2015 NEEDHAM GROWTH

CONFERENCE

NEW YORK

JANUARY 13, 2015

2

Safe Harbor Statement

This presentation contains statements about management's future expectations, plans and prospects of our business that

constitute forward-looking statements, which are found in various places throughout the press release, including , but not

limited to, statements relating to expectations of orders, net sales, product shipments, backlog, expenses, timing of

purchases of assembly equipment by customers, gross margins, operating results and capital expenditures. The use of

words such as “anticipate”, “estimate”, “expect”, “can”, “intend”, “believes”, “may”, “plan”, “predict”, “project”, “forecast”,

“will”, “would”, and similar expressions are intended to identify forward looking statements, although not all forward looking

statements contain these identifying words. The financial guidance set forth under the heading “Outlook” constitutes forward

looking statements. While these forward looking statements represent our judgments and expectations concerning the

development of our business, a number of risks, uncertainties and other important factors could cause actual developments

and results to differ materially from those contained in forward looking statements, including the discovery of weaknesses in

our internal controls and procedures, our inability to maintain continued demand for our products; the impact on our

business of potential disruptions to European economies from euro zone sovereign credit issues; failure of anticipated

orders to materialize or postponement or cancellation of orders, generally without charges; the volatility in the demand for

semiconductors and our products and services; failure to adequately decrease costs and expenses as revenues decline,

loss of significant customers, lengthening of the sales cycle, incurring additional restructuring charges in the future, acts of

terrorism and violence; inability to forecast demand and inventory levels for our products, the integrity of product pricing and

protect our intellectual property in foreign jurisdictions; risks, such as changes in trade regulations, currency fluctuations,

political instability and war, associated with substantial foreign customers, suppliers and foreign manufacturing operations;

potential instability in foreign capital markets; the risk of failure to successfully manage our diverse operations; those

additional risk factors set forth in Besi's annual report for the year ended December 31, 2013 and other key factors that

could adversely affect our businesses and financial performance contained in our filings and reports, including our statutory

consolidated statements. We are under no obligation to (and expressly disclaim any such obligation to) update or alter our

forward-looking statements whether as a result of new information, future events or otherwise.

January 2015

3

Agenda

I. Company Overview

II. Market Trends

III. Strategic Objectives

IV. Financial Overview

January 2015

4

I. COMPANY OVERVIEW

January 2015

5

Company Overview

• Leading assembly equipment supplier with #1 and #2 positions in key products. 27% addressable market share

• Broad portfolio: die attach, packaging and plating

• Strategic positioning in wafer level and substrate packaging

• Global mfg. operations in 7 countries; 1,649 employees worldwide. HQ in Duiven, the Netherlands

Corporate Profile

• LTM revenue and net income of € 342.8 and € 52.8 million

• Cash at 9/30/14: € 105.4 million

• Total debt at 9/30/14: € 19.3 million

• € 57 million of dividends and share repurchases since 2011

Financial Highlights

• Growth of advanced packaging, smart phones/tablets, Internet of Things and market share offer revenue upside

• Significant unrealized earnings potential from optimization of Asian production model, supply chain efficiencies and development of common platforms

Investment Considerations

January 2015

€ 85.5

€ 342.8

25.9%

43.2%

20%

25%

30%

35%

40%

45%

0

100

200

300

400

2003 LTM

Gro

ss M

arg

in (

%)

Reven

ue

(€

mill

ion

s)

Revenue Gross Margin

6

Company Development

•2000 2002 2005 2009

Die Attach Acquisitions

•2006 Dragon I complete: € 6 million cost savings

•2008 Dragon II complete: € 15 million cost savings

•2010 Plan: € 7.0 million cost savings. Headcount and product line restructuring

•2012 : € 8.3 million cost savings. Headcount reduction. Plating unit rationalized

•2014: US die sorting operations rationalized. Transferred to Besi Austria

Restructuring

•2006-09 Standard packaging and certain die bonding systems transferred to Malaysia

•2007-09 Dutch tooling & Hungarian die bonding transferred to Asia

•2009-11 Epoxy DB transferred to Malaysia

•2003-12 Malaysian system and Chinese tooling capacity expansion.

•2013 Soft solder DB transferred to Malaysia

•2006-14 Asian headcount increased from 34% to 59%

Asian Production Transfer

January 2015

7

Dicing

Back-end Semiconductor Assembly Process

Die Attach Wire Bond Packaging Plating

Leadframe Assembly

Substrate

Wire Bond Assembly

Substrate

Flip Chip Assembly

Wafer Level Packaging

Flip Chip Assembly

Wire Bond

Die Bond

FC Die Bond

FC Die Bond

Molding

Molding

Molding

Trim & Form

Singulation

Singulation

Singulation

Plating

Ball Grid Array

Ball Grid Array

Die Sort

Die Sort

Die Sort

Die Attach Packaging Ball Attach

Besi Product Positioning

January 2015

8

Customers OEMs End Products

Customer Ecosystem

• Blue chip customer base, top 10 customers represented 51% of 2013 revenue

• Leading Asian Subcontractors and IDMs. 50/50% split in 2013

• Equipment utilized to produce chips for leading fabless companies: Qualcomm,

Broadcom, MediaTek

• Long term relationships, some exceeding 45 years

IDMs

Subcontractors

January 2015

9

• Strategic positioning in advanced

packaging has yielded benefits:

• Enhanced top line development

• Increased gross margins

• Operating initiatives have supported gross

and net margins during last market decline:

• Product line restructurings

• Asian production transfer

• Reduction of European based costs

• Increased tax efficiency

• Increased scalability of business model

• YTD ‘14 results reflect industry rebound,

market share gains and profit potential of

enhanced business model

• Solid liquidity base to finance growth and

shareholder dividends

Year Ended December 31,

(€ millions, except share data) 2011 2012 2013

YTD

2014

Revenue 326.9 273.7 254.9 289.8

Orders 301.1 276.1 251.9 326.2

Gross margin 40% 40% 40% 44%

EBITDA 45.6 32.4 27.9 65.2

Pretax income 34.4 19.5 19.2 57.1

Net income 26.4 15.8 16.1 51.4

EPS (diluted) 0.73 0.42 0.43 1.36

Net margin 8% 6% 6% 18%

Dividend per share 0.22 0.30 0.33 N/A

Net cash 62.7 79.5 71.0 86.1

Summary Historical Financials

January 2015

10

II. MARKET TRENDS

January 2015

147.9

351.1 326.9

273.7 254.9

201.9

289.8

-1.0%

137.4%

-6.9% -16.3%

-6.9%

43.5%

-50%

0%

50%

100%

150%

-

100.0

200.0

300.0

400.0

2009 2010 2011 2012 2013 YTD 2013 YTD 2014

(€ m

illi

on

s)

Besi Revenue

Revenue YoY Growth Rate

Assembly Equipment Market Trends

* Source: VLSI Oct 2014

2.1

4.7 4.3

3.9

3.0 3.5

3.7

-27.1%

124.0%

-7.7% -9.6% -23.1%

16.2% 5.0%

-50%

0%

50%

100%

150%

-

1.0

2.0

3.0

4.0

5.0

2009 2010 2011 2012 2013 2014E 2015E

(US

$ b

illi

on

s)

Assembly Equipment*

Market Size YoY Growth Rate

• VLSI forecasts renewed growth of assembly market in 2014 and 2015

• Besi revenue growth exceeding assembly market in 5 of past 6 years

11 January 2015

2010-2014 Quarterly Book to Bill Ratio

12 January 2015

Mar10

Jun10

Sept10

Dec10

Mar11

Jun11

Sept11

Dec11

Mar12

Jun12

Sept12

Dec12

Mar13

Jun13

Sept13

Dec13

Mar14

Jun14

Sept14

Nov14

Total Equipment 1.21 1.18 1.03 0.90 0.95 0.94 0.71 0.85 1.12 0.93 0.78 0.92 1.11 1.10 0.97 1.02 1.06 1.10 0.94 1.02

Assembly Market 1.51 1.35 0.81 0.86 1.01 0.92 0.81 1.02 1.28 1.11 0.53 0.92 1.08 1.26 0.68 1.06 1.25 1.25 0.69 0.78

1.21

0.90 1.12

0.78

1.06

0.94

1.02

1.51

0.81

1.28

0.53

1.26

0.68

1.25

0.69

0.78

0.50

0.75

1.00

1.25

1.50

1.75

• Besi order trends highly correlated to assembly equipment industry

• Strong industry growth in H1 followed by weaker H2 has been the trend

• 2014 is no exception

Source: Semi January 2015

13

Die Bonding 36.9%

Flip Chip 17.1%

Die Sorting 4.3%

Singulation 8.4%

Presses 8.7%

Molds 15.8%

Lead Trim & Form 7.2%

Plating 1.6%

Assembly Equipment Market Composition

• Half of 2013 assembly market represented by die attach and wire bonding equipment

• Die Attach represents Besi’s largest addressable market

Die Attach

58%

Packaging

40%

Plating

2%

Assembly Equipment Market *

(2013: $3.0 billion) Besi Addressable Market *

(2013: $1.2 billion)

* Source: VLSI Oct 2014

Wire Bonding 26.8%

Die Attach 20.1%

Packaging 23.1%

Plating 0.6%

Other Assembly

(Inspection, Dicing) 29.4%

January 2015

Advanced Packaging Unit Volume and Market Share Are Increasing

14

8% 9%

10%

13%

19%

26%

31% 32%

34%

36%

0%

5%

10%

15%

20%

25%

30%

35%

40%

-

5

10

15

20

25

30

35

2008 2009 2010 2011 2012 2013 2014 2015 2016 2017

AP

Mark

et

Sh

are

%

M w

afe

rs, 300M

M E

q.

Advanced Packaging Wafers

Advanced Packaging Unit Market Share (%)

CAGR 2008-2017: 22.7%

• Advanced Packaging (Flip Chip/WLP) is fastest growing assembly process

• In growth phase with move to <20 nano driven by smart phones, tablets,

autos and Internet of Things

Source: VLSI January 2014

January 2015

15

Advanced Packaging Growth Favors Besi

Greater Miniaturization

Greater Complexity

Increased Density

Higher Performance

Lower Power Consumption

Higher Accuracy

• High growth applications require ever smaller, denser and more complex chips with increased performance, all at lower power usage

• <40 nanometer geometry will be the standard chip design over the next 3-5 years

• System on Chip or System in Package via substrate and wafer level packaging process is the only answer

• Besi has full range of AP systems. 2013E revenue: 70% substrate/wafer level vs. 30% leadframe

Die Attach

• Die Sorting: DS 9000

• Die Bonding: ES 2009, 2100

• Flip Chip: DC 8800, 8800 TCB, 2100

• Multi Module: DC evo 2200

Packaging

• Molding: AMS-LM 95

• Singulation: FSL

High Growth End

User Areas:

Mobile internet

devices, Autos,

MEMS, Internet of

Things

Datacon Esec Fico

January 2015

New Smart Phone Designs Increase Addressable Market Potential

• Besi systems can assemble 50% of the generation 2012 components and 70% of the generation 2014 components

- New

16

Main ComponentsGeneration

2012

Generation

2014Manufacturer IDM/OSAT Besi system Utilized

Processor X X Apple TSMC ->Amkor/Stats/ASE 8800FCQ, AMS-W/LMDRAM Memory X X Hynix/Micron Hynix/Micron 2100sD, FSLNAND Flash X X Hynix/Toshiba Hynix/Amkor/Toshiba 8800FCQ, AMS-W/LMPower Management

Apple PM IC X Dialog Dialog 2100sDPMIC X X Qualcomm N/A

M3 Microcontroller X NXP Amkor/NXP 8800FCQ, AMS-W/LMAccelerometer/Gyroscope/Barometric

Gyroscope X X Invensense Amkor/ASE/STM 2100xP, 2100sD, AMS-W/LM, FCL3-ax accelerometer X Bosch Bosch evobarometric sensor X Bosch Bosch evo

CommunicationsGeneration

2012

Generation

2014Manufacturer IDM/OSAT Besi system Utilized

Wifi/NFCWifi module X X Murata Murata Murata's equipmentNFC X NXP Amkor 8800FCQ, AMS-W/LMNFC Booster IC X AMS Daca N/A

LTELTE Modem X Qualcomm Amkor/Stats/Spil/ASE 8800FCQ, AMS-W/LMLow Band LTE PAD X Skyworks Skyworks 2200evo, FSLMid Band PAD X Skyworks Skyworks 2200evo, FSLHigh Band PAD X Avago ASE/Amkor 2100xP, 2100sD, AMS-W/LM

Receiver/TransceiverRF Transceiver X X Qualcomm Amkor 2100xP, 2100sD, AMS-W/LMRF Receiver X X Qualcomm N/AEnvelop Tracking IC X Qualcomm TSMC ->Amkor/Stats/ASE 8800FCQ, AMS-W/LM

Antenna Switch X X RFMD Amkor/ASE,/RFMD 2100xP, 2100sD PA

PA X X Avago ASE/Amkor 2100xP, 2100sD, AMS-W/LMPA Module X Triquint ASE 2200evo, 2100sD

Video/AudioGeneration

2012

Generation

2014Manufacturer IDM/OSAT Besi system Utilized

CameraBack side 8M (OSI) X X Apple LG, Sharp, Mitsumi 2200evoFront 1.2M X X Apple Cowell, Sony 2200evo

Finger print sensor X Apple ASE 2200evoAudio

2+4 microphones X ST ST 2100 xpAudio Codec X X Cirrus Logic Amkor 2100xP, 2100sD, AMS-W/LM

Touch screen controlTouch screen control X X Broadcom Signetics 2100sDTouch Transmitter X TI TI FCL

January 2015

Flip Chip/Wire Bond Process Shift Is Another Revenue Opportunity

17

• Move to <40 nanometer can only be accomplished by use of flip chip die bonding vs. wire bonding process

• Flip chip revenue represents only 26% currently of total potential market of $1.0 billion

• Expected to gain share rapidly over next 6 years vs. wire bonding (4.4% CAGR delta) as per VLSI

• Growth rates could accelerate depending on adoption rates by key IDMs/subcons

CAGR 2013 – 19*

Flip Chip 8.3%

Wire Bond 3.9%

Wire Bonding Flip Chip Bonding

Reduces board area by up to 95%.

Requires far less height

Offers higher speed electrical

performance

Greater I/O connection flexibility

More durable interconnection

method

Lower cost for high volume production,

with costs below $0.01 per connection

Flip Chip Advantages

* Source: VLSI October 2014

Flip Chip $404 32% Wire

Bonding $875 68%

2019*

Flip Chip $250 26%

Wire Bonding

$695 74%

2013*

January 2015

Besi Has Gained Market Share In Its Addressable Markets

18

• Gained share in fastest growing segments of the assembly equipment market:

• Flip chip die bonding, multi module die attach and ultra thin molding for

advanced packaging applications

Besi Market Share

Source: VLSI, October 2014 and Besi estimates 2012 2013

Total Assembly Equipment Sales 8.6% 10.8% Besi Addressable Market 21.8% 27.0%

Total Die Attach Equipment 27.7% 33.1% Die Bonding 29.7% 39.6% Flip Chip 22.2% 25.4% Other 25.9% 7.5%

Total Packaging Equipment 11.1% 16.0% Molds 12.0% 19.2% Lead Trim & Form 15.0% 17.6% Singulation 5.3% 5.1%

Total Plating 75.8% 83.8%

January 2015

19

• Customers are largest producers.

• Most advanced packaging

applications

• Strong customer market shares:

• 50 – 100% of die attach

requirements

• 35 – 50% of packaging

requirements

• Customer market shares p.a. vary

based on capacity needs and

purchasing cycles

• Primary competition:

• Die Attach: ASM-PT, Hitachi

• Packaging: Towa, Hanmi,

ASM-PT

And With Leading Edge Technology Customers

* No customer purchases indicated

** Fabless semiconductor companies such as Qualcomm, Broadcom and Mediatek have assembly

production done by subcontractors

*** In general, Samsung satisfies approximately 50% of its equipment needs internally

Die Attach Packaging

In USD 2011 2012 2013 2011 2012 2013

Subcontractors

ASE 76% 67% 59% 34% 36% 65%

Amkor 36% 75% 84% 63% 45% 11%

STATSChippac 100% 95% 100% 61% 28% 100%

SPIL 63% 47% 93% 35% 37% 76%

Unisem 100% 92% 84% 68% 0%* 0%*

Cowell/Foxconn

(Camera Modules) 0% 100% 0%*

IDMs **

Skyworks 78% 100% 96% 0% 13% 24%

ST Micro 92% 91% 72% 51% 44% 76%

Infineon 93% 81% 97% 37% 0%* 24%

Samsung*** 17% 5% 0%* 37% 0%* 100%

% of Besi Die Attach

and Packaging

systems revenue 30%

47%

43%

67%

53%

64%

January 2015

20

III. STRATEGIC OBJECTIVES

January 2015

Key Strategic Objectives

Operational Objectives

Expansion of Asian supply chain. System module outsourcing

Die attach integration activities

Development Objectives

Advanced TCB die bonding development

Introduction of next generation die attach and wafer molding systems

Common platform/parts activities

2013 2014 2015

21 January 2015

Asian Production Significantly Expanded

22

396

487

658 673

570

782

170

331

553 579 493

754

42.9%

68.0%

84.0% 86.0% 86.5%

96.4%

0.0%

10.0%

20.0%

30.0%

40.0%

50.0%

60.0%

70.0%

80.0%

90.0%

100.0%

-

100

200

300

400

500

600

700

800

900

2010 2011 2012 2013 H1 2013 H1 2014

% D

irect

Sh

ipm

en

ts

Sh

ipm

en

ts

Total Asian Shipments Direct Asian Shipments % Direct

+37%

January 2015

Has Led to Lower European and Aggregate Headcount

23

• Fixed European/North American

headcount reduction:

• Down 17.5% since 2011

• Down 3.0% since Q3-13

• Declined from 56% of total in 2009 to

41% at end of Q3-14

• Aggregate of 1,649 headcount at Q3-14

(including temps):

• Asian production temps primarily

support 67.5% YTD order ramp in 2014

738 741 680 624 623 610 611

772 802 799

810 839 897 895

1,510 1,543 1,479

1,434 1,462 1,507 1,506

-

200

400

600

800

1,000

1,200

1,400

1,600

1,800

2010 2011 2012 2013 Q12014

Q22014

Q32014

Hea

dcou

nt

Europe/NA Fixed HC Asia Fixed HC Total

51%

49%

52%

48%

54%

46%

56%

44%

57%

43%

60%

40%

59%

41%

January 2015

And Also Reduced Break Even Revenue Levels

24

270

235

212

-

50

100

150

200

250

300

2011 2012 2013

(€ m

illio

ns)

(13.0%)

(10.0%)

January 2015

Materials Cost Reduction Is Also a Key Priority

25

• Qualify and Select Asian Vendors

• 50% of the way there

Supply Chain Actions

• Redesign products

• Increase standardization of systems

• Component parts

• Modules

Development Actions

+5% Gross

Margin Upside

• Material costs represent approximately 45% of revenue

• Shift to Asia centric supply chain:

• Reduces transport, inventory costs and obsolescence

• Improves cycle time and ramping flexibility

• Management Board reviews progress weekly component by component

January 2015

26

IV. FINANCIAL OVERVIEW

January 2015

€ 201.9

€ 289.8

7.3%

17.7%

5%

9%

13%

17%

21%

25%

29%

33%

37%

41%

45%

49%

53%

57%

61%

65%

69%

73%

€ 0

€ 25

€ 50

€ 75

€ 100

€ 125

€ 150

€ 175

€ 200

€ 225

€ 250

€ 275

€ 300

2013 YTD 2014 YTD

Net

marg

in %

€ m

illio

ns

Revenue Net Margin

Gross Margin

OPEX

Headcount

Effective Tax Rate

€ 65.4

€ 103.5

6.8%

20.8%

5%

10%

15%

20%

25%

30%

35%

40%

45%

50%

55%

60%

65%

70%

75%

80%

85%

90%

95%

€ 0

€ 25

€ 50

€ 75

€ 100

Q3 2013 Q3 2014

Net

marg

in %

€ m

illio

ns

Revenue Net Margin

Gross Margin

OPEX

Headcount

Effective Tax Rate

Revenue Growth and Operating Leverage Yield Increased Profitability in 2014

15.5% 10.2%

1,493 1,649

€ 20.1

MM

€ 23.0

MM

+10.5%

-5.3 points

+14.2%

39.2% 45.3%

+58.3%

+14.0%

20.4% 10.0%

1,493 1,649

€ 62.1

MM

€ 69.1

MM

+10.5%

-10.4 points

+11.3%

39.8% 43.8% +4.0 points

+43.5%

+10.4%

Q3-14/Q3-13 YTD-14/YTD-13

+6.1 points

€ 4.4

€ 21.5

€ 14.7

€ 51.4

27 January 2015

28

• Quarterly revenue/order patterns show

cyclicality of semiconductor business:

• Three cycles past 3 years

• Short term patterns due to customer

caution and increased seasonality

• Q3-13 trough. Significant 2014 rebound

• Gross margins have improved despite

cyclicality:

• Increased scalability of production model

• Shift to higher margin systems

• Lower unit costs due to:

• Asian production transfer

• Reduction in European personnel

• Product mix shift to higher margin

advanced packaging systems has

aided gross margin development:

• Multi module + flip chip die attach

• Ultra thin molding systems

• Drivers: mobile internet, intelligent auto

components, IOT and new devices

• Exit from lower margin plating, wire

bonding and packaging systems

Quarterly Revenue/Gross Margin Trends

64

72

65

53

70

116

104

64

83

48

57

111

124

91

39.6% 40.4%

39.2% 40.1%

42.3% 43.2%

45.3%

30.0%

35.0%

40.0%

45.0%

50.0%

55.0%

60.0%

-

20

40

60

80

100

120

140

Q1-13 Q2-13 Q3-13 Q4-13 Q1-14 Q2-14 Q3-14G

ross M

arg

in %

In M

illio

ns €

Revenue Orders Gross Margin

January 2015

Net Income Trends

• Quarterly net income trends reflect

industry and seasonal volatility

• Net margins of 20.8% in Q3-14

• Profit growth aided by through cycle

gross margin expansion and opex

leverage in business model

• Quarterly opex have ranged between

€ 20-25 million over past 11 quarters

• € 23.0 million in Q3-14

• Significant reduction in effective tax

rate has also helped

• Declined from 20.4% to 10.0% YTD

• Due to 2012 European operational

restructuring

Quarterly Trends

3.8

6.5 4.4 1.4

7.0

22.9

21.5

5.9% 9.0% 6.8%

2.7%

10.0%

19.7% 20.8%

-1.0%

4.0%

9.0%

14.0%

19.0%

24.0%

0

4

8

12

16

20

24

28

Q1-13 Q2-13 Q3-13 Q4-13 Q1-14 Q2-14 Q3-14

(eu

ro in

millio

ns)

Net Income Net Margin

14.7

51.4

7.3%

17.7%

0.0%

2.0%

4.0%

6.0%

8.0%

10.0%

12.0%

14.0%

16.0%

18.0%

20.0%

0

10

20

30

40

50

60

2013 2014

(eu

ro in

millio

ns)

Net Income Net Margin

Year to Date Trends

29 January 2015

Liquidity Trends

Quarterly Trends

91.9

81.1 78.5

89.6 91.9

83.8

105.4

27.7 24.9

22.5 18.6 19.1

21.3 19.3

64.2

56.2 56.0

71.0 72.8

62.5

86.1

0

20

40

60

80

100

120

Q1-13 Q2-13 Q3-13 Q4-13 Q1-14 Q2-14 Q3-14

(eu

ro in

mill

ion

s)

Cash Debt Net Cash

• Solid liquidity position

• € 105.4 million cash at 9/30/14

• € 2.76 per share vs. € 13.78 price (as of

October 24, 2014)

• Net cash reached € 86.1 million in Q3-14

• Has Been Utilized to Enhance

Shareholder Value

• € 57 million spent on cash dividends and

share repurchases 2011-2014

• Strong balance sheet helps support

future organic growth and acquisition

strategy

30 January 2015

Q4-14 Guidance

Revenue Gross Margin* Operating Expenses* Capex

Q3 Q4 Q3 Q4 Q3 Q4 Q3 Q4

€ 103.5 45.3% € 23.0 € 1.6

42%

-

44%

Down

12-18%

Up

€ 0.6

MM

* Excluding restructuring

• Revenue up 65-70% above Q4-13. Down 12-18% vs. Q3-14

• Besi business is stronger than prior years despite typical H2 seasonal downturn

• Gross margins of 42-44% as lower revenue and mix affect levels vs particularly

strong Q3

• Opex up 5-10% vs. Q3-14

• Capex of € 2.2 million

Up

5-10%

31 January 2015

Summary

Leading semi assembly equipment supplier with #1 or #2 positions in fastest

growing assembly segments

Scalability and profitability of business model greatly

enhanced in cyclical industry

Strong 9M 2014 growth. Gained market share in advanced packaging.

Favorable outlook for 2014

Solid liquidity position to finance growth

Significant upside potential.

Advanced packaging growth, operating initiatives and optimization of Asian

production model

Committed to enhancing shareholder value.

Attractive dividend yield relative to peers

32 January 2015

Q&A

33 January 2015