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BLACK&DECKERBLACK&DECKERJess Dibelka Jess Dibelka
Mark SteimerMark SteimerLaura Traub Laura Traub Julianne TwomeyJulianne Twomey
12/10/0712/10/07
Introduction
• Lithium-ion battery pack
• Metal Oxide Semiconductor Field Effect Transistor (MOSFET)
• Electrical switch that controls the speed of the drill head
• Introduces an electrical resistance
• Continuous current loading raises MOSFET temperature
MOSFET
• Small Voltage applied to gate
• Creates electric field across +p substrate
• Conduction bands allow large currents to flow through MOSFET
Trigger
Motor
75°C(OSHA)
Objectives
98 °C(Plastic Deformation
Temperature)
175°C
Goal: Reduce the temperature of the MOSFET junction during use to avoid failure
Quantity of Energy Absorbed
18V Circular Saw ABR Test Loading
0
10
20
30
40
0 200 400 600 800 1000
Time (s)
Cu
rren
t (A
)
JtRIE j 85.14012 Circular Saw Current Profile Used to Over Constrain Design
Heat Energy
Trigger
MOSFET
Motor
Rj
Target Values
Ranking Concept Metrics Target Value
1 Quantity of Heat Absorbed 1401.85 J2 Mass of Device 20.3 g3 Volume of Device <12 cm3
4 Qty Battery Cycles Before Tj = 175 oC 2
5 MOSFET Orientation 0 o Angle6 Unit Production Cost $0.137 Number of Assembly Parts 38 Number of Processing Steps 49 DOF of Device Within Casing 0
Heat Removal Concepts
Final Heat Sink Concept
Design Issues
• MOSFET Attachment/Orientation• Geometric fit within handle• Heat Absorbed • Thermal
– Thermal Gradient– Cp, K, ρ
Required Volume
CCT
cmTc
EV
oo
p
4098
37.9 3
Volume Analysis Heat Sink
Cast
• Aluminum 356
• V = 9.37cm3
Stamped
• Aluminum 6061
• V = 9.99 cm3
Using Law of Energy Conservation
Detailed Design Process
1) SolidWorks Modeling
2) Geometrically Fit in 3D Drill Handle
3) Thermal Model of Drill Handle
Thermal Model Drill Handle
Solid Works Design
Fit Design in Drill Handle
Stamped Concepts Eliminated
• Maximum gage thickness of 3 mm
•Stamping designs occupy more space than cast
• Copper mass significantly higher
Material Mass (g)
Al 6061 26.98
Cu 62.78
3 MOSFET Mounts = 3 Cast Designs
Oval Flange D-Sink
MOSFET wires bent 45oMOSFET wires rotated 90oMOSFET wires un-bent
Thermal Modeling
• Initial Solid Modeling
• Apply 1401 J of energy to heat sink
• Natural convection from heat sink
• Apply adiabatic wall on outer drill
handle
Heat Sink Temp Profile Heat Sink in Drill Handle
97.4 oC
95.3 oC
1401 J
Thermal Modeling Results
Heat Sink Temp Surface Plot
Drill HandleTemp Surface Plot
Design Constraints Flange Oval D-Sink
Max Heat Sink Temperature (Constraint < 98oC)
81.2 75.5 81.4
Max MOSFET Temperature (Constraint < 175oC)
85.3 76.3 83.4
Max Drill Handle Temperature (Constraint < 75oC)
67.4 44.0 62.2
Testing Overview
1) Indicate Heat Sink temperatures with simplified Box
Test
2) Test Heat Sink in Drill Handle
a. Heat Sink Thermal Repeatability
b. Test Procedure Repeatability
Testing Procedure
1) Attach thermocouples
2) Attach resistor and apply
thermal grease
3) Place Heat Sink in Box
4) Apply 1401 J of energy over
732 s
5) Obtain temperature profiles
Thermocouples
Test 1: Box Test
Testing Set-Up
Testing Procedure
Test 2: Drill Handle Test
1) Identical procedure
2) Heat sink placed in drill
handle
3) Thermal repeatability:
Flange tested 3 times
4) Test procedure repeatability:
Oval tested 2 times Thermocouples
Testing Data Collected
For each trial collected thermocouple readings for:
•Heat Sink•MOSFET•Handle
Heat Sink Testing Conclusions
Maximum MOS FET Temperature @ 40
oC Ambient 79.5 81.4 79.1
Maximum Outer H andle T emperature @ 40
oC Ambient 49.0 47.0 54.0
Maximum Heat S ink Temperature @ 40 o C Ambient 70.2 69.7 70.6
Max H eat S ink Temperature D ifference1.09 2.14 0.62
MOSF ET W ire Bend A ngle0 45 90
D-Sink TestingFlange TestingConstraints/ Metrics Oval Testing
9.93 cm3
Qty Battery Cycles before T j= 175oC 2.0.9 J /goC
• Relatively No Thermal Change Between Heat Sinks• Flange has Best MOSFET Attachment • Therefore : Flange is Best Design•Heat Sink Loading and Test Procedure Proved Repeatable
Design Process Conclusion
Temperature difference due to Adiabatic wall condition in Modeling.
Can re-design using FloWorks assuming 10oC Temperature difference.
FloWorks to Test Analysis
Heat Sink Flange Oval D-Sink
Drill Handle 10.42 ±.45 11.55 ± 2.46 9.36 ±.72
Box 15.10 ± 2.26 15.31 ± 2.93 13.10 ± 2.46
Average ∆T (FloWorks - Testing) ± Standard Deviation
Ultimate Re-Design
1) Incorporates 0° wire bend angle MOSFET attachment
2) Use FloWorks to yield max heat sink temperature of ~96oC.
3) Expect testing to yield a temperature of ~86oC
4) Leaving a Margin of Safety of ~10oCV = 6.45 cc
Ultimate FloWorks (oC)
Expected Test
Results (oC)
Maximum MOSFET Temperature 40 oC Ambient 102.2 92.2
Maximum Outer Handle Temperature 40
oC Ambient 66.4 56.4
Maximum Heat Sink Temperature 40
oC Ambient 95.95 85.8
Cost Analysis
Cost ($)Prototyping Machinist $2,100.00
Material $0.72Testing 20 Thermocouples $15.00Total $2,115.72
Production Heat Sink Cost $0.13
Validation Resources
•Machinist
• 10 hrs at $70/hr
•Material
•$2/lb, 50% scrap
•Thermocouples
•Production cost
•$30,000 tooling cost
•700,000 total parts
Path Forward- B&D• Confirm Predicted Test Results of Ultimate Design• Use Design Methodology to Develop Heat Sinks in Future
Tools• Receive Cost Quotes from Heat Sink Suppliers• Test Reliability of Bolt and Nut Attachment Under Long
Term Thermal Cycling• Adapt If Needed To Fit Other Tools
Summary
•All constraints and target values are achieved in heat sink design!!!
•Heat sinks and testing procedure are repeatable
• Difference in heat sink performance between FloWorks and Testing is ~10oC
•New “Ultimate” heat sink is lighter and incorporates positives of previous heat sinks
• Cost for Black and Decker to implement Ultimate is approximately 13 ¢ per heat sink
Questions
Thank You:Black and Decker
Daniel Brisach (Thermal Modeling Help)Roger Stahl (Rapid Prototypes)
& Dr. Glancey
Test Data CV
Flange Thermocouple 1 2 3 4 5Trial 1 52.29 52.95 52.99 53.44 53.09Trial 2 54.39 54.84 53.10 55.24 54.96Trial 3 53.14 54.04 53.00 54.43 53.99Average 53.27 53.94 53.03 54.37 54.01Standard Deviation 1.055 0.951 0.060 0.902 0.940CV 0.020 0.018 0.001 0.017 0.017
Oval Thermocouples 6 7 8 9 10Trial 1 54.90 54.95 55.25 54.80 55.56Trial 2 54.75 54.92 54.47 55.23 55.11Average 54.83 54.94 54.86 55.01 55.33Standard Deviation 0.1093 0.0215 0.5486 0.3079 0.3178CV 0.0020 0.0004 0.0100 0.0056 0.0057
Test Data Delta TBOX TESTFlange Thermoucouples 1 2 3 4 5Trial 1 49.6157 50.192 46.2467 48.9612 50.2699Flow Works oC 65.85 64.991 66.634 66.054 64.694Delta T 16.2343 14.799 20.3873 17.0928 14.4241Oval Thermocouples 6 7 8 9 10Trial 1 48.6948 46.136 49.6454 49.4585 48.3986Flow Works oC 64.912 64.387 64.451 64.397 64.355Delta T 16.2172 18.251 14.8056 14.9385 15.9564D-Sink 11 12 14 15 16Trial 1 50.7996 51.8578 51.6556 50.893 51.1887Flow Works oC 64.11 63.87 63.69 63.61 63.69Delta T 13.3104 12.0122 12.0344 12.717 12.5013Average Delta T 15.04543Standard Deviation 2.39503
Test Data Delta THANDLE TESTFlange Thermoucouples 1 2 3 4 5Trial 1 52.29 52.95 52.99 53.44 53.09Trial 2 54.39 54.84 53.10 55.24 54.96Trial 3 53.14 54.04 53.00 54.43 53.99Flow Works oC 66.06 66.25 67.11 66.17 65.53Delta T Trial 1 13.76 13.30 14.11 12.72 12.44Delta T Trial 2 11.67 11.41 14.01 10.92 10.57 Delta T Trial 3 12.92 12.20 14.11 11.74 11.53Oval Thermocouples 6 7 8 9 10Trial 1 54.90 54.95 55.25 54.80 55.56Trial 2 54.75 54.92 54.47 55.23 55.11
Flow Works oC 67.18 66.6 66.644 66.482 66.623Delta T Trial 1 12.28 11.65 11.40 11.69 11.07Delta T Trial 2 12.43 11.68 12.17 11.25 11.52D-Sink Thermocouples 11 12 13 14 15 16Trail 1 53.95 53.44 53.36 54.70 52.55 54.48Flow Works oC 65.54 65.46 65.61 65.69 65.38 65.50Delta T Trial 1 11.59 12.02 12.25 10.99 12.83 11.02Average Delta T 12.10Standard Deviation 0.97
Testing Target Value Results
Heat Sinks Satisfied the Constraints with ~ 20oC Margin of
Safety
2 Mass of Heat Sink (g) 25.91 25.26 25.78 24.80 29.82 25.05
3 Volume of Heat Sink (g) 9.39 9.36 9.34 9.19 9.36 9.28
Ranking Testing Prototype Metrics Flange Target Flange Actual D-Sink Target D-Sink Actual Oval Target Oval Actual
ConstraintMaximum MOSFET Temperature
@ 40 oC Ambient 175oC 79.5 81.4 79.1
ConstraintMaximum Outer Handle Temperature
@ 40 oC Ambient 75oC 49.0 47.0 54.0
ConstraintMaximum Heat Sink Temperature
@ 40 oC Ambient 98oC 70.2 69.7 70.6
1 Quantity of Heat Absorbed 1401.9 J Controlled Controlled Controlled
4 Qty Battery Cycles or Time before T j= 175oC 2 or 732 s Controlled Controlled Controlled
8 Max Temperature Change 1 oC 1.1 2.1 0.6
Testing Prototype Metrics Target ValueRanking D-Sink ActualFlange Actual Oval Actual
Testing ResultsFlange Repeatability
Plain English Statement
Example of CV
Poor control Cv = .2
Fair control Cv = .1
Tight control Cv = .05
Excellent control Cv = .025
World class Cv = .0125
Seldom achieved Cv = .000625
Courtesy of Dr. Glancey
Oval Test Repeatability
Thermocouple 1 2 3 4 5
Coefficient of Variability 0.083 0.077 0.004 0.076 0.082
Thermocouple 6 7 8 9 10
Coefficient of Variability 0.009 0.002 0.047 0.027 0.028
Energy Analysis MOSFET
JtRIE jin 85.14012
CT
RR
TT
t
E
oJ
TGJC
Jin
102
max
Total Energy Equation
Actual MOSFET Junction Temperature
Energy Calculations
Total Energy (J)Junction
Temperature (oC)
2 Battery Packs Resistance 150oC
1401.85 102.75
2 battery Packs Resistance 100oC
1168.21 101.96
Rotor Lock 1160.70 103.48
Energy Analysis Heat Sink
399.9 cmV
Tc
EV
TVcEE
p
in
pstin
Volume of Heat Sink Required
Thermal Analysis Handle
CT
TThATTL
kAWE
qqEE
oP
HSPHSout
convcondoutst
25.58
)()(91.1 21
TP
Thermal Analysis Constants
CT
R
R
cmA
cmASA
cmLcmK
Wk
oHS 98
0053.
0063.
7.23
3.4..6
1
3.
002.
100
150
22
21
CCT
W
CR
W
CR
stKcm
Wh
CT
oo
o
TG
o
JC
oHS
4098
2
48.
732
002.
98
2
Equation Constants
Material Properties Cp Al 6061
(J/goC)
Cp Al 356 (J/goC)
Cp Cu Anneal (J/goC)
ρ Al 6061 (g/cc)
ρ Al A356 Cast
(g/cc)
ρ Cu Anneal (g/cc)
K 6061 (W/mK)
K Al 356 (W/mK)
K Cu Anneal (W/mK)
0.896 0.963 0.385 2.700 2.680 8.960 167 151 385
V Stamping Al 6061 (cm3)
V Cast Al 356 (cm3)
V Stamping Cu (cm3)
m Al 6061 (g)
m Al 356 (g)
m Cu Anneal
(g)
9.99 9.37 7.01 26.98 25.10 62.78
Testing Calculations
AmpsI
VV
R
P
IRV
RIWP
18.6
309.
05.
91.1
)( 2