DEM240320J1 TMH-PW-N VER5 · 0 15.10.2016 ZFY Initial Release 1 24.10.2016 ZFY Modify Backlight Characteristics Modify Luminance Modify Pins Definition(A1-A4) Modify outline drawing

18.06.2020

Display Elektronik GmbH

DEM 240320J1 TMH-PW-N

2,4“ TFT

TFT MODULE

Product Specification Ver.: 5

DEM 240320J1 TMH-PW-N Production Specification

Version: 5 PAGE: 2

Revision History

Revision Date Originator Detail Remarks

0 15.10.2016 ZFY Initial Release

1 24.10.2016 ZFY

Modify Backlight Characteristics Modify Luminance Modify Pins Definition(A1-A4) Modify outline drawing

P5 P6 P10 P26

2 14.12.2016 ZFY Add Weight Add Chromacity

P4 P6

3 10.07.2017 ZFY Add Pins Definition P10

4 19.05.2018 ZDT Modify Interface Pins Definition Modify many details

P11 P23-P24

5 18.06.2020 MHI Modify Inspection Specification Modify Reliability Specification

P20 P22


Version: 5 PAGE: 3

Table of Contents No. Item Page

1. General Description ............................................................................................................................ 4 2. Module Parameter .............................................................................................................................. 4 3. Absolute Maximum Ratings ................................................................................................................ 4 4. DC Characteristics .............................................................................................................................. 5 5. Backlight Characteristic ...................................................................................................................... 5

5.1. Backlight Characteristics .......................................................................................................... 5 5.2. Backlighting Circuit .................................................................................................................. 5

6. Optical Characteristics ........................................................................................................................ 6 6.1. Optical Characteristics ............................................................................................................. 6 6.2. Definition of Response Time .................................................................................................... 6 6.3. Definition of Contrast Ratio ...................................................................................................... 7 6.4. Definition of Viewing Angles ..................................................................................................... 7 6.5. Definition of Color Appearance ................................................................................................ 8 6.6. Definition of Surface Luminance, Uniformity and Transmittance ............................................. 8

7. Block Diagram and Power Supply ...................................................................................................... 9 8. Interface Pins Definition .................................................................................................................... 10 9. AC Characteristics ............................................................................................................................ 12

9.1. 8080 MCU 8-bit/16-bit Interface Timing Characteristics ........................................................ 12 9.2. Serial Interface Characteristics .............................................................................................. 13 9.3. Reset Timing .......................................................................................................................... 15

10. Quality Assurance ............................................................................................................................. 16 10.1. Purpose .................................................................................................................................. 16 10.2. Standard for Quality Test ........................................................................................................ 16 10.3. Nonconforming Analysis & Disposition .................................................................................. 16 10.4. Agreement Items .................................................................................................................... 16 10.5. Standard of the Product Visual Inspection ............................................................................. 17 10.6. Inspection Specification ......................................................................................................... 17 10.7. Classification of Defects ......................................................................................................... 20 10.8. Identification/marking criteria ................................................................................................. 20 10.9. Packaging .............................................................................................................................. 21

11. Reliability Specification ..................................................................................................................... 22 12. Precautions and Warranty ................................................................................................................ 23

12.1. Safety ..................................................................................................................................... 23 12.2. Handling ................................................................................................................................. 23 12.3. Storage ................................................................................................................................... 23 12.4. Metal Pin (Apply to Products with Metal Pins) ....................................................................... 23 12.5. Operation ............................................................................................................................... 24 12.6. Static Electricity ...................................................................................................................... 24 12.7. Limited Warranty .................................................................................................................... 24

13. Outline Drawing ................................................................................................................................ 25


Version: 5 PAGE: 4

1. General Description

The specification is a transmissive type color active matrix liquid crystal display (LCD) which uses amorphous thin film transistor (TFT) as switching devices. This product is composed of a TFT-LCD panel, driver ICs and a backlight unit.

2. Module Parameter

Features Details Unit Display Size (Diagonal) 2.4” - LCD Type TN TFT - Display Mode Transmissive / Normally White - Resolution 240 x RGB x 320 Pixels View Direction 6 O’clock Best Image Gray Scale Inversion Direction 12 O’clock - Module Outline 42.72 x 60.26 x 2.65 (Note1 ) mm Active Area 36.72 x 48.96 mm Pixel Size 0.153 x 0.153 mm Pixel Arrangement Stripe - Polarizer Surface Treatment Anti-Glare - Display Colors 262k -

Interface 16/8 Bit Parallel Interface 3/4 Wire Serial Interface -

With or without touch panel Without - Driver IC ST7789V (Sitronix) - Operating Temperature -20 to 70 ºC Storage Temperature -30 to 80 ºC Weight 10 g

Note 1: Exclusive hooks, posts, FFC/FPC tail etc.

3. Absolute Maximum Ratings

VSS=0V, Ta=25ºC Item Symbol Min. Max. Unit

Supply Voltage VCC -0.3 4.6 V VCI -0.3 4.6 V Storage Temperature TSTG -30 +80 ºC Operating Temperature TOP -20 +70 ºC

Note 1: If Ta below 50ºC, the maximal humidity is 90%RH, if Ta over 50ºC, absolute humidity should be less than 60%RH.

Note 2: The response time will be extremely slow when the operating temperature is around -10°C, and the back ground will become darker at high temperature operating.


Version: 5 PAGE: 5

4. DC Characteristics

Item Symbol Min. Typ. Max. Unit

Supply Voltage VCC 2.4 2.8 3.3 V VCI 1.65 1.8 3.3 V

Logic Low Input Voltage VIL GND - 0.3*VCI V Logic High Input Voltage VIH 0.7*VCI - VCI V Logic Low Output Voltage VOL GND - 0.2*VCI V Logic High Output Voltage VOH 0.8*VCI - VCI V Current Consumption All Black

Logic ICC+ IIN - (8) - mA

Analog

5. Backlight Characteristic

5.1. Backlight Characteristics

Item Symbol Condition Min. Typ. Max. Unit Forward Voltage VF Ta=25 ºC, IF=15mA/LED 2.8 3.1 3.3 V Forward Current IF Ta=25 ºC, VF=3.1V/LED - 60 - mA Power Dissipation PD - 186 - mW Uniformity Avg - 80 - % LED Working Life (25°C) - 50000 Hrs Drive Method Constant current LED Brand Nichia LED Configuration 4 White LEDs in parallel

Note1：LED life time defined as follows: The final brightness is at 50% of original brightness. The environmental conducted under ambient air flow, at Ta=25±2 ºC, 60%RH±5%, IF=15mA

5.2. Backlighting Circuit

A1

K

A2A3

A4


Version: 5 PAGE: 6

6. Optical Characteristics

6.1. Optical Characteristics Ta=25ºC, VCC=2.8V, TN LC+ Polarizer

Bac

klig

ht O

n (T

rans

mis

sive

Mod

e)

Item Symbol Condition Specification

Unit Min. Typ. Max.

Luminance on

TFT( fI =15mA/LED) Lv

Normally viewing angle θX = φY =0º

250 320 - cd/m²

Contrast Ratio(See 6.3) CR - 250 -

Response Time (See 6.2)

TR+TF - 30 - ms

Chromaticity Transmissive

(See 6.5)

Red XR

0.547 0.597 0.647 YR 0.288 0.338 0.388

Green XG 0.267 0.317 0.367 YG 0.585 0.635 0.685

Blue XB 0.096 0.146 0.196 YB 0.031 0.081 0.131

White XW 0.250 0.300 0.350 YW 0.292 0.342 0.392

Viewing Angle (See 6.4)

Horizontal θX+

Center CR≥10

55 70 -

Deg. θX- 55 70 -

Vertical φY+ 55 70 - φY- 35 50 -

NTSC Ratio(Gamut) - 55 - %

6.2. Definition of Response Time

6.2.1. Normally Black Type (Negative)

Selected stateNon-selected state

Tr Tf

Relative Brightness

100%

90%

10%

0%

Non-selected state

Tr is the time it takes to change form non-selected stage with relative luminance 10% to selected state with relative luminance 90%; Tf is the time it takes to change from selected state with relative luminance 90% to non-selected state with relative luminance 10%. Note: Measuring machine: LCD-5100


Version: 5 PAGE: 7

6.2.2. Normally White Type (Positive)

Selected stateNon-selected state

Tr Tf

Relative Brightness

100%

90%

10%

0%

Non-selected state

Tr is the time it takes to change form non-selected stage with relative luminance 90% to selected state with relative luminance 10%; Tf is the time it takes to change from selected state with relative luminance 10% to non-selected state with relative luminance 90%; Note: Measuring machine: LCD-5100 or EQUI

6.3. Definition of Contrast Ratio

Contrast is measured perpendicular to display surface in reflective and transmissive mode. The measurement condition is: Measuring Equipment Eldim or Equivalent Measuring Point Diameter 3mm//1mm Measuring Point Location Active Area centre point

Test pattern A: All Pixels white B: All Pixel black

Contrast setting Maximum Definitions: CR (Contrast) = Luminance of White Pixel / Luminance of Black Pixel

6.4. Definition of Viewing Angles

Measuring machine: LCD-5100 or EQUI


Version: 5 PAGE: 8

6.5. Definition of Color Appearance

R,G,B and W are defined by (x, y) on the IE chromaticity diagram NTSC=area of RGB triangle/area of NTSC triangleX100% Measuring picture: Red, Green, Blue and White (Measuring machine: BM-7)

6.6. Definition of Surface Luminance, Uniformity and Transmittance

Using the transmissive mode measurement approach, measure the white screen luminance of the display panel and backlight. 6.6.1. Surface Luminance: LV = average (LP1:LP9) 6.6.2. Uniformity = Minimal (LP1:LP9) / Maximal (LP1:LP9) * 100% 6.6.3. Transmittance = LV on LCD / LV on Backlight * 100%

Note: Measuring machine: BM-7

X

Y c

X/6 X/3 X/3 X/6

Y/6

Y/3

Y/3

Y/6

1 2 3

4 5 6

7 8 9

Display Area


Version: 5 PAGE: 9

7. Block Diagram and Power Supply


Version: 5 PAGE: 10

8. Interface Pins Definition

No. Symbol Function Remark 1 DB10 Data bus 2 DB11 Data bus 3 DB12 Data bus 4 DB13 Data bus 5 GND Ground 6 VCC Power supply

7 /CS Chip select signal CSX=/CS

8 RS - Display Data/Command Selection in Parallel Interface - Serial Clock in Serial Interface - D/CX=DCX=RS

DCX Pin

9 /WR - Write enable in MCU parallel interface - Display data/command selection pin in 4-line serial interface - WRX=/WR

10 /RD - Read enable in 8080 MCU parallel interface - If not used, please fix this pin at VDDI or DGND - RDX=/RD

11 IM0 MCU interface mode select NOTE1 12 IM3 MCU interface mode select NOTE1 13 IM2 MCU interface mode select NOTE1 14 SDI SPI interface input pin 15 SDO SPI interface output pin. 16 NC No connection 17 NC No connection 18 NC No connection 19 NC No connection 20 LED-K Led cathode 21 LED-A1 Led anode-1 22 LED-A2 Led anode-2 23 LED-A3 Led anode-3 24 LED-A4 Led anode-4 25 DB14 Data bus 26 DB1 Data bus 27 DB2 Data bus 28 DB3 Data bus 29 DB4 Data bus 30 DB5 Data bus 31 DB6 Data bus 32 DB7 Data bus 33 DB8 Data bus


Version: 5 PAGE: 11

34 /RESET Reset signal 35 VCI Power supply 36 VCC Power supply 37 IM1 MCU interface mode select NOTE1 38 DB15 Data bus 39 DB16 Data bus 40 DB17 Data bus

NOTE1:

IM3 IM2 IM1 IM0 MCU-Interface Mode DB Pin in use 1 0 0 0 80 MCU 16-bit bus interface II D[17:10], D[8:1] 1 0 0 1 80 MCU 8-bit bus interface II D[17:10] 1 1 0 1 3-wire 9-bit data serial interface II SDI: In/SDO:OUT 1 1 1 0 4-wire 8-bit data serial interface II SDI: In/SDO:OUT


Version: 5 PAGE: 12

9. AC Characteristics

9.1. 8080 MCU 8-bit/16-bit Interface Timing Characteristics


Version: 5 PAGE: 13

9.2. Serial Interface Characteristics

9.2.1 3-Line Serial Interface


Version: 5 PAGE: 14

9.2.2 4-Line Serial Interface


Version: 5 PAGE: 15

9.3. Reset Timing


Version: 5 PAGE: 16

10. Quality Assurance

10.1. Purpose

This standard for Quality Assurance assures the quality of LCD module products supplied to customer.

10.2. Standard for Quality Test

10.2.1. Sampling Plan: GB2828.1-2012 Single sampling, general inspection level II

10.2.2. Sampling Criteria: Visual inspection: AQL 1.5% Electrical functional: AQL 0.65%.

10.2.3. Reliability Test: Detailed requirement refer to Reliability Test Specification.

10.3. Nonconforming Analysis & Disposition

10.3.1. Nonconforming analysis: 10.3.1.1. Customer should provide overall information of non-conforming sample for

their complaints. 10.3.1.2. After receipt of detailed information from customer, the analysis of

nonconforming parts usually should be finished in one week. 10.3.1.3. If cannot finish the analysis on time, customer will be notified with the

progress status. 10.3.2. Disposition of nonconforming:

10.3.2.1. Non-conforming product over PPM level will be replaced. 10.3.2.2. The cause of non-conformance will be analyzed. Corrective action will be

discussed and implemented.

10.4. Agreement Items

Shall negotiate with customer if the following situation occurs: 10.4.1. There is any discrepancy in standard of quality assurance. 10.4.2. Additional requirement to be added in product specification. 10.4.3. Any other special problem.


Version: 5 PAGE: 17

10.5. Standard of the Product Visual Inspection

10.5.1. Appearance inspection: 10.5.1.1. The inspection must be under illumination about 1000 – 1500 lx, and the

distance of view must be at 30cm ± 2cm. 10.5.1.2. The viewing angle should be 45° from the vertical line without reflection light

or follows customer's viewing angle specifications. 10.5.1.3. Definition of area: A Zone: Active Area, B Zone: Viewing Area,

10.5.2. Basic principle:

10.5.2.1. A set of sample to indicate the limit of acceptable quality level must be discussed by both us and customer when there is any dispute happened.

10.5.2.2. New item must be added on time when it is necessary.

10.6. Inspection Specification

No. Item Criteria (Unit: mm)

01

Black / White spot

Foreign

material (Round type)

Pinholes Stain

Particles inside cell.

(Minor defect)

φ= ( a + b) /2 Distance between 2 defects should more than 3mm apart.

Area Size

Acc. Qty

φ≤0.10 Ignore 0.10


Version: 5 PAGE: 18

03

Black and

White line

Scratch

Foreign

material (Line type)

(Minor defect)

Length Width Acc. Qty

/ W ≦ 0.03 Ignore L ≦ 5 0.03 ＜ W ≦ 0.1 1

/ 0.1 ＜ W 0 Total 3

Distance between 2 defects should more than 3mm apart. Scratches not viewable through the back of the display are acceptable.

04 Glass Crack

(Minor

defect)

Crack is potential to enlarge, any type is not allowed.

05

Glass Chipping Pad Area: (Minor defect)

Length and Width Acc. Qty c > 3.0, b< 1.0 1 c< 3.0, b< 1.0 3

a 3.0, b< 1.0 1 c< 3.0, b< 1.0 2 c< 3.0, b< 0.5 4

a


Version: 5 PAGE: 19

07

Glass Chipping Except Pad Area: (Minor defect)

Length and Width Acc. Qty c > 3.0, b< 1.0 1 c< 3.0, b< 1.0 2 c< 3.0, b< 0.5 4

a


Version: 5 PAGE: 20

11 Bubble on Polarizer

(Minor defect)

Diameter Acc. Qty φ≤0.20 Ignore

0.20


Version: 5 PAGE: 21

10.9. Packaging

10.9.1. There should be no damage of the outside carton box, each packaging box should have one identical label.

10.9.2. Modules inside package box should have compliant mark. 10.9.3. All direct package materials shall offer ESD protection

Note1: Bright dot is defined as the defective area of the dot is larger than 50% of one sub-pixel area.

Bright dot: The bright dot size defect at black display pattern. It can be recognized by 2% transparency of filter when the distance between eyes and panel is 350mm±50mm. Dark dot: Cyan, Magenta or Yellow dot size defect at white display pattern. It can be recognized by 5% transparency of filter when the distance between eyes and panel is 350mm±50mm. Note2: Mura on display which appears darker / brighter against background brightness on parts of display area.


Version: 5 PAGE: 22

11. Reliability Specification

No Item Condition Quantity Criteria

1 High Temperature Operating 70°C, 96Hrs 2 GB/T2423.2 -2008

2 Low Temperature Operating -20°C, 96Hrs 2 GB/T2423.1 -2008

3 High Humidity Storage 50°C, 90%RH, 96Hrs 2 GB/T2423.3 -2016

4 High Temperature Storage 80°C, 96Hrs 2 GB/T2423.2 -2008

5 Low Temperature Storage -30°C, 96Hrs 2 GB/T2423.1 -2008

6 Thermal Cycling Test Storage -20°C, 60min~70°C, 60min, 20 cycles. 2 GB/T2423.22

-2012

7 Packing Vibration Frequency range:10Hz~50Hz Acceleration of gravity:5G X, Y, Z 30 min for each direction.

2 GB/T5170.14 -2009

8 Electrical Static Discharge Air:±8KV 150pF/330Ω 5 times

2 GB/T17626.2 -2018 Contact:±4KV 150pF/330Ω 5 times

9 Drop Test (Packaged) Height:80 cm,1 corner, 3 edges, 6 surfaces.

2 GB/T2423.8 -1995

Note1. No defection cosmetic and operational function allowable. Note2. Total current Consumption should be below double of initial value


Version: 5 PAGE: 23

12. Precautions and Warranty

12.1. Safety

12.1.1. The liquid crystal in the LCD is poisonous. Do not put it in your mouth. If the liquid crystal touches your skin or clothes, wash it off immediately using soap and water.

12.1.2. Since the liquid crystal cells are made of glass, do not apply strong impact on them. Handle with care.

12.2. Handling

12.2.1. Reverse and use within ratings in order to keep performance and prevent damage. 12.2.2. Do not wipe the polarizer with dry cloth, as it might cause scratch. If the surface of

the LCD needs to be cleaned, wipe it swiftly with cotton or other soft cloth soaked with petroleum IPA, do not use other chemicals.

12.3. Storage

12.3.1. Do not store the LCD module beyond the specified temperature ranges. 12.3.2. Strong light exposure causes degradation of polarizer and color filter.

12.4. Metal Pin (Apply to Products with Metal Pins)

12.4.1. Pins of LCD and Backlight 12.4.1.1. Solder tip can touch and press on the tip of Pin LEAD during the soldering 12.4.1.2. Recommended Soldering Conditions

Solder Type: Sn96.3~94-Ag3.3~4.3-Cu0.4~1.1 Maximum Solder Temperature: 370°C Maximum Solder Time: 3s at the maximum temperature Recommended Soldering Temp: 350±20°C Typical Soldering Time: ≤3s

12.4.1.3. Solder Wetting

Solder Pin Lead Solder Pin Lead Recommended Not Recommended

12.4.2. Pins of EL 12.4.2.1. Solder tip can touch and press on the tip of EL leads during soldering. 12.4.2.2. No Solder Paste on the soldering pad on the motherboard is recommended. 12.4.2.3. Recommended Soldering Conditions

Solder type: Nippon Alimit Leadfree SR-34, size 0.5mm Recommended Solder Temperature: 270～290°C Typical Soldering Time: ≤2s

Minimum solder distance from EL lamp (body):2.0mm 12.4.2.4. No horizontal press on the EL leads during soldering. 12.4.2.5. 180° bend EL leads three times is not allowed.


Version: 5 PAGE: 24

12.4.2.6. Solder Wetting

Recommended Not Recommended

12.4.2.7. The type of the solder iron:

Recommended Not Recommended

12.4.2.8. Solder Pad

12.5. Operation

12.5.1. Do not drive LCD with DC voltage 12.5.2. Response time will increase below lower temperature 12.5.3. Display may change color with different temperature 12.5.4. Mechanical disturbance during operation, such as pressing on the display area, may

cause the segments to appear “fractured”. 12.5.5. Do not connect or disconnect the LCM to or from the system when power is on. 12.5.6. Never use the LCM under abnormal condition of high temperature and high humidity. 12.5.7. Module has high frequency circuits. Sufficient suppression to the electromagnetic

shall be done by system manufacturers. Grounding and shielding methods may be important to minimize the interference.

12.5.8. Do not display the fixed pattern for long time（we suggest the time not longer than one hour）because it may develop image sticking due to the TFT structure.

12.6. Static Electricity

12.6.1. CMOS LSIs are equipped in this unit, so care must be taken to avoid the electro-static charge, by ground human body, etc.

12.6.2. The normal static prevention measures should be observed for work clothes and benches.

12.6.3. The module should be kept into anti-static bags or other containers resistant to static for storage.

12.7. Limited Warranty

12.7.1. Our warranty liability is limited to repair and/or replacement. We will not be responsible for any consequential loss.

12.7.2. If possible, we suggest customer to use up all modules in six months. If the module storage time over twelve months, we suggest that recheck it before the module be used.

12.7.3. After the product shipped, any product quality issues must be feedback within three months, otherwise, we will not be responsible for the subsequent or consequential events.


Version: 5 PAGE: 25

13. Outline Drawing

NO

TES:

1.D

ispl

ay s

ize:

2.4"

TFT

2.V

iew

ing

dire

ctio

n:6

O'C

LOC

K 3

.Gar

y Sc

ale

inve

rsio

n di

rect

ion:

12 O

'CLO

CK

3.D

ispl

ay m

ode:

Tran

smis

sive

/Nor

mal

whi

te 4

.Ope

ratio

n te

mpe

ratu

re:-2

0°C

~+70

°C 5

.Sto

rage

tem

pera

ture

:-30°

C~+

80°C

6.D

river

IC:S

T778

9V 7

.Pow

er s

uppl

y vo

ltage

:2.8

V 8

.Bac

klig

ht :W

hite

(4 L

ED

)/2.8

V~3.

1(TY

P)~3

.3V/

60m

A 9

.LED

life

:NIC

HIA

/50K

hrs

Brig

hnes

s:32

0(TY

P)cd

/m²

10.

RO

HS

mus

t be

com

plie

d *

Uns

peci

ficat

ion

tole

ranc

e ar

e ±0

.2m

m

(2.9)1.2±

0.2 (3)

36.7

2(AA

)

40.3

2±0.

2(LCD

)

42.7

2±0.

2(BL

)1.2±0.2 56.26±0.2(LCD)

*60.26±0.2(BL)

48.96(AA)2.

65M

AX

3.5±0.5

stiffener

contact sideFront

Back

20.5

±0.

1

R0.3

23.94±0.5

35.1

±0.

2

2.4

TFT

240*(RG

B)*320

COMP

ONENT

ARE

A

(21.50) MAX1.50

41.42±0.1

0.625

P0.5

*39=

19.5

±0.1

5.36±

0.5

13.16±

0.5

140

6±0.5

10.36±0.5

22±0.5 2±

0.5

XRYU

XLYD

2-0.

6±0.

2

15.94±0.5

Viewin

g after

bending,

shipment wit

h unfold FPC

140

2-0.

95

DEM

2403

20J1

TMH

-PW-

N /

E

WYW

(15)

22±0.5

2.61±0.5

(26)

(1.8)

UL E2

5342

5

DOUB

LE S

IDE

TAP

ET=

0.1M

M

W=0.

3

DEM

2403

20J1

TMH

-PW-

N /

E

WYW A1

K

A2 A3 A4

IM3

IM2

IM1

IM0

MCU-Interface Mode

DB Pin in use

10

00

10

01

80 MCU 16-bit bus interface II

80 MCU 8-bit bus

interface

IID[17:10],D[8:1]

D[17:10]

11

01

11

10

3-wi

re 9

-bit

date

ser

ial

inte

rfac

e II

4-wi

re 8

-bit

dat

e se

rial

int

erfa

ce I

I

/RD

/WR

RS/CS

GND

DB13

DB12

DB11

31DB5

32DB6

33DB7

34/RESET

35 36VCC

25DB14

26 27 28DB2

29DB3

30DB4

19 20 21LED-A1

22LED-A2

23LED-A3

24LED-A4

13IM2

14 15 16 17 187 8 9 10 11IM0

12IM3

VCC

65432DB10

1

SYMB

OL

PIN 37

IM1

38DB15

39DB16

40DB17

NC(XR)

NC(YD)

NC(XL)

NC(YU)

LED-K

DB1

SDI

SDO

VCI

DOUB

LE S

IDE

TAP

ET=

0.1M

M

SDI:In

/SDO:OUT

SDI:In

/SDO:OUT

DB8

0.65

0.3±

0.05

961

A2 A

3 A4

A1K

Sing

le A

rea

XR

YU

XL

YD

A4 A3 A2

A1K

Documents

DEM240320J1 TMH-PW-N VER5 · 0 15.10.2016 ZFY Initial Release 1 24.10.2016 ZFY Modify Backlight Characteristics Modify Luminance Modify Pins Definition(A1-A4) Modify outline drawing