This presentation may contain confidential and/or privileged information. Any unauthorized copying, disclosure or distribution of the material in this document is strictly forbidden.

A Peek into the EOS Lab: Micro Laser Sintering

Joachim Goebner, EOS

A Peek into Micro Laser-Sintering

Source: IVAM, EOS

A look into the lab and beyond

Motivation

Technology

Business

Text

Text

Micro Laser-Sintering extends Additive Manufacturing to the Micro World

Sustainability

Time to market

Customization

Functional integration

Complexity for free

Freedom of design

Markets for miniaturized parts are growing

Additive manufacturing serves global manufacturing trends

Micro Laser-Sintering

Source: IVAM, EOS

2002 2006 2008 2009 2014 2016 2013

First working R&D system at University of Applied Sciences Mittweida

3D-Micromac presents “MicroForm”, EOS enters project

MLS technology demonstrator

EOS offers MLS application development

MLS Pre-series systems at EOS & TU Darmstadt

First production facility in place

MLS Series system

Technology: Roadmap Micro Laser-Sintering

Source: HS Mittweida, 3D-Micromac AG, TCC Chemnitz, EOS GmbH

Technology: Current status EOSINT µ60

Effects Facts

Material

Particle size up to 5µm (D90)

Stainless Steel 316L

Molybdenum

Laser

Continuous wave & pulsed

Spot size diameter up to 30µm

Recoating

Layer thickness from 1 to 5 µm

Monitoring of platform & recoater position

Sub µ resolution of the platform

NEW: Bi-directional

NEW: Ceramic blades

Material

Fine detail resolution

Medical devices

High temperature melting applications

e.g. Medical & Automotive

Laser

Best part density and surface roughness

Minimum wall thickness approx. 30µm so far

Recoating

Fine detail resolution

Prepared for manufacturing

Repeatability of layer thickness

Increased productivity

Less wear

Technology: Current status EOSINT µ60

Effects Facts

Process Chamber

Build envelope: Ø 57 mm x 30 mm height

Inert atmosphere ( < 1ppm O2 and H2O)

Gas tight design

Gas cleaning included

NEW: Airlock system with Rapid Transfer Port

Process chamber

Fits micro parts

Enables safe processing of reactive materials

Low running cost

Sustainability

Easy & safe interaction to / from workstation

NEW: Workstation in glove box design

Inert atmosphere

Gas tight design

Gas cleaning included

Airlock system with Rapid Transfer Port

Workstation

Safe pre- and post processing of powder & parts

Low running cost

Sustainability

Easy & safe interaction to / from machine

Technology: Operating reactive powder securely

Source: EOS GmbH

Workstation

EOSINT µ60

Sieving Preparing Cartridges

This area is secure because of the gas tight Machine, Workstation and

Rapid Transfer Port

Powder Platforms

Tools

Powder Platforms

Tools Parts

Part & Tool cleaning

Warehouse

Post processing

QA

Technology: Current status EOSINT µ60

Effects Facts

Software

Workflow structure

Supports different user levels & Remote access

Comprehensive data logging

NEW: 64 bit OS

Software

Easy learning and managing

Fits business; Quick and cheap help

QA, Process control, Traceability

Future oriented, can handle large data

Source: EOS GmbH

Concept Study – Flexure hinges for bendable handling or endoscopy applications

EOS – Electro Optical Systems

Micro Grabber

Challenge

For handling applications, a flexible yet strong arm with a mounted grabber is required

Solution

Flexure hinge designed for optimal mechanical response

Mounted grabber with 300 µm width

Advantages

Functional integration: hinges are integrated in the main body

Miniaturization of grabber mechanics

Flexure hinge arm design Grabber details

Concept Study – Y stent for artery branches

EOS – Electro Optical Systems

Y stent

Challenge

For endovascular aneurysm repairs and for preventing aneurysm (e.g. in fistulae used for dialysis) Y shaped stents are required

Solution

Y stent built with 300 µm wall thickness

Subsequent plasma polishing

Advantages

Anatomic situation of blood vessels can be reproduced in stent design

Post processing eliminates sharp edges

Concept Study – Square holes & lattice structures

EOS – Electro Optical Systems

Square holes & lattice structures

Challenge

Radiation applications from medical devices to space research need structures to guide or shield radiation

Solution

Square holes and even changing cross section are no problem

Wall thickness down to 15 µm imaginable today

Advantages

MLS enables certain solutions for the first time

Lattice structures, a few micron “thick” can be manufactured much cheaper with MLS than with e.g. etching

32µm

90 µm

45 µm

Concept Study – Fluid mixing chamber

EOS – Electro Optical Systems

Fluid mixing chamber

Challenge

Mixing solution required for 3 liquid components; applied mechanical load has to be minimized

Solution

Spiral shaped pipes with 200µm wall thickness and 150µm inner diameter

Advantages

Applied load is minimized, no moving parts required for mixing

mixing ratio can be easily modified by pipe diameter, flow ratio and design of the mixing chamber

Concept Study – Personalised rings

EOS – Electro Optical Systems

Personalised rings

Situation

Increasing costs for precious metals motivate material savings for jewelry without compromising its appearance

Solution

Hollow structures save material

Plasma polishing enhances surface finish

Advantages

Jewelry can be personalized without extra cost

Structures are a unique design feature

Ring & bracelet

Hollow structure as design element

Different ring designs

Business: Application development together with partners is the key to success

Source: EOS GmbH

Manufacturing solutions Application development Manufacturing challenges

Medical devices

Automotive

Molds

MLS Application development since 2009

Jewelry

Watchmakers

Space research

This presentation may contain confidential and/or privileged information. Any unauthorized copying, disclosure or distribution of the material in this document is strictly forbidden.

Thank you for your attention!

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www.eos.info info@eos.info joachim.goebner@eos.info