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ALPHA ® TRUEHEIGHT ® PREFORMS ALPHA ® TrueHeight ® Solder Preforms prevents die tilt and delivers consistent bondline thickness. ALPHA ® TrueHeight ® Preforms can be tailored for different applications. Customized shapes and thicknesses, with embedded spacer(s) that address all major applications requiring 75µm bondline and above, can be delivered to you. ALPHA ® TrueHeight ® Preforms have built in spacers that can be strategically located to ensure consistent bondline thickness and minimal die tilt. The design architecture not only addresses the BLT requirement but also reduces opportunities for voiding. Gases aren’t prevented from escaping the structure itself. Also, ALPHA ® TrueHeight ® Preforms can be flux coated with a wide range of fluxes designed for your specific application. Key Attributes Superior bondline thickness control • Minimal bondline tilt • Consistent reliability performance • Tailored for your specific application(s) • Simplicity of design offers best-in-class overall performance TOUGHER ELECTRONIC ASSEMBLIES REDUCED LABOR COST LONG-TERM RELIABILITY SPEED LIMIT REDUCED TIME TO MARKET HIGHER YIELDS REDUCED VOIDING SOLDER PREFORMS Die Solder Substrate ENGINEERED WITH SIMPLICITY IN MIND TO ALLOW EASE OF IMPLEMENTATION AND MAXIMUM SOLDERING PERFORMANCE.

ALPHA TRUEHEIGHT PREFORMS - alphaassembly.com · ALPHA ® TRUEHEIGHT® ... ENGINEERED WITH SIMPLICITY IN MIND TO ALLOW EASE OF ... Flexible bondline control at strategic location(s)

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ALPHA® TRUEHEIGHT® PREFORMS

ALPHA® TrueHeight® Solder Preforms prevents die tilt and delivers consistent bondline thickness.ALPHA® TrueHeight® Preforms can be tailored for different applications. Customized shapes and thicknesses, with embedded spacer(s) that address all major applications requiring 75µm bondline and above, can be delivered to you.

ALPHA® TrueHeight® Preforms have built in spacers that can be strategically located to ensure consistent bondline thickness and minimal die tilt. The design architecture not only addresses the BLT requirement but also reduces opportunities for voiding. Gases aren’t prevented from escaping the structure itself. Also, ALPHA® TrueHeight® Preforms can be flux coated with a wide range of fluxes designed for your specific application.

Key Attributes

• Superior bondline thickness control

• Minimal bondline tilt

• Consistent reliability performance

• Tailored for your specific application(s)

• Simplicity of design offers best-in-class overall performance

TOUGHERELECTRONICASSEMBLIES

REDUCEDLABORCOST

LONG-TERM RELIABILITY

SPEEDLIMIT

REDUCEDTIME TOMARKET

HIGHERYIELDS

REDUCEDVOIDING

SOLDER PREFORMS

DieSolderSubstrate

ENGINEERED WITH SIMPLICITY IN MIND TO ALLOW EASE OFIMPLEMENTATION AND MAXIMUM SOLDERING PERFORMANCE.

Global Headquarters300 Atrium Drive Somerset, NJ 08873 USATel: +1-814-946-1611

European HeadquartersUnit 2, Genesis Business Park Albert Drive, Woking, Surrey, GU21 5RWUKTel: +44 (0) 1483 758400

Asia/Pacific8/F, Paul Y. Centre, 51 Hung To RoadKwun Tong, KowloonHong KongTel: 852-3190-3100

AlphaAssembly.com

For more information about ALPHA® TrueHeight® Preforms, please contact your Alpha Representative.

©2017 Alpha Assembly Solutions Issued 10/17 SM1474

PRODUCT INFORMATION

LEGEND TOLERANCE

a = length (1.35 to 58mm) ±0.05mm

b = width (1.35 to 58mm) ±0.05mm

c = thickness ±10%

Flexible bondline control at strategic location(s)

Also available in other or special alloys upon request

Bondline thickness available from 0.075mm

ALPHA® TRUEHEIGHT® PREFORMS

a

b c

TECHNICAL DATA

STANDARD ALLOY DESIGNATION SOLIDUS / LIQUIDUS. °C

J-STD-006BPb-free

High Reliability Sn-Pb

SAC305 / 387 / 357 / 405 InnoLot / PowerBond

Sn5Pb92.5Ag2.5

217 – 221206- 218 / 225 – 255

299 – 304

Proprietary Low Silver SACX Plus 0307 217 - 228

ALPHA® TRUEHEIGHT® PREFORMS APPLICATIONSSpacer(s) are used depending on assembly type:• Single – single point lift to achieve desired BLT• Dual – achieve desired BLT and control tilt

Die and Clip Attach RF Power Amplifier Assembly Multi-Layer Assembly