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Products & ServicesProducts & Services
US Sites• AS9100• ISO 9001• ITAR-Registered• DMEA Trusted Source• MIL-PRF-38534, Class H• MIL-PRF-38535, Class Q & V Level Assembly &Test• MIL-PRF-38535, Class Q / V / Y - CGA / Column Attach• MIL-STD-883 Laboratory Suitability• MIL-STD-883 Hi-Rel Micro Laboratory• MIL-STD-202, Laboratory Suitability• MIL-STD-750, Laboratory Suitability• AS6081: A1, A3, A4, A5, A6, FSC 5962
Limited Electrical Test per QTSL-5961 / 5962 3.1.3• Nadcap AC7120• ANSI / ESD-S20.20
Micross is committed to delivering differentiated value to our customers throughout all of our sites. We continually monitor internal metrics & business processes and our team consistently strives to provide customers with industry-leading quality services and products while upholding our long-tenured reputation of strict standards for quality and reliability.
QUALITY CERTIFICATIONS
UK Sites• ISO14001• JOSCAR Registered• HM Government - Cyber Essentials
VALUE STREAMS
QUALITY CERTIFICATIONS VALUE STREAMS
Bare Die and Wafer Processing
ComponentModification
Advanced InterconnectTechnology
Advanced Testing:Electrical Test
Packaging and Assembly
Advanced Testing:Environmental Test
Based in Orlando, Florida & Norwich, UK includes:
Largest global source for Bare Die & Wafers andValue-added Services
Based in Manchester, New Hampshire & Round Rock,
Texas and Crewe, UK includes: BGA Reballing, Lead Attach,
Robotic Hot Solder Dip, Trim & Form, Counterfeit
Mitigation Services
Based in Raleigh RTP, North Carolina includes: Advanced
wafer-level development & prototyping services and 3D Heterogeneous Integration
Based in Orlando, Florida & Milpitas, California includes: FPGA, ASIC, RF Test; PEMs
and COTS Upscreening and Qualification
Based in Orlando, Florida & Norwich, UK
includes: Hermetic, Plastic (CSP/BGA/QFN),
Multi-chip SiP Packaging; Precision Die Attach &
Optoelectronic Assembly
Based in Orlando, Florida & Milpitas, California includes: HTOL
– Dynamic/Static/DC/RF, LTOL, Advanced Chamberless Burn-in
(ACBI), HAST
Micross is the global provider of mission-critical hi-reliability microelectronic components and services including six distinct value streams formed to create one-source solution for customers across the aerospace, defense, space, medical, commercial and industrial sectors. These are available separately or in combination under a single PO: One Source, One Solution.
Hi-Rel Products Based in Orlando, Florida includes:
SMD/5962, Hi-Rel Memory, Analog & Power, COTS/Retail+
DIE DISTRIBUTION & WAFER PROCESSING
Largest Global One Source Provider of Bare Die, Wafer & Value-Added Services
DIE DISTRIBUTION & WAFER PROCESSING
• Comprehensive array of capabilities to meet customer demands
• Most experienced in-house engineering support team – design application & engineering solutions
BROADEST AUTHORIZED LINE CARD IN THE INDUSTRY
DIE DISTRIBUTION & WAFER PROCESSING DIE DISTRIBUTION & WAFER PROCESSING
FULL TURNKEY WAFER PROCESSING
DICING
• ±1µ tolerance• Wafer sizes up to 12”/300mm• Multi-project wafer dicing• Step-cutting & advanced dicing techniques
DIE SORT/PICK & PLACE
• Automated, virtually contactless handling of singulated die
• Compatible with all electronic wafer maps• Multiple bin/grade die picking
DIE INSPECTION
• Commercial, military, space grades & custom• Automated Optical Inspection
PROBE
• Direct dock 12”/300mm wafer probers• Elevated & low temperature• Full parametric testing, functional test• Speed or trim binning
WAFER BUMPING
• Solder, gold & copper pillar bump
WAFER THINNING
• Wafers thinned down to 100 µm
CUSTOMIZED OUTPUT
• Waffle tray or Gel-Pak• Reconstructed wafer• Tape-and-reel (pocket, blister
or Surf Tape®)
CARRIER OPTIONS
• Sawn wafer on film-frame and ring-frame• Automated in-feed grinding of wafers• Reconstructed wafer
VALUE-ADDED SERVICES
• Lot Acceptance Testing: Class H & Class K• Kitting, KANBAN and VMI Programs• Extensive Die-specific Failure Analysis• Part parametric search & cross-reference• Systematic wafer lot traceability• Mechanical & electrical verification of
capacitors• BOM analysis & logistics management
DIE BANKING & OBSOLESCENCE MANAGEMENT
• Die and finished product banking (multiple global storage sites)
• Production continuation• Long-term risk mitigation and logistics
One Source for Innovative Next-Gen Wafer-Level Packaging and 3DHI Services
ADVANCED INTERCONNECT TECHNOLOGY
• ITAR-Registered & Trusted Source Facility
• Premier Center for Wafer-Level Packaging (WLP) and 3D Heterogeneous Integration (HI)
• Established WLP processes and the flexibility to tailor unique solutions to the most demanding interconnect requirements
FULL INTEGRATION & PACKAGING TECHNOLOGIES INCLUDE:• 3D integration technology: TSV, TGV, Si interposers, 3D IC
• Advanced interconnect and packaging technologies: Solder bumping, Cu pillar, Cu-based microbumps and assembly
• Flip-chip & Multi-chip module assembly, including patented PADS fluxless assembly process
• Microstructure fabrication and packaging: Monolithic integration, novel microfabrication and wafer-level vacuum packaging
HETEROGENEOUS INTEGRATIONMicross AIT 2.5D/3D integration technology platform is based on several enabling process modules, which include; Through-silicon via (TSV) interconnects:
• High density 3D IC applications, filled 2-20 µm diameter, up to 10:1 aspect ratio
• Wafer thinning (to < 20 µm Si thickness) & processing on temporary carrier wafer
• Flip-chip & high-density metal-metal interconnects and assembly, down to <10 µm pitch
• TSV-last processes for TSV insertion into CMOS device wafers and wafers with high density BEOL metal routing layers
WLCSP and flip chip wafer bumping with Pb-based and Pb-free solder alloys
One Source for Complete Packaging & Advanced Assembly Solutions
PACKAGING & ASSEMBLY
COMPLETE PACKAGING CAPABILITIES• Hermetic Packaging: Ceramic & Metal Can• Wafer-level Vacuum/Hermetic Packaging• Plastic Packaging: CSP/BGA/LGA/QFN• Flip-Chip/MCM/SiP• Die Stacking 2.5D/3D• Custom Packaging• Customer-specific Package Solutions for
standard OEM Devices
HERMETIC PACKAGING CAPABILITIES • Ceramic 600 & 400 mil DIP SOJ• Two-sided LCC / Four-sided LCC• Gull Wing• QFP• PGA• Flat Pack / Formed-leaded Flat Pack• Metal Can
PACKAGING & ASSEMBLYPLASTIC PACKAGING CAPABILITIESExtended Temperature (-55˚C to 125˚C)
• CSP (Chip Scale Package)• BGA (Ball Grid Array)• LGA (Land Grid Array)• MCM (Multi-Chip Module)• QFN (Quad Flat No-Leads)• SiP (System in Package)
ADVANCED ASSEMBLY CAPABILITIES• Optoelectronics
» Optical to Electronic Transceiver Placement » SiP Opto Devices
• Precision Die Placement with accuracies better than +/- 0.5 microns
• Flip-Chip & highly integrated devices• SiP
» Critical tolerance assembly, die attach and wirebond » SMT placement down to 01005
ADVANCED DIE ATTACH & FLIPCHIP• Precision Die Attach: Epoxy, Eutectic, Lead,
Lead-free Solder and Thermal Compression • Wire Bond: Au & Al Wire, Ball/Wedge
Bonding, Wedge/Wedge, Heavy Gauge Wedge/Wedge
• Lid Seal/Encapsulation » Material: Ceramic, Metal, Plastic » Epoxy, Solder, Resistance Weld,
Parallel Seam Seal• Marking / Lead Finishing
ADVANCED INTERCONNECT TECHNOLOGY
Industry-leading provider of Component Modification Solutions driven by proprietary processes and innovative technologies
COMPONENT SOLUTIONS• Robotic Hot Solder Dip (RHSD)• BGA Reballing• Lead Attach• Trim & Form and Reconditioning
TEST & INSPECTION• Fine & Gross Leak Testing• Acoustic Microscopy• X-ray Inspection • X-ray Fluorescence Analysis
PCB SOLUTIONS• Assembly• Rework• Repair• Component Harvesting
SUPPORT SOLUTIONS• Tape and Reel• 3D Scan• Bake and Package• Marking & Labeling
ROBOTIC HOT SOLDER DIP• Established Center of Excellence in Manchester, NH (63,000 sq. ft.) & pioneered
Robotic Hot Solder Dip Technology (RHSD) since 1984. • Unparalleled robotic capacity supporting industry-leading quality & lead-times.• Robotic Hot Solder Dip (RHSD) for Tin Whisker Risk Elimination, Gold Removal and
Restoration of Solderability• RoHS Compliance – removes SnPb & replaces it with SAC305 or specified alloy• Post-Process Testing: Solderability, XRF Solder Characterization, Ionic Cleanliness• Proprietary ultra-flat finish for bottom termination packages (QFN, MLF, LCC)
TIN WHISKER ELIMINATION per automated process removes 100% of the pure tin and replace with SnPb (tin-lead) RHSD per: GEIA-STD-0006 and Nadcap AC 7120
ADVANCED INTERCONNECT TECHNOLOGYCOMPONENT MODIFICATION SERVICES
BGA Reballing
Robotic Hot Solder Dip
ADVANCED INTERCONNECT TECHNOLOGYCOMPONENT MODIFICATION SERVICES
BGA REBALLING / BALL ATTACH• Established Center of Excellence in Round Rock, TX (25,000 sq. ft.) supports proprietary
robotic processes to deliver guaranteed BGA reballing yields & industry-leading turnaround times. • BGA reballing for conversion from Pb free (RoHS) to leaded (SnPb) or Sn/Pb to SAC305• Ball attach to LGA, QFN and DFN packages• BGA re-work & repair• LGA Gold Removal & Reballing• Ball pitch from 0.4mm min/Ball diameter from 0.3mm min• Component size from 4mm x 4mm to 52mm x 52mm• CTE Mismatch Mitigation
Options include: HMPS spheres, BTCE Micross patent, Non-collapsible spheres
LEAD ATTACH • Reduce solder joint stress through attachment of J-shape and L-shape leads to LCC’s using
thermo-compression bond or proprietary hi-temp solder process• Lead Replacement: Restoration & Repair of bent/damaged leads• Lead Material: CDA 102 Copper, ASTM B-170 Grade 2• Attachment verified by Lead Integrity & Bond Pull Testing
LEAD TRIM & FORM and RECONDITIONING• Forms and trims straight leads for surface mount placement per customer’s drawing or spec (an
RHSD process typically follows to coat leads & prevent oxidation)• Reconditioning of Bent or Damaged Leads:
Robotic process realigns bent leads and scans to verify results• Trim & Form for J-Leaded, SOIC, SOJ, DIP, PSOP, TSOP, FP, QFP & other package outlines;
Compliant to J-STD-001
CGA ATTACH• 2,500+ Column Placement Capable• Column composition Sn10Pb90 or Sn20Pb80• 1mm/1.27mm pitch tooling available• DLA Certified
COUNTERFEIT MITIGATION SERVICESMicross Clearwater provides screening services for customer-supplied parts to mitigate the risk of counterfeit component entering the DIB Supply Chain.
• Independent Third-party ITAR-Registered Lab Complies with AS6081 & AS6171 Requirements
• Value-add Solutions in Final Manufacturing & Test• Highly-Experienced & Personalized Service
ADVANCED INTERCONNECT TECHNOLOGYCOMPONENT MODIFICATION SERVICES
World’s leading independent qualification & production testing capabilities for mission-critical ASICs, FPGAs & RF Components
ADVANCED TEST SOLUTIONS: ELECTRICAL TEST
NEXT-GEN TEST SOLUTIONS• Device Characterization Testing:
FPGA, ASIC, RF• High-Speed Digital• Element Evaluation• Failure Analysis: Engineering &
Analytical Services• Leading-edge Sub 28nm Test
EXTENSIVE IN-HOUSE TEST CAPABILITIES
• Testing for Memory, Analog, Logic, ASICs, Processor, Mixed Signal & Discrete
• Full Static & Dynamic Burn-in• Controlled Chamber Testing• Capability to -65°C to +320°C forced air• 300mm Wafer Probe over Temp
(-55°C to 125°C)• Probe of partial wafers & singulated die
TEST PLATFORMS• Verigy 93K, Pin Scale, Smart Scale• LTX ASLX Mixed Signal Test/ LTX TS80
Linear/Mixed Signal Test• ATS 8256 High Voltage CMOS• Teradyne J937-50/100 MHz, 361/O’s• Credence Diamond D10• Testronics 201C Discrete Component Test
RF TEST SOLUTIONS• High-speed RF Component Test using
standalone bench and in conjunction with an ATE
• 24-48 RF Ports on ATE• ATE Hybrid testing platform based on best-
of-breed equipment• Higher throughput and less device damage
compared to rack-and-stack systems• RF 6-110 GHz
PEMS (Plastic Encapsulated Microcircuits)
• One Complete Turnkey Solution to support the use of COTS Devices in critical Aerospace & Defense applications
• Extensive Knowledge of All EEE Parts: Discretes, Passives, Linears, Memory, FPGA, Microcontrollers, A/D, D/C
• Advanced Automated Test Capabilities:VLSI & RF
• Comprehensive In-house Test Capabilities: HAST, Temp Cycle, Dynamic Burn-in and Full Electrical Testing of devices
• In partnership with Hi-Rel Labs; the premier authority in DPA
• Destructive Physical Analysis (DPA) and Failure Analysis Capabilities for Both Military and Space Applications (adheres to DLA Standards)
• Laser Ablation for Advanced Decapsulation of Copper Bond Wire ICs
ENVIRONMENTAL / RELIABILITY TEST
Offers a broad range of Advanced Level I and II Reliability Qualification Testing, including proprietary ACBI™ (Advanced Chamberless Burn-in) Technology
KEY RELIABILITY TEST SERVICES• Life Test/Burn-in (HTOL/LTOL),
Junction Regulated• HTOL – Dynamic/Static/DC/RF
Junction Controlled• Pre-Conditioning/MRT• Temperature & Power Cycling• Temperature Humidity Bias (THB)• HAST, Thermal Shock• Autoclave• Mechanical Shock, Vibration, Acceleration• Fine/Gross Leak — Kr85
• Temperature/Power Cycle Operating Life• Thermal Shock• EFR Analysis• ESD/Latch-up• Acoustic Microscopy• X-Ray• Shadow Moiré/Warpage Analysis• Solderability• Salt Atmosphere• Particle Impact Noise Detection• Other Level III & Sub System
RELIABILITY ANALYSISEvaluate parts with a wide array of environmental and mechanical stresses
LEVEL I & LEVEL II QUALIFICATIONEvaluate die, package and board-level reliability
QUALIFICATION REGIMEESD, EFR, IME, Smart Burn-in, ACBI™
CUSTOMIZED RELIABILITY TESTSCustomized qualification plans. Specialized set-ups, real-time in-situ monitoring and data-logging capabilities
FAILURE ANALYSISIn-depth investigation of process, field failures and elemental analysis
CUSTOMIZED UPSCREENING CAPABILITY
Capability to evaluate and screen parts as per customer requirements for Flight, ITAR and Hi-rel Applications
ADVANCED TEST SOLUTIONS: ELECTRICAL TEST ENVIRONMENTAL / RELIABILITY TEST
Offers the broadest range of built-to-stock portfolio of up-screened Hi-Rel components, including a portfolio of 5962-certified products accredited by DLA
HI-REL PRODUCTS
SRAM 256Kb to 16Mb Mono, 16Mb MCM, 5V & 3.3V, 10ns to 100ns, x8/x16/x32
SDRAM SDR – 64Mb, 128Mb, 256Mb, 512Mb, PC100 or PC133
iPEM SDR – 1.2Gb, 25mm x 32mm
iPEM DDR – 1.2Gb, 2.4Gb, 25mm x 32mm & 16mm x 23mm
iPEM DDR2 – 2.1Gb, 2.4Gb, 4.2Gb, 4.8Gb, 25mm x 32mm & 16mm x 23mm
iPEM DDR3 – 1GB, 4GB, 21mm x 19mm
Sync SRAM 4.0Mb to 36Mb, 100-250MHZ, 3.3V, Pipeline, Flow-Through & ZBL
Legacy DRAM 256Kb to 64Mb, 5V, x1 and x4 LCC, Flatpack and DIP
DRAM DDR2 & DDR3
EEPROM 1Mb Mono, 4Mb MCM, 5V, in Flatpack, LCC, CSOJ, PGA, and CQFP
Flash 1Mb & 4Mb Mono, 16Mb to 64Mb MCM, 5V & 3V, 60ns to 150ns, multiple packages including DIP, Flatpack, LCC and CQFP
UVEPROM 256Kb to 1Mb Mono, 55ns to 200ns, in LCC, DIP
VRAM 1Mb/4Mb, 100ns to 200ns, in LCC, DIP and CSOJ
MRAM, FRAM, & Radiation Tolerant Devices
SMD/5962 Memory Analog & Power COTS/Retail+
HI-REL MEMORY
RETAIL+ PRODUCT LINE
Micross Retail+ Product Line enables customers to use industry-leading components that were not previously available for their hi-rel, long-life applications. Micross purchases COTS components and enhances them for use in military, aerospace, transportation, industrial and medical applications.
Retail+ Products are converted from RoHS Pb-free solder metallurgies to tin-lead (SnPb 63/37) based metallurgies. Pb-free BGA packages are reballed and Pb-free leaded and non-leaded packages go through a solder dip exchange using our established processes that brings them up to standards for use in hi-reliability applications.
Available Products: DDR/Flash, Processors, Power Management Integrated Circuits (PMIC)
CONTACT US
Micross OrlandoDie Distribution & Hermetic/Plastic Packaging
(Precision Die Attach & SiP Assembly)7725 N. Orange Blossom TrailOrlando, FL 32810-2696 USA
(407) 298 [email protected]
Micross AITAdvanced Interconnect Technology
(WLP / Wafer Bumping3D Heterogeneous Integration)
3021 East Cornwallis RoadPO Box 110283
Research Triangle Park, NC 27709 USA(919) 248 1800
Micross STS MilpitasSilicon Turnkey Solutions
(Upscreening / Environmental Test)1804 McCarthy Blvd.
Milpitas, CA 95035 USA(408) 904 0200
Micross ExpressDie Distribution
400 W. Cummings Park #6900Woburn, MA 01801-6532 USA
[email protected](781) 938 0866
Micross Manchester (formerly Corfin)Component Modification Services
(Robotic Hot Solder Dip/Lead Attach)1050 Perimeter Road
Manchester, NH 03103 USA(603) 893 9900
Micross Round Rock (formerly Corfin)Component Modification Services
(BGA Reballing)33 Cypress Blvd., Suite 400Round Rock, TX 78665 USA
(512) 833 5868toll free: 1 888 400 5868
Micross ClearwaterCounterfeit Detection Services
& DNA Marking4400 140th Ave North, Suite 140
Clearwater, FL 33762 USA(727) 532 1777
UK Locations
Micross NorwichDie Distribution &
Specialty Packaging/Assembly2-4 Hellesdon Park Road, Drayton High Road
Norwich, NR6 5DR, [email protected]+44 (0) 1603 788 967
Micross CreweComponent Modification Services(Solder Dip/Reballing/Lead Attach)
15 Orion WayOff University Way
Crewe, Cheshire, CW1 6NG, UK+44 (0) 1270 252 566
US Locations
TM
@microsscomps
company/micross-components
July 15, 2020 Rev 1.0
@microsscomps
www.micross.com
