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Digital Design: Principles and Practices Chapter 9 Memory, CPLDs, and FPGAs

Digital Design: Principles and Practices Chapter 9 Memory, CPLDs, and FPGAs

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Digital Design:Principles and Practices

Chapter 9Memory, CPLDs, and FPGAs

9.1 Read-Only Memory

Read-Only Memory (ROM)• A read-only memory (ROM) is a combinational circuit with n

inputs and b outputs. The inputs are called address inputs and are traditionally named

A0, A1, …, An-1. The outputs are called data outputs and are typically named D0,

D1, …, Db-1.

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Read-Only Memory (ROM)

• A ROM “stores” the truth table of an n-input, b-output combinational logic function.

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Read-Only Memory (ROM)

• A ROM is a combinational circuit Not really a memory Information is “stored” when a ROM is manufactured or

programmed.

• ROM is nonvolatile memory; that is, its contents are preserved even if no power is applied.

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Nonvolatile Memory• ROM: hardwired during fabrication

• PROM (programmable ROM): can be programmed once only fuse

• EPROM (Erasable PROM): can be erased by UV light, and can be re-programmed Floating gate

• EEPROM (Electrically Erasable PROM): can be erased with on-chip circuitry Floating gate

• Flash memory: a variant of EEPROM that erases entire blocks rather than individual bits Floating gate

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Categories of Memory Arrays

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Programmable ROMs

• ROM has in practice become synonymous with nonvolatile, not read-only memory.

• Programming/writing speeds are generally slower than read speeds.

• Four type of nonvolatile memories: PROM (Programmable ROM) EPROM (Erasable Programmable ROM) EEPROM (Electrically Erasable Programmable ROM) Flash memories

• PROMs us fuses while EPROMs, EEPROMs, and Flash use charge stored on a floating gate.

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Floating Gate nMOS Transistor

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Floating Gate nMOS Transistor• The floating gate is a good conductor, but it is not attached to

anything.

• Applying a high voltage to the upper gate causes electrons to jump through the thin oxide onto the floating gate.

• Injecting the electrons induces a negative voltage on the floating gate, effectively increasing the threshold voltage (Vt) of the transistor to the point that it is always OFF.

• EPROM: knock off the electrons off the floating gate by UV light

• EEPROM and Flash can be erased electrically.

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9.2 Read/Write Memory

Read/Write Memory

• The name read/write memory (RWM) is given to memory arrays in which we can store and retrieve information at any time.

• Random-Access Memory (RAM) Static RAM (SRAM) Dynamic RAM (DRAM)

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9.3 Static RAM

Basic Structure of a 2n x b RAM

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• CS: Chip Select• OE: Output Enable• WE: Write Enable

• Read: CS and OE are asserted• Write: CS and WE are asserted

Inte

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Str

uctu

re o

f an

8 x

4 SR

AM

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Functional Behavior of an SRAM Cell

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12-Transistor SRAM Cell

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6-Transistor (6T) SRAM Cell

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Stick Diagram of 6T SRAM Cell

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Layout of 6T SRAM Cell

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Only poly and diff layers are shown.

9.4 Dynamic RAM

DRAM Cell

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DRAM Cell

• A DRAM cell contains a transistor and a capacitor.

• A basic DRAM cell is substantially smaller than a SRAM cell, but the cell must be periodically read and refreshed so that its contents do not leak away.

• One a read, the bitline is first precharged to VDD/2. When the wordline rises, the capacitor shares its charge with the bitline, causing a voltage change △V that can be sensed. The read process disturbs the cell contents at x, so the cell must be rewritten after each read. [Figure 11.26] Sense amplifier

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DRAM Cell – Read Operation

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DRAM’s Capacitor

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DRAM’s Capacitor

• A large cell capacitance (Ccell) is important to provide a reasonable voltage swing. It also is necessary to retain the contents of the cell for an acceptably long time.

• Specialized DRAM processes are required for manufacturing trench capacitors.

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