Top 5 BGA Rework Challenges

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BGA Rework-Big Challenges

I.I. Drivers for BGA Challenges-Pitch, Thin Packages, Drivers for BGA Challenges-Pitch, Thin Packages, Handheld Packages, Higher TempsHandheld Packages, Higher Temps

II.II. Top “5” BGA ChallengesTop “5” BGA Challenges Warped BGAs Neighboring Device Damage Underfill Rework Extensive Mask Damage Pad Damage

III.III. Lurking Challenges in BGA Rework-0.3mm pitch, lower Lurking Challenges in BGA Rework-0.3mm pitch, lower temp solders, shields in the areatemp solders, shields in the area

IV.IV. Q/AQ/A

Issue # 1Warpage

Removal-controlled heat source-bottom side preheat; multi-zone bottom heaters

Warped Packages

Removal-proper board holdersWarped Packages

Head-in-Pillow

Shadow-Moire-is a non-contact, full-field optical technique that uses geometric interference between a reference grating

and its shadow on a sample to measure relative vertical

displacement at each pixel position in the resulting image.

Issue # 2Neighboring Device

Damage

Shielding of Neighboring Devices

Experimental MethodShielding of Neighboring Devices

Clay GelShielding of Neighboring Devices

Results

Distance from test IC Speaker 30.95mm

Battery 9.73mm

Connector 6.14mm

Rework Location

Control (no shields) 123° C 177° C 227° C 232° C

Copper Tape 106° C 129° C 128° C 232° C

Stainless Steel 61° C 143° C 158° C 239° C

Clay/Water Gel 66° C 86° C 89° C 231° C

Kapton™ Tape 99° C 145° C 153° C 241° C

Ceramic Fiber 63° C 111° C 113° C 231° C

Shielding of Neighboring Devices

Issue # 3Underfill

Standard Hot Air Method-Post Device Removal

Underfilled BGAs

Chemical Softening and Standard Hot Air Method-Post Device RemovalUnderfilled BGAs

Chemical Softening and Standard Hot Air Method-Post Device Removal

Underfilled BGAs

Chemical Softening and Standard Hot Air Method-Post Device Removal

Underfilled BGAs

Underfill

Issue # 4Mask Damage

Extensive Mask Damage

Methods for Mask Repair

I.I. PensPensII.II. UV-Cured Mask (IPC 7721 2.4.1)UV-Cured Mask (IPC 7721 2.4.1)III.III. Thermally-Cured Mask (IPC 7721 2.4.1)Thermally-Cured Mask (IPC 7721 2.4.1)IV.IV. Stay in Place Stencil (IPC 7721 5.7.2)Stay in Place Stencil (IPC 7721 5.7.2)V.V. Stenciling Technique (IPC 7721 2.4.2)Stenciling Technique (IPC 7721 2.4.2)

“Pens” for Mask Replacement

Damaged Solder Mask

Placement of Stencil

Squeegeeing Mask Through Stencil Apertures

Damaged Solder Mask Post Removal

Reduced ball size as solder flows down the via.

Solder short

Stay-in Place Stencil-Eliminates Shorts

Uniform, consistent ball size. No solder flow along traces or to vias.

Stay-in Place Stencil-No Flow of Solder Down “Dogbone”

With Stay-in-Place Stencil

With Stay-in Place Stencil

Without Stay-in-Place Stencil

Issue # 5Lifted Pads

Damaged/Lifted Pads Post Removal

Pad Repair IPC 7721 4.7.1 Epoxy or 4.7.2 Film

BGA Rework-Big Challenges

Top “5” BGA ChallengesTop “5” BGA Challenges Warped BGAs Neighboring Device Damage Underfill Rework Extensive Mask Damage Pad Damage

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Top 5 BGA Rework Challenges

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