1

CARRIER BUS LAYOUT(a)± 193 mm

ladder1ladder2

15.8

6 m

m

13.62 mm

Pixel chipPixel chip

Michel Morel EP/ED 09/2000

32 x 425µ

256

x 50

µ

Decoupling capacitors

16.8

mm

70.72 mm70.72 mm

Power supplies connector

13.9

2mm

1000mm

Flexible Extender

Bonding wires

MCMMCM- pilot- GOL- Serializer- Laser drivers- Analogue part

Pilot &link drivers

Data

Controls

Clk

Note: the drawing is not to scale

50 mm

12m

m

copperAluminium

Pull upnetworkresistors

2

1

2

3

4

5

6

READOUT CHIP

PIXEL DETECTOR

200µ

600µ

13.92mm

AluminiumPolyimide

6 ANALOG_GND 25µ5 ANALOG_POWER 25µ4 VERTICAL LINES 5µ3 HORIZONTAL LINES 10µ2 DIGITAL_POWER 25µ1 DIGITAL_GND 25µ

Via between horizontal and vertical lines

Michel Morel EP/ED 05/00Michel Morel EP/E

CARRIER BUS + DETECTOR AND READOUT CHIPCROSS SECTION (solution A)

BONDIND WIRES

15.86mm

CARBON FIBER SUPPORT

COOLING TUBE

1mm

Note: the drawing is not to scale

3

1

2

3

4

5

6

READOUT CHIP

PIXEL DETECTOR

AluminiumPolyimide

CARBON FIBER SUPPORT

PIXEL BUS + DETECTOR AND READOUT CHIPCROSS SECTION (solution B)

1 ANALOG_GND 25µ2 ANALOG_ POWER 25µ3 HORIZONTAL LINES 10µ4 VERTICAL LINES 5µ5 DIGITAL_POWER 25µ6 DIGITAL_GND 25µ

1

2

5

6

Glue

COOLING TUBE

11.92mm2mm

0.6

0.2

?

Michel Morel EP/ED 09/2000

PIXEL_BUS

4

200µ

AluminiumPolyimide Michel Morel EP/ED 09/2000

CARRIER BUS + EXTENDER & MCMCROSS SECTION

Note: the drawing is not to scale CopperGlue

12mm

1.15mm

Carrier bus

MCMPilot & GOL

400µ MCM Carrier

250µ extender

Opt.Link

Opt.Link

Opt.Link

5

CARRIER BUS CROSS SECTION(solution A)

Glue 5µPolyimide 15µ

Aluminium 25µ

Liquid Polyimide 5µ

200µ

Aluminium 10µAluminium 5µ

Michel Morel EP/ED 09/00Michel Morel EP/ED 0

1) Digital ground

2) Digital power supply 3) Horizontal lines4) vertical lines

5) Analogue power

6) Analogue ground

6

Copper

Kapton

EXTENDER CROSS SECTION

1 - Analogue GND2 - Analogue Power (3A)3 - Digital GND4 - Digital Power (3A)5 - MCM power (1A)

Michel Morel EP/ED 09/00

6 - Bias Detector (1mA)

150µ

250µ

12mm

Note: the drawing is not to scale

2mm

1 5 6 6

TOP VIEW1m

12mm

2 3 4 5

Power supplies connectorBonding sector( NI.AU )

7

Bonding wire

Vertical lines

Analogue power

Analogue ground

Pixel_chip

EXAMPLES OF BONDING CONNECTIONS(solution A)

Michel Morel EP/ED 09/00

400µ

8

Vertical linesAnalogue power

Analogue ground

EXAMPLES OF BONDING CONNECTIONS(solution B)

400µ

digital powerDigital ground

Pixel readout chip

Pixel detector

Michel Morel EP/ED 09/00

9

CARRIER BUS PROTOTYPE MADE AT CERN

200mm x 17mm4 aluminium layersbus = 81 lines 100µ

Aluminium: 15µKapton: 50µGlue: 10µTotal thickness:300µ

Michel Morel EP/ED 09/00

10

EXAMPLE OF BONDING CONNECTIONSBETWEEN THE PIXEL CARRIER AND HIS SUPPORT INTERFACE

(power supplies connections)

11

polyimide

Signals layer

VDD plane

These layers have been cut mechanically

12

Analogue ground plane (AGND)

Analogue power plane (VDDA)

Vertical Signal plane

Digital power plane (VDD)

Analogue ground plane (AGND)

Analogue power plane (VDDA)

Vertical Signal plane

Digital power plane (VDD)

Digital ground plane (GND)

These layers have been cut chemically

13

Bonding connections of a PIXEL chip

14

ladder

Pixel_chip

Pilot & Optical link

Extender

carrier bus

Michel Morel EP/ED 09/00

TOP VIEW OF ALICE PIXEL DETECTORONE SECTOR REPRESENTED (SOLUTION A)

Image:INFN(Padova)

15

Image:INFN(Padova)

ALICE PIXEL DETECTOR