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A Highly Integrated and Comprehensive
SiP Solutions for IoT
Teck Lee Senior Technical Manager, ASE Group, Taiwan.
Introduction
IoT Segmentation
Source: Yole, 2016/10
SiP Heterogeneous Integration
Miniaturization by SiP core technologies
Heterogeneous integration with different technologies
Design / Performance Optimization
Lower cost alternative than SoC
Fast-turn-tailor-made changes
Higher quality, production efficiency and re-configurable
Die/Package, Components System-in-Package (SiP)
Die1
28nm/Fab1
Digital
Die2
40nm/Fab2
Analog +
Die3
20nm/Fab3
Memory +
Die4
14nm/Fab4
Power SA
W
Filte
r MEMS Sensor
+ + +
+ + +
Die1
28nm/Fab1
Digital Die3
20nm/Fab3
Memory
Die2
40nm/Fab2
Analog
Die4
14nm/Fab4
Power
SA
W
Filte
r
MEMS Sensor
ASE SiP Key Milestone
Hybrid WB+FC w/ MUF
WiFi Module
WiFi+BT Combo Module
Sputter Conformal Shielding
Glass Integrated Passive Device (IPD)
Ap
plic
atio
ns
Enab
ling
Tech
no
logi
es
Cu Pillar w/ MUF
WiFi+BT+GPS+FM 4 in 1 Module
3G+WiMax Module Biometric Sensor Module
LTE Modem Module
Compartment Shielding
2005 2007 2010 2011 2013 2014 2015
M.2 SSD Module
Antenna on Package (AoP)
a-EASI (Embedded Die in LF)
SESUB (Embedded Die in SUB)
Double Sided Module
2016
HyPas Platform
Cap bank
SW Passive SAW/BAW PA
SiP Module and
System Integration Solution
Wireless Connectivity - BLE
Application: Bluetooth Low Energy (BLE) for wearable products
Challenge: Size reduction; conventional module size and antenna size
occupy large area making wearable products less attractive
Service provided: Module design, manufacturing, system-level testing
& firmware co-qualification
Technology: Antenna on Package (AoP)
Conformal Shielding
Improvement: 82% module XY size reduction
Before: Single Sided Module with Chip Antenna Module Size : 15.0 x 15.0 x 2.0 mm
Solution : AoP Module Size : 6.5 x 6.5 x 1.2 mm (82% XY reduction)
BLE 4.0 (2.4 GHz) Single Chip RF Passive 20 Pcs Substrate : 4 layer , 0.3 mm Metal Lid , 0201
Wireless Connectivity - WLAN
Application: WiFi 802.11 a/b/g/n 2x2 for smartphone & wearable products
Challenge: size reduction, especially on XY dimension
Service provided: Module design & manufacturing
Technology: Double side SMT
Double side molding & exposed molding
Conformal shielding
Improvement: 30% module XY size reduction
Before: Single Sided Module Module Size: 10.0 x 6.6 x 1.1 mm
Solution: Double Sided Molding Module Module Size: 7.75 x 5.4 x 1.3 mm (30 % XY reduction)
SI SI
Substrate
802.11 a/b/g/n 2x2 + BT 4.0 Dual Band (2.4 & 5 GHz) RF Passive 50 Pcs Substrate : 2+2+2 , 0.3 mm MUF, C/S , 01005, 100um SMT clearance
Sensor Integrated SiP: Sensor + AFE/MCU
Application: Smart Handheld (Ambient Light / Proximity / Gesture), Body
Motion & Physiological Sign Sensing
Challenge: Product mechanical constraint, especially on XY dimension
Service provided: Design, materials, assembly & manufacturing,
system-level testing & firmware co-qualification
Technologies:
Stacked die & WB
High density SMT
Embedded die substrate
Improvement: 80% module XY size reduction
Before: Double-sided module
Module Size: PCB-27 x 10 x 3 mm; Sensor-15x10mm
Solution: Embedded die substrate
Module Size : 8 x 8 x 1.2 mm (~80 % XY size reduction)
Top View Bottom View
Features:
1. Security Lock/Unlock: Accelerator, BLE Beacon
2. Fitness Monitor: HRM/SpO2 Sensor
3. Turn Lighting: Gesture Sensor
4. UV, Front/Rear Lighting: UV/ALS Sensor
1
3
2
4 4
BLE+MCU+Sensors for Smart Bike
HyPas Platform Solutions
HyPas Platform
What is HyPas?
High Performance Passives and Package Hybrid Solution
3D Inductor and Highly Integrated SiP Module
Features:
With or Without Glass
High-Q 3D tall pillar inductor
Functional passive form by integrated L+C
Embedded active/passive ability
Compatible with Fan-out process
Low profile and compact form factor
Compatible to traditional SMT & FC process
WB tuning mechanism
EMI shielding
Cap bank
SW Passive SAW/BAW PA
Cap bank RFIC
Glass
3D Solution: HyPas vs. TGV
HyPas with Tall Pillar (TP)
- No TGV
- Embedded IPD cap bank
- Top 2RDL/ Bottom 2 RDL
- Tall Pillar Diameter < 30um , > 120um Pillar High
- 3D Inductor
- RFIC with 70um Cu pillar
- FC with MUF assembly
- Pre-solder
RFIC (Si)
Cap bank 150um
< 2x2mm RF Module
50um
Total: 400um
IPD with TGV
RFIC (Si)
TGV MIM-Cap.
280um
2.4x2.4mm RF Module
- Glass with TGV
- Glass IPD cap
- Top 1RDL/ Bottom 1 RDL
- TGV Diameter 60um/ Depth 250um
- 3D Inductor
- RFIC with 70um Cu pillar
- FC with MUF assembly
- WLCSP assembly with 250um ball
100um
Total: 900um
Summary
Summary
ASE offers variety of technology solution for SiP requirements
HyPas Platform is a High performance Passives/ Packaging solution
Highly integrated SiP solution is especially suited for IOT End Devices