ATLASATLASATLASATLAS Design• Ash finished electric hybrid tracing to

connector fields– Changes to allow for HCC-less and HCC running

on one hybrid awaiting final confirmation of HCC footprint• Should come next week

• Power board work by Sam continuing– Toroidal DC-DC and pararrel power boards

ready for submission– Flat coil next on list – SP board (with SPP) needs details from Mitch

ATLASATLASATLASATLAS Assembly Results So Far• Very positive results in gluing

ASIC to hybrids and hybrids-to-sensor– One solid row of epoxy under

ABC130, one dotted row under thermistor, HCC and hybrid-to-tape bonds

• ~50% epoxy coverage with 100-120 mm thickness

• Performed pickup trials with ABC130.– No visible marking under microscope

Slide 2

ATLASATLASATLASATLAS Minor Jig Issues• All worked as well as expected

but:– ASIC glue stencil tended to rock

on single ASIC column, pumping too much glue onto ASIC

– Epolite (sensor-to-hybrid) epoxy tended to push AWAY the hybrid from the sensors• Previously we were worried that the

glue would pull the hybrid TOWARDS the sensors

• Expect that skimming glue onto back of hybrid with stencil would also bend hybrid and pump extra glue between stencil and hybrid

Chip Pickup Tool

Glue Stencil

ABC130

Chip Pickup Tool

Hybrid

Sensor

Epolite

Slide 3

ATLASATLASATLASATLAS Chip Stencil Fix• Glue a plastic bar onto chip

stencil which will touch the chip pickup tool– This has been trialled

successfully with 3 pickup tools and two stencils

Chip Pickup Tool

Glue Stencil

ABC130Plastic Bar

Slide 4

ATLASATLASATLASATLAS Chip Pickup Tool Fix• We want to put a

removable bars on chip pickup tool to push on outside of hybrid– Under design and

prototyping now– Will add a groove into

chip pickup tool to locate and hold bar• Needs to avoid HCC

region for both types of hybrids

Slide 5

Chip Pickup Tool

Hybrid

Sensor

Epolite

PlasticBar

Bar would locate in the two dowel holes and the additional slot

ATLASATLASATLASATLAS Assembly Future Plans (I)

• Once pickup tool bar shown to stabilize unsupported hybrid will make metal stencil to screen Epolite onto back of hybrid– Without bar, epoxy will

pump between stencil and hybrid, binding hybrid to it.

Stencil would be for one hybrid (this shows paper stencil onto sensor for two hybrids

Slide 6

ATLASATLASATLASATLAS Assembly Future Plans (II)

• One of the reasons to change the hybrid pickup tool face to anodized AL is improve the uniformity and stability– Ideally, all tools will be “identical” and therefore interchangeable

• In current ABC250 tooling, the same tool has to be used for gluing ASICs-to-hybrids and hybrids-to-sensors

• We plan to test this in the next set of hybrid and module assemblies– Will exchange the tooling between ASIC and hybrid gluing

• As first test of this, we can exchange jigs after ASIC gluing and curing and the vacuum does not leak and the tool legs all touch

Slide 7

ATLASATLASATLASATLAS Bonding Experience• So far, so good

– Not complaints from anyone• Every attempt successful

– ~>6 chip cards, 5 hybrids, 1 modules

– Much easier than 250 nm (both hybrid and module)

• Biggest unexplored issue is the best bonding parameters for the ABC130 metal– Much softer/thicker than

ABC25 (more like FEI4)

• First chip on boards bonded ok and systematic studies started at Liverpool

Slide 8

ATLASATLASATLASATLAS Jigs Distribution Plans• A set of jigs to do one hybrid sent to Birmingham

already to continue accelerated silver epoxy curing studies

• Hope to have a jig sets for Cambridge, Glasgow, UCSC, and LBL for hybrids for end of February or beginning of March– ASIC glue stencil, ASIC trays, pickup tools, 8 way jig

and module assembly tools from Liverpool• Only one pickup tool per site until bar for pickup tool

understood

– Module testing plates from LBL– Other 2-3 pickup tools per site and module glue

stencil will follow with successful module trialling

Slide 9

ATLASATLASATLASATLASComponent Distribution/Status

• Orders of 10 panels (2 per site) due back this week (will be before end of February

• Plenty (~150) glass and (~100) mechanical sensors

• More plain glass ASICs need to be diced (~500-1000); starting at Glasgow

• Only component we could be short of is patterned AL glass ABC130s from CNM– Needed for both hybrid and module bonding

trials

Slide 10

Is there an interest in the community for another AL glass ABC130 submission? Glass ASICs from CNM

TM hybrids from Stevenage

Mechanical Sensor from HPK

ATLASATLASATLASATLAS Wish list• We would want a spectrum analyser for

power board work (£3.5k)– Might be able to borrow the B180 unit

• For submissions, we will need:– £5k for electrical hybrids (40)– £~1k for power board submissions, frames,

aux. boards, etc.– £~2k for AL patterned ASICs

• We assume next mech and elecrical hybrid submission would get billed after Q1 2014