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Your BEST choice in Solder Rework/Repair/Test, Solder Training & Soldering Tools BGA Rework-Big Challenges I. I. Drivers for BGA Challenges-Pitch, Thin Drivers for BGA Challenges-Pitch, Thin Packages, Handheld Packages, Higher Temps Packages, Handheld Packages, Higher Temps II. II. Top “5” BGA Challenges Top “5” BGA Challenges Warped BGAs Neighboring Device Damage Underfill Rework Extensive Mask Damage Pad Damage III. III. Lurking Challenges in BGA Rework-0.3mm pitch, Lurking Challenges in BGA Rework-0.3mm pitch, lower temp solders, shields in the area lower temp solders, shields in the area IV. IV. Q/A Q/A

Top 5 BGA Rework Challenges

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Page 1: Top 5 BGA Rework Challenges

Your BEST choice in Solder Rework/Repair/Test, Solder Training & Soldering Tools

BGA Rework-Big Challenges

I.I. Drivers for BGA Challenges-Pitch, Thin Packages, Drivers for BGA Challenges-Pitch, Thin Packages, Handheld Packages, Higher TempsHandheld Packages, Higher Temps

II.II. Top “5” BGA ChallengesTop “5” BGA Challenges Warped BGAs Neighboring Device Damage Underfill Rework Extensive Mask Damage Pad Damage

III.III. Lurking Challenges in BGA Rework-0.3mm pitch, lower Lurking Challenges in BGA Rework-0.3mm pitch, lower temp solders, shields in the areatemp solders, shields in the area

IV.IV. Q/AQ/A

Page 2: Top 5 BGA Rework Challenges

Your BEST choice in Solder Rework/Repair/Test, Solder Training & Soldering Tools

Issue # 1Warpage

Page 3: Top 5 BGA Rework Challenges

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Removal-controlled heat source-bottom side preheat; multi-zone bottom heaters

Warped Packages

Page 4: Top 5 BGA Rework Challenges

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Removal-proper board holdersWarped Packages

Page 5: Top 5 BGA Rework Challenges

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Head-in-Pillow

Page 6: Top 5 BGA Rework Challenges

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Shadow-Moire-is a non-contact, full-field optical technique that uses geometric interference between a reference grating

and its shadow on a sample to measure relative vertical

displacement at each pixel position in the resulting image.

Page 7: Top 5 BGA Rework Challenges

Your BEST choice in Solder Rework/Repair/Test, Solder Training & Soldering Tools

Issue # 2Neighboring Device

Damage

Page 8: Top 5 BGA Rework Challenges

Shielding of Neighboring Devices

Page 9: Top 5 BGA Rework Challenges

Shielding of Neighboring Devices

Page 10: Top 5 BGA Rework Challenges

Experimental MethodShielding of Neighboring Devices

Page 11: Top 5 BGA Rework Challenges

Experimental MethodShielding of Neighboring Devices

Page 12: Top 5 BGA Rework Challenges

Experimental MethodShielding of Neighboring Devices

Page 13: Top 5 BGA Rework Challenges

Experimental MethodShielding of Neighboring Devices

Page 14: Top 5 BGA Rework Challenges

Experimental MethodShielding of Neighboring Devices

Page 15: Top 5 BGA Rework Challenges

Clay GelShielding of Neighboring Devices

Page 16: Top 5 BGA Rework Challenges

Results

Distance from test IC Speaker 30.95mm

Battery 9.73mm

Connector 6.14mm

 Rework Location 

Control (no shields)  123° C  177° C  227° C  232° C 

Copper Tape  106° C 129° C 128° C 232° C

Stainless Steel 61° C 143° C 158° C 239° C

Clay/Water Gel 66° C 86° C 89° C 231° C

Kapton™ Tape 99° C 145° C 153° C 241° C

Ceramic Fiber 63° C 111° C 113° C 231° C

Shielding of Neighboring Devices

Page 17: Top 5 BGA Rework Challenges

Your BEST choice in Solder Rework/Repair/Test, Solder Training & Soldering Tools

Issue # 3Underfill

Page 18: Top 5 BGA Rework Challenges

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Standard Hot Air Method-Post Device Removal

Underfilled BGAs

Page 19: Top 5 BGA Rework Challenges

Your BEST choice in Solder Rework/Repair/Test, Solder Training & Soldering Tools

Standard Hot Air Method-Post Device Removal

Underfilled BGAs

Page 20: Top 5 BGA Rework Challenges

Your BEST choice in Solder Rework/Repair/Test, Solder Training & Soldering Tools

Standard Hot Air Method-Post Device Removal

Underfilled BGAs

Page 21: Top 5 BGA Rework Challenges

Your BEST choice in Solder Rework/Repair/Test, Solder Training & Soldering Tools

Standard Hot Air Method-Post Device Removal

Underfilled BGAs

Page 22: Top 5 BGA Rework Challenges

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Chemical Softening and Standard Hot Air Method-Post Device RemovalUnderfilled BGAs

Page 23: Top 5 BGA Rework Challenges

Your BEST choice in Solder Rework/Repair/Test, Solder Training & Soldering Tools

Chemical Softening and Standard Hot Air Method-Post Device Removal

Underfilled BGAs

Page 24: Top 5 BGA Rework Challenges

Your BEST choice in Solder Rework/Repair/Test, Solder Training & Soldering Tools

Chemical Softening and Standard Hot Air Method-Post Device Removal

Underfilled BGAs

Page 25: Top 5 BGA Rework Challenges

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Underfill

Page 26: Top 5 BGA Rework Challenges

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Issue # 4Mask Damage

Page 27: Top 5 BGA Rework Challenges

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Extensive Mask Damage

Page 28: Top 5 BGA Rework Challenges

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Methods for Mask Repair

I.I. PensPensII.II. UV-Cured Mask (IPC 7721 2.4.1)UV-Cured Mask (IPC 7721 2.4.1)III.III. Thermally-Cured Mask (IPC 7721 2.4.1)Thermally-Cured Mask (IPC 7721 2.4.1)IV.IV. Stay in Place Stencil (IPC 7721 5.7.2)Stay in Place Stencil (IPC 7721 5.7.2)V.V. Stenciling Technique (IPC 7721 2.4.2)Stenciling Technique (IPC 7721 2.4.2)

Page 29: Top 5 BGA Rework Challenges

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“Pens” for Mask Replacement

Page 30: Top 5 BGA Rework Challenges

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Damaged Solder Mask

Page 31: Top 5 BGA Rework Challenges

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Placement of Stencil

Page 32: Top 5 BGA Rework Challenges

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Squeegeeing Mask Through Stencil Apertures

Page 33: Top 5 BGA Rework Challenges

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Damaged Solder Mask Post Removal

Page 34: Top 5 BGA Rework Challenges

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Reduced ball size as solder flows down the via.

Solder short

Stay-in Place Stencil-Eliminates Shorts

Page 35: Top 5 BGA Rework Challenges

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Uniform, consistent ball size. No solder flow along traces or to vias.

Stay-in Place Stencil-No Flow of Solder Down “Dogbone”

Page 36: Top 5 BGA Rework Challenges

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With Stay-in-Place Stencil

With Stay-in Place Stencil

Page 37: Top 5 BGA Rework Challenges

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Without Stay-in-Place Stencil

Without Stay-in-Place Stencil

Page 38: Top 5 BGA Rework Challenges

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Issue # 5Lifted Pads

Page 39: Top 5 BGA Rework Challenges

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Damaged/Lifted Pads Post Removal

Page 40: Top 5 BGA Rework Challenges

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Damaged/Lifted Pads Post Removal

Page 41: Top 5 BGA Rework Challenges

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Damaged/Lifted Pads Post Removal

Page 42: Top 5 BGA Rework Challenges

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Pad Repair IPC 7721 4.7.1 Epoxy or 4.7.2 Film

Page 43: Top 5 BGA Rework Challenges

Your BEST choice in Solder Rework/Repair/Test, Solder Training & Soldering Tools

BGA Rework-Big Challenges

Top “5” BGA ChallengesTop “5” BGA Challenges Warped BGAs Neighboring Device Damage Underfill Rework Extensive Mask Damage Pad Damage

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