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www.f1-media.com [email protected] F1M84 Datasheet Confidential / Preliminary Documentation Revision 2.0 F1media

Datasheet - F1 Media · Initial carrier frequency tolerance Normal -20 20 KHz Carrier ... 2MHz (2nd Adjacent channel) 3MHz (3rd Adjacent channel) 11 0 -30 -40 dB Blocking performance

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F1M84

Datasheet

Confidential / Preliminary Documentation

Revision 2.0

F1media

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List of Contents 1. General

1.1 Overview

1.2 Features

1.3 Application

1.4 Pinout Diagram

1.5 Device Terminal Functions

1.6 Module Dimension

2. Characteristics

2.1 Electrical Characteristics

2.2 RF Characteristics

3. Interface

3.1 UART interface

3.2 USB interface

3.3 Serial Flash interface

3.4 Programming and Debug interface

3.5 I2C EEPROM interface

3.6 LED drivers

3.7 Audio Interfaces

3.8 Battery Charger

4. Application Schematic

5. PCB Layout

6. Reflow Temperature Profile

7. Revision History

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1. General

1.1 Overview This specification covers Bluetooth module (class-2) which complies with Bluetooth specification version 4.0 /Bluetooth low energy

and integrates RF & Baseband controller in small package. This Module has deployed CSR’s CSR8645/8640/8620/8610 chipset.

Fil

ter

Ba

lun

2.4

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1.2 Features

• Bluetooth supports

. Bluetooth v4.0 specification compliant

. Dual-mode Bluetooth low energy radio

. Support for Bluetooth basic rate/EDR

• Kalimba DSP

. Enhanced Kalimba DSP (80MIPS)

• Physical interfaces

. UART/USB(2.0)

. 1-bit SPI flash memory interface

. 22’s general PIO

. PCM/I2S interfaces

. 3 LED drivers

• Improved Audio Quality

. CVC noise cancel support

. aptX Music quality enhancement

. Multipoint support for HPF/A2DP

• Audio Interface

. analog/digital support

. 1/2 microphone (analog/digital)

. Supported sample rates of 8, 11.025, 16, 22.05, 32, 44.1, 48 and 96kHz(DAC only)

• Bluetooth Profiles

. Bluetooth v4.0 specification support

. HFP v1.6 (wideband speech)

. HSP v1.2

. A2DP v1.2

. AVRCP v1.4

. Support for smartphone applications (apps)

• Battery Charger

. Lithium ion/Lithium polymer battery charger

. Support USB charger detection

1.3 Application • Stereo headsets

• Wired stereo headsets

• Portable stereo speakers

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1.4 Pinout Diagram

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1.5 Device Terminal Functions

PIN Name Description

QSPI

I2C_SCL/QSPI_FLASH_CLK/PIO[10]

I2C_SDA/QSPI_FLASH_IO[0]/PIO[11]

QSPI_FLASH_IO[1]/PIO[13]

I2C_WP/QSPI_FLASH_CSB/PIO[12]

28

27

26

25

I2C bus clock/SPI flash CLK/PIO[10]

I2C bus data/SPI flash data bit0/PIO[11]

SPI flash data bit 1/PIO[13]

I2C bus memory write protect/SPI flash chip enable/PIO[12]

MIC

MIC _AN

MIC _AP

MIC _BN

MIC _BP

MIC_BIAS

58

59

60

61

57

MIC input negative, channel A , Left

MIC input positive, channel A, Left

MIC input negative, channel B, Right

MIC input positive, channel B, Right

MIC bias

SPEAKER

SPKR_LN

SPKR_LP

SPKR_RN

SPKR_RP

64

65

62

63

Speaker output negative, left

Speaker output positive, left

Speaker output negative, right

Speaker output positive , right

PCM/SPI

PCM1_CLK/SPI_CLK/PIO[5]

PCM1_IN/SPI_MOSI/PIO[2]

PCM1_OUT/SPI_MISO/PIO[3]

PCM1_SYNC/SPI_CSB/PIO[4]

SPI_PCM#

34

33

35

32

36

SPI data clock/PCM CLOCK

SPI data input/PCM IN

SPI data output/PCM OUT

SPI chip select/PCM SYNC

SPI/PCM select input. (0:PCM/, 1:SPI)

LED LED0/PIO[29]

LED1/PIO[30]

LED2/PIO[31]

29

30

56

LED[0] drive output

LED[1] drive output

LED[2] drive output

USB USB_P

USB_N

51

50

USB data Plus

USB data Minus

UART

UART_RTS/PIO[16]

UART_TX/PIO[15]

UART_CTS/PIO[17]

UART_RX/PIO[14]

23

20

21

22

UART request to send, active low

UART data output, active low

UART clear to send, active low

UART data input, active low (idle status high)

PIO

PIO[0]

PIO[1]

PIO[6]

PIO[7]

PIO[8]

PIO[9]

PIO[18]

PIO[19]

PIO[20]

PIO[21]

AIO[0]

15

14

12

16

11

17

10

9

55

54

19

Programmable input/output line

Programmable input/output line

Programmable input/output line

Programmable input/output line

Programmable input/output line

Programmable input/output line

Programmable input/output line

Programmable input/output line

Programmable input/output line

Programmable input/output line

AIO

Other Pins

ANT 1 RF Connection to Antenna

GND 2,3,4,5,6,7,8,44,

66,67,68,69,70

Ground

VREGIN_DIG 37 Digital LDO input

VBAT 42 Battery voltage input

VDD_PADS 39 Positive Supply input for input/output ports

VDD_1V8 53 1.8V supply input

VDD_1V35 48 1.35V supply input

VREGENABLE 38 Regulator enable input

3V3 49 3.3V output voltage

CHG_EXT 45 External charger control

VBUS 40 Charger input

SMPS_1V35 47 1.35V LDO sense input

SMPS_1V8 52 1.8V LDO sense input

VBAT_SENSE 46 Battery charger sense input

LX_1V8 41 Inductor connection for 1.8V LDO

LX_1V35 43 Inductor connection for 1.35V LDO

AUX_1V35 13 Auxiliary input 1.35V

RESETB 31 Reset if low.

XTAL_IN 24 Crystal input

XTAL_OUT 18 Crystal output

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1.6 Module Dimension

2. Characteristics

2.1 Electrical Characteristics

Absolute Maximum Ratings

Rating MIN MAX

Storage temperature -40°C 85°C

Charger (VBUS) 5.75V

Supply voltage (VDD_1V35) 1.45V

Supply voltage (VDD_1V8) 1.95V

Recommended Operating Conditions

Operating Condition MIN MAX

Operating temperature range -30°C 85°C

Charger (VBUS) 4.56V 5.75V

Supply voltage (VDD_1V35) 1.40V

Supply voltage (VDD_1V8) 1.95V

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2.2 RF Characteristics

Transmitter

Specification Condition MIN TYP MAX UNIT

Output transmit power Normal -6 1 4 dBm

Transmit power density Normal 4 dBm

Transmit power control Normal 2 8 dBm

Frequency Range Normal 2400 2483.5 MHz

20dB bandwidth for modulated carrier Normal 850 1000 KHz

Adjacent channel transmit power

±2MHz

±3MHz

±4MHz

-20

-40

-40

dBm

Modulation Characteristics

f1avg

f2max

f2avg / f1avg

140

115

175

80

KHz

KHz

%

Initial carrier frequency tolerance Normal -20 20 KHz

Carrier frequency Drift

One slot packet(DH1)

Three slot packet(DH3)

Five slot packet(DH5)

-25

-40

-40

25

40

40

KHz

Transceiver

Specification Condition MIN TYP MAX UNIT

Adjacent channel transmit power

30MHz ~ 1GHz

1GHz ~12.75GHz

1.8GHz ~5.1GHz

5.1GHz ~5.3GHz

-36

-30

-47

-47

dBm

Receiver

Specification Condition MIN TYP MAX UNIT

Sensitivity level (0.1% BER) Single slot packets -70 -78 dBm

Transmit power density Multi slot packet -70 -78 dBm

C/I performance

co-channel

1MHz (Adjacent channel)

2MHz (2nd Adjacent channel)

3MHz (3rd Adjacent channel)

11

0

-30

-40

dB

Blocking performance

30MHz ~ 2000MHz

2000MHz ~ 2400MHz

2500MHz ~ 3000MHz

3000MHz ~ 12.75GHz

-10

-27

-27

-10

dBm

Intermodulation performance n=5 -39 dBm

Maximum input level -20 -10 dBm

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3. Interface

3.1 UART interface Four signals are used to implement the UART function.

This is only for test and debug. UART_TX and UART_RX transfer data between the two devices. The remaining two signals,

UART_CTS and UART_RTS, can be used to implement RS232 hardware flow control where both are active low indicators.

3.1.1 UART Setting

User can change data format the following selection using PSKEY.

However, host shall communicate with default setting UART connection initiated at first time.

Baud Rate = (PSKEY_UART_BAUD_RATE) / 0.004096

Parameter Possible value

Baud Rate 9600 ~ 4M Baud

Flow Control None

Parity None, Odd or Even

Number of Stop Bits 1 or 2

Bits per channel 8

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3.2 USB interface F1M84 has a full speed(12Mbps) USB interface for communicating with other compatible digital devices. F1M84 contains internal

USB termination resistors and requires no external resistor matching. F1M84 supports the Universal serial bus specification, battery

charging specification together.

The below describes USB basics and architecture.

- Power distribution for high and low bus-powered configurations

- Power distribution for self-powered configuration, which includes USB VBUS monitoring

- USB enumeration

- USB suspend modes and Bluetooth low-power modes :

. Global suspend

. Selective suspend, includes remote wake

. Wake on Bluetooth, includes permitted devices and set-up prior to selective suspend

. Suspend mode current draw

. PIO status in suspend mode

. Resume, detach and wake PIOs

- Battery charging from USB, which describes dead battery provision, charge currents, charging in suspend modes and USB

VBUS voltage consideration

3.3 Serial Flash interface F1M84 supports external serial flash ICs. This enables additional data storage areas for device-specific data. F1M84 supports serial

single I/O devices with a 1-bit I/O flash-memory interface.

3.4 Programming and Debug interface F1M84 provides a debug SPI interface for programming

3.5 I2C EEPROM interface F1M84 supports optional I2C eeprom for storage of setting value and voice prompt data

3.6 LED drivers F1M84 includes a 3-pad synchronized PWM LED driver for driving RGB LEDs for producing a wide range of colors. All LEDs are

controlled by firmware. The terminals are open-drain outputs, so the LED must be connected from a positive supply rail to the pad

in series with a current-limiting resistor.

3.7 Audio Interfaces

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F1M84’s audio interface consists below.

- Stereo/dual-mono audio codec

- Dual analogue audio inputs

- Dual analogue audio outputs

- 2 digital microphone inputs

- Configurable PCM and I2S interface

3.7.1 Audio Output

F1M84 have a buffer with gain-setting, a low-pass filter and a class AB output stage amplifier

Mono operation is a single-channel operation of the stereo codec. The left channel represents the single mono channel for audio

in and audio out. In mono operation, the right channel is the auxiliary mono channel for dual-mono channel operation

3.7.2 Analog Input

F1M84 contains an independent low-noise microphone bias generator. In using Line input, F1M84 supports a differential input and

a single-ended input.

3.7.3 PCM interface

F1M84 supports PCM interface.

- Continuous transmission and reception of PCM encoded audio data over Bluetooth

- Processor overhead reduction through hardware support for continual transmission and reception of PCM data

- PCM interface master, generating PCM_SYNC and PCM_CLK

- PCM interface slave, accepting externally generated PCM_SYNC and PCM_CLK

- Various clock formats including :

. Long Frame Sync

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. Short Frame Sync

. GCI timing environments

- 13-bit or 16-bit linear, 8-bit u-law or A-law companded sample formats

- Receives and transmits on any selection of 3 of the first 4 slots following PCM_SYNC

3.7.4 I2S Interface

The digital audio interface supports the industry standard formats for I2S, left-justified or right-justified. The interface shares the

same pins as the PCM interface, which means each audio bus is mutually exclusive in its usage.

3.8 Battery Charger

3.8.1 Battery Charger Hardware Operating Modes

The battery charger has 5 modes.

- Disabled

- Trickle charge

- Fast charge

- Standby : fully charged or float charge

- Error : charging input voltage.

The battery charger operating mode is determined by the battery voltage and current. The internal charger circuit can provide up

to 200mA. For currents higher than this, external pass transistor is need.

3.8.1.1 Disable mode

In this mode, the battery charger is fully disabled and draws no active current on any of its terminals.

3.8.1.2 Trickle Charge mode

In this mode, a current of approximately 10% of the fast charge current.

3.8.1.3 Fast Charge mode

In this mode, a current of approximately is between 10mA and 200mA.

3.8.1.4 Standby mode

When the battery is fully charged, the charger enters standby mode, and battery charging stops.

3.8.1.5 Error mode

The charger enters the error mode if the voltage on the VBUS pin is too low to operate the charger correctly. In this mode,

charging is stopped. The battery charger does not require a reset to resume normal operation.

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4. Application Schematic

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5. PCB Layout

Unit : mm

Top view

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6. Reflow Temperature Profile

Recommended solder reflow profile are shown in below and follow the lead-free profile in accordance with JEDEC Std 20C. Table

lists the critical reflow temperatures. Flux residue remaining from board assembly can contribute to electrochemical migration

(ECM) over time. This depends on a number of factors, including flux type, amount of flux residue remaining after reflow, and

stress conditions during product use, such as temperature, humidity, and potential difference between pins. Care should be taken

in selecting production board/module assembly processes and materials, taking into account these factors.

Process Step Lead-Free Solder

Ramp rate 3°C/sec

Preheat Max. 150°C to 180°C, 60 to 180 sec

Time above liquidus +220°C 30 to 90 sec

Peak temperature +255°C ±5°C

Time within 5°C of peak temperature 10 to 20 sec

Ramp-down rate 6°C/sec max

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7. Revision History

Revision Date Change Descriptions Issued by

Rev 1.0 2012-10-10 Initial release S.J.LEE

Rev 2.0 2013-09-24 Added Antenna And pinmap change como