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Model Defect Defect cause Corrective actionTKC0600 Transformer - Lead Dirty The acidification film which on the surface of i) Additional Checking frequency to ensure that " Solder Slot "

contamination. solder slot not completely wipped off. So, free from the " Acidification Slot ".when PIN terminal getting tin,it attached on. Before : Checking 1 time pershift.

After : Checking 3 times pershift.

ii). Add checker to inspect for " Lead Pin " surface during mass prod.

Supplier : Ryhoso

TKC0800 Input Lead Set - Lead Oxidize Excess flux cover the wire lead re-action i) Improve process control by revise the soldering process towith solder become Oxidize if kept for prevent the flux re-action with solder.long storage time ( 6 Months ) Before : Dipping 100% of wire lead into the solder flux.

After : Dipping 75% of wire lead into solder flux.

ii) 100% re-inspection if the solder products was kept morethan 6 months after process.

Lead withOK Condition

Lead Oxidize( NG )

Before and After Improvement :-

Before:

After :

Solder Slot Dirty Contamination

( NG Condition )

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No. Model Part Name DefectDetected

RejectedRatio

Defect (Rootcaused) Supplier Improvement activties

1 TKC0601 Transformer Lead Dirty 130/ 21600 The acidification film which on the surface o i) Additional Checking frequency to ensure that " Solder Slot "Contamination solder slot not completely wipped off. So, free from the " Acidification fi lm ".

when PIN terminal getting tin,it attached on. Before : Checking 1 time pershift.After : Checking 3 times pershift.

ii). Add checker to inspect for " Lead Pin " surface during mass pr

iii) Update work instruction for future monitoring.

iv) Provide training to related PIC regarding defectrootcaused and action taken.

Worst Defect 1 ( June 2013 )

Dirty Contamination( NG Condition )

Training Record

Work Instruction

Monitor List

Process Flow

Solder Slot

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No. Model Part Name Defect Detected Rejected Defect (Rootcaused)1 TKC0800 I nput Lead Set Lead Oxidize NG 89/556 Excess flux cover the wire lead re-act

with solder become Oxidize if kept folong storage time ( 6 Months )

Worst Defect 2 ( JUNE 2013 )

Lead withOK Condition

Lead Oxidize( NG Condition

Before :

After :

Before and After Improvement Action:-

Work Instruction

Attention Note Attention Note

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Supplier Improvement activtiesi) Improve process control by revise the soldering process toprevent the flux re-action with solder.Before : Dipping 100% of wire lead into the solder flux.After : Dipping 75% of wire lead into solder flux.

ii) 100% re-inspection if the solder products was kept more

than 6 months after process.

iii) Update work instruction for future monitoring.

iv) Provide training to related PIC regarding defectrootcaused and action taken.

Training Record

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Monitor List

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pcs pcs.