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FLASH MEMORY
1
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
K9XXG08XXM
* Samsung Electronics reserves the right to change products or specification without notice.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALLINFORMATION IN THIS DOCUMENT IS PROVIDED
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.
1. For updates or additional information about Samsung products, contact your nearest Samsung office.
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similarapplications where Product failure could result in loss of life or personal or physical harm, or any military ordefense application, or any governmental procurement to which special terms or provisions may apply.
FLASH MEMORY
2
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Document Title2G x 8 Bit / 4G x 8 Bit / 8G x 8 Bit NAND Flash Memory
Revision History
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the rightto change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you haveany questions, please contact the SAMSUNG branch office near your office.
Revision No
0.0
0.1
1.0
Remark
Advance
Preliminary
Final
History
1. Initial issue
1. Add random data output after Read for copy2. Add read for copy-back with data output timing guide3. Modify 2-plane copy-back program operation4. Modify 2KB program operation timing guide
1. Interleave two plane copy-back program timing is added.2. QDP LGA package is added.3. tCSD is changed. (10ns -> 0ns)
Draft Date
Dec, 26th 2006
Feb. 2nd 2007
Mar. 31st 2007
FLASH MEMORY
3
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
GENERAL DESCRIPTION
FEATURES
• Voltage Supply - 3.3V Device(K9XXG08UXM) : 2.7V ~ 3.6V• Organization - Memory Cell Array : (2G + 64M) x 8bit - Data Register : (4K + 128) x 8bit • Automatic Program and Erase - Page Program : (4K + 128)Byte - Block Erase : (256K + 8K)Byte• Page Read Operation - Page Size : (4K + 128)Byte - Random Read : 25µs(Max.) - Serial Access : 25ns(Min.) * K9NCG08U5M : 50ns(Min.) • Fast Write Cycle Time - Page Program time : 200µs(Typ.) - Block Erase Time : 1.5ms(Typ.)
2G x 8 Bit / 4G x 8 Bit / 8G x 8 Bit NAND Flash Memory
• Command/Address/Data Multiplexed I/O Port• Hardware Data Protection - Program/Erase Lockout During Power Transitions• Reliable CMOS Floating-Gate Technology -Endurance : 100K Program/Erase Cycles(with 1bit/512Byte ECC) - Data Retention : 10 Years• Command Driven Operation• Intelligent Copy-Back with internal 1bit/528Byte EDC• Unique ID for Copyright Protection• Package : - K9KAG08U0M-PCB0/PIB0 : Pb-FREE PACKAGE 48 - Pin TSOP1 (12 x 20 / 0.5 mm pitch) - K9WBG08U1M-PCB0/PIB0 : Pb-FREE PACKAGE 48 - Pin TSOP1 (12 x 20 / 0.5 mm pitch) - K9WBG08U1M-ICB0/IIB0 52 - Pin TLGA (12 x 17 / 1.0 mm pitch) - K9MCG08U5M-PCB0/PIB0 : Pb-FREE PACKAGE 48 - Pin TSOP1 (12 x 20 / 0.5 mm pitch)
Offered in 2Gx8bit, the K9KAG08U0M is a 16G-bit NAND Flash Memory with spare 512M-bit. The device is offered in 3.3V vcc. ItsNAND cell provides the most cost-effective solution for the solid state application market. A program operation can be performed intypical 200µs on the (4K+128)Byte page and an erase operation can be performed in typical 1.5ms on a (256K+8K)Byte block. Datain the data register can be read out at 25ns(K9NCG08U5M: 50ns) cycle time per Byte. The I/O pins serve as the ports for addressand data input/output as well as command input. The on-chip write controller automates all program and erase functions includingpulse repetition, where required, and internal verification and margining of data. Even the write-intensive systems can take advan-tage of the K9KAG08U0M′s extended reliability of 100K program/erase cycles by providing ECC(Error Correcting Code) with realtime mapping-out algorithm. The K9KAG08U0M is an optimum solution for large nonvolatile storage applications such as solid statefile storage and other portable applications requiring non-volatility.An ultra high density solution having two 16Gb stacked with two chip selects is also available in standard 32Gb TSOPI package andanother ultra high density solution having two 32Gb TSOPI package stacked with four chip selects is also available in 64Gb TSOPI-DSP.
PRODUCT LISTPart Number Vcc Range Organization PKG Type
K9KAG08U0M-P
2.7V ~ 3.6V X8
TSOP1K9WBG08U1M-P
K9WBG08U1M-I 52TLGA
K9NCG08U5M-P TSOP1-DSP
FLASH MEMORY
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K9KAG08U0MK9WBG08U1M
K9NCG08U5M
PIN CONFIGURATION (TSOP1)K9KAG08U0M-PCB0/PIB0
PACKAGE DIMENSIONS
48-PIN LEAD FREE PLASTIC THIN SMALL OUT-LINE PACKAGE TYPE(I)
48 - TSOP1 - 1220F Unit :mm/Inch
0.787±0.00820.00±0.20
#1
#24
0.20
+0.0
7-0
.03
0.00
8+0.0
03-0
.001
0.50
0.01
97
#48
#25
0.48
812
.40
MA
X
12.0
00.
472
0.10
0.
004
MA
X
0.25
0.01
0(
)
0.039±0.0021.00±0.05
0.0020.05 MIN
0.0471.20 MAX
0.45~0.750.018~0.030
0.724±0.00418.40±0.10
0~8°
0.01
00.
25TY
P
0.12
5+0
.075
0.03
5
0.00
5+0.0
03-0
.001
0.500.020( )
48-pin TSOP1Standard Type12mm x 20mm
123456789
101112131415161718192021222324
484746454443424140393837363534333231302928272625
N.CN.CN.CN.CN.CN.CR/B RECE
N.CN.CVccVssN.CN.CCLEALEWEWPN.CN.CN.CN.CN.C
N.CN.CN.CN.CI/O7I/O6I/O5I/O4N.CN.CN.CVccVssN.CN.CN.CI/O3I/O2I/O1I/O0N.CN.CN.CN.C
FLASH MEMORY
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K9KAG08U0MK9WBG08U1M
K9NCG08U5M
PIN CONFIGURATION (TSOP1)K9WBG08U1M-PCB0/PIB0
PACKAGE DIMENSIONS
48-PIN LEAD FREE PLASTIC THIN SMALL OUT-LINE PACKAGE TYPE(I)
48 - TSOP1 - 1220F Unit :mm/Inch
0.787±0.00820.00±0.20
#1
#24
0.20
+0.0
7-0
.03
0.00
8+0.0
03-0
.001
0.50
0.01
97
#48
#25
0.48
812
.40
MA
X
12.0
00.
472
0.10
0.
004
MA
X
0.25
0.01
0(
)
0.039±0.0021.00±0.05
0.0020.05 MIN
0.0471.20 MAX
0.45~0.750.018~0.030
0.724±0.00418.40±0.10
0~8°
0.01
00.
25TY
P
0.12
5+0
.075
0.03
5
0.00
5+0.0
03-0
.001
0.500.020( )
48-pin TSOP1Standard Type12mm x 20mm
123456789
101112131415161718192021222324
484746454443424140393837363534333231302928272625
N.CN.CN.CN.CN.C
R/B2 R/B1
RECE1CE2N.CVccVssN.CN.CCLEALEWEWPN.CN.CN.CN.CN.C
N.CN.CN.CN.CI/O7I/O6I/O5I/O4N.CN.CN.CVccVssN.CN.CN.CI/O3I/O2I/O1I/O0N.CN.CN.CK9WBG08U1MN.C
FLASH MEMORY
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K9KAG08U0MK9WBG08U1M
K9NCG08U5M
1.00
1.001.00
1.00
2.00
7 6 5 4 3 2 1
1.00
1.00
1.00
12.00±0.10
#A1
17.0
0±0.
10
17.0
0±0.
10
B
A12.00±0.10
(Datum B)
(Datum A)
12.0
0
10.00
2.50
2.50
2.00
0.50
1.30
A
B
C
D
E
F
G
H
J
K
L
M
N
12-∅1.00±0.05 41-∅0.70±0.05
Side View
1.0(
Max.)
0.10 C
17.00±0.10
Top View Bottom View
A B C D E F G H J K L M N
7
6
5
4
3
2
1
K9WBG08U1M- ICB0 / IIB0
52-TLGA (measured in millimeters)
NC NC NC NC NC NC
NC NC NCNCNCNC
NC
NCNC
NC
VccVcc
Vss
Vss
Vss
/RE1
/RE2
/CE1 /CE2
CLE1 CLE2
ALE1
ALE2
/WE1
/WE2
/WP1
/WP2R/B1
R/B2
Vss
IO0-1
IO0-2
IO1-1
IO1-2
IO2-1
IO3-1
IO2-2
IO3-2
IO4-1 IO4-2
IO5-1
IO5-2
IO6-1
IO6-2
IO7-1
IO7-2
∅ ABCM0.1 ∅ ABCM0.1
PACKAGE DIMENSIONS
FLASH MEMORY
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K9KAG08U0MK9WBG08U1M
K9NCG08U5M
18.80 MAX REF
12.4
0 M
AX R
EF
0.13
~0.2
3 Pin #1
#1
#24
#48
0.50
TYP
#25
(0.10)A
(0.2
49) B
AS
ICG
AG
E P
LAN
E 0.399~0.60020.00±0.20
0.02
MIN
2.35
MAX
TYP B
OTH
SID
ESBO
TTOM
TSO
P ON
LY
(0.10)A
-A-
SEATING
PIN CONFIGURATION (TSOP1-DSP)
K9NCG08U5M-PCB0/PIB0
PACKAGE DIMENSIONS
48-PIN LEAD FREE PLASTIC THIN SMALL OUT-LINE PACKAGE TYPE(I)
48 - TSOP1 - 1220AF Unit :mm/Inch
PLANE
123456789
101112131415161718192021222324
484746454443424140393837363534333231302928272625
48-pin TSOP1Dual Stacked Package
12mm x 20mm
N.CN.CN.C
R/B2R/B1 RECE1CE2N.CVccVss
CLEALEWEWPN.CN.CN.CN.CN.C
N.CN.CN.CN.CI/O7I/O6I/O5I/O4N.CN.C
VccVssN.CN.CN.CI/O3I/O2I/O1I/O0N.CN.CN.CN.C
N.C
R/B4R/B3
CE3CE4
FLASH MEMORY
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K9KAG08U0MK9WBG08U1M
K9NCG08U5M
PIN DESCRIPTION
NOTE Connect all VCC and VSS pins of each device to common power supply outputs.Do not leave VCC or VSS disconnected.There are two CE pins (CE1 & CE2) in the K9WBG08U1M and four CE pins (CE1 & CE2 & CE3 & CE4) in the K9NCG08U5M.There are two R/B pins (R/B1 & R/B2) in the K9WBG08U1MK9WBG08U1MK9NCG08U5M and four R/B pins (R/B1 & R/B2 & R/ B3& R/B4) in the K9NCG08U5M.
Pin Name Pin Function
I/O0 ~ I/O7
DATA INPUTS/OUTPUTS The I/O pins are used to input command, address and data, and to output data during read operations. The I/O pins float to high-z when the chip is deselected or when the outputs are disabled.
CLECOMMAND LATCH ENABLEThe CLE input controls the activating path for commands sent to the command register. When active high, commands are latched into the command register through the I/O ports on the rising edge of the WE signal.
ALEADDRESS LATCH ENABLEThe ALE input controls the activating path for address to the internal address registers. Addresses are latched on the rising edge of WE with ALE high.
CE / CE1
CHIP ENABLEThe CE / CE1 input is the device selection control. When the device is in the Busy state, CE / CE1 high is ignored, and the device does not return to standby mode in program or erase operation.Regarding CE / CE1 control during read operation , refer to ’Page Read’ section of Device operation.
CE2 CHIP ENABLEThe CE2 input enables the second K9K8G08U0A
REREAD ENABLEThe RE input is the serial data-out control, and when active drives the data onto the I/O bus. Data is valid tREA after the falling edge of RE which also increments the internal column address counter by one.
WEWRITE ENABLEThe WE input controls writes to the I/O port. Commands, address and data are latched on the rising edge of the WE pulse.
WPWRITE PROTECTThe WP pin provides inadvertent program/erase protection during power transitions. The internal high volt-age generator is reset when the WP pin is active low.
R/B / R/B1
READY/BUSY OUTPUTThe R/B / R/B1 output indicates the status of the device operation. When low, it indicates that a program, erase or random read operation is in process and returns to high state upon completion. It is an open drain output and does not float to high-z condition when the chip is deselected or when outputs are disabled.
Vcc POWERVCC is the power supply for device.
Vss GROUND
N.C NO CONNECTIONLead is not internally connected.
FLASH MEMORY
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K9KAG08U0MK9WBG08U1M
K9NCG08U5M
4K Bytes 128 Bytes
Figure 1. K9KAG08U0M Functional Block Diagram
Figure 2. K9KAG08U0M Array Organization
NOTE : Column Address : Starting Address of the Register.* L must be set to "Low".* The device ignores any additional input of address cycles than required.
I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7
1st Cycle A0 A1 A2 A3 A4 A5 A6 A7
2nd Cycle A8 A9 A10 A11 A12 *L *L *L
3rd Cycle A13 A14 A15 A16 A17 A18 A19 A20
4th Cycle A21 A22 A23 A24 A25 A26 A27 A28
5th Cycle A29 A30 A31 *L *L *L *L *L
VCC
X-Buffers
Command
I/O Buffers & Latches
Latches& Decoders
Y-BuffersLatches& Decoders
Register
Control Logic& High Voltage
Generator Global Buffers OutputDriver
VSS
A13 - A31
A0 - A12
Command
CEREWE
CLE WP
I/0 0
I/0 7
VCCVSS
512K Pages(=8,192 Blocks)
4K Bytes
8 bit
128 Bytes
1 Block = 64 Pages(256K + 8K) Byte
I/O 0 ~ I/O 7
1 Page = (4K + 128)Bytes1 Block = (4K + 128)B x 64 Pages = (256K + 8K) Bytes1 Device = (4K+128)B x 64Pages x 8,192 Blocks = 16,896 Mbits
Row Address
Page Register
ALE
16,384M + 512M BitNAND Flash
ARRAY
(4,096 + 128)Byte x 524,288
Y-Gating
Row Address
Column Address
Column Address
Row Address
Data Register & S/A
FLASH MEMORY
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K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Product IntroductionThe K9KAG08U0M is a 16,896Mbit(17,716,740,096 bit) memory organized as 524,288 rows(pages) by 4,224x8 columns. Spare128x8 columns are located from column address of 4,096~4,223. A 4,224-byte data register is connected to memory cell arraysaccommodating data transfer between the I/O buffers and memory during page read and page program operations. The memoryarray is made up of 32 cells that are serially connected to form a NAND structure. Each of the 32 cells resides in a different page. Ablock consists of two NAND structured strings. A NAND structure consists of 32 cells. Total 2,162,688 NAND cells reside in a block.The program and read operations are executed on a page basis, while the erase operation is executed on a block basis. The memoryarray consists of 8,192 separately erasable 256K-byte blocks. It indicates that the bit by bit erase operation is prohibited on theK9KAG08U0M.
The K9KAG08U0M has addresses multiplexed into 8 I/Os. This scheme dramatically reduces pin counts and allows system upgradesto future densities by maintaining consistency in system board design. Command, address and data are all written through I/O's bybringing WE to low while CE is low. Those are latched on the rising edge of WE. Command Latch Enable(CLE) and Address LatchEnable(ALE) are used to multiplex command and address respectively, via the I/O pins. Some commands require one bus cycle. Forexample, Reset Command, Status Read Command, etc require just one cycle bus. Some other commands, like page read and blockerase and page program, require two cycles: one cycle for setup and the other cycle for execution. The 2,112M byte physical spacerequires 32 addresses, thereby requiring five cycles for addressing : 2 cycles of column address, 3 cycles of row address, in thatorder. Page Read and Page Program need the same five address cycles following the required command input. In Block Erase oper-ation, however, only the three row address cycles are used. Device operations are selected by writing specific commands into thecommand register. Table 1 defines the specific commands of the K9KAG08U0M.
In addition to the enhanced architecture and interface, the device incorporates copy-back program feature from one page to anotherpage without need for transporting the data to and from the external buffer memory. Since the time-consuming serial access anddata-input cycles are removed, system performance for solid-state disk application is significantly increased.
FLASH MEMORY
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K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Table 1. Command Sets
NOTE : 1. Random Data Input/Output can be executed in a page. 2. Any command between 11h and 80h/81h/85h is prohibited except 70h/F1/F2 and FFh. 3. Read EDC Status is only available on Copy Back operation. 4. Interleave-operation between two chips is allowed. It’s prohibited to use F1h and F2h commands for other operations except interleave-operation. 5. Two-Plane Random Data Output msut be used after Two-Plane Read operation
Caution : Any undefined command inputs are prohibited except for above command set of Table 1.
Function 1st Cycle 2nd Cycle Acceptable Command during Busy
Read 00h 30h
Read for Copy Back 00h 35h
Read ID 90h -
Two-Plane Page Read 60h----60h 30h
Two-Plane Read for Copy-Back 60h----60h 35h
Reset FFh - O
Page Program 80h 10h
Page Program with 2KB Data 80h----11h 80h----10h
Two-Plane Page Program 80h---11h 81h---10h
Copy-Back Program 85h 10h
Copy-Back Program with 2KB Data 85h----11h 85h----10h
Two-Plane Copy-Back Program(2) 85h---11h 81h---10h
Block Erase 60h D0h
Two-Plane Block Erase 60h---60h D0h
Random Data Input(1) 85h -
Random Data Output(1) 05h E0h
Two Plane Random Data Output(1), (5) 00h----05h E0h
Read Status 70h O
Read EDC Status(3) 7Bh O
Chip1 Status(4) F1h O
Chip2 Status(4) F2h O
FLASH MEMORY
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K9KAG08U0MK9WBG08U1M
K9NCG08U5M
K9KAG08U0M is arranged in four 4Gb memory planes. Each plane contains 2,048 blocks and 4,224 byte page registers. This allowsit to perform simultaneous page program and block erase by selecting one page or block from each plane. The block address map isconfigured so that two-plane program/erase/read operations can be executed by dividing the memory array into plane 0~1 or plane2~3 separately. For example, two-plane program/erase/read operation into plane 0 and plane 2 is prohibited. That is to say, two-plane program/erase/read operation into plane 0 and plane 1 or into plane 2 and plane 3 is allowed
Memory Map
Plane 0 Plane 1 Plane 2 Plane 3(2048 Block) (2048 Block) (2048 Block) (2048 Block)
Page 0Page 1
Page 63Page 62
Block 0
Page 0Page 1
Page 63Page 62
Block 1
Page 0Page 1
Page 63Page 62
Block 4096
Page 0Page 1
Page 63Page 62
Block 4097
Page 0Page 1
Page 63Page 62
Block 4094
Page 0Page 1
Page 63Page 62
Block 4095
Page 0Page 1
Page 63Page 62
Block 8190
Page 0Page 1
Page 63Page 62
Block 8191
4224byte Page Registers 4224byte Page Registers 4224byte Page Registers 4224byte Page Registers
Page 0Page 1
Page 63Page 62
Block 2
Page 0Page 1
Page 63Page 62
Block 3
Page 0Page 1
Page 63Page 62
Block 4098
Page 0Page 1
Page 63Page 62
Block 4099
Page 0Page 1
Page 63Page 62
Block 4092
Page 0Page 1
Page 63Page 62
Block 4093
Page 0Page 1
Page 63Page 62
Block 8188
Page 0Page 1
Page 63Page 62
Block 8189
FLASH MEMORY
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K9KAG08U0MK9WBG08U1M
K9NCG08U5M
RECOMMENDED OPERATING CONDITIONS(Voltage reference to GND, K9XXG08UXM-XCB0 :TA=0 to 70°C, K9XXG08UXM-XIB0:TA=-40 to 85°C)
Parameter Symbol K9XXG08UXM(3.3V) UnitMin Typ. Max
Supply Voltage VCC 2.7 3.3 3.6 V
Supply Voltage VSS 0 0 0 V
ABSOLUTE MAXIMUM RATINGS
NOTE : 1. Minimum DC voltage is -0.6V on input/output pins. During transitions, this level may undershoot to -2.0V for periods <30ns. Maximum DC voltage on input/output pins is VCC+0.3V which, during transitions, may overshoot to VCC+2.0V for periods <20ns.2. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
Parameter Symbol Rating Unit
Voltage on any pin relative to VSSVCC -0.6 to + 4.6
VVIN -0.6 to + 4.6
VI/O -0.6 to Vcc + 0.3 (< 4.6V)
Temperature Under BiasK9XXG08UXM-XCB0
TBIAS-10 to +125
°CK9XXG08UXM-XIB0 -40 to +125
Storage TemperatureK9XXG08UXM-XCB0
TSTG -65 to +150 °CK9XXG08UXM-XIB0
Short Circuit Current IOS 5 mA
DC AND OPERATING CHARACTERISTICS(Recommended operating conditions otherwise noted.)
NOTE : 1. VIL can undershoot to -0.4V and VIH can overshoot to VCC +0.4V for durations of 20 ns or less. 2. Typical value is measured at VCC=3.3V, TA=25°C. Not 100% tested. 3. The typical value of the K9WBG08U1M’s ISB2 is 40µA and the maximum value is 200µA. 4. The typical value of the K9NCG08U5M’s ISB2 is 80µA and the maximum value is 400µA. 5. The maximum value of K9WBG08U1M-P’s ILI and ILO is ±40µA, the maximum value of K9WAG08U1M-I’s ILI and ILO is ±20µA. 6. The maximum value of K9NCG08U5M’s ILI and ILO is ±80µA.
Parameter Symbol Test Conditions
K9XXG08UXM
Unit3.3V
Min Typ Max
Operating Current
Page Read with Serial Access ICC1 tRC=25ns, (K9NCG08U5M: tRC=50ns)
CE=VIL, IOUT=0mA- 25 35
mAProgram ICC2 -
Erase ICC3 -
Stand-by Current(TTL) ISB1 CE=VIH, WP=0V/VCC - - 1
Stand-by Current(CMOS) ISB2 CE=VCC-0.2, WP=0V/VCC - 20 100
µAInput Leakage Current ILI VIN=0 to Vcc(max) - - ±20
Output Leakage Current ILO VOUT=0 to Vcc(max) - - ±20
Input High Voltage VIH(1) - 0.8x Vcc - Vcc +0.3
VInput Low Voltage, All inputs VIL(1) - -0.3 - 0.2x Vcc
Output High Voltage Level VOH IOH=-400µA 2.4 - -
Output Low Voltage Level VOL IOL=2.1mA - - 0.4
Output Low Current(R/B) IOL(R/B) VOL=0.4V 8 10 - mA
FLASH MEMORY
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K9KAG08U0MK9WBG08U1M
K9NCG08U5M
VALID BLOCK
NOTE : 1. The device may include initial invalid blocks when first shipped. Additional invalid blocks may develop while being used. The number of valid blocks is
presented with both cases of invalid blocks considered. Invalid blocks are defined as blocks that contain one or more bad bits. Do not erase or pro-gram factory-marked bad blocks. Refer to the attached technical notes for appropriate management of invalid blocks.
2. The 1st block, which is placed on 00h block address, is guaranteed to be a valid block up to 1K program/erase cycles with 1bit/512Byte ECC.3. The number of valid blocks is on the basis of single plane operations, and this may be decreased with two plane operations.* : Each K9KAG08U0M chip in the K9WBG08U1M and K9NCG08U5M has Maximum 160 invalid blocks.
Parameter Symbol Min Typ. Max Unit
K9KAG08U0M NVB 8,032 - 8,192 Blocks
K9WBG08U1M NVB 16,064* - 16,384* Blocks
K9NCG08U5M NVB 32,128* - 32,768* Blocks
AC TEST CONDITION(K9XXG08XXM-XCB0 :TA=0 to 70°C,K9XXG08XXM-XIB0:TA=-40 to 85°C,K9XXG08UXM: Vcc=2.7V ~ 3.3V, unless otherwise noted)
Parameter K9XXG08UXM
Input Pulse Levels 0V to Vcc
Input Rise and Fall Times 5ns
Input and Output Timing Levels Vcc/2
Output Load1 TTL GATE and CL=50pF (K9KAG08U0M-P, K9WBG08U1M-I)
1 TTL GATE and CL=30pF (K9WBG08U1M-P, K9NCG08U5M-P)
MODE SELECTION
NOTE : 1. X can be VIL or VIH.
2. WP should be biased to CMOS high or CMOS low for standby.
CLE ALE CE WE RE WP Mode
H L L H X Read Mode
Command Input
L H L H X Address Input(5clock)
H L L H H Write Mode
Command Input
L H L H H Address Input(5clock)
L L L H H Data Input
L L L H X Data Output
X X X X H X During Read(Busy)
X X X X X H During Program(Busy)
X X X X X H During Erase(Busy)
X X(1) X X X L Write Protect
X X H X X 0V/VCC(2) Stand-by
CAPACITANCE(TA=25°C, VCC=3.3V , f=1.0MHz)
NOTE : Capacitance is periodically sampled and not 100% tested. K9WBG08U1M-IXB0’s capacitance(I/O, Input) is 10pF.
Item Symbol Test Condition Min
MaxUnit
K9KAG08U0M K9WBG08U1M K9NCG08U5M
Input/Output Capaci- CI/O VIL=0V - 10 20 40 pF
Input Capacitance CIN VIN=0V - 10 20 40 pF
FLASH MEMORY
15
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Program / Erase Characteristics
NOTE : 1. Typical value is measured at Vcc=3.3V, TA=25°C. Not 100% tested. 2. Typical program time is defined as the time within which more than 50% of the whole pages are programmed at 3.3V Vcc and 25°C temperature.
Parameter Symbol Min Typ Max Unit
Program Time tPROG - 200 700 µs
Dummy Busy Time for Two-Plane Page Program tDBSY - 0.5 1 µs
Number of Partial Program Cycles Nop - - 4 cycles
Block Erase Time tBERS - 1.5 2 ms
AC Timing Characteristics for Command / Address / Data Input
NOTES : 1. The transition of the corresponding control pins must occur only once while WE is held low 2. tADL is the time from the WE rising edge of final address cycle to the WE rising edge of first data cycle
Parameter Symbol
Min Max
UnitK9NCG08U5M
K9KAG08U0MK9NCG08U5M
K9KAG08U0M
K9WBG08U1M K9WBG08U1M
CLE Setup Time tCLS(1) 25 12 - - ns
CLE Hold Time tCLH 10 5 - - ns
CE Setup Time tCS(1) 35 20 - - ns
CE Hold Time tCH 10 5 - - ns
WE Pulse Width tWP 25 12 - - ns
ALE Setup Time tALS(1) 25 12 - - ns
ALE Hold Time tALH 10 5 - - ns
Data Setup Time tDS(1) 20 12 - - ns
Data Hold Time tDH 10 5 - - ns
Write Cycle Time tWC 45 25 - - ns
WE High Hold Time tWH 15 10 - - ns
Address to DataLoading Time
tADL(2)100 100 - - ns
FLASH MEMORY
16
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
AC Characteristics for Operation
NOTE: 1. If reset command(FFh) is written at Ready state, the device goes into Busy for maximum 5µs.
Parameter Symbol
Min Max
UnitK9NCG08U5M
K9KAG08U0MK9NCG08U5M
K9KAG08U0M
K9WBG08U1M K9WBG08U1M
Data Transfer from Cell to Register tR - - 25 25 µs
ALE to RE Delay tAR 10 10 - ns
CLE to RE Delay tCLR 10 10 - ns
Ready to RE Low tRR 20 20 - ns
RE Pulse Width tRP 25 12 - ns
WE High to Busy tWB - - 100 100 ns
Read Cycle Time tRC 50 25 - - ns
RE Access Time tREA - - 30 20 ns
CE Access Time tCEA - - 45 25 ns
RE High to Output Hi-Z tRHZ - - 100 100 ns
CE High to Output Hi-Z tCHZ - - 30 30 ns
CE High to ALE or CLE Don’t Care tCSD 10 10 - - -
RE High to Output hold tRHOH 15 15 - - ns
RE Low to Output hold tRLOH - 5 - - ns
CE High to Output hold tCOH 15 15 - - ns
RE High Hold Time tREH 15 10 - - ns
Output Hi-Z to RE Low tIR 0 0 - - ns
RE High to WE Low tRHW 100 100 - - ns
WE High to RE Low tWHR 60 60 - - ns
Device Resetting Time(Read/Program/Erase) tRST - - 5/10/500(1) 5/10/500(1) µs
WP High to WE Low tWW 100 100 - - ns
FLASH MEMORY
17
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
NAND Flash Technical Notes
Identifying Initial Invalid Block(s)
Initial Invalid Block(s)Initial invalid blocks are defined as blocks that contain one or more initial invalid bits whose reliability is not guaranteed by Samsung.The information regarding the initial invalid block(s) is called the initial invalid block information. Devices with initial invalid block(s)have the same quality level as devices with all valid blocks and have the same AC and DC characteristics. An initial invalid block(s)does not affect the performance of valid block(s) because it is isolated from the bit line and the common source line by a select tran-sistor. The system design must be able to mask out the initial invalid block(s) via address mapping. The 1st block, which is placed on00h block address, is guaranteed to be a valid block up to 1K program/erase cycles with 1bit/512Byte ECC.
All device locations are erased(FFh) except locations where the initial invalid block(s) information is written prior to shipping. The ini-tial invalid block(s) status is defined by the 1st byte in the spare area. Samsung makes sure that either the 1st or 2nd page of everyinitial invalid block has non-FFh data at the column address of 4096. Since the initial invalid block information is also erasable inmost cases, it is impossible to recover the information once it has been erased. Therefore, the system must be able to recognize theinitial invalid block(s) based on the original initial invalid block information and create the initial invalid block table via the followingsuggested flow chart(Figure 3). Any intentional erasure of the original initial invalid block information is prohibited.
* Check "FFh" at the column address 4096
Figure 3. Flow chart to create initial invalid block table
Start
Set Block Address = 0
Check "FFh"
Increment Block Address
Last Block ?
End
No
Yes
Yes
Create (or update) NoInitial
of the 1st and 2nd page in the block
Invalid Block(s) Table
FLASH MEMORY
18
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
NAND Flash Technical Notes (Continued)
Program Flow Chart
Start
I/O 6 = 1 ?
I/O 0 = 0 ? No*
Write 80h
Write Address
Write Data
Write 10h
Read Status Register
Program Completed
or R/B = 1 ?
Program Error
Yes
No
Yes
: If program operation results in an error, map out the block including the page in error and copy the target data to another block.
*
Error in write or read operationWithin its life time, additional invalid blocks may develop with NAND Flash memory. Refer to the qualification report for the actualdata.The following possible failure modes should be considered to implement a highly reliable system. In the case of status read fail-ure after erase or program, block replacement should be done. Because program status fail during a page program does not affectthe data of the other pages in the same block, block replacement can be executed with a page-sized buffer by finding an erasedempty block and reprogramming the current target data and copying the rest of the replaced block. In case of Read, ECC must beemployed. To improve the efficiency of memory space, it is recommended that the read or verification failure due to single bit error bereclaimed by ECC without any block replacement. The said additional block failure rate does not include those reclaimed blocks.
Failure Mode Detection and Countermeasure sequence
Write Erase Failure Status Read after Erase --> Block Replacement
Program Failure Status Read after Program --> Block Replacement
Read Single Bit Failure Verify ECC -> ECC Correction
ECC : Error Correcting Code --> Hamming Code etc. Example) 1bit correction & 2bit detection
FLASH MEMORY
19
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Erase Flow Chart
Start
I/O 6 = 1 ?
I/O 0 = 0 ? No*
Write 60h
Write Block Address
Write D0h
Read Status Register
or R/B = 1 ?
Erase Error
Yes
No
: If erase operation results in an error, map outthe failing block and replace it with another block. *
Erase Completed
Yes
Read Flow Chart
Start
Verify ECC No
Write 00h
Write Address
Read Data
ECC Generation
Reclaim the Error
Page Read Completed
Yes
NAND Flash Technical Notes (Continued)
Write 30h
Block Replacement
* Step1When an error happens in the nth page of the Block ’A’ during erase or program operation. * Step2Copy the data in the 1st ~ (n-1)th page to the same location of another free block. (Block ’B’)* Step3Then, copy the nth page data of the Block ’A’ in the buffer memory to the nth page of the Block ’B’.* Step4Do not erase or program Block ’A’ by creating an ’invalid block’ table or other appropriate scheme.
Buffer memory of the controller.
1stBlock A
Block B
(n-1)thnth
(page)
{∼
1st
(n-1)thnth
(page)
{∼
an error occurs.1
2
FLASH MEMORY
20
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
NAND Flash Technical Notes (Continued)
Copy-Back Operation with EDC & Sector Definition for EDCGenerally, copy-back program is very powerful to move data stored in a page without utilizing any external memory. But, if the sourcepage has one bit error due to charge loss or charge gain, then without EDC, the copy-back program operation could also accumulatebit errors.K9KAG08U0M supports copy-back with EDC to prevent cumulative bit errors. To make EDC valid, the page program operationshould be performed on either whole page(4224byte) or sector(528byte). Modifying the data of a sector by Random Data Inputbefore Copy-Back Program must be performed for the whole sector and is allowed only once per each sector. Any partialmodification smaller than a sector corrupts the on-chip EDC codes. A 4,224-byte page is composed of 8 sectors of 528-byte and each 528-byte sector is composed of 512-byte main area and 16-bytespare area.
"A" area
512 Byte
(1’st sector)
Main Field (4,096 Byte)
"I" (1’st )
16
"B" area
512 Byte
(2’nd sector)"C" area
512 Byte
(3’rd sector)"D" area
512 Byte
(4’th sector)
Spare Field (128 Byte)
Table 2. Definition of the 528-Byte Sector
Sector Main Field (Column 0~2,047) Spare Field (Column 2,048~2,111)
Area Name Column Address Area Name Column Address
1’st 528-Byte Sector "A" 0 ~ 511 "I" 4,096 ~ 4,111
2’nd 528-Byte Sector "B" 512 ~ 1,023 "J" 4,112 ~ 4,127
3’rd 528-Byte Sector "C" 1,024 ~ 1,535 "K" 4,128 ~ 4,143
4’th 528-Byte Sector "D" 1,536 ~ 2,047 "L" 4,114 ~ 4,159
5’th 528-Byte Sector "E" 2,048 ~ 2,559 "M" 4,160 ~ 4,175
6’th 528-Byte Sector "F" 2,560 ~ 3,071 "N" 4,176 ~ 4,191
7’th 528-Byte Sector "G" 3,072 ~ 3,583 "O" 4,192 ~ 4,207
8’th 528-Byte Sector "H" 3,584 ~ 4,095 "P" 4,208 ~ 4,223
"E" area(5’th sector)
"F" area(6’th sector)
"G" area(7’th sector)
"H" area(8’th sector)
"J" (2’nd )
"K" (3’rd )
"L" (4’th )
"M" (5’th )
"N" (6’tht )
"O" (7’th )
"P" (8’th )
512 Byte 512 Byte 512 Byte 512 Byte Byte16
Byte16
Byte16
Byte16
Byte16
Byte16
Byte16
Byte
FLASH MEMORY
21
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Within a block, the pages must be programmed consecutively from the LSB (least significant bit) page of the block to MSB (most sig-nificant bit) pages of the block. Random page address programming is prohibited. In this case, the definition of LSB page is the LSBamong the pages to be programmed. Therefore, LSB doesn’t need to be page 0.
From the LSB page to MSB page
DATA IN: Data (1) Data (64)
(1)(2)(3)
(32)
(64)
Data register
Page 0Page 1Page 2
Page 31
Page 63
Ex.) Random page program (Prohibition)
DATA IN: Data (1) Data (64)
(2)(32)(3)
(1)
(64)
Data register
Page 0Page 1Page 2
Page 31
Page 63
Addressing for program operation
:
:
:
:
Interleave Page ProgramK9KAG08U0M is composed of two K9F8G08U0Ms. K9KAG08U0M provides interleaving operation between two K9F8G08U0Ms.
This interleaving page program improves the system throughput almost twice compared to non-interleaving page program.
At first, the host issues page program command to one of the K9F8G08U0M chips, say K9F8G08X0M(chip #1). Due to thisK9KAG08U0M goes into busy state. During this time, K9F8G08U0M(chip #2) is in ready state. So it can execute the page programcommand issued by the host.
After the execution of page program by K9F8G08U0M(chip #1), it can execute another page program regardless of theK9F8G08U0M(chip #2). Before that the host needs to check the status of K9F8G08U0M(chip #1) by issuing F1h command. Onlywhen the status of K9F8G08U0M(chip #1) becomes ready status, host can issue another page program command. If theK9F8G08U0M(chip #1) is in busy state, the host has to wait for the K9F8G08U0M(chip #1) to get into ready state.
Similarly, K9F8G08U0M chip(chip #2) can execute another page program after the completion of the previous program. The host canmonitor the status of K9F8G08U0M(chip #2) by issuing F2h command. When the K9F8G08U0M(chip #2) shows ready state, hostcan issue another page program command to K9F8G08U0M(chip #2).
This interleaving algorithm improves the system throughput almost twice. The host can issue page program command to each chipindividually. This reduces the time lag for the completion of operation.
NOTE: During interleave operations, 70h command is prohibited.
FLASH MEMORY
22
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
R/ B
(#1)
bus
y of
Chi
p #1
I/OX
80h
10h
Com
man
d
A31
: Lo
w
Add
& D
ata
80h
10h
A31
: Hig
h
Add
& D
ata
bus
y of
Chi
p #2
inte
rnal
onl
y
R/B
(#2
)in
tern
al o
nly
R/B
Inte
rleav
e Pa
ge P
rogr
am
≈ ≈ ≈
F1h
or F
2h
AB
CD
anot
her p
age
prog
ram
on
Chi
p #1
Stat
e A
: C
hip
#1 is
exe
cutin
g a
page
pro
gram
ope
ratio
n an
d ch
ip #
2 is
in re
ady
stat
e. S
o th
e ho
st c
an is
sue
a pa
ge p
rogr
am c
omm
and
to c
hip
#2.
Stat
e B
: B
oth
chip
#1
and
chip
#2
are
exec
utin
g pa
ge p
rogr
am o
pera
tion.
Stat
e C
: P
age
prog
ram
on
chip
#1
is te
rmin
ated
, but
pag
e pr
ogra
m o
n ch
ip #
2 is
stil
l ope
ratin
g. A
nd t
he s
yste
m s
houl
d is
sue
F1h
com
man
d to
det
ect t
he s
tatu
s of
chi
p #1
. If c
hip
#1 is
read
y, s
tatu
s I/O
6 is
"1" a
nd th
e sy
stem
can
issu
e an
othe
r pag
e pr
ogra
m c
omm
and
to c
hip
#1.
Stat
e D
: C
hip
#1 a
nd C
hip
#2 a
re re
ady.
Acc
ordi
ng to
the
abov
e pr
oces
s, th
e sy
stem
can
ope
rate
pag
e pr
ogra
m o
n ch
ip #
1 an
d ch
ip #
2 al
tern
atel
y.
Stat
usO
pera
tion
Stat
us C
omm
and
/ Dat
a
F1h
F2h
AC
hip
1 : B
usy,
C
hip
2 : R
eady
8xh
Cxh
BC
hip
1 : B
usy,
C
hip
2 : B
usy
8xh
8xh
CC
hip
1 : R
eady
, C
hip
2 : B
usy
Cxh
8xh
DC
hip
1 : R
eady
, C
hip
2 : R
eady
Cxh
Cxh
FLASH MEMORY
23
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
R/ B
(#1)
bus
y of
Chi
p #1
I/OX
60h
D0h
Com
man
d
A31
: L
ow
Add
60
hD
0h
A31
: H
igh
Add
bus
y of
Chi
p #2
inte
rnal
onl
y
R/B
(#2
)in
tern
al o
nly
R/B
Inte
rleav
e B
lock
Era
se
≈ ≈ ≈
F1h
or F
2h
AB
CD
anot
her B
lock
Era
se o
n C
hip
#1
Stat
e A
: C
hip
#1 is
exe
cutin
g a
bloc
k er
ase
oper
atio
n, a
nd c
hip
#2 is
in re
ady
stat
e. S
o th
e ho
st c
an is
sue
a bl
ock
eras
e co
mm
and
to c
hip
#2.
Stat
e B
: B
oth
chip
#1
and
chip
#2
are
exec
utin
g bl
ock
eras
e op
erat
ion.
Stat
e C
: B
lock
era
se o
n ch
ip #
1 is
term
inat
ed, b
ut b
lock
era
se o
n ch
ip #
2 is
stil
l ope
ratin
g. A
nd t
he s
yste
m s
houl
d is
sue
F1h
com
man
d to
det
ect t
he s
tatu
s of
chi
p #1
. If
chip
#1
is re
ady,
sta
tus
I/O6
is "1
" and
the
syst
em c
an is
sue
anot
her b
lock
era
se c
omm
and
to c
hip
#1.
Stat
e D
: C
hip
#1 a
nd C
hip
#2 a
re re
ady.
Acc
ordi
ng to
the
abov
e pr
oces
s, th
e sy
stem
can
ope
rate
blo
ck e
rase
on
chip
#1
and
chip
#2
alte
rnat
ely.
Stat
usO
pera
tion
Stat
us C
omm
and
/ Dat
a
F1h
F2h
AC
hip
1 : B
usy,
C
hip
2 : R
eady
8xh
Cxh
BC
hip
1 : B
usy,
C
hip
2 : B
usy
8xh
8xh
CC
hip
1 : R
eady
, C
hip
2 : B
usy
Cxh
8xh
DC
hip
1 : R
eady
, C
hip
2 : R
eady
Cxh
Cxh
FLASH MEMORY
24
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
R/B
(#1)
t D
BSY
I/OX
Com
man
d
t PR
OG
of c
hip
#1in
tern
al o
nly
R/B
(#2)
inte
rnal
onl
y
R/B
81h
10h
A31
:Lo
w
Add
& Da
ta80
h11
h
A31
: Lo
w
Add
& Da
ta
F1h
or F
2h*
81h
10h
A31
:Hig
h
Add
& Da
ta80
h11
h
A31:
High
Add
& Da
ta
t D
BS
Y tP
RO
G o
f Chi
p #2
≈
R/n
B (#
1)
I/OX
inte
rnal
onl
y
R/B
(#2)
inte
rnal
onl
y
R/B
tPR
OG
of C
hip
#2
1
1
Inte
rleav
e Tw
o-Pl
ane
Page
Pro
gram
≈≈≈
≈≈
Stat
e A
: C
hip
#1 is
exe
cutin
g a
page
pro
gram
ope
ratio
n, a
nd c
hip
#2 is
in re
ady
stat
e. S
o th
e ho
st c
an is
sue
a pa
ge p
rogr
am c
omm
and
to c
hip
#2.
Stat
e B
: B
oth
chip
#1
and
chip
#2
are
exec
utin
g pa
ge p
rogr
am o
pera
tion.
Stat
e C
: P
age
prog
ram
on
chip
#1
is c
ompl
eted
and
chi
p #1
is re
ady
for t
he n
ext o
pera
tion.
Chi
p #2
is s
till e
xecu
ting
page
pro
gram
ope
ratio
n.St
ate
D :
Bot
h ch
ip #
1 an
d ch
ip #
2 ar
e re
ady.
Not
e :
*F1h
com
man
d is
requ
ired
to c
heck
the
stat
us o
f chi
p #1
to is
sue
the
next
pag
e pr
ogra
m c
omm
and
to c
hip
#1.
F2h
com
man
d is
requ
ired
to c
heck
the
stat
us o
f chi
p #2
to is
sue
the
next
pag
e pr
ogra
m c
omm
and
to c
hip
#2.
Acc
ordi
ng to
the
abov
e pr
oces
s, th
e sy
stem
can
ope
rate
two-
plan
e pa
ge p
rogr
am o
n ch
ip #
1 an
d ch
ip #
2 al
tern
atel
y.
AB
CD
FLASH MEMORY
25
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
R/B
(#1)
I/OX
Com
man
d
t B
ERS
of
chip
#1
inte
rnal
onl
y
R/B
(#2)
inte
rnal
onl
y
R/B
60h
D0h
A31
:Low
Add
60h
A31 :
Low
Add
F1h
or F
2h*
60h
D0h
A31
:Hi
gh
Add
60h
A31
: H
igh
Add
t BE
RS
of c
hip
#2
tBER
S o
f ch
ip #
2
1
1
Inte
rleav
e Tw
o-Pl
ane
Blo
ck E
rase
R/B
(#1)I/O
X
inte
rnal
onl
y
R/B
(#2)
inte
rnal
onl
y
R/B
≈≈ ≈
AB
C
Stat
e A
: C
hip
#1 is
exe
cutin
g a
bloc
k er
ase
oper
atio
n, a
nd c
hip
#2 is
in re
ady
stat
e. S
o th
e ho
st c
an is
sue
a bl
ock
eras
e co
mm
and
to c
hip
#2.
Stat
e B
: B
oth
chip
#1
and
chip
#2
are
exec
utin
g bl
ock
eras
e op
erat
ion.
Stat
e C
: B
lock
era
se o
n ch
ip #
1 is
com
plet
ed a
nd c
hip
#1 is
read
y fo
r the
nex
t ope
ratio
n. C
hip
#2 is
stil
l exe
cutin
g bl
ock
eras
e op
erat
ion.
Stat
e D
: B
oth
chip
#1
and
chip
#2
are
read
y.N
ote
: *F
1h c
omm
and
is re
quire
d to
che
ck th
e st
atus
of c
hip
#1 to
issu
e th
e ne
xt b
lock
era
se c
omm
and
to c
hip
#1.
F2h
com
man
d is
requ
ired
to c
heck
the
stat
us o
f chi
p #2
to is
sue
the
next
blo
ck e
rase
com
man
d to
chi
p #2
.A
s th
e ab
ove
proc
ess,
the
syst
em c
an o
pera
te tw
o-pl
ane
bloc
k er
ase
on c
hip
#1 a
nd c
hip
#2 a
ltern
ativ
ely.
D
FLASH MEMORY
26
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
R/B
(#1)
I/OX
Com
man
d
inte
rnal
onl
y
R/B
(#2)
inte
rnal
onl
y
R/B
F1h
or F
2h*
1
1
Inte
rleav
e R
ead
to P
age
Prog
ram
Ope
ratio
n
R/B
(#1)I/O
X
inte
rnal
onl
y
R/B
(#2)
inte
rnal
onl
y
R/B
AB
C
Stat
e A
: C
hip
#1 is
exe
cutin
g a
page
pro
gram
ope
ratio
n, a
nd c
hip
#2 is
in re
ady
stat
e. S
o th
e ho
st c
an is
sue
a re
ad c
omm
and
to c
hip
#2.
Stat
e B
: B
oth
chip
#1
is e
xecu
ting
page
pro
gram
ope
ratio
n an
d ch
ip #
2 is
exe
cutin
g re
ad o
pera
tion.
Stat
e C
: R
ead
oper
atio
n on
chi
p #2
is c
ompl
eted
and
chi
p #2
is re
ady
for t
he n
ext o
pera
tion.
Chi
p #1
is s
till e
xecu
ting
page
pro
gram
ope
ratio
n.St
ate
D :
Bot
h ch
ip #
1 an
d ch
ip #
2 ar
e re
ady.
Not
e :
*F1h
com
man
d is
requ
ired
to c
heck
the
stat
us o
f chi
p #1
to is
sue
the
next
com
man
d to
chi
p #1
.
F
2h c
omm
and
is re
quire
d to
che
ck th
e st
atus
of c
hip
#2 to
issu
e th
e ne
xt c
omm
and
to c
hip
#2.
As
the
abov
e pr
oces
s, th
e sy
stem
can
ope
rate
Inte
rleav
e re
ad to
pag
e po
rgra
m o
n ch
ip #
1 an
d ch
ip #
2 al
tern
ativ
ely.
D
10h
80h
A31
: Lo
w
Add
Data
in
tPR
OG
of
chip
#1
30h
00h
A31 :
Hig
h
Add
Data
out
tR o
f ch
ip #
2
tPR
OG
of
chip
#1
FLASH MEMORY
27
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
R/B
(#1)
I/OX
inte
rnal
onl
y
R/B
(#2)
inte
rnal
onl
y
R/B
1
Inte
rleav
e C
opy-
Bac
k Pr
ogra
m O
pera
tion
AB
Stat
e A
: C
hip
#1 is
exe
cutin
g a
copy
-bac
k pr
ogra
m o
pera
tion,
and
chi
p #2
is in
read
y st
ate.
So
the
host
can
issu
e a
read
for c
opy-
back
com
man
d to
chi
p #2
.St
ate
B :
Bot
h ch
ip #
1 is
exe
cutin
g co
py-b
ack
prog
ram
ope
ratio
n an
d ch
ip #
2 is
exe
cutin
g re
ad fo
r cop
y-ba
ck o
pera
tion.
Stat
e C
: R
ead
for c
opy-
back
ope
ratio
n on
chi
p #2
is c
ompl
eted
and
chi
p #2
is re
ady
for t
he n
ext o
pera
tion.
Chi
p #1
is s
till e
xecu
ting
copy
-bac
k pr
ogra
m o
pera
tion.
Stat
e D
: B
oth
chip
#1
and
chip
#2
are
read
y.St
ate
E : C
hip
#2 is
exe
cutin
g a
copy
-bac
k pr
ogra
m o
pera
tion,
and
chi
p #1
is in
read
y st
ate.
So
the
host
can
issu
e a
read
for c
opy-
back
com
man
d to
chi
p #1
.St
ate
F : B
oth
chip
#2
is e
xecu
ting
copy
-bac
k pr
ogra
m o
pera
tion
and
chip
#1
is e
xecu
ting
read
for c
opy-
back
ope
ratio
n.St
ate
C :
Rea
d fo
r cop
y-ba
ck o
pera
tion
on c
hip
#1 is
com
plet
ed a
nd c
hip
#1 is
read
y fo
r the
nex
t ope
ratio
n. C
hip
#2 is
stil
l exe
cutin
g co
py-b
ack
prog
ram
ope
ratio
n.St
ate
D :
Bot
h ch
ip #
1 an
d ch
ip #
2 ar
e re
ady.
Not
e :
*F1h
com
man
d is
requ
ired
to c
heck
the
stat
us o
f chi
p #1
to is
sue
the
next
com
man
d to
chi
p #1
.
F
2h c
omm
and
is re
quire
d to
che
ck th
e st
atus
of c
hip
#2 to
issu
e th
e ne
xt c
omm
and
to c
hip
#2.
As
the
abov
e pr
oces
s, th
e sy
stem
can
ope
rate
Inte
rleav
e co
py-b
ack
prog
ram
on
chip
#1
and
chip
#2
alte
rnat
ivel
y.
10h
85h
A31
: Lo
w
Add
tPR
OG
of
chip
#1
35h
00h
A31 :
Hig
h
Add
tR o
f ch
ip #
2
Com
man
d
F1h
or F
2h*
C
R/B
(#1)
I/OX
inte
rnal
onl
y
R/B
(#2)
inte
rnal
onl
y
R/B
1D
F
10h
85h
A31
: Hi
gh
Add
35h
00h
A31 :
Low
Add
Com
man
d
F1h
or F
2h*
G
tPR
OG
of
chip
#2
tR o
f ch
ip #
1
EH
FLASH MEMORY
28
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
R/B
(#1)
I/OX
tR
inte
rnal
onl
y
R/B
(#2)
inte
rnal
onl
y
R/B
60h A31
: L
ow
Add
1
1
Inte
rleav
e Tw
o-Pl
ane
Cop
y B
ack
Prog
ram
R/B
(#1)
I/OX
inte
rnal
R/B
(#2)
inte
rnal
R/B
A
A19
: L
owA3
1 :
Low
A19
: Hi
ghA
31 :
Low
A19
: L
owA
31 :
Low
A19
: H
igh
tPR
OG
of C
hip
#1on
ly
only
A31
: L
owA
19 :
Low
A31
: L
owA
19 :
Hig
h
60h
Add
35h
00h
Add
05h
Add
E0h
Data
Out
00
hAd
d 05
hAd
d E0
hDa
ta O
ut
85h
Add
11h tD
BSY81
hAd
d 10
h60
h A31
: Hi
ghAdd
A19
: Lo
wA
31 :
Hig
hA
19 :
Hig
h
60h
Add
35h
A31
: Hi
ghA1
9 :
Low
00h
Add
05h
Add
E0h
Data
Out
2
tR
FLASH MEMORY
29
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
R/B
(#1)
I/OX
Com
man
d
inte
rnal
R/B
(#2)
inte
rnal
R/B
F1h
or F
2h*
32
Inte
rleav
e Tw
o-Pl
ane
Cop
y B
ack
Prog
ram
R/B
(#1)
I/OX
inte
rnal
R/B
(#2)
inte
rnal
R/B
B
C
Stat
e A
: C
hip
#1 is
exe
cutin
g a
page
pro
gram
ope
ratio
n, a
nd c
hip
#2 is
in re
ady
stat
e. S
o th
e ho
st c
an is
sue
a pa
ge p
rogr
am c
omm
and
to c
hip
#2.
Stat
e B
: B
oth
chip
#1
and
chip
#2
are
exec
utin
g pa
ge p
rogr
am o
pera
tion.
Stat
e C
: P
age
prog
ram
on
chip
#1
is c
ompl
eted
and
chi
p #1
is re
ady
for t
he n
ext o
pera
tion.
Chi
p #2
is s
till e
xecu
ting
page
pro
gram
ope
ratio
n.St
ate
D :
Bot
h ch
ip #
1 an
d ch
ip #
2 ar
e re
ady.
Not
e :
*F1h
com
man
d is
requ
ired
to c
heck
the
stat
us o
f chi
p #1
to is
sue
the
next
pag
e pr
ogra
m c
omm
and
to c
hip
#1.
F2h
com
man
d is
requ
ired
to c
heck
the
stat
us o
f chi
p #2
to is
sue
the
next
pag
e pr
ogra
m c
omm
and
to c
hip
#2.
Acc
ordi
ng to
the
abov
e pr
oces
s, th
e sy
stem
can
ope
rate
two-
plan
e pa
ge p
rogr
am o
n ch
ip #
1 an
d ch
ip #
2 al
tern
atel
y.
tPR
OG
of C
hip
#2
only
only
A31
: H
igh
A19
: H
igh
00h
Add
05h
Add
E0h
Data
Out
A31
: Hi
ghA1
9 :
Low
A31
: Hg
ihA1
9 :
High
85h
Add
11h
81h
Add
10h
only
only
tPR
OG
of C
hip
#1
tPR
OG
of C
hip
#2
≈
≈
3D
tDB
SY
FLASH MEMORY
30
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
System Interface Using CE don’t-care. For an easier system interface, CE may be inactive during the data-loading or serial access as shown below. The internal 4,224bytedata registers are utilized as separate buffers for this operation and the system design gets more flexible. In addition, for voice oraudio applications which use slow cycle time on the order of µ-seconds, de-activating CE during the data-loading and serial accesswould provide significant savings in power consumption.
Figure 4. Program Operation with CE don’t-care.
CE
WEtWP
tCHtCS
Address(5Cycles)80h Data Input
CE
CLE
ALE
WE
Data Input
CE don’t-care
10h
Address(5Cycle)00h
CE
CLE
ALE
WE
Data Output(serial access)
CE don’t-care
R/B tR
RE
tCEA
out
tREA
CE
RE
I/O0~7
Figure 5. Read Operation with CE don’t-care.
30h
I/Ox
I/Ox
≈≈
≈
≈≈
≈≈
≈≈
≈≈
≈≈
≈≈
≈
≈≈
≈≈
≈
≈
≈ ≈
FLASH MEMORY
31
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Command Latch Cycle
CE
WE
CLE
ALE
Command
Address Latch Cycle
tCLS
tCS
tCLH
tCH
tWP
tALS tALH
tDS tDH
NOTE
Device I/O DATA ADDRESS
I/Ox Data In/Out Col. Add1 Col. Add2 Row Add1 Row Add2 Row Add3
K9KAG08U0M I/O 0 ~ I/O 7 4,224byte A0~A7 A8~A12 A13~A20 A21~A28 A29~A31
I/Ox
CE
WE
CLE
ALE
Col. Add1
tCStWC
tWP
tALS
tDStDH
tALH tALStWH
tWC
tWP
tDStDH
tALH tALStWH
tWC
tWP
tDStDH
tALH tALStWH
tDStDH
tWP
I/Ox Col. Add2 Row Add1 Row Add2
tWC
tWHtALH tALS
tDStDH
Row Add3
tALH
tCLS
FLASH MEMORY
32
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Input Data Latch Cycle
CE
CLE
WE
DIN 0 DIN 1 DIN final
ALE
tALS
tCLH
tWC
tCH
tDS tDH tDStDH
tDStDH
tWP
tWH
tWP tWP≈≈
≈I/Ox
≈≈
≈
* Serial Access Cycle after Read(CLE=L, WE=H, ALE=L)
RE
CE
R/B
Dout Dout Dout
tRC
tREA
tRR
tRHOH
tREAtREH
tREA tCOH
tRHZ
≈≈
≈≈
I/Ox
tCHZ
tRHZ
NOTES : 1. Transition is measured at ±200mV from steady state voltage with load. This parameter is sampled and not 100% tested. 2. tRLOH is valid when frequency is higher than 33MHz. tRHOH starts to be valid when frequency is lower than 33MHz.
FLASH MEMORY
33
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Status Read Cycle & EDC Status Read Cycle
CE
WE
CLE
RE
70h/7Bh Status Output
tCLR
tCLH
tWPtCH
tDStDH tREAtIR
tRHOH
tCOHtWHR
tCEA
tCLS
I/Ox
tCHZ
tRHZ
tCS
RE
CE
R/B
I/Ox
≈
tRR
tCEA
tREA
tRP tREH
tRC
≈
tRHZ
tCHZ
Serial Access Cycle after Read(EDO Type, CLE=L, WE=H, ALE=L)
tRHOH
tCOH
tRLOH
≈≈
Dout Dout
tREA
≈
NOTES : 1. Transition is measured at ±200mV from steady state voltage with load. This parameter is sampled and not 100% tested. 2. tRLOH is valid when frequency is higher than 33MHz. tRHOH starts to be valid when frequency is lower than 33MHz.
F1/F2
FLASH MEMORY
34
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Read Operation(Intercepted by CE)
CE
CLE
R/B
WE
ALE
RE
Busy
00h Dout N Dout N+1 Dout N+2
Row AddressColumn Address
tWB
tAR
tCHZ
tR
tRR
tRC
30h
Read Operation
CE
CLE
R/B
WE
ALE
RE
Busy
00h Col. Add1 Col. Add2 Row Add1 Dout N Dout N+1
Column Address Row Address
tWBtAR
tR tRCtRHZ
tRR
Dout M
tWC
≈≈
≈
Row Add2 30h
tCLR
I/Ox
I/Ox Col. Add1 Col. Add2 Row Add1 Row Add2
Row Add3
Row Add3
tCLR
tCSD
tCSD
tCOH
FLASH MEMORY
35
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Ran
dom
Dat
a O
utpu
t In
a Pa
ge
CE
CLE
R/B
WE
ALE
RE
Busy
00h
Dout
NDo
ut N
+1
Row
Addr
ess
Colu
mn
Addr
ess
tWB
tAR
tR tRR
tRC
30h/
35h
05h
Colu
mn
Addr
ess
Dout
MDo
ut M
+1I/O
xC
ol. A
dd1
Col
. Add
2R
ow A
dd1
Row
Add2
Col
Add
1Co
l Add
2Ro
w Ad
d3E
0h
tRH
W
tCLR
tWH
R tRE
A
FLASH MEMORY
36
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Page Program Operation
CE
CLE
R/B
WE
ALE
RE
80h 70h I/O0DinN
Din 10hMSerialData
Input Command Column Address Row Address 1 up to m ByteSerial Input
ProgramCommand
Read StatusCommand
I/O0=0 Successful ProgramI/O0=1 Error in Program
tPROGtWB
tWC tWC tWC
≈≈
≈
≈
I/Ox Co.l Add1 Col. Add2 Row Add1 Row Add2 Row Add3
NOTES : tADL is the time from the WE rising edge of final address cycle to the WE rising edge of first data cycle.
tADLtWHR
FLASH MEMORY
37
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Page
Pro
gram
Ope
ratio
n w
ith R
ando
m D
ata
Inpu
t
CE
CLE
R/B
WE
ALE
RE
80h
70h
I/O0
Din N
Din
10h
MSe
rial D
ata
Inpu
t Com
man
dC
olum
n Ad
dres
sR
ow A
ddre
ssSe
rial I
nput
Prog
ram
Com
man
dR
ead
Stat
usC
omm
and
tPR
OG
tWB
tWC
tWC
≈ ≈
≈
≈
85h
Ran
dom
Dat
aIn
put C
omm
and
Col
umn
Addr
ess
tWC
Din J
Din K
Seria
l Inp
ut
≈ ≈
I/Ox
Col. A
dd1
Col. A
dd2
Row
Add1
Row
Add2
Col. A
dd1
Col. A
dd2
Row
Add3
≈
NO
TES
: 1. t
AD
L is
the
time
from
the
WE
risi
ng e
dge
of fi
nal a
ddre
ss c
ycle
to th
e W
E ris
ing
edge
of f
irst d
ata
cycl
e.
tAD
L
2. F
or E
DC
ope
ratio
n, o
nly
one
time
rand
om d
ata
inpu
t is
poss
ible
at t
he s
ame
addr
ess.
tAD
L
tWH
R
I/O0=
0 Su
cces
sful
Pro
gram
I/O0=
1 Er
ror i
n Pr
ogra
m
FLASH MEMORY
38
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Cop
y-B
ack
Prog
ram
Ope
ratio
n W
ith R
ando
m D
ata
Inpu
t
CE
CLE
R/B
WE
ALE
RE
00h
I/Ox
85h
Colu
mn
Addr
ess
Row
Addr
ess
Read
EDC
Sta
tus
or R
ead
Stat
us C
omm
and
I/O0=
0 Su
cces
sful
Pro
gram
I/O0=
1 Er
ror i
n Pr
ogra
m
tPR
OG
tWB
tWC
≈
Busy
tWB tR
Busy
≈10
h
Copy
-Bac
k Da
taIn
put C
omm
and
35h
Colu
mn
Addr
ess
Row
Addr
ess
Data
1Da
ta N
≈≈
I/Ox
Col A
dd1
Col A
dd2
Row A
dd1
Row A
dd2
Col A
dd1
Col A
dd2
Row A
dd1
Row A
dd2
Row A
dd3
Row A
dd3
70h/
7Bh
I/O1
~ I/O
2 : E
DC S
tatu
s (7
Bh o
nly)
NO
TES
: 1.
tAD
L is
the
time
from
the
WE
risin
g ed
ge o
f fin
al a
ddre
ss c
ycle
to th
e W
E ri
sing
edg
e of
firs
t dat
a cy
cle.
tAD
L
2. F
or E
DC
ope
ratio
n, o
nly
one
time
rand
om d
ata
inpu
t is
poss
ible
at t
he s
ame
addr
ess.
tWH
R
FLASH MEMORY
39
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Block Erase Operation
CE
CLE
R/B
WE
ALE
RE
60h
Erase CommandRead StatusCommand
I/O0=1 Error in Erase
D0h 70h I/O 0
Busy
tWB tBERS
I/O0=0 Successful Erase
Row Address
tWC
≈Auto Block EraseSetup Command
I/Ox Row Add1 Row Add2 Row Add3
tWHR
FLASH MEMORY
40
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
00h C
olum
n A
ddre
ss
tW
Row
Add
ress
A13
~A20
A21
~A28
A29
~A31
A8~
A12
A0~
A7
tWC
Col
umn
Add
ress
A8~
A12
A0~
A7
05h
Dou
t N
00h C
olum
n Ad
dres
s
tW
Row
Add
ress
A13
~A20
A21
~A28
A29
~A31
A8~
A12
A0~
A7
tWC
Col
umn
Add
ress
A8~
A12
A0~
A7
05h
E0h
Dou
t M
60h
tW
Row
Add
ress
A13
~A20
A21
~A28
A29
~A31
tWC
60h
tW
Row
Add
ress
A13
~A20
A21
~A28
A29
~A31
tWC
30h
1
1
CE
CLE
R/B
WE
ALE
RE I/O
x
CE
CLE
R/B
WE
ALE
RE I/O
x
Bus
y
tWB
tR
tREA
tWH
RtCLR
tWH
RtCLR
tRE
A
E0h
tRC
tRC
Dou
t N
+1
tRH
W
Dou
t M
+1
A13
~ A
18 :
Fixe
d ’L
ow’
A19
: F
ixed
’Low
’A
20 ~
A30
: Fi
xed
’Low
’
A13
~ A
18 :
Val
idA
19
:
Fix
ed ’H
igh’
A20
~ A
30 :
Val
id
A0 ~
A12
: F
ixed
’Low
’A1
3 ~
A18
: Fix
ed ’L
ow’
A 19
: F
ixed
’Low
’ A2
0 ~
A30:
Fix
ed ’L
ow’
A0
~ A1
2 :
Val
id
A0
~ A1
2 :
Fix
ed ’L
ow’
A13
~ A
18 :
Fixe
d ’L
ow’
A19
: F
ixed
’Hig
h’
A20
~ A
30 :
Fixe
d ’L
ow’
A0
~ A1
2 :
Val
id
A31
: V
alid
A31
: M
ust b
e sa
me
as p
revi
ous
A31
A31
: M
ust b
e sa
me
as p
revi
ous
A31
A31
: M
ust b
e sa
me
as p
revi
ous
A31
Two-
Plan
e Pa
ge R
ead
Ope
ratio
n w
ith T
wo-
Plan
e R
ando
m D
ata
Out
FLASH MEMORY
41
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Two-
Plan
e Pa
ge P
rogr
am O
pera
tion
80h
I/O0~
7
R/B
11h
Ex.)
Two-
Plan
e Pa
ge P
rogr
am
tDB
SY
Add
ress
& D
ata
Inpu
t 8
1h10
h A
ddre
ss &
Dat
a In
put
70h
tPR
OG
Col
Add
1,2
& R
ow A
dd 1
,2,3
4224
Byt
e D
ata
CE
CLE
R/B
WE
ALE
RE
80h
Din N
Din
11h
MSe
rial D
ata
Inp
ut C
omm
and
Colu
mn
Addr
ess
Prog
ram
tDBS
YtW
B
tWC
≈ ≈
≈
≈
Comm
and
(Dum
my)
Din N
10h
≈ ≈
≈
I/O
Prog
ram C
onfirm
Comm
and
(True
)
81h
70h
Page
Row
Add
ress
I/Ox
≈
1 up
to 4
224
Byt
e D
ata
Ser
ial I
nput
Din M
Read
Stat
us C
omma
nd
tDB
SY :
t
yp. 5
00ns
m
ax. 1µs
Col A
dd1
Col A
dd2Ro
w Add
1Ro
w Add2
Row A
dd3
Col A
dd1Co
l Add2
Row A
dd1Ro
w Add2
Row A
dd3
Col
Add
1,2
& R
ow A
dd 1
,2,3
4224
Byt
e D
ata
A 0 ~
A12
: Va
lidA1
3 ~
A18
: Fix
ed ’L
ow’
A19
: Fi
xed
’Low
’ A2
0 ~
A30
: Fix
ed ’L
ow’
A 0 ~
A11
: V
alid
A 13
~ A1
8 : V
alid
A19
: Fi
xed
’Hig
h’
A20
~ A3
0 : V
alid
Not
e: A
ny c
omm
and
betw
een
11h
and
81h
is p
rohi
bite
d ex
cept
70h
/F1h
/F2h
and
FFh
.
Not
e
tWH
R
A31
: V
alid
A31
: M
ust b
e sa
me
as p
revi
ous
A31
I/O 0
= 0
Suc
cess
ful E
rase
I/O 0
= 1
Err
or in
Era
se
tWB
tPR
OG
FLASH MEMORY
42
K9KAG08U0MK9WBG08U1M
K9NCG08U5MTw
o-Pl
ane
Blo
ck E
rase
Ope
ratio
n
Blo
ck E
rase
Set
up C
omm
and1
Era
se C
onfir
m C
omm
and
Rea
d S
tatu
sC
omm
and
60h
Row
Add
1,2,
3
I/O0~
7
R/B
60h
A9 ~
A25
D0h
tBE
RS
Ex.)
Add
ress
Res
tric
tion
for T
wo-
Plan
e B
lock
Era
se O
pera
tion
CE
CLE
R/B
I/OX
WE
ALE
RE
60h
Row
Add
1D
0h70
hI/O
0
Bus
y
tWB
tBE
RS
tWC
D0h
70h
Add
ress
Add
ress
Row
Add
1,2,
3
I/O 0
= 0
Suc
cess
ful E
rase
I/O 0
= 1
Err
or in
Era
se
Row
Add
2R
ow A
dd3
A13
~ A1
8: F
ixed
’Low
’A1
9
:
Fixe
d ’L
ow’
A20
~ A3
0 : F
ixed
’Low
’
A12
~ A
18 :
Fix
ed ’L
ow’
A19
: F
ixed
’Hig
h’A
20 ~
A30
: V
alid
60h
Row
Add
1D
0hR
ow A
dd2
Row
Add
3
Row
Add
ress
tWC
Blo
ck E
rase
Set
up C
omm
and2R
ow A
ddre
ss
tWH
R
A31
: V
alid
A31
: M
ust b
e sa
me
as p
revi
ous
A31
FLASH MEMORY
43
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Read ID Operation
CE
CLE
WE
ALE
RE
90h
Read ID Command Maker Code Device Code
00h ECh
tREA
Address 1cycle
I/Ox
tAR
Device Device Code (2nd Cycle) 3rd Cycle 4th Cycle 5th Cycle
K9KAG08U0M D5h 51h A6h 68h
K9WBG08U1M Same as K9KAG08U0M in itK9NCG08U5M
Device4th cyc.Code 3rd cyc. 5th cyc.
FLASH MEMORY
44
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
4th ID Data Description I/O7 I/O6 I/O5 I/ I/O3 I/O2 I/O1 I/O0
Page Size (w/o redundant area )
1KB 2KB 4KB 8KB
0 00 11 01 1
Block Size (w/o redundant area )
64KB128KB256KB512KB
0 0 0 1 1 0 1 1
Redundant Area Size ( byte/512byte)
8 16
01
Organization x8 x16
01
Serial Access Minimum
50ns/30ns25nsReservedReserved
0101
0011
ID Definition Table90 ID : Access command = 90H
Description
1st Byte2nd Byte3rd Byte4th Byte5th Byte
Maker CodeDevice CodeInternal Chip Number, Cell Type, Number of Simultaneously Programmed Pages, EtcPage Size, Block Size,Redundant Area Size, Organization, Serial Access MinimumPlane Number, Plane Size
3rd ID Data Description I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0
Internal Chip Number
1 2 4 8
0 0 0 1 1 0 1 1
Cell Type
2 Level Cell 4 Level Cell 8 Level Cell 16 Level Cell
0 0 0 1 1 0 1 1
Number of Simultaneously Programmed Pages
1 2 4 8
0 0 0 1 1 0 1 1
Interleave ProgramBetween multiple chips
Not Support Support
0 1
Cache Program Not Support Support
0 1
FLASH MEMORY
45
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
5th ID Data Description I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0
Plane Number
1 2 4 8
0 0 0 1 1 0 1 1
Plane Size (w/o redundant Area)
64Mb128Mb256Mb512Mb1Gb2Gb4Gb8Gb
0 0 0 0 0 1 0 1 0 0 1 1 1 0 0 1 0 1 1 1 0 1 1 1
Reserved 0 0 0
FLASH MEMORY
46
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Device OperationPAGE READPage read is initiated by writing 00h-30h to the command register along with five address cycles. After initial power up, 00h commandis latched. Therefore only five address cycles and 30h command initiates that operation after initial power up. The 4,224 bytes of datawithin the selected page are transferred to the data registers in less than 20µs(tR). The system controller can detect the completion ofthis data transfer(tR) by analyzing the output of R/B pin. Once the data in a page is loaded into the data registers, they may be readout in 25ns(K9NC08U5M:50ns) cycle time by sequentially pulsing RE. The repetitive high to low transitions of the RE clock make thedevice output the data starting from the selected column address up to the last column address. The device may output random data in a page instead of the consecutive sequential data by writing random data output command.The column address of next data, which is going to be out, may be changed to the address which follows random data output com-mand. Random data output can be operated multiple times regardless of how many times it is done in a page.
Figure 6. Read Operation
Address(5Cycle)00h
Col. Add.1,2 & Row Add.1,2,3
Data Output(Serial Access)
Data Field Spare Field
CE
CLE
ALE
R/B
WE
RE
tR
30hI/Ox
≈≈
≈≈
≈≈
FLASH MEMORY
47
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Figure 7. Random Data Output In a Page
Address00h Data Output
R/B
RE
tR
30h/35h Address05h E0h5Cycles 2Cycles Data Output
Data Field Spare Field Data Field Spare Field
I/Ox
Col. Add.1,2 & Row Add.1,2,3
PAGE PROGRAMThe device is programmed basically on a page basis, but it does allow multiple partial page programming of a word or consecutivebytes up to 4,224, in a single page program cycle. The number of consecutive partial page programming operation within the samepage without an intervening erase operation must not exceed 4 times for a single page. The addressing should be done in sequentialorder in a block. A page program cycle consists of a serial data loading period in which up to 4,224bytes of data may be loaded intothe data register, followed by a non-volatile programming period where the loaded data is programmed into the appropriate cell. The serial data loading period begins by inputting the Serial Data Input command(80h), followed by the five cycle address inputs andthen serial data loading. The data other than those to be programmed do not need to be loaded. The device supports random datainput in a page. The column address for the next data, which will be entered, may be changed to the address which follows randomdata input command(85h). Random data input may be operated multiple times regardless of how many times it is done in a page.Modifying the data of a sector by Random Data Input before Copy-Back Program must be performed for the whole sectorand is allowed only once per each sector. Any partial modification smaller than a sector corrupts the on-chip EDC codes.The Page Program confirm command(10h) initiates the programming process. Writing 10h alone without previously entering theserial data will not initiate the programming process. The internal write state controller automatically executes the algorithms and tim-ings necessary for program and verify, thereby freeing the system controller for other tasks. Once the program process starts, theRead Status Register command may be entered to read the status register. The system controller can detect the completion of a pro-gram cycle by monitoring the R/B output, or the Status bit(I/O 6) of the Status Register. Only the Read Status commands and Resetcommand are valid while programming is in progress. When the Page Program is complete, the Write Status Bit(I/O 0) may bechecked(Figure 8). The internal write verify detects only errors for "1"s that are not successfully programmed to "0"s. The commandregister remains in Read Status command mode until another valid command is written to the command register.
Figure 8. Program & Read Status Operation
80h
R/B
Address & Data Input I/O0 Pass
Data
10h 70h
Fail
tPROG
I/OxCol. Add.1,2 & Row Add.1,2,3
"0"
"1"
Col. Add.1,2
FLASH MEMORY
48
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Figure 9. Random Data Input In a Page
80h
R/B
Address & Data Input I/O0 Pass10h 70h
Fail
tPROG
85h Address & Data InputI/OxCol. Add.1,2 & Row Add1,2,3 Col. Add.1,2
Data Data
"0"
"1"
COPY-BACK PROGRAMThe Copy-Back program is configured to quickly and efficiently rewrite data stored in one page without utilizing an external memory.Since the time-consuming cycles of serial access and re-loading cycles are removed, the system performance is improved. The ben-efit is especially obvious when a portion of a block is updated and the rest of the block also need to be copied to the newly assignedfree block. The operation for performing a copy-back program is a sequential execution of page-read without serial access and copy-ing-program with the address of destination page. A read operation with "35h" command and the address of the source page movesthe whole 4,224-byte data into the internal data buffer. As soon as the device returns to Ready state, Page-Copy Data-input com-mand (85h) with the address cycles of destination page followed may be written. The Program Confirm command (10h) is required toactually begin the programming operation. During tPROG, the device executes EDC of itself. Once the program process starts, theRead Status Register command (70h) or Read EDC Status command (7Bh) may be entered to read the status register. The systemcontroller can detect the completion of a program cycle by monitoring the R/B output, or the Status bit(I/O 6) of the Status Register.When the Copy-Back Program is complete, the Write Status Bit(I/O 0) and EDC Status Bits (I/O 1 ~ I/O 2) may be checked(Figure 10& Figure 11& Figure 12& Figure 13& Figure 14). The internal write verification detects only errors for "1"s that are not successfullyprogrammed to "0"s and the internal EDC checks whether there is only 1-bit error for each 528-byte sector of the source page. Morethan 2-bit error detection is not available for each 528-byte sector. The command register remains in Read Status command mode orRead EDC Status command mode until another valid command is written to the command register.During copy-back program, data modification is possible using random data input command (85h) as shown in Figure11. But EDCstatus bits are not available during copy back for some bits or bytes modified by Random Data Input operation. However, in case of the 528 byte sector unit modification, EDC status bits are available.
Figure 10. Page Copy-Back Program Operation
00h
R/B
Add.(5Cycles) I/O0 Pass85h 70h/7Bh
Fail
tPROG
Add.(5Cycles)
tR
Source Address Destination Address
35h 10hI/OxCol. Add.1,2 & Row Add.1,2,3Col. Add.1,2 & Row Add.1,2,3
Figure 11. Page Copy-Back Program Operation with Random Data Input
00h
R/B
Add.(5Cycles) 85h 70h
tPROG
Add.(5Cycles)
tR
Source Address Destination Address
Data35h 10h85h DataAdd.(2Cycles)
There is no limitation for the number of repetition.
I/OxCol. Add.1,2 & Row Add.1,2,3 Col. Add.1,2 & Row Add.1,2,3 Col. Add.1,2
Note: 1. For EDC operation, only one time random data input is possible at the same address.
Note: Copy-Back Program operation is allowed only within the same memory plane.
"0"
"1"
FLASH MEMORY
49
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Figure 12. Page Copy-Back Program Operation with EDC & Read EDC Status
00h
R/B
Add.(5Cycles) 85h 7Bh
tPROG
Add.(5Cycles)
tR
Source Address Destination Address
35h 10hI/OxCol. Add.1,2 & Row Add.1,2,3Col. Add.1,2 & Row Add.1,2,3
EDC Status Output
Figure 14. Block Erase Operation
BLOCK ERASEThe Erase operation is done on a block basis. Block address loading is accomplished in three cycles initiated by an Erase Setupcommand(60h). Only address A19 to A31 is valid while A13 to A18 is ignored. The Erase Confirm command(D0h) following the blockaddress loading initiates the internal erasing process. This two-step sequence of setup followed by execution command ensures thatmemory contents are not accidentally erased due to external noise conditions.At the rising edge of WE after the erase confirm command input, the internal write controller handles erase and erase-verify. Whenthe erase operation is completed, the Write Status Bit(I/O 0) may be checked. Figure 14 details the sequence.
60h
Row Add 1,2,3
R/B
Address Input(3Cycle) I/O0 PassD0h 70h
Fail
tBERS
I/Ox"0"
"1"
EDC OPERATIONNote that for the user who use Copy-Back with EDC mode, only one time random data input is possible at the same address duringCopy-Back program or page program mode. For the user who use Copy-Back without EDC, there is no limitation for the random datainput at the same address.
Figure 13. Two-Plane Page Copy-Back Program Operation with EDC & Read EDC Status
R/B
85h 7Bh
tPROG
Add.(5Cycles)
Destination Address
11hI/OxCol. Add.1,2 & Row Add.1,2,3
EDC Status Output
60h
R/B
Add.(3Cycles)
tR
Source Address
I/Ox Row Add.1,2,3
35h60h Add.(3Cycles)
Source Address Row Add.1,2,3
81h Add.(5Cycles)
Destination Address
10h
Col. Add.1,2 & Row Add.1,2,3
tDBSY
FLASH MEMORY
50
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
TWO-PLANE PAGE READTwo-Plane Page Read is an extension of Page Read, for a single plane with 4,224 byte page registers. Since the device is equippedwith two memory planes, activating the two sets of 4,224 byte page registers enables a random read of two pages. Two-Plane PageRead is initiated by repeating command 60h followed by three address cycles twice. In this case only same page of same block canbe selected from each plane. After Read Confirm command(30h) the 8,448 bytes of data within the selected two page are transferred to the data registers in lessthan 25us(tR). The system controller can detect the completion of data transfer(tR) by monitoring the output of R/B pin.Once the data is loaded into the data registers, the data output of first plane can be read out by issuing command 00h with FiveAddress Cycles, command 05h with two column address and finally E0h. The data output of second plane can be read out using theidentical command sequences. The restrictions for Two-Plane Page Program are shown in Figure 15. Two-Plane Read must beused in the block which has been programmed with Two-Plane Page Program.
Figure 15. Two-Plane Page Read Operation with Two-Plane Random Data Out
60hI/OX
R/B
60h 30h
tR
Address (3 Cycle) Address (3 Cycle)
A13 ~ A18 : Fixed ’Low’A19 : Fixed ’Low’A20 ~ A30: Fixed ’Low’
A13 ~ A18 : ValidA19 : Fixed ’High’A20 ~ A30 : Valid
1
R/B
Data OutputI/Ox 00h 05h Address (5 Cycle) E0h Address (2 Cycle)
1
Row Add.1,2,3 Row Add.1,2,3
Col. Add. 1,2 & Row Add.1,2,3 Col. Add.1,2A0 ~ A12 : Fixed ’Low’A13 ~ A18 : Fixed ’Low’A19 : Fixed ’Low’A20 ~ A30 : Fixed ’Low’
A0 ~ A12 : Valid
2
R/B
Data OutputI/Ox 00h 05h Address (5 Cycle) E0h Address (2 Cycle)
2Col. Add. 1,2 & Row Add.1,2,3 Col. Add.1,2
A0 ~ A12 : Fixed ’Low’A13 ~ A18 : Fixed ’Low’A19 : Fixed ’High’ A20 ~ A30 : Fixed ’Low’
A0 ~ A12 : Valid
TWO-PLANE PAGE PROGRAMTwo-Plane Page Program is an extension of Page Program, for a single plane with 4,224 byte page registers. Since the device isequipped with two memory planes, activating the two sets of 4,224 byte page registers enables a simultaneous programming of twopages. After writing the first set of data up to 4,224 byte into the selected page register, Dummy Page Program command (11h) instead ofactual Page Program command (10h) is inputted to finish data-loading of the first plane. Since no programming process is involved,R/B remains in Busy state for a short period of time(tDBSY). Read Status command (70h) may be issued to find out when the devicereturns to Ready state by polling the Ready/Busy status bit(I/O 6). Then the next set of data for the other plane is inputted after the81h command and address sequences. After inputting data for the last plane, actual True Page Program(10h) instead of dummyPage Program command (11h) must be followed to start the programming process. The operation of R/B and Read Status is thesame as that of Page Program. Althougth two planes are programmed simultaneously, pass/fail is not available for each page whenthe program operation completes. Status bit of I/O 0 is set to "1" when any of the pages fails. Restriction in addressing with Two-Plane Page Program is shown is Figure16.
A31 : Must be same as previous A31 A31 : Valid
A31 : Must be same as previous A31
A31 : Must be same as previous A31
FLASH MEMORY
51
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Figure 16. Two-Plane Page Program
80h 11hDataInput
Plane 0(2048 Block)
Block 0Block 2
Block 4094Block 4092
NOTE :1. It is noticeable that same physically row address is applied to the two blocks
81h 10h
Plane 1(2048 Block)
Block 1Block 3
Block 4095Block 4093
A0 ~ A12 : ValidA13 ~ A18 : Fixed ’Low’A19 : Fixed ’Low’A20 ~ A30 : Fixed ’Low’A31 : Valid
A0 ~ A12 : ValidA13 ~ A18 : ValidA19 : Fixed ’High’A20 ~ A30: ValidA31 : Must be same as previous A31
2. Any command between 11h and 81h is prohibited except 70h/F1h/F2h and FFh.
Note*2
NOTE : It is an example for two-plane page program into plane 0~1(In this case, A30 is low), and the method for two-plane page program into plane 2 ~3 is same. two-plane page program into plane 0&2(or plane 0&3, or plane 1&2, or plane 1&3) is prohibited.
80hI/O0 ~ 7
R/B
Address & Data Input 11h 81h 10h
tDBSY tPROG
Address & Data Input Pass70h I/O0
Fail
"0"
"1"
FLASH MEMORY
52
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Figure 17. Two-Plane Copy-Back Program Operation
TWO-PLANE COPY-BACK PROGRAMTwo-Plane Copy-Back Program is an extension of Copy-Back Program, for a single plane with 4,224 byte page registers. Since thedevice is equipped with two memory planes, activating the two sets of 4,224 byte page registers enables a simultaneous program-ming of two pages.
R/B
85h 70h
tPROG
Add.(5Cycles)
Destination Address
10hI/Ox
Col. Add.1,2 & Row Add.1,2,3
81h Add.(5Cycles)
Destination AddressCol. Add.1,2 & Row Add.1,2,3
11h
tDBSY
A0 ~ A12 : Fixed ’Low’A13 ~ A18 : Fixed ’Low’A19 : Fixed ’Low’A20 ~ A30 : Fixed ’Low’A31 : Must be same as previous A31
A0 ~ A12 : Fixed ’Low’A13 ~ A18 : ValidA19 : Fixed ’High’A20 ~ A30 : ValidA31 : Must be same as previous A31
1Note2
60hI/OX
R/B
60h 35h
tR
Address (3 Cycle) Address (3 Cycle)
A13 ~ A18 : Fixed ’Low’A19 : Fixed ’Low’A20 ~ A30: Fixed ’Low’
A13 ~ A18 : Fixed ’Low’A19 : Fixed ’High’A20 ~ A30 : valid
1
Row Add.1,2,3 Row Add.1,2,3
A31 : Valid A31 : Must be same as previous A31
Note: 1. Copy-Back Program operation is allowed only within the same memory plane. 2. Any command between 11h and 81h is prohibited except 70h/F1h and FFh.
FLASH MEMORY
53
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Figure 18. Two-Plane Copy-Back Program Operation with Random Data Input
R/B
85h 11h
tDBSY
Add.(5Cycles) Data 85h DataI/OxCol. Add.1,2 & Row Add.1,2,3 Col. Add.1,2
Add.(2Cycles)
R/B
81h 10h
tPROG
Add.(5Cycles) Data 85h DataI/OxCol. Add.1,2 & Row Add.1,2,3 Col. Add.1,2
Add.(2Cycles)
1 2
2
Destination Address
Destination Address
Note: 1. Copy-Back Program operation is allowed only within the same memory plane. 2. On the same plane, It’s prohibited to operate copy-back program from an odd address page(source page) to an even address page(target page) or from an even address page(source page) to an odd address page(target page). Therefore, the copy-back program is permitted just between odd address pages or even address pages. 3. Any command between 11h and 81h is prohibited except 70h/F1h and FFh.
Note3
A0 ~ A12 : ValidA13 ~ A18 : Fixed ’Low’A19 : Fixed ’Low’A20 ~ A30 : Fixed ’Low’A31 : Must be same as previous A31
A0 ~ A12 : ValidA13 ~ A18 : ValidA19 : Fixed ’High’A20 ~ A30 : ValidA31 : Must be same as previous A31
60hI/OX
R/B
60h 35h
tR
Address (3 Cycle) Address (3 Cycle)
A13 ~ A18 : Fixed ’Low’A19 :Fixed ’Low’A20 ~ A30 : Fixed ’Low’
A13 ~ A18 : Fixed ’Low’A19 : Fixed ’High’A20 ~ A30 : valid
1
Row Add.1,2,3 Row Add.1,2,3
A31 : Valid A31 : Must be same as previous A31
FLASH MEMORY
54
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Figure 19. Two-Plane Block Erase Operation
60hI/OX
R/B
60h D0h I/O0 Pass
Fail
tBERS
Address (3 Cycle) Address (3 Cycle) 70h"0"
"1"A13 ~ A18 : Fixed ’Low’A19 :Fixed ’Low’A20 ~ A30 : Fixed ’Low’
A13 ~ A18 : Fixed ’Low’A19 : Fixed ’High’A20 ~ A30 : valid
TWO-PLANE BLOCK ERASEBasic concept of Two-Plane Block Erase operation is identical to that of Two-Plane Page Program. Up to two blocks, one from eachplane can be simultaneously erased. Standard Block Erase command sequences (Block Erase Setup command(60h) followed bythree address cycles) may be repeated up to twice for erasing up to two blocks. Only one block should be selected from each plane.The Erase Confirm command(D0h) initiates the actual erasing process. The completion is detected by monitoring R/B pin or Ready/Busy status bit (I/O 6).Two-plane erase operations can be executed by dividing the memory array into plane 0~1 or plane 2~3 separately. For example, two-plane erase operation into plane 0 and plane 2 is prohibited. That is to say, two-plane erase operation into plane 0and plane 1 or into plane 2 and plane 3 is allowed.
A31 : Valid A31 : Must be same as previous A31
NOTE : Two-plane block erase into plane 0&2(or plane 0&3, or plane 1&2, or plane 1&3) is prohibited.
FLASH MEMORY
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K9KAG08U0MK9WBG08U1M
K9NCG08U5M
READ STATUS
Table 3. Status Register Definition for 70h Command
NOTE : 1. I/Os defined ’Not use’ are recommended to be masked out when Read Status is being executed.
I/O Page Program Block Erase Read Definition
I/O 0 Pass/Fail Pass/Fail Not use Pass : "0" Fail : "1"
I/O 1 Not use Not use Not use Don’t -cared
I/O 2 Not use Not use Not use Don’t -cared
I/O 3 Not Use Not Use Not Use Don’t -cared
I/O 4 Not Use Not Use Not Use Don’t -cared
I/O 5 Not Use Not Use Not Use Don’t -cared
I/O 6 Ready/Busy Ready/Busy Ready/Busy Busy : "0" Ready : "1"
I/O 7 Write Protect Write Protect Write Protect Protected : "0" Not Protected : "1"
The device contains a Status Register which may be read to find out whether program or erase operation is completed, and whetherthe program or erase operation is completed successfully. After writing 70h or F1h/F2h command to the command register, a readcycle outputs the content of the Status Register to the I/O pins on the falling edge of CE or RE, whichever occurs last. This two linecontrol allows the system to poll the progress of each device in multiple memory connections even when R/B pins are common-wired.RE or CE does not need to be toggled for updated status. Refer to Table 3 for specific 70h Status Register definitions and table 4 forspecific F1h/F2h Status Register definitions. The command register remains in Status Read mode until further commands are issuedto it. Therefore, if the status register is read during a random read cycle, the read command(00h) should be given before starting readcycles.
Table 4. F1h/F2h Read Status Register Definition
NOTE : 1. I/Os defined ’Not use’ are recommended to be masked out when Read Status is being executed.
I/O No. Page Program Block Erase Read Definition
I/O 0 Chip Pass/Fail Chip Pass/Fail Not use Pass : "0" Fail : "1"
I/O 1 Plane0 Pass/Fail Plane0 Pass/Fail Not use Pass : "0" Fail : "1"
I/O 2 Plane1 Pass/Fail Plane1 Pass/Fail Not use Pass : "0" Fail : "1"
I/O 3 Not Use Not Use Not Use Don’t -cared
I/O 4 Not Use Not Use Not Use Don’t -cared
I/O 5 Not Use Not Use Not Use Don’t -cared
I/O 6 Ready/Busy Ready/Busy Ready/Busy Busy : "0" Ready : "1"
I/O 7 Write Protect Write Protect Write Protect Protected : "0" Not Protected : "1"
FLASH MEMORY
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K9KAG08U0MK9WBG08U1M
K9NCG08U5M
READ EDC STATUSRead EDC status operation is only available on ’Copy Back Program’. The device contains an EDC Status Register which may beread to find out whether there is error during ’Read for Copy Back’. After writing K9KAG08U0M command to the command register,a read cycle outputs the content of the EDC Status Register to the I/O pins on the falling edge of CE or RE, whichever occurs last.This two line control allows the system to poll the progress of each device in multiple memory connections even when R/B pins arecommon-wired. RE or CE does not need to be toggled for updated status. Refer to Table 5 for specific Status Register definitions.The command register remains in EDC Status Read mode until further commands are issued to it.
Table 5. Status Register Definition for 7Bh Command
NOTE : 1. I/Os defined ’Not use’ are recommended to be masked out when Read Status is being executed. 2. More than 2-bit error detection isn’t available for each 528 Byte sector. That is to say, only 1-bit error detection is avaliable for each 528 Byte sector.
I/O Copy Back Program Page Program Block Erase Read Definition
I/O 0 Pass/Fail of Copy Back Program Pass/Fail Pass/Fail Not use Pass : "0", Fail : "1"
I/O 1 EDC Status Not use Not use Not use No Error : "0", Error : "1"
I/O 2 Validity of EDC Status Not use Not use Not use Valid : "1", Invalid : "0"
I/O 3 Not Use Not Use Not Use Not Use Don’t -cared
I/O 4 Not Use Not Use Not Use Not Use Don’t -cared
I/O 5 Not Use Not Use Not Use Not Use Don’t -cared
I/O 6 Ready/Busy of Copy Back Program Ready/Busy Ready/Busy Ready/Busy Busy : "0", Ready : "1"
I/O 7 Write Protect of Copy Back Program Write Protect Write Protect Write Protect Protected : "0", Not Protected :"1"
FLASH MEMORY
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K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Figure 20. Read ID Operation
CE
CLE
I/OX
ALE
RE
WE
90h 00h
Address. 1cycle Maker code Device code
tCEA
tAR
tREA
READ IDThe device contains a product identification mode, initiated by writing 90h to the command register, followed by an address input of00h. Five read cycles sequentially output the manufacturer code(ECh), and the device code and 3rd, 4th, 5th cycle ID respectively.The command register remains in Read ID mode until further commands are issued to it. Figure 20 shows the operation sequence.
tWHR
tCLR
Device4th Cyc.CodeECh 3rd Cyc. 5th Cyc.
Device Device Code (2nd Cycle) 3rd Cycle 4th Cycle 5th Cycle
K9KAG08U0M D5h 51h A6h 68h
K9WBG08U1M Same as K9KAG08U0M in itK9NCG08U5M
FLASH MEMORY
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K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Figure 21. RESET Operation
RESETThe device offers a reset feature, executed by writing FFh to the command register. When the device is in Busy state during randomread, program or erase mode, the reset operation will abort these operations. The contents of memory cells being altered are nolonger valid, as the data will be partially programmed or erased. The command register is cleared to wait for the next command, andthe Status Register is cleared to value C0h when WP is high. If the device is already in reset state a new reset command will beaccepted by the command register. The R/B pin changes to low for tRST after the Reset command is written. Refer to Figure 21below.
FFhI/OX
R/BtRST
Table 5. Device StatusAfter Power-up After Reset
Operation mode 00h Command is latched Waiting for next command
FLASH MEMORY
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K9KAG08U0MK9WBG08U1M
K9NCG08U5M
READY/BUSYThe device has a R/B output that provides a hardware method of indicating the completion of a page program, erase and randomread completion. The R/B pin is normally high but transitions to low after program or erase command is written to the command regis-ter or random read is started after address loading. It returns to high when the internal controller has finished the operation. The pin isan open-drain driver thereby allowing two or more R/B outputs to be Or-tied. Because pull-up resistor value is related to tr(R/B) andcurrent drain during busy(ibusy) , an appropriate value can be obtained with the following reference chart(Fig.22). Its value can bedetermined by the following guidance.
VCC
R/Bopen drain output
Device
GND
Rp ibusy
CL
Busy
Ready Vcc
VOH
tf tr
VOL
3.3V device - VOL : 0.4V, VOH : 2.4V
Figure 22. Rp vs tr ,tf & Rp vs ibusy
tr,tf
[s]
Ibus
y [A
]
Rp(ohm)
Ibusy
tr
@ Vcc = 3.3V, Ta = 25°C , CL = 50pF
1K 2K 3K 4K
100n
200n 2m
1m
50
tf
100
150
200
3.6 3.6 3.6 3.6
2.4
1.2
0.8
0.6
where IL is the sum of the input currents of all devices tied to the R/B pin.
Rp value guidance
Rp(max) is determined by maximum permissible limit of tr
Rp(min, 3.3V part) =VCC(Max.) - VOL(Max.)
IOL + ΣIL =
3.2V
8mA + ΣIL
FLASH MEMORY
60
K9KAG08U0MK9WBG08U1M
K9NCG08U5M
DATA PROTECTION & POWER UP SEQUENCEThe device is designed to offer protection from any involuntary program/erase during power-transitions. An internal voltage detectordisables all functions whenever Vcc is below about 2V(3.3V device). WP pin provides hardware protection and is recommended tobe kept at VIL during power-up and power-down. A recovery time of minimum 100µs is required before internal circuit gets ready forany command sequences as shown in Figure 23. The two step command sequence for program/erase provides additional softwareprotection.
Figure 23. AC Waveforms for Power Transition
VCC
WP
High
≈≈
WE
3.3V device : ~ 2.5V 3.3V device : ~ 2.5V
100µs
≈≈
FLASH MEMORY
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K9KAG08U0MK9WBG08U1M
K9NCG08U5M
K9F8G08X0M is designed also to support the read for copy-back with data output to check a bit error for the controller which can’tuse the read EDC status operation. The command sequences are as follows.
Figure A-1. (Using Data Output) Page Copy-Back Program Operation
READ FOR COPY-BACK WITH DATA OUTPUT TIMING GUIDE
Figure A-1. (Using Data Output) Page Copy-Back Program Operation
Note: 1. Copy-Back Program operation is allowed only within the same memory plane.
"0"
"1"
00h
R/B
Add.(5Cycles) I/O0 Pass
Fail
tPROGtR
Source Address Destination Address
I/OxCol. Add.1,2 & Row Add.1,2,3Col. Add.1,2 & Row Add.1,2,3
35h Data Output 85h Add.(5Cycles) 10h 70h≈
≈
Figure A-2. (Using Data Output) Page Copy-Back Program Operation with Random Data Input
R/B
Source Address Destination Address There is no limitation for the number of repetition.
I/OxCol. Add.1,2 & Row Add.1,2,3 Col. Add.1,2 & Row Add.1,2,3 Col. Add.1,2
00h Add.(5Cycles) 35h
tR
Data Output 85h Add.(5Cycles) Data
≈≈
85h Add.(2Cycles) Data 10h
tPROG
70h
FLASH MEMORY
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K9KAG08U0MK9WBG08U1M
K9NCG08U5M
R/B
85h 70h
tPROG
Add.(5Cycles)
Destination Address
10hI/Ox
Col. Add.1,2 & Row Add.1,2,3
81h Add.(5Cycles)
Destination AddressCol. Add.1,2 & Row Add.1,2,3
11h
tDBSY
A0 ~ A12 : Fixed ’Low’A13 ~ A18 : Fixed ’Low’A19 : Fixed ’Low’A20 ~ A30 : Fixed ’Low’A31 : Must be same as previous A31
A0 ~ A12 : Fixed ’Low’A13 ~ A18 : ValidA19 : Fixed ’High’A20 ~ A30 : ValidA31 : Must be same as previous A31
3Note3
60hI/OX
R/B
60h 35h
tR
Address (3 Cycle) Address (3 Cycle)
A13 ~ A18 : Fixed ’Low’A19 : Fixed ’Low’A20 ~ A30: Fixed ’Low’
A13 ~ A18 : Fixed ’Low’A19 : Fixed ’High’A20 ~ A30 : valid
1
R/B
Data OutputI/Ox 00h 05h Address (5 Cycle) E0h Address (2 Cycle)
1
Row Add.1,2,3 Row Add.1,2,3
Col. Add. 1,2 & Row Add.1,2,3 Col. Add.1,2A0 ~ A12 : Fixed ’Low’A13 ~ A18 : Fixed ’Low’A19 : Fixed ’Low’A20 ~ A30: Fixed ’Low’
A0 ~ A12 : Valid
2
R/B
Data OutputI/Ox 00h 05h Address (5 Cycle) E0h Address (2 Cycle)
2Col. Add. 1,2 & Row Add.1,2,3 Col. Add.1,2
A0 ~ A12 : Fixed ’Low’A13 ~ A18 : Fixed ’Low’A19 : Fixed ’High’ A20 ~ A30 : Fixed ’Low’
A0 ~ A12 : Valid
3
A31 : Valid A31 : Must be same as previous A31
A31 : Must be same as previous A31
A31 : Must be same as previous A31
Figure A-3. (Using Data Output) Two-Plane Copy-Back Program Operation
Data Field Spare Field
(1) (3)
Plane0
Source page
Target page (1) : Two-Plane Read for Copy Back
(2) : Two-Plane Random Data Out
(3) : Two-Plane Copy-Back Program
Note: 1. Copy-Back Program operation is allowed only within the same memory plane. 2. Any command between 11h and 81h is prohibited except 70h/F1h and FFh.
(2)Data Field Spare Field
(1) (3)
Plane1
Source page
Target page
(2)
FLASH MEMORY
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K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Figure A-4. (Using Data Output) Two-Plane Copy-Back Program Operation with Random Data Input
R/B
85h 11h
tDBSY
Add.(5Cycles) Data 85h DataI/OxCol. Add.1,2 & Row Add.1,2,3 Col. Add.1,2
Add.(2Cycles)
R/B
81h 10h
tPROG
Add.(5Cycles) Data 85h DataI/OxCol. Add.1,2 & Row Add.1,2,3 Col. Add.1,2
Add.(2Cycles)
3 4
4
Destination Address
Destination Address
Note: 1. Copy-Back Program operation is allowed only within the same memory plane. 2. On the same plane, It’s prohibited to operate copy-back program from an odd address page(source page) to an even address page(target page) or from an even address page(source page) to an odd address page(target page). Therefore, the copy-back program is permitted just between odd address pages or even address pages. 3. Any command between 11h and 81h is prohibited except 70h/F1h and FFh.
Note3
A0 ~ A12 : ValidA13 ~ A18 : Fixed ’Low’A19 : Fixed ’Low’A20 ~ A30 : Fixed ’Low’A31 : Must be same as previous A31
A0 ~ A12 : ValidA13 ~ A18 : ValidA19 : Fixed ’High’A20 ~ A30 : ValidA31 : Must be same as previous A31
60hI/OX
R/B
60h 35h
tR
Address (3 Cycle) Address (3 Cycle)
A13 ~ A18 : Fixed ’Low’A19 :Fixed ’Low’A20 ~ A30 : Fixed ’Low’
A13 ~ A18 : Fixed ’Low’A19 : Fixed ’High’A20 ~ A30 : valid
1
R/B
Data OutputI/Ox 00h 05h Address (5 Cycle) E0h Address (2 Cycle)
1
Row Add.1,2,3 Row Add.1,2,3
Col. Add. 1,2 & Row Add.1,2,3 Col. Add.1,2A0 ~ A12 : Fixed ’Low’A13 ~ A18 : Fixed ’Low’A19 : Fixed ’Low’A20 ~ A30: Fixed ’Low’
A0 ~ A12 : Valid
2
R/B
Data OutputI/Ox 00h 05h Address (5 Cycle) E0h Address (2 Cycle)
2Col. Add. 1,2 & Row Add.1,2,3 Col. Add.1,2
A0 ~ A12 : Fixed ’Low’A13 ~ A18 : Fixed ’Low’A19 : Fixed ’High’ A20 ~ A30 : Fixed ’Low’
A0 ~ A12 : Valid
3
A31 : Valid A31 : Must be same as previous A31
A31 : Must be same as previous A31
A31 : Must be same as previous A31
FLASH MEMORY
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K9KAG08U0MK9WBG08U1M
K9NCG08U5M
80hI/O0~7
R/B
11h
tDBSY
Address & Data Input Address & Data Input
tPROG
A0 ~ A12 : ValidA13 ~ A18 : Fixed ’Low’
Note: Any command between 11h and 80h is prohibited except 70h/F1h and FFh.
NoteCol Add1,2 & Row Add 1,2,32112 Byte Data
Col Add1,2 & Row Add 1,2,32112 Byte Data
A20 ~ A30 : Fixed ’Low’A19 : Valid
A0 ~ A12 : ValidA13 ~ A18 : Vaild A20 ~ A30 : ValidA19 : Must be same with the previous
80h 10h 70h
R/B
85h 10h
tPROG
Add.(5Cycles) Data 85h DataI/OxCol. Add.1,2 & Row Add.1,2,3
Add.(5Cycles)
00h
R/B
Add.(5Cycles)
tR
Source Address
35hI/OxCol. Add.1,2 & Row Add.1,2,3
1
Col. Add.1,2 & Row Add.1,2,31Destination Address Destination Address
A0 ~ A12 : ValidA13 ~ A18 : Fixed ’Low’A19 : ValidA20 ~ A30 : Fixed ’Low’A31 : Valid
A0 ~ A12 : ValidA13 ~ A18 : ValidA19 : Must be same with the previousA20 ~ A30 : ValidA31 : Must be same as previous A31
11h
Note: 1. Copy-Back Program operation is allowed only within the same memory plane. 2. Any command between 11h and 85h is prohibited except 70h/F1h/F2 and FFh.
K9KAG08U0M is designed also to support the program operation with 2KByte data to offer the backward compatibility to the control-ler which uses the NAND with 2KByte page. The command sequences are as follows.
Figure A-1. (2KB X 2) Program Operation
Figure A-2. (2KB X 2) Copy-Back Program Operation
2KB PROGRAM OPERATION TIMING GUIDE
A31 : Valid A31 : Must be same as previous A31
tDBSY
Data Output
≈
FLASH MEMORY
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K9KAG08U0MK9WBG08U1M
K9NCG08U5M
R/B
85h 11h
tDBSY
Add.(5Cycles) Data 85h DataI/OxCol. Add.1,2 & Row Add.1,2,3 Col. Add.1,2
Add.(2Cycles)
00h
R/B
Add.(5Cycles)
tR
Source Address
35hI/OxCol. Add.1,2 & Row Add.1,2,3
1
R/B
85h 10h
tPROG
Add.(5Cycles) Data 85h DataI/OxCol. Add.1,2 & Row Add.1,2,3 Col. Add.1,2
Add.(2Cycles)
1 2
2
Destination Address
Destination Address
Note: 1. Copy-Back Program operation is allowed only within the same memory plane. 2. Any command between 11h and 85h is prohibited except 70h/F1h/F2 and FFh.
Note2
A0 ~ A12 : ValidA13 ~ A18 : Fixed ’Low’A19 : ValidA20 ~ A30 : Fixed ’Low’A31 : Valid
A0 ~ A12 : ValidA13 ~ A18 : ValidA19 : Must be same with the previousA20 ~ A30 : ValidA31 : Must be same as previous A31
Figure A-3. (2KB X 2) Copy-Back Program Operation with Random Data Input
Data Output
≈≈
FLASH MEMORY
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K9KAG08U0MK9WBG08U1M
K9NCG08U5M
Data Field Spare Field
(1) (6)
Plane0
Source page
Target page
(1) : Two-Plane Read for Copy Back
(2) : Random Data Out On Plane 0 (Up to 4224Byte)
(3) : Random Data In On Plane 0 (Up to 4224Byte)
(4) : Random Data Out On Plane 1 (Up to 4224Byte)
(5) : Random Data In On Plane 1 (Up to 4224Byte)
(6): Two-Plane Program for Copy Back
(2)
(1) (6)
Plane1
Source page
Target page
(4)
4KByte 4KByte
(3) (5)Data Field Spare Field
Col. Add.1,2
60hI/OX
R/B
tPROG
A13 ~ A18 : Fixed ’Low’A19 : Fixed ’Low’A20 ~ A30 : Fixed ’Low’
A13 ~ A18 : ValidA19 : Fixed ’High’A20 ~ A30 : Valid
1
R/B
I/Ox
1
Row Add.1,2,3 Row Add.1,2,3 Col. Add. 1,2 & Row Add.1,2,3 Col. Add.1,2A0 ~ A12 : Fixed ’Low’A13 ~ A18 : Fixed ’Low’A19 : Fixed ’Low’A20 ~ A30 : Fixed ’Low’
A0 ~ A12 : Valid
2
R/B
I/Ox
Add(3 Cycle) 60h Add(3 Cycle) 35h 00h Add(5 Cycle) 05h Add(2 Cycle) DOUTE0h
Up to 4224Byte
85h Add(5 Cycle) DIN Add(2 Cycle) 11h85h DIN
Col. Add. 1,2 & Row Add.1,2,3 Col. Add.1,2A0 ~ A12 : Fixed ’Low’A13 ~ A18 : Fixed ’Low’A19 : Fixed ’High’A20 ~ A21 : Fixed ’Low’
A0 ~ A12 : Valid
00h Add(5 Cycle) 05h Add(2 Cycle) DOUTE0h
Up to 4224Byte
tDBSY
Col. Add.1,2 & Row Add.1,2,3Destination AddressA0 ~ A12 : ValidA13 ~ A18 : Fixed ’Low’A19 : Fixed ’Low’A20 ~ A30: Fixed ’Low’A31 : Must be same as previous A31
Col. Add.1,2
81h Add(5 Cycle) DIN Add(2 Cycle) 10h85h DIN
Col. Add.1,2 & Row Add.1,2,3Destination Address
A0 ~ A12 : ValidA13 ~ A18 : ValidA19 : Fixed ’High’A20 ~ A30 : ValidA31 : Must be same as previous A31
2
Note: 1. Copy-Back Program operation is allowed only within the same memory plane.
tR
70h
Figure A-4. 2-Plane Copy-Back Program Operation with Ramdon Data Input
A31 : Valid A31 : Must be same as previous A31
A31 : Must be same as previous A31
A31 : Must be same as previous A31
2-PLANE PAGE PROGRAM OPERATION USING 4KB BUFFER RAMK9GAG08X0M consists of 4KB pages and can support Two-Plane program operation. The internal RAM requirement for a controlleris 8KB, but for those controllers which support less than 8KB RAM, the following sequence can be used for Two-Plane program oper-ation.
FLASH MEMORY
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K9KAG08U0MK9WBG08U1M
K9NCG08U5M
WP AC TIMING GUIDEEnabling WP during erase and program busy is progibited.The erase and program operations are enabled and disabled as follows:
Figure 24. Program Operation
1. Enable Mode
≈
80h 10h
WE
I/O
WP
R/B tww(min.100ns)
2. Disable Mode
≈
80h 10h
WE
I/O
WP
R/B tww(min.100ns)
1. Enable Mode
≈
60h D0h
WE
I/O
WP
R/B tww(min.100ns)
2. Disable Mode
≈
60h D0h
WE
I/O
WP
R/B tww(min.100ns)
Figure 25. Erase Operation
Recommended