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Products & ServicesProducts & Services
US Sites• AS9100• ISO 9001• ITAR-Registered• DMEA Trusted Source• MIL-PRF-38534, Class H• MIL-PRF-38535, Class Q & V Level Assembly &Test• MIL-PRF-38535, Class Q / V / Y - CGA / Column Attach• MIL-STD-883 Laboratory Suitability• MIL-STD-883 Hi-Rel Micro Laboratory• MIL-STD-202, Laboratory Suitability• MIL-STD-750, Laboratory Suitability• AS6081: A1, A3, A4, A5, A6, FSC 5962
Limited Electrical Test per QTSL-5961 / 5962 3.1.3• Nadcap AC7120• ANSI / ESD-S20.20
Micross is committed to delivering differentiated value to our customers throughout all of our sites. We continually monitor internal metrics & business processes and our team consistently strives to provide customers with industry-leading quality services and products while upholding our long-tenured reputation of strict standards for quality and reliability.
QUALITY CERTIFICATIONS
UK Sites• ISO14001• JOSCAR Registered• HM Government - Cyber Essentials
VALUE STREAMS
QUALITY CERTIFICATIONS VALUE STREAMS
Bare Die and Wafer Processing
ComponentModification
Advanced InterconnectTechnology
Advanced Testing:Electrical Test
Packaging and Assembly
Advanced Testing:Environmental Test
Based in Orlando, Florida & Norwich, UK includes:
Largest global source for Bare Die & Wafers andValue-added Services
Based in Manchester, New Hampshire & Round Rock,
Texas and Crewe, UK includes: BGA Reballing, Lead Attach,
Robotic Hot Solder Dip, Trim & Form, Counterfeit
Mitigation Services
Based in Raleigh RTP, North Carolina includes: Advanced
wafer-level development & prototyping services and 3D Heterogeneous Integration
Based in Orlando, Florida & Milpitas, California includes: FPGA, ASIC, RF Test; PEMs
and COTS Upscreening and Qualification
Based in Orlando, Florida & Norwich, UK
includes: Hermetic, Plastic (CSP/BGA/QFN),
Multi-chip SiP Packaging; Precision Die Attach &
Optoelectronic Assembly
Based in Orlando, Florida & Milpitas, California includes: HTOL
– Dynamic/Static/DC/RF, LTOL, Advanced Chamberless Burn-in
(ACBI), HAST
Micross is the global provider of mission-critical hi-reliability microelectronic components and services including six distinct value streams formed to create one-source solution for customers across the aerospace, defense, space, medical, commercial and industrial sectors. These are available separately or in combination under a single PO: One Source, One Solution.
Hi-Rel Products Based in Orlando, Florida includes:
SMD/5962, Hi-Rel Memory, Analog & Power, COTS/Retail+
DIE DISTRIBUTION & WAFER PROCESSING
Largest Global One Source Provider of Bare Die, Wafer & Value-Added Services
DIE DISTRIBUTION & WAFER PROCESSING
• Comprehensive array of capabilities to meet customer demands
• Most experienced in-house engineering support team – design application & engineering solutions
BROADEST AUTHORIZED LINE CARD IN THE INDUSTRY
DIE DISTRIBUTION & WAFER PROCESSING DIE DISTRIBUTION & WAFER PROCESSING
FULL TURNKEY WAFER PROCESSING
DICING
• ±1µ tolerance• Wafer sizes up to 12”/300mm• Multi-project wafer dicing• Step-cutting & advanced dicing techniques
DIE SORT/PICK & PLACE
• Automated, virtually contactless handling of singulated die
• Compatible with all electronic wafer maps• Multiple bin/grade die picking
DIE INSPECTION
• Commercial, military, space grades & custom• Automated Optical Inspection
PROBE
• Direct dock 12”/300mm wafer probers• Elevated & low temperature• Full parametric testing, functional test• Speed or trim binning
WAFER BUMPING
• Solder, gold & copper pillar bump
WAFER THINNING
• Wafers thinned down to 100 µm
CUSTOMIZED OUTPUT
• Waffle tray or Gel-Pak• Reconstructed wafer• Tape-and-reel (pocket, blister
or Surf Tape®)
CARRIER OPTIONS
• Sawn wafer on film-frame and ring-frame• Automated in-feed grinding of wafers• Reconstructed wafer
VALUE-ADDED SERVICES
• Lot Acceptance Testing: Class H & Class K• Kitting, KANBAN and VMI Programs• Extensive Die-specific Failure Analysis• Part parametric search & cross-reference• Systematic wafer lot traceability• Mechanical & electrical verification of
capacitors• BOM analysis & logistics management
DIE BANKING & OBSOLESCENCE MANAGEMENT
• Die and finished product banking (multiple global storage sites)
• Production continuation• Long-term risk mitigation and logistics
One Source for Innovative Next-Gen Wafer-Level Packaging and 3DHI Services
ADVANCED INTERCONNECT TECHNOLOGY
• ITAR-Registered & Trusted Source Facility
• Premier Center for Wafer-Level Packaging (WLP) and 3D Heterogeneous Integration (HI)
• Established WLP processes and the flexibility to tailor unique solutions to the most demanding interconnect requirements
FULL INTEGRATION & PACKAGING TECHNOLOGIES INCLUDE:• 3D integration technology: TSV, TGV, Si interposers, 3D IC
• Advanced interconnect and packaging technologies: Solder bumping, Cu pillar, Cu-based microbumps and assembly
• Flip-chip & Multi-chip module assembly, including patented PADS fluxless assembly process
• Microstructure fabrication and packaging: Monolithic integration, novel microfabrication and wafer-level vacuum packaging
HETEROGENEOUS INTEGRATIONMicross AIT 2.5D/3D integration technology platform is based on several enabling process modules, which include; Through-silicon via (TSV) interconnects:
• High density 3D IC applications, filled 2-20 µm diameter, up to 10:1 aspect ratio
• Wafer thinning (to < 20 µm Si thickness) & processing on temporary carrier wafer
• Flip-chip & high-density metal-metal interconnects and assembly, down to <10 µm pitch
• TSV-last processes for TSV insertion into CMOS device wafers and wafers with high density BEOL metal routing layers
WLCSP and flip chip wafer bumping with Pb-based and Pb-free solder alloys
One Source for Complete Packaging & Advanced Assembly Solutions
PACKAGING & ASSEMBLY
COMPLETE PACKAGING CAPABILITIES• Hermetic Packaging: Ceramic & Metal Can• Wafer-level Vacuum/Hermetic Packaging• Plastic Packaging: CSP/BGA/LGA/QFN• Flip-Chip/MCM/SiP• Die Stacking 2.5D/3D• Custom Packaging• Customer-specific Package Solutions for
standard OEM Devices
HERMETIC PACKAGING CAPABILITIES • Ceramic 600 & 400 mil DIP SOJ• Two-sided LCC / Four-sided LCC• Gull Wing• QFP• PGA• Flat Pack / Formed-leaded Flat Pack• Metal Can
PACKAGING & ASSEMBLYPLASTIC PACKAGING CAPABILITIESExtended Temperature (-55˚C to 125˚C)
• CSP (Chip Scale Package)• BGA (Ball Grid Array)• LGA (Land Grid Array)• MCM (Multi-Chip Module)• QFN (Quad Flat No-Leads)• SiP (System in Package)
ADVANCED ASSEMBLY CAPABILITIES• Optoelectronics
» Optical to Electronic Transceiver Placement » SiP Opto Devices
• Precision Die Placement with accuracies better than +/- 0.5 microns
• Flip-Chip & highly integrated devices• SiP
» Critical tolerance assembly, die attach and wirebond » SMT placement down to 01005
ADVANCED DIE ATTACH & FLIPCHIP• Precision Die Attach: Epoxy, Eutectic, Lead,
Lead-free Solder and Thermal Compression • Wire Bond: Au & Al Wire, Ball/Wedge
Bonding, Wedge/Wedge, Heavy Gauge Wedge/Wedge
• Lid Seal/Encapsulation » Material: Ceramic, Metal, Plastic » Epoxy, Solder, Resistance Weld,
Parallel Seam Seal• Marking / Lead Finishing
ADVANCED INTERCONNECT TECHNOLOGY
Industry-leading provider of Component Modification Solutions driven by proprietary processes and innovative technologies
COMPONENT SOLUTIONS• Robotic Hot Solder Dip (RHSD)• BGA Reballing• Lead Attach• Trim & Form and Reconditioning
TEST & INSPECTION• Fine & Gross Leak Testing• Acoustic Microscopy• X-ray Inspection • X-ray Fluorescence Analysis
PCB SOLUTIONS• Assembly• Rework• Repair• Component Harvesting
SUPPORT SOLUTIONS• Tape and Reel• 3D Scan• Bake and Package• Marking & Labeling
ROBOTIC HOT SOLDER DIP• Established Center of Excellence in Manchester, NH (63,000 sq. ft.) & pioneered
Robotic Hot Solder Dip Technology (RHSD) since 1984. • Unparalleled robotic capacity supporting industry-leading quality & lead-times.• Robotic Hot Solder Dip (RHSD) for Tin Whisker Risk Elimination, Gold Removal and
Restoration of Solderability• RoHS Compliance – removes SnPb & replaces it with SAC305 or specified alloy• Post-Process Testing: Solderability, XRF Solder Characterization, Ionic Cleanliness• Proprietary ultra-flat finish for bottom termination packages (QFN, MLF, LCC)
TIN WHISKER ELIMINATION per automated process removes 100% of the pure tin and replace with SnPb (tin-lead) RHSD per: GEIA-STD-0006 and Nadcap AC 7120
ADVANCED INTERCONNECT TECHNOLOGYCOMPONENT MODIFICATION SERVICES
BGA Reballing
Robotic Hot Solder Dip
ADVANCED INTERCONNECT TECHNOLOGYCOMPONENT MODIFICATION SERVICES
BGA REBALLING / BALL ATTACH• Established Center of Excellence in Round Rock, TX (25,000 sq. ft.) supports proprietary
robotic processes to deliver guaranteed BGA reballing yields & industry-leading turnaround times. • BGA reballing for conversion from Pb free (RoHS) to leaded (SnPb) or Sn/Pb to SAC305• Ball attach to LGA, QFN and DFN packages• BGA re-work & repair• LGA Gold Removal & Reballing• Ball pitch from 0.4mm min/Ball diameter from 0.3mm min• Component size from 4mm x 4mm to 52mm x 52mm• CTE Mismatch Mitigation
Options include: HMPS spheres, BTCE Micross patent, Non-collapsible spheres
LEAD ATTACH • Reduce solder joint stress through attachment of J-shape and L-shape leads to LCC’s using
thermo-compression bond or proprietary hi-temp solder process• Lead Replacement: Restoration & Repair of bent/damaged leads• Lead Material: CDA 102 Copper, ASTM B-170 Grade 2• Attachment verified by Lead Integrity & Bond Pull Testing
LEAD TRIM & FORM and RECONDITIONING• Forms and trims straight leads for surface mount placement per customer’s drawing or spec (an
RHSD process typically follows to coat leads & prevent oxidation)• Reconditioning of Bent or Damaged Leads:
Robotic process realigns bent leads and scans to verify results• Trim & Form for J-Leaded, SOIC, SOJ, DIP, PSOP, TSOP, FP, QFP & other package outlines;
Compliant to J-STD-001
CGA ATTACH• 2,500+ Column Placement Capable• Column composition Sn10Pb90 or Sn20Pb80• 1mm/1.27mm pitch tooling available• DLA Certified
COUNTERFEIT MITIGATION SERVICESMicross Clearwater provides screening services for customer-supplied parts to mitigate the risk of counterfeit component entering the DIB Supply Chain.
• Independent Third-party ITAR-Registered Lab Complies with AS6081 & AS6171 Requirements
• Value-add Solutions in Final Manufacturing & Test• Highly-Experienced & Personalized Service
ADVANCED INTERCONNECT TECHNOLOGYCOMPONENT MODIFICATION SERVICES
World’s leading independent qualification & production testing capabilities for mission-critical ASICs, FPGAs & RF Components
ADVANCED TEST SOLUTIONS: ELECTRICAL TEST
NEXT-GEN TEST SOLUTIONS• Device Characterization Testing:
FPGA, ASIC, RF• High-Speed Digital• Element Evaluation• Failure Analysis: Engineering &
Analytical Services• Leading-edge Sub 28nm Test
EXTENSIVE IN-HOUSE TEST CAPABILITIES
• Testing for Memory, Analog, Logic, ASICs, Processor, Mixed Signal & Discrete
• Full Static & Dynamic Burn-in• Controlled Chamber Testing• Capability to -65°C to +320°C forced air• 300mm Wafer Probe over Temp
(-55°C to 125°C)• Probe of partial wafers & singulated die
TEST PLATFORMS• Verigy 93K, Pin Scale, Smart Scale• LTX ASLX Mixed Signal Test/ LTX TS80
Linear/Mixed Signal Test• ATS 8256 High Voltage CMOS• Teradyne J937-50/100 MHz, 361/O’s• Credence Diamond D10• Testronics 201C Discrete Component Test
RF TEST SOLUTIONS• High-speed RF Component Test using
standalone bench and in conjunction with an ATE
• 24-48 RF Ports on ATE• ATE Hybrid testing platform based on best-
of-breed equipment• Higher throughput and less device damage
compared to rack-and-stack systems• RF 6-110 GHz
PEMS (Plastic Encapsulated Microcircuits)
• One Complete Turnkey Solution to support the use of COTS Devices in critical Aerospace & Defense applications
• Extensive Knowledge of All EEE Parts: Discretes, Passives, Linears, Memory, FPGA, Microcontrollers, A/D, D/C
• Advanced Automated Test Capabilities:VLSI & RF
• Comprehensive In-house Test Capabilities: HAST, Temp Cycle, Dynamic Burn-in and Full Electrical Testing of devices
• In partnership with Hi-Rel Labs; the premier authority in DPA
• Destructive Physical Analysis (DPA) and Failure Analysis Capabilities for Both Military and Space Applications (adheres to DLA Standards)
• Laser Ablation for Advanced Decapsulation of Copper Bond Wire ICs
ENVIRONMENTAL / RELIABILITY TEST
Offers a broad range of Advanced Level I and II Reliability Qualification Testing, including proprietary ACBI™ (Advanced Chamberless Burn-in) Technology
KEY RELIABILITY TEST SERVICES• Life Test/Burn-in (HTOL/LTOL),
Junction Regulated• HTOL – Dynamic/Static/DC/RF
Junction Controlled• Pre-Conditioning/MRT• Temperature & Power Cycling• Temperature Humidity Bias (THB)• HAST, Thermal Shock• Autoclave• Mechanical Shock, Vibration, Acceleration• Fine/Gross Leak — Kr85
• Temperature/Power Cycle Operating Life• Thermal Shock• EFR Analysis• ESD/Latch-up• Acoustic Microscopy• X-Ray• Shadow Moiré/Warpage Analysis• Solderability• Salt Atmosphere• Particle Impact Noise Detection• Other Level III & Sub System
RELIABILITY ANALYSISEvaluate parts with a wide array of environmental and mechanical stresses
LEVEL I & LEVEL II QUALIFICATIONEvaluate die, package and board-level reliability
QUALIFICATION REGIMEESD, EFR, IME, Smart Burn-in, ACBI™
CUSTOMIZED RELIABILITY TESTSCustomized qualification plans. Specialized set-ups, real-time in-situ monitoring and data-logging capabilities
FAILURE ANALYSISIn-depth investigation of process, field failures and elemental analysis
CUSTOMIZED UPSCREENING CAPABILITY
Capability to evaluate and screen parts as per customer requirements for Flight, ITAR and Hi-rel Applications
ADVANCED TEST SOLUTIONS: ELECTRICAL TEST ENVIRONMENTAL / RELIABILITY TEST
Offers the broadest range of built-to-stock portfolio of up-screened Hi-Rel components, including a portfolio of 5962-certified products accredited by DLA
HI-REL PRODUCTS
SRAM 256Kb to 16Mb Mono, 16Mb MCM, 5V & 3.3V, 10ns to 100ns, x8/x16/x32
SDRAM SDR – 64Mb, 128Mb, 256Mb, 512Mb, PC100 or PC133
iPEM SDR – 1.2Gb, 25mm x 32mm
iPEM DDR – 1.2Gb, 2.4Gb, 25mm x 32mm & 16mm x 23mm
iPEM DDR2 – 2.1Gb, 2.4Gb, 4.2Gb, 4.8Gb, 25mm x 32mm & 16mm x 23mm
iPEM DDR3 – 1GB, 4GB, 21mm x 19mm
Sync SRAM 4.0Mb to 36Mb, 100-250MHZ, 3.3V, Pipeline, Flow-Through & ZBL
Legacy DRAM 256Kb to 64Mb, 5V, x1 and x4 LCC, Flatpack and DIP
DRAM DDR2 & DDR3
EEPROM 1Mb Mono, 4Mb MCM, 5V, in Flatpack, LCC, CSOJ, PGA, and CQFP
Flash 1Mb & 4Mb Mono, 16Mb to 64Mb MCM, 5V & 3V, 60ns to 150ns, multiple packages including DIP, Flatpack, LCC and CQFP
UVEPROM 256Kb to 1Mb Mono, 55ns to 200ns, in LCC, DIP
VRAM 1Mb/4Mb, 100ns to 200ns, in LCC, DIP and CSOJ
MRAM, FRAM, & Radiation Tolerant Devices
SMD/5962 Memory Analog & Power COTS/Retail+
HI-REL MEMORY
RETAIL+ PRODUCT LINE
Micross Retail+ Product Line enables customers to use industry-leading components that were not previously available for their hi-rel, long-life applications. Micross purchases COTS components and enhances them for use in military, aerospace, transportation, industrial and medical applications.
Retail+ Products are converted from RoHS Pb-free solder metallurgies to tin-lead (SnPb 63/37) based metallurgies. Pb-free BGA packages are reballed and Pb-free leaded and non-leaded packages go through a solder dip exchange using our established processes that brings them up to standards for use in hi-reliability applications.
Available Products: DDR/Flash, Processors, Power Management Integrated Circuits (PMIC)
CONTACT US
Micross OrlandoDie Distribution & Hermetic/Plastic Packaging
(Precision Die Attach & SiP Assembly)7725 N. Orange Blossom TrailOrlando, FL 32810-2696 USA
(407) 298 7100sales@micross.com
Micross AITAdvanced Interconnect Technology
(WLP / Wafer Bumping3D Heterogeneous Integration)
3021 East Cornwallis RoadPO Box 110283
Research Triangle Park, NC 27709 USA(919) 248 1800
Micross STS MilpitasSilicon Turnkey Solutions
(Upscreening / Environmental Test)1804 McCarthy Blvd.
Milpitas, CA 95035 USA(408) 904 0200
Micross ExpressDie Distribution
400 W. Cummings Park #6900Woburn, MA 01801-6532 USA
express@micross.com(781) 938 0866
Micross Manchester (formerly Corfin)Component Modification Services
(Robotic Hot Solder Dip/Lead Attach)1050 Perimeter Road
Manchester, NH 03103 USA(603) 893 9900
Solutions.MHT@micross.com
Micross Round Rock (formerly Corfin)Component Modification Services
(BGA Reballing)33 Cypress Blvd., Suite 400Round Rock, TX 78665 USA
(512) 833 5868toll free: 1 888 400 5868
Solutions.RR@micross.com
Micross ClearwaterCounterfeit Detection Services
& DNA Marking4400 140th Ave North, Suite 140
Clearwater, FL 33762 USA(727) 532 1777
UK Locations
Micross NorwichDie Distribution &
Specialty Packaging/Assembly2-4 Hellesdon Park Road, Drayton High Road
Norwich, NR6 5DR, UKBareDie@micross.com+44 (0) 1603 788 967
Micross CreweComponent Modification Services(Solder Dip/Reballing/Lead Attach)
15 Orion WayOff University Way
Crewe, Cheshire, CW1 6NG, UK+44 (0) 1270 252 566
US Locations
TM
@microsscomps
company/micross-components
sales@micross.com
July 15, 2020 Rev 1.0
@microsscomps
www.micross.com
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