Forward Current
Forward Current, mA
Rela
tive
Inte
nsity
0 10 20 30 40 50
0
0.4
0.8
1.2
1.6
2
2.4
Forward Current Vs Forward Voltage
Forward Voltage, V
Forw
ard
Curr
ent,
mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Maximum Current Vs Ambient Temperature
Ambient temperature
Forw
ard
Curr
ent,
If
0 10 20 30 40 50 60 70 80 90 100
5
10
15
20
25
Relative Intensity Vs. Wavelength
Wavelength, nm
Rela
tive
Inte
nsity
400 450 500 550 600 650 700 750 800
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Rela
tive
Inte
nsity
; Nor
mal
ized
at 2
0mA
Relative Intensity Vs Forward Current
Forward Current; mA
Rela
tive
Inte
nsity
; Nor
mal
ized
at 1
0mA
0 10 20 30 40 50
0
1
2
3
4
Forward Current Vs Forward Voltage
Forward Voltage; V
Forw
ard
Curr
ent;
mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Maximum Current Vs Ambient Temperature
Ambient Temperature
Forw
ard
Curr
ent;
mA
0 10 20 30 40 50 60 70 80 90 100
0
5
10
15
20
25
Dominant Wavelength Shift Vs Forward Current
Forward Current, mA
0 5 10 15 20 25 30
-4
-2
0
2
4
6
8
10
12
Relative Intensity Vs Wavelength
Wavelength, nm
400 450 500 550 600 650 700 750 800
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Forward Current Vs Forward Voltage
Forward Voltage, V
Variables
IF mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Relative Intensity Vs Wavelength
Wavelength, nm
Variables
Relative Intensity
350 400 450 500 550 600 650 700 750 8000
0.10.20.30.40.50.60.70.80.9
1
21/04/2014 V2.06
InGaN : DNZP-DJG-I1
Relative Luminous Intensity Vs Forward Current
Forward Current, mA
Rel
ativ
e In
tens
ity
0 10 20 30 40 50
0
0.4
0.8
1.2
1.6
2
2.4
Forward Current Vs Forward Voltage
Forward Voltage, V
Forw
ard
Cur
rent
, mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Maximum Current Vs Ambient Temperature
Ambient temperature
Forw
ard
Cur
rent
, If
0 10 20 30 40 50 60 70 80 90 100
5
10
15
20
25
Relative Intensity Vs. Wavelength
Wavelength, nm
Rel
ativ
e In
tens
ity
400 450 500 550 600 650 700 750 800
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Radiation Pattern
0.270°
90°
80°
0
60°
50°
40°
30° 20°
0.6
0.4
1.0
0.8
10° 0°
DOMINANTOpto TechnologiesInnovating Illumination
TM
Relative Intensity Vs Forward Current
Forward Current; mA
Rel
ativ
e In
tens
ity; N
orm
aliz
ed a
t 5m
A
0 10 20 30 40 50
0
1
2
3
4
5
6
7
8
Forward Current Vs Forward Voltage
Forward Voltage; V
Forw
ard
Cur
rent
; mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Maximum Current Vs Ambient Temperature
Ambient Temperature
Forw
ard
Cur
rent
; mA
0 10 20 30 40 50 60 70 80 90 100
5
10
15
20
25
Relative Intensity Vs Wavelength
Wavelength; nm
Rel
ativ
e In
tens
ity
400 450 500 550 600 650 700 750 800
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Relative Luminous Intensity Vs Forward Current
Forward Current, mA
Rel
ativ
e In
tens
ity
0 10 20 30 40 50
0
0.4
0.8
1.2
1.6
2
2.4
Forward Current Vs Forward Voltage
Forward Voltage, V
Forw
ard
Cur
rent
, mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Maximum Current Vs Ambient Temperature
Ambient temperature
Forw
ard
Cur
rent
, If
0 10 20 30 40 50 60 70 80 90 100
5
10
15
20
25
Relative Intensity Vs. Wavelength
Wavelength, nm
Rel
ativ
e In
tens
ity
400 450 500 550 600 650 700 750 800
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Rel
ativ
e In
tens
ity; N
orm
aliz
ed a
t 20m
ARelative Intensity Vs Forward Current
Forward Current; mA
Rel
ativ
e In
tens
ity; N
orm
aliz
ed a
t 10m
A
0 10 20 30 40 50
0
1
2
3
4
Forward Current Vs Forward Voltage
Forward Voltage; V
Forw
ard
Cur
rent
; mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Maximum Current Vs Ambient Temperature
Ambient Temperature
Forw
ard
Cur
rent
; mA
0 10 20 30 40 50 60 70 80 90 100
0
5
10
15
20
25
Dominant Wavelength Shift Vs Forward Current
Forward Current, mA
0 5 10 15 20 25 30
-4
-2
0
2
4
6
8
10
12
Relative Intensity Vs Wavelength
Wavelength, nm
400 450 500 550 600 650 700 750 800
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Forward Current Vs Forward Voltage
Forward Voltage, V
Variables
IF mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Relative Intensity Vs Wavelength
Wavelength, nm
Variables
Relative Intensity
350 400 450 500 550 600 650 700 750 8000
0.10.20.30.40.50.60.70.80.9
1
08/12/2016 V7.09
InGaN Warm White: DDF-LJGDOMINANTOpto TechnologiesInnovating Illumination
TM
Radiation Pattern
Junction Temperature Tj(°C)
Rel
ativ
e Fo
rwar
d Vo
ltage
∆V F (
V)
Junction Temperature Tj(°C)
Rel
ativ
e Lu
min
ous
Inte
nsity
I rel
Relative Luminous Intensity Vs Junction TemperatureIV/IV(25°C) = f(Tj); IF = 20mA
Junction Temperature Tj(°C)
∆Cx
, ∆C
y
Chromaticity Coordinate Shift Vs Junction Temperature∆Cx, ∆Cy = f(Tj); IF = 20mA
0.270°
90°
80°
0
60°
50°
40°
30° 20°
0.6
0.4
1.0
0.8
10° 0°
-0.5
-0.4
-0.3
-0.2
-0.1
0.0
0.1
0.2
0.3
0.4
0.5
-50 -30 -10 10 30 50 70 90 110 1300.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-50 -30 -10 10 30 50 70 90 110 130
Rel
ativ
e Fo
rwar
d Vo
ltage
∆V F
(V)
Relative Forward Voltage Vs Junction Temperature∆VF = VF - VF(25°C) = f(Tj); IF = 20mA
Junction Temperature Tj(°C) Junction Temperature Tj(°C)
Relative Luminous Intensity Vs Junction TemperatureIV /IV (25°C) = f(Tj); IV = 20mA
Rel
ativ
e Lu
min
ous
Inte
nsity
I rel
-0.5
-0.4
-0.3
-0.2
-0.1
0.0
0.1
0.2
0.3
0.4
0.5
-50 -30 -10 10 30 50 70 90 110 1300.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-50 -30 -10 10 30 50 70 90 110 130
Rel
ativ
e Fo
rwar
d Vo
ltage
∆V F
(V)
Relative Forward Voltage Vs Junction Temperature∆VF = VF - VF(25°C) = f(Tj); IF = 20mA
Junction Temperature Tj(°C) Junction Temperature Tj(°C)
Relative Luminous Intensity Vs Junction TemperatureIV /IV (25°C) = f(Tj); IV = 20mA
Rel
ativ
e Lu
min
ous
Inte
nsity
I rel
Relative Forward Voltage Vs Junction Temperature∆VF = VF - VF(25°C) = f(Tj); IF =20mA
-10.0
-8.0
-6.0
-4.0
-2.0
0.0
2.0
4.0
6.0
8.0
10.0
-50 -30 -10 10 30 50 70 90 110 130
∆Cx
∆Cy
-0.030
-0.025
-0.020
-0.015
-0.010
-0.005
0.000
0.005
0.010
0.015
0.020
0.025
0.030
-50 -30 -10 10 30 50 70 90 110 130
Rel
ativ
e W
avel
engt
h ∆λ
dom
(nm
)
Relative Wavelength Vs Junction Temperature∆λdom = λdom - λdom (25°C) = f(Tj); IF = 20mA
∆Cx,
∆C
y
Chromaticity Coordinate Shift Vs Junction Temperature∆Cx, ∆Cy = f(Tj); IF = 20mA
Junction Temperature Tj(°C) Junction Temperature Tj(°C)
InGaN : DNZP-DJG-I1
06/04/2017 V3.07
Mini DomiLED • InGaN : DNZP-DJG-I1 Package Outlines
DOMINANTOpto TechnologiesInnovating Illumination
TM
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone
Sn Plating
14/06/2016 V3.08
PrimaxPlus • 180 InGaN White: MBWW-KZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone Resin
Au Plating
Note: This product is Pb free
180 InGaN White: MBWW-KZHGDOMINANTOpto TechnologiesInnovating Illumination
TM
Note : Primary thermal path is through Cathode lead of LED package.
12/10/2016 V3.0
7
PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone
Au Plating
DOMINANT
Opto Technologies
Innovating IlluminationTM
Note: This product is Pb free
350 InGaN Yellow: MAZY-YZHG
Note : Primary thermal path is through Cathode lead of LED package.
DOMINANT Opto Technologies
09/05/14
PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx
Page 1 of 9
PRELIMINARY
UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to
change without notice.
Super high brightness surface mount LED for automotive applications.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance;
Superior corrosion robustness.
Compatible to IR reflow soldering.
PrimaxPlus 350mA White: MAW-YZHG 31/05/2013 V1.0
7
Primax • 175 InGaN White: MBWW-FSC Package Outlines
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Ag Plating
DOMINANT
Opto Technologies
Innovating IlluminationTM
Note: This product is Pb free
175 InGaN White: MBWW-FSC
18/04/2016 V1.0
8
PrimaxPlus 100 InGaN White: PQW-SSG Package OutlinesInGaN White: PQW-SSG
DOMINANT
Opto Technologies
Innovating IlluminationTM
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Sn Plating
Note: This product is Pb free
DOMINANT Opto Technologies
24/09/13
PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx
Page 1 of 14
PRELIMINARY
UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to
change without notice.
Super high brightness surface mount LED.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance.
Compatible to IR reflow soldering.
PrimaxPlus 100mA Warm White: MAF-PSC
Note : Primary thermal path is through Cathode lead of LED package
InGaN Warm White: DDF-LJG08/12/2016 V7.0
10
DomiLED • InGaN Warm White: DDF-LJG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANT
Opto Technologies
Innovating IlluminationTM
Note : Primary thermal path is through Cathode lead of LED package.
07/07/2011 V4.0
6
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANT
Opto Technologies
Innovating IlluminationTM
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
12/10/2016 V3.07
PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone
Au Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
350 InGaN Yellow: MAZY-YZHG
Note : Primary thermal path is through Cathode lead of LED package.
DOMINANT Opto Technologies
09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED for automotive applications.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance;
Superior corrosion robustness.
Compatible to IR reflow soldering.
PrimaxPlus 350mA White: MAW-YZHG
31/05/2013 V1.07
Primax • 175 InGaN White: MBWW-FSC Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Ag Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
175 InGaN White: MBWW-FSC
18/04/2016 V1.08
PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Sn Plating
Note: This product is Pb free
DOMINANT Opto Technologies
24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance.
Compatible to IR reflow soldering.
PrimaxPlus 100mA Warm White: MAF-PSC
Note : Primary thermal path is through Cathode lead of LED package
InGaN Warm White: DDF-LJG
08/12/2016 V7.010
DomiLED • InGaN Warm White: DDF-LJG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note : Primary thermal path is through Cathode lead of LED package.
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
12/10/2016 V3.07
PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone
Au Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
350 InGaN Yellow: MAZY-YZHG
Note : Primary thermal path is through Cathode lead of LED package.
DOMINANT Opto Technologies
09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED for automotive applications.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance;
Superior corrosion robustness.
Compatible to IR reflow soldering.
PrimaxPlus 350mA White: MAW-YZHG
31/05/2013 V1.07
Primax • 175 InGaN White: MBWW-FSC Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Ag Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
175 InGaN White: MBWW-FSC
18/04/2016 V1.08
PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Sn Plating
Note: This product is Pb free
DOMINANT Opto Technologies
24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance.
Compatible to IR reflow soldering.
PrimaxPlus 100mA Warm White: MAF-PSC
Note : Primary thermal path is through Cathode lead of LED package
InGaN Warm White: DDF-LJG
08/12/2016 V7.010
DomiLED • InGaN Warm White: DDF-LJG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note : Primary thermal path is through Cathode lead of LED package.
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
12/10/2016 V3.07
PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone
Au Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
350 InGaN Yellow: MAZY-YZHG
Note : Primary thermal path is through Cathode lead of LED package.
DOMINANT Opto Technologies
09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED for automotive applications.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance;
Superior corrosion robustness.
Compatible to IR reflow soldering.
PrimaxPlus 350mA White: MAW-YZHG
31/05/2013 V1.07
Primax • 175 InGaN White: MBWW-FSC Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Ag Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
175 InGaN White: MBWW-FSC
18/04/2016 V1.08
PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Sn Plating
Note: This product is Pb free
DOMINANT Opto Technologies
24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance.
Compatible to IR reflow soldering.
PrimaxPlus 100mA Warm White: MAF-PSC
Note : Primary thermal path is through Cathode lead of LED package
InGaN Warm White: DDF-LJG
08/12/2016 V7.010
DomiLED • InGaN Warm White: DDF-LJG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note : Primary thermal path is through Cathode lead of LED package.
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
12/10/2016 V3.0
7
PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone
Au Plating
DOMINANT
Opto Technologies
Innovating IlluminationTM
Note: This product is Pb free
350 InGaN Yellow: MAZY-YZHG
Note : Primary thermal path is through Cathode lead of LED package.
DOMINANT Opto Technologies
09/05/14
PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx
Page 1 of 9
PRELIMINARY
UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to
change without notice.
Super high brightness surface mount LED for automotive applications.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance;
Superior corrosion robustness.
Compatible to IR reflow soldering.
PrimaxPlus 350mA White: MAW-YZHG 31/05/2013 V1.0
7
Primax • 175 InGaN White: MBWW-FSC Package Outlines
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Ag Plating
DOMINANT
Opto Technologies
Innovating IlluminationTM
Note: This product is Pb free
175 InGaN White: MBWW-FSC
18/04/2016 V1.0
8
PrimaxPlus 100 InGaN White: PQW-SSG Package OutlinesInGaN White: PQW-SSG
DOMINANT
Opto Technologies
Innovating IlluminationTM
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Sn Plating
Note: This product is Pb free
DOMINANT Opto Technologies
24/09/13
PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx
Page 1 of 14
PRELIMINARY
UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to
change without notice.
Super high brightness surface mount LED.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance.
Compatible to IR reflow soldering.
PrimaxPlus 100mA Warm White: MAF-PSC
Note : Primary thermal path is through Cathode lead of LED package
InGaN Warm White: DDF-LJG08/12/2016 V7.0
10
DomiLED • InGaN Warm White: DDF-LJG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANT
Opto Technologies
Innovating IlluminationTM
Note : Primary thermal path is through Cathode lead of LED package.
07/07/2011 V4.0
6
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANT
Opto Technologies
Innovating IlluminationTM
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
12/10/2016 V3.07
PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone
Au Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
350 InGaN Yellow: MAZY-YZHG
Note : Primary thermal path is through Cathode lead of LED package.
DOMINANT Opto Technologies
09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED for automotive applications.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance;
Superior corrosion robustness.
Compatible to IR reflow soldering.
PrimaxPlus 350mA White: MAW-YZHG
31/05/2013 V1.07
Primax • 175 InGaN White: MBWW-FSC Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Ag Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
175 InGaN White: MBWW-FSC
18/04/2016 V1.08
PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Sn Plating
Note: This product is Pb free
DOMINANT Opto Technologies
24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance.
Compatible to IR reflow soldering.
PrimaxPlus 100mA Warm White: MAF-PSC
Note : Primary thermal path is through Cathode lead of LED package
InGaN Warm White: DDF-LJG
08/12/2016 V7.010
DomiLED • InGaN Warm White: DDF-LJG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note : Primary thermal path is through Cathode lead of LED package.
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
12/10/2016 V3.07
PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone
Au Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
350 InGaN Yellow: MAZY-YZHG
Note : Primary thermal path is through Cathode lead of LED package.
DOMINANT Opto Technologies
09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED for automotive applications.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance;
Superior corrosion robustness.
Compatible to IR reflow soldering.
PrimaxPlus 350mA White: MAW-YZHG
31/05/2013 V1.07
Primax • 175 InGaN White: MBWW-FSC Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Ag Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
175 InGaN White: MBWW-FSC
18/04/2016 V1.08
PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Sn Plating
Note: This product is Pb free
DOMINANT Opto Technologies
24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance.
Compatible to IR reflow soldering.
PrimaxPlus 100mA Warm White: MAF-PSC
Note : Primary thermal path is through Cathode lead of LED package
InGaN Warm White: DDF-LJG
08/12/2016 V7.010
DomiLED • InGaN Warm White: DDF-LJG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note : Primary thermal path is through Cathode lead of LED package.
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TMNote : Primary thermal path is through Cathode lead of LED package
06/04/2017 V3.08
InGaN : DNZP-DJG-I1
Recommended Solder Pad
DOMINANTOpto TechnologiesInnovating Illumination
TM
DOMINANT Semiconductors
11/05/10 Mini DomiLED InGaN White DNW-DZJG - Catalogue-pv3 Page 5 of 9
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Recommended Solder Pad
06/04/2017 V3.09
Taping and orientation
• Reels come in quantity of 3000 units.• Reel diameter is 180 mm.
InGaN : DNZP-DJG-I1DOMINANTOpto TechnologiesInnovating Illumination
TM
06/04/2017 V3.010
Packaging Specification
InGaN : DNZP-DJG-I1DOMINANTOpto TechnologiesInnovating Illumination
TM
08/12/2016 V7.013
Packaging Specification
InGaN Warm White: DDF-LJGDOMINANTOpto TechnologiesInnovating Illumination
TM
06/04/2017 V3.011
InGaN : DNZP-DJG-I1DOMINANTOpto TechnologiesInnovating Illumination
TM
Packaging Specification
Average 1pc Mini DomiLED 1 completed bag (3000pcs)
0.034 190 ± 10Weight (gram)
CardboardBox
Dimensions (mm) Empty BoxWeight (kg)
Super Small
Small
Medium
Large
For Mini DomiLED
Reel / BoxCardboard BoxSize
Weight (gram) 0.007 200 ± 10
DOMINANT TM
Moisture sensitivity level
Moisture absorbent material +Moisture indicator
The reel, moisture absorbent material and moisture indicator aresealed inside the moisture proof foil bag
Reel
Barcode label
Label
(L) Lot No : lotno
(P) Part No : partno
(C) Cust No : partno
(G) Grouping : group
(Q) Quantity : quantity
(D) D/C : date code
(S) S/N : serial no
DOMINANT Opto TechnologiesML TEMP2 260˚CRoHS Compliant
Made in Malaysia
325 x 225 x 190
325 x 225 x 280
570 x 440 x 230
570 x 440 x 460
0.38
0.54
1.46
1.92
9 reels MAX
15 reels MAX
60 reels MAX
120 reels MAX
06/04/2017 V3.012
Time (sec)0 50 100 150 200
300
250
225
200
175
150
125
100
75
50
25
275
Tem
pera
ture
(˚C
)Classification Reflow Profile (JEDEC J-STD-020C)
Ramp-up3˚C/sec max.
255-260˚C10-30s
60-150s
Ramp-down
6˚C/secmax.
Preheat 60-180s
480s max
217˚C
Recommended Pb-free Soldering Profile
InGaN : DNZP-DJG-I1DOMINANTOpto TechnologiesInnovating Illumination
TM
06/04/2017 V3.013
InGaN : DNZP-DJG-I1DOMINANTOpto TechnologiesInnovating Illumination
TM
Appendix
1) Brightness:1.1 Luminous intensity is measured with an internal reproducibility of ± 8 % and an expanded uncertainty of ± 11 % (according to GUM with a coverage factor of k=3).1.2 Luminous flux is measured with an internal reproducibility of ± 8 % and an expanded uncertainty of ± 11 % (according to GUM with a coverage factor of k=3).
2) Color:2.1 Chromaticity coordinate groups are measured with an internal reproducibility of ± 0.005 and an expanded uncertainty of ± 0.01 (accordingly to GUM with a coverage factor of k=3).2.2 DOMINANT wavelength is measured with an internal reproducibility of ± 0.5nm and an expanded uncertainty of ± 1nm (accordingly to GUM with a coverage factor of k=3).
3) Voltage:3.1 Forward Voltage, Vf is measured with an internal reproducibility of ± 0.05V and an expanded uncertainty of ± 0.1V (accordingly to GUM with a coverage factor of k=3).
4) Corrosion Robustness:4.1 Test conditions: 40 °C / 90 % rh / 15 ppm H2S / 336 h. = Stricter than IEC 60068-2-43 (H2S) [25 °C / 75% rh / 10 ppm H2S / 21 days].
Revision History
Page
-
2, 3
1, 9, 11, 13
Subjects
Initial Release
Add Thermal ResistanceAdd Characteristics
Add FeaturesError on Taping and OrientationUpdate Package Specification
Add Appendix
Date of Modification
24 Jan 2014
21 Apr 2014
06 Apr 2017
InGaN : DNZP-DJG-I1
06/04/2017 V3.014
DOMINANTOpto TechnologiesInnovating Illumination
TM
NOTE
All the information contained in this document is considered to be reliable at the time of publishing. However, DOMINANT
Opto Technologies does not assume any liability arising out of the application or use of any product described herein.
DOMINANT Opto Technologies reserves the right to make changes to any products in order to improve reliability, function
or design.
DOMINANT Opto Technologies products are not authorized for use as critical components in life support devices or systems
without the express written approval from the Managing Director of DOMINANT Opto Technologies.
InGaN : DNZP-DJG-I1
About Us
DOMINANTOpto TechnologiesInnovating Illumination
TM
DOMINANT Opto Technologies is a dynamic company that is amongst the world’s leading automotive LED manufac-turers. With an extensive industry experience and relentless pursuit of innovation, DOMINANT’s state-of-art manu-facturing and development capabilities have become a trusted and reliable brand across the globe. More information about DOMINANT Opto Technologies, a ISO/TS 16949 and ISO 14001 certified company, can be found under http://www.dominant-semi.com.
Please contact us for more information:
DOMINANT Opto Technologies Sdn. BhdLot 6, Batu Berendam, FTZ Phase III, 75350 Melaka, Malaysia.Tel: +606 283 3566 Fax: +606 283 0566E-mail: [email protected]