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Session 2
Socket Design
Burn-in & TestSocket Workshop2000
COPYRIGHT NOTICE• The papers in this publication comprise the proceedings of the 2000BiTS Workshop. They reflect the authors’ opinions and are reproduced aspresented , without change. Their inclusion in this publication does notconstitute an endorsement by the BiTS Workshop, the sponsors, or theInstitute of Electrical and Electronic Engineers, Inc.
· There is NO copyright protection claimed by this publication. However,each presentation is the work of the authors and their respectivecompanies: as such, proper acknowledgement should be made to theappropriate source. Any questions regarding the use of any materialspresented should be directed to the author/s or their companies.
BURN-IN & TESTSOCKET WORKSHOP
“Package Tolerance Of VFQON: Effect On Socket Design”David Pfaff Marc AbelanetPlastronics Plastronics
“Aspect Of Socket Designs And Its Trends”Lin Pong GohIntel
“Interconnect Solutions For ATE”Mehdi Attaran Iraj BarbaiOztek Oztek
Presentations
Package Tolerance ofVFQON: Effect on Socket
Design
2000 Burn-in and Test Sockets WorkshopFebruary 27-29th, 2000
Marc Abelanet and David Pfaff2601 Texas Drive
Irving Texas 75062972-258-2580;
10/11/99BITSConference
February 28th, 2000 2Plastronics Socket Co.
Agenda
• New Package Family– JEDEC Proposal– Packaging Industry Versions
• Tolerance Study of JEDEC Proposal• Effect on Socket Design - Optimal Design?• Conclusion
10/11/99BITSConference
February 28th, 2000 3Plastronics Socket Co.
New JEDEC Family
• Plastic thin fine pitchquad flat no leadpackage or VFQON
• Industry needs forpackage– Light weight– Small outline– Excellent electrical
characteristics
• Similar to crossbetween LCC and LGApackages
10/11/99BITSConference
February 28th, 2000 4Plastronics Socket Co.
Packaging Industry Versions
• Amkor - MLF• ASAT - LPCC• JEDEC MO-208 (example: Fujitsu - BCC+)• JEDEC MO-209 (example: Samsung - SON)• All Similar Types of Packages
– Flat pad leads on peripheral of device– Leads on bottom side of package only (minimal on side)– Registration to the socket only on outside of package– Wide variety of sizes and pitches
• Sizes from 3 to 10 mm• Pitches of 1, .8, .65, and .5mm
10/11/99BITSConference
February 28th, 2000 5Plastronics Socket Co.
JEDEC VFQON PackageTolerances
• Analysis of Outside Dimensions• Analysis of Pad Dimensions• Locational Tolerances of Pads vs. Body• Finalized Tolerance Study with all Factors
– Per JEDEC– Per Amkor MLF
10/11/99BITSConference
February 28th, 2000 6Plastronics Socket Co.
Outside Dimensional Tolerances
10/11/99BITSConference
February 28th, 2000 7Plastronics Socket Co.
Pad Dimensional Tolerance
10/11/99BITSConference
February 28th, 2000 8Plastronics Socket Co.
Locational Tolerances of Pads
10/11/99BITSConference
February 28th, 2000 9Plastronics Socket Co.
Full Tolerance Analysis Per JEDEC
10/11/99BITSConference
February 28th, 2000 10Plastronics SocketCo.
Full Tolerance Analysis Per Amkor
10/11/99BITSConference
February 28th, 2000 11Plastronics SocketCo.
Socketing Issues Topics
• Electrical Considerations of Contact Element• Size of Contact
– Ability to Mold Components– Ability to Assembly Socket
• Inexpensive Method of Providing Sockets forDifferent Variations of VFQON
• Ability (Difficulty) to Meet Tolerances of Package
10/11/99BITSConference
February 28th, 2000 12Plastronics SocketCo.
Electrical Characteristics
• Package is built for highfrequency,telecommunicationsdevices
• Contact for burn-in use,but good electrical specs.
• Inductance ~3nH• Resistance <30 mOhms• Surface Compression
Mount or Through-Hole• Size - .150”x.150”x.004”
10/11/99BITSConference
February 28th, 2000 13Plastronics SocketCo.
Mold and Assembly of Socket
• Size of contact .004”• Molding gate
allowance of .006” forslots
• Autoloader machinesize tolerance .001”
10/11/99BITSConference
February 28th, 2000 14Plastronics SocketCo.
Different Size Packages
• Must be inexpensiveto tool
• One master socket– Lid with interchangeable
pressure plates– Base
• Two piece modularinserts– Option of surface mount
or through-hole
10/11/99BITSConference
February 28th, 2000 15Plastronics SocketCo.
Meeting the Tolerance of thePackage
• Difficulty to make reliable contact with JEDEC designspecifications– Alignment to the contact pads
• Location of package in plastic guides to be within +/-.001”
• Contact size limited to .004” per force curveconsiderations
• Contact size also limited to .006” for space betweenmaximum size package terminal
• Tolerances of package critical to build functionalsocket - mainly OD variation
10/11/99BITSConference
February 28th, 2000 16Plastronics SocketCo.
Conclusion
• Large variety of packages creates requirement foreasily adaptable sockets
• Electrical characteristics of new package typecreate requirement for high-performance contact
• Volume nature of connector creates requirementfor low-cost stamped or formed contact
• Tolerance is based on specific packaging house,not wide JEDEC tolerances
BiTS Feb 2000
Aspect of Socket Designs and its TrendsAspect of Socket Designs and its Trends
byLP Goh
Intel Technology Sdn. BhdIntel Test Tooling Operation (ITTO)
Malaysia
Intel Itto PenangLP Goh Feb 2000
2LP Goh Feb 2000 Intel Itto Penang
BiTS Feb 2000
Objective IntroductionComparison of various types of BIS featuresCurrent design trendCommon issues during developmentFuture trendConclusion
Agenda:
3LP Goh Feb 2000 Intel Itto Penang
BiTS Feb 2000
Objective
Elaborate current socket trends fromassembly (BIB interface), cost, automationand performance point of view
Address common BIS development issuesFuture BIS cost and performance
requirement trends
4LP Goh Feb 2000 Intel Itto Penang
BiTS Feb 2000
Introduction:
BI: to screen device infant mortality.BIS: interface hardware between DUT and BIBSocket’s functionality, cost, delivery, maintainability are critical items for product delivery. Failure Rate
456789
1011
1 3 5 7 9 11 13 15 17
Time
Fai
lure
Rat
e
Figure 1: Bath Tub curve
5LP Goh Feb 2000 Intel Itto Penang
BiTS Feb 2000Comparison of various types of BISfeatures:
1. BIB-interface type of socket.Through hole SMT
Cost per unit socket Low HighMaintenance Difficult (soldered) Easy (screw mounted)BIB interface Reliable Not reliable (BIB warpage)
Open top Clamp shellAutomation Excellent Poor Manual operation Not ergonomic RecommendedDimensional tolerance Tight (automate) Loose (manual)Actuation High force Low forceCost per socketing Low High
2. Operation-mode type of socket
6LP Goh Feb 2000 Intel Itto Penang
BiTS Feb 2000
Current Design trend
1. Design for BIB assembly processA. Through-hole type socketThrough-hole type needs to accommodate two challenges:
Pitch of device lead is getting finer (2.54mm, 1.27mm, 1mm, 0.8mm); as a result, solder bridging (shorted condition between solder tail after wave solder) worsen(b) through hole type burn-in socket is not reusable after it has been soldered
B. Surface Mount Socket
Challenges faced by surface mount socket:(a) high contact-pin-to-pad force induced high warpage on BIB. Extra components are required to minimize warpage.(b) Higher cost
7LP Goh Feb 2000 Intel Itto Penang
BiTS Feb 2000
Impact of solder bridge
Figure 2: Impact of solder bridgePlastic material melted and stick to contact pin
Contact pin
8LP Goh Feb 2000 Intel Itto Penang
BiTS Feb 2000
Current Design trend ctd…
2. Design for real estate management and cost
higher socket density per board (minimum X & Y)higher board density per burn-in oven (minimum Z height), trade off between power, heat sink height and BIS density requirement.increasing number of passive component required per board.Sharing mold toolre-use socket for close form factor package
9LP Goh Feb 2000 Intel Itto Penang
BiTS Feb 2000
Current Design trend ctd…
3. Design for automation
Tight dimensional tolerance is required for precision alignment between socket and package.Open top socket for ease of package loadingLong lasting with appropriate material, PES, PEIActuated type to capture and release package easilyRobust contact pin design for repetitive processIncreasing in pin count, increasing in actuation force
10LP Goh Feb 2000 Intel Itto Penang
BiTS Feb 2000Current Design trend ctd…
4. Design for performance
Contact pin to carry high current and low inductanceHigh performance heat sink for heat dissipation .Maintain contact pin force while pin count is increasing
Simple contact pin for spring force
Figure 3: Contact pin design for performance
11LP Goh Feb 2000 Intel Itto Penang
BiTS Feb 2000
Common Issues during development
1. Project management/ coordinationTool modification lead time impacting project schedule.
2. Prediction tool capabilitiesThermal, mechanical and electrical simulation reduces the design modification iteration. Fine tuning on tooling is still required.Prototype socket in early discovery work is costly.
12LP Goh Feb 2000 Intel Itto Penang
BiTS Feb 2000
3. Component DesignEfficient heat sink requires for high power product occupies invaluable space.Low inductance contact needed for high frequency testing
Common issues during development ctd…...
Figure 4: Simulation to optimize heat sink geometry
13LP Goh Feb 2000 Intel Itto Penang
BiTS Feb 2000
Future trends
1. Cost and time to marketReplaceable/ reusable socket for next generation burn-in socket.Viability of flexible socket toolingConcept of test during burn in
2. Socket technologyDevice package is evolving --- smaller in size, more pins. Socket needs to have more pins while maintaining its minimum contact force.Socket contact pin performance in high current environment.
14LP Goh Feb 2000 Intel Itto Penang
BiTS Feb 2000
Conclusion
Burn-in socket is a critical item to enable product to meet the competitive market needs. The socket design, cost, delivery schedule and volume capacity will come under intense scrutiny in this competitive semiconductor industry.
The total solution for future burn-in requires re-usable, long lasting, easy to produce, low cost (burn-in per device) and high performance socket. User needs to balance between cost versus performance requirement.
Interconnect Solutions for ATE
Iraj Barabi / Mehdi AttaranOZ Technologies Inc.February 26th 2000
Industry Trends
MiniaturizationReduced Pitch , Increased Pin CountIncreased Performance RequirementsMulti-site testingIntegrated solutionSpeed & flexibility
Contactor DesignConsiderations
Electrical PerformanceMechanical PerformanceDimensional VariationsDesign Reuse\ModularityManual and Automated Test CapabilityField ServiceableCost Effective
Electrical Requirements
AC< 1nH contact InductanceLow cross-talkLow capacitanceSimulation
DC<40 m Ohm contact ResistanceCurrent carrying capacity
Equivalent Circuit Diagram
Electrical Modeling
Electrical Modeling
Electrical SimulationElectrical Simulation
Current Density
Mechanical Requirements
High level of accuracySimulation & Modelinglarge window of operationModular designlong LifeReduced mechanical cross-talkControlled contact pointThermal consideration
AAss= 0.4mm-0.6mm= 0.4mm-0.6mmBBss= 0.5mm-0.7mm= 0.5mm-0.7mm
AAaa=0.46mm=0.46mm BBaa=0.6mm=0.6mm
Accuracy
Accuracy Of DesignAccuracy Of Design
Corner #1 Corner #2
Corner #3 Corner #4
Mechanical Modeling
Force
Deflection
Mechanical Modeling
Thermal SimulationThermal Simulation
Structural Simulations
Large Window Of OperationLarge Window Of Operation
Modular Design
Modularity
2 PC housing pins performance 100K (PI1566)
10
60
110
160
210
260
310
360
0 20000 40000 60000 80000 100000
Cycles
Con
tact
(moh
m)
Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8Pin 9 Pin 10 Pin 11 Pin 12 Pin 13 Pin 14 Pin 15 Pin 16Pin 17 Pin 18 Pin 19 Pin 20 Pin 21 Pin 22 Pin 23 Pin 24Pin 25 Pin 26 Pin 27 Pin 28 Pin 29 Pin 30 Pin 31 Pin 32
Life Cycle Testing
0 50
100
150
200
250
300
0
20,000
40,000
60,000
80,000
100,000
120,000
140,000
160,000
180,000
200,000
220,000
240,000
260,000
280,000
300,000
320,000
340,000
360,000
380,000
400,000
420,000
440,000
460,000
480,000
500,000
Life cycle vs. Resistance
Num
ber of Insertions
Resistance mΩ
Mechanical Cross-Talk
Deflection=~0.010”Force= ~ 10gf
AmbientAmbient
Controlled Contact
AmbientAmbient
After
Before
Controlled Contact
Thermal Considerations
Air Intake
Thermal Considerations
Thermal Simulations
Conclusion
• Design and validation of ATE testcontactors requires a vast array ofdiscipline and technologies.
• Mechanical, Electrical, Thermal andfunctional requirements must beoptimized in a concurrent and interlinkedprocess to yield necessary performancerequirements.