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IMEC NANOELECTRONICS PLATFORM TECHNOLOGY R&D FOR SMART APPLICATIONS
LODE LAUWERS VICE PRESIDENT, PHD CMOS SALES/ BUSINESS DEVELOPMENT
MAY 2014
10000 m2 CR(200mm + 300mm) CMOS + MEMS, BIOlab, Pvline, lifescience lab,...
2013: 330 MEUR
2013: 2100 people
PARTNERING WITH IMEC
ACCESS to world-leading R&D in nano-electronics
EXTENDING your R&D base LEVERAGE scientific knowledge
GLOBAL partnerships ACHIEVE industry Relevant solutions
300mm pilot line Nano
biolabs
Clean Room/Pilot line [~ 10 000 m2] + Labs 24/7 Continuous operation
IMEC TOWER: Expansion of 14,208 m2 16 floors /450 people & lab space
200mm pilot line
Si & Organ. solar cell
line
Neuro- electronics
lab
2011 expansion
I1 I2 I3
I4
I5
STATE-OF-THE-ART RESEARCH FACILITIES
2012 2013 2014 2015 2016 2017 2018 2019
300mm pilot line Nano
biolabs
Clean Room/Pilot line [~ 10 000 m2] + Labs 24/7 Continuous operation
IMEC TOWER: Expansion of 14,208 m2 16 floors /450 people & lab space
2016H1: Fab Expansion
Collaboration European suppliers... Unpatterned wafer development
Advanced patterning development
Full 300/450mm process capability Advanced process development
200mm pilot line
Si & Organ. solar cell
line
Neuro- electronics
lab
2011 expansion
I1 I2 I3
I4
I5
RESEARCH PROGRAMS IMEC R&D PROGRAMS
TECHNOLOGY PLATFORMS
APPLICATION PROGRAMS SMART SYSTEMS
& ENERGY
RESEARCH PROGRAMS FOR FULL ECOSYSTEM
EXTREME SCALING SUB-14nm CMOS CONCEPTS & MATERIALS, PLATFORMS, SYSTEM
FOR LOGIC & MEMORY
IMEC CORE CMOS PROGRAM
RESEARCH COMPLEXITY
Technology complexity increases:
Multitude of material options & processing techniques
Combination of new materials & architectures
System/circuit level implications
INCREASING R&D COST
Partnering in R&D on next generation technologies: sharing costs, risk, talent & IP
IC manufacturers, IDMs, fabless & fablite companies and equipment suppliers
Largest worldwide commitment to the advancement of CMOS technology
11
Lithography FEOL cluster Interconnects
Logi
c
Mem
ory
Nan
o-in
terc
onne
cts
193n
m e
xten
sion
s
EU
V L
ithog
raph
y
Supporting Expertise Centers (process steps, reliability, Physical analyisis, modelling, characterisation...)
STT
MR
AM
3D IN
TEG
RA
TIO
N
IMEC CORE CMOS PROGRAM
DS
A
OP
TIC
AL
I/O
INSITE
Patterning center motivation
Increasing R&D challenges Increasing R&D cost
Consolidating industry
Cost sharing Risk mitigation
Maximum leveraging of full eco-system
Increased supplier involvement & commitment
= Patterning Center
Increased critical mass on unit process development Most advanced equipment at affordable conditions
PATTERNING CENTER / SUPPLIERS HUB
Increased supplier involvement & commitment
Increased critical mass on unit process development Most advanced equipment at affordable conditions
IMEC CORE CMOS PROGRAM: BUILDING A ‘LAYERED ECOSYSTEM’...
.... OF WORLDWIDE PARTNERSHIPS
IMEC WORLDWIDE PARTNERSHIPS IN FULL ECOSYSTEM IMEC CORE CMOS PROGRAM: BUILDING A ‘LAYERED ECOSYSTEM’...
.... OF WORLDWIDE PARTNERSHIPS
300mm CLEANROOM
Sub-15nm chip process technology
Investment > 1B$
Unique lithography cluster centered around ASML equipment
Advanced equipment and preproduction tools
Semi-industrial operation: 24/7
4,800m² class 1,000 area, ballroom-style
450mm extension Movie
LOGIC SCALING ROADMAP
LOGIC: BEYOND 7nm / 5nm
TunnelFET: Sub-60mV/decade subtreshold slope, allowing further reduction of supply voltage and power reduction
Many different device options under research: Graphene FET, spintronics, BISFET, Ge tunnelFET, InAs tunnelFET, Graphene FET, spintorque, ...
MEMORY: BEYOND 20nm
STT MRAM DRAM replacement beyond 20nm
Non-volatile memory for both embedded and stand-alone applications
Re RAM Flash replacement beyond 10nm
Non-volatile memory
High speed, low energy, superior scalability, CMOS compatible
3D SONOS Flash replacement to 10nm
Non-volatile memory
Memory cells implemented in vertical plugs consisting of 8,16,32 ... stacks
3D STACKING TECHNOLOGY
Future applications require higher transistor density in smaller form factor
Stacking different dies on top of each other
16 x higher IO density than today’s solutions
3D & OPTICAL IO
Optical IO: extension of 3D stacking
Further performance boosting, extreme high-bandwidth
Optical interconnects using silicon photonics instead of electrical interconnects
Fabrication of optical components by using CMOS processing techniques and equipment
Need for best-in-class optical components Movie
EUV
EUV: key for keeping patterning cost manageable in advanced nodes
Since 2011: ASML preproduction scanner NXE:3100
2014: ASML NXE:3300 EUV production tool expected
INSITE
New processing technologies, materials, architectures, interconnect technologies have impact on system/circuit level
Insite program gives product designers early insight in future technology nodes and the impact on their products
RESEARCH PROGRAMS
HETEROGENEOUS INTEGRATION: PROJECTS & PLATFORMS FOR DOD
RESEARCH PROGRAMS
Economically scalable route to high-volume manufacturing
Low power, high resolution, large area, outdoor readability, flexibility & light weight
FLEXIBLE DISPLAYS & ELECTRONICS
active-matrix OLED: thin-film transistor backplane switches individual pixels on and off
Direct processing of oxide backplane
Low-temperature, state-of-the-art processing
Large-area printing of flexible diplays
Roll-to-roll printing
Flexible RFID tags,...
Ultra-high frequency Schottky diode based on IGZO
RESEARCH PROGRAMS
RESEARCH PROGRAMS
Miniaturized & highly instrumented bioreactors to cultivate cells as if they are
inside the body
Cell sorting and detection building block
Wireless device connecting to low-cost, small, disposable chip
detecting bio parameters
LIFE SCIENCES: GRAND CHALLENGES KEY ENABLING TECHNOLOGIES
Low Cost
High Throughput
High Data Accuracy
BODY AREA NETWORKS
ECG PATCH EEG HEADSET MULTI-PARAMETER WRISTBAND
RESEARCH PROGRAMS
RESEARCH PROGRAMS
RECONFIGURABLE RADIOS MM WAVE COMMUNICATION ULP CIRCUITS
RECONFIGURABLE RADIOS
Radios that adapt their transmission parameters autonomously to the environment.
Focus on low-cost & low-power, enabling future 4G & 5G networks & digital video broadcasting
Reconfigurable analog front-end / digital baseband / spectrum sensing / record-breaking ADCs
mmWAVE SOLUTIONS
Wireless solutions using bandwidth capacity available at 60 Ghz
Short-range, Gigabit/s communication (e.g. uncompressed video distribution in the home, Gbit/s wireless connections between laptop and printers
Traditionally in III-V
CMOS enables higher integration, resulting in a smaller, cheaper, single-chip radio
79GHz RADAR
Detection system that can sense the environment
Low-cost modules will open up completely new opportunities
Applications: autonomous driving, security, robotics, smart homes, immersive gaming, assisted living
PHASED ARRAY ANTENNAS
FULLY INTEGRATED CMOS MMIC
COMPLETE SOLUTION IN 1cm X 1cm PACKAGE
Building on mm-wave expertise
High resolution, compact, low-powered radar systems built in CMOS technology
ULP circuits optimized for battery & harvested operation
Radios made available for licensing:
- 400 MHz medical radio - Body area network radio - Event driven radio - IR UWB radio platform
ULTRA-LOW POWER CIRCUITS
RESEARCH PROGRAMS
RESEARCH PROGRAMS
IMAGE SENSOR PLATFORMS Backside
illuminated image sensors
Embedded CCD in CMOS image sensors
Organic photodetectors
VISION SYSTEMS Hyperspectral
imaging
Lens Free imaging
RESEARCH PROGRAMS
THIN-FILM
ORGANIC Photovoltaic
s
CZTS
RESEARCH PROGRAMS
SILICON PHOTOVOLTAICS
ORGANIC PHOTOVOLTAICS
Polymers or small molecules
Large, flexible, translucent substrates
Roll to roll development for high throughput
Increase efficiency and lifetime
Certified cell efficiencies beyond 9%
Key technologies: transient metal-oxide interfacing layers & tandem cell architectures
ENERGY: GaN POWER DEVICES
Cost-effective and efficient power conversion in tomorrow's electricity grid
Power devices on GaN-on-Si wafers in 200mm CMOS compatible process flow
RESEARCH PROGRAMS
RESEARCH PROGRAMS
Sweat analysis & physical condition
Glucose, Asthma
Level of CO2 & NO2
CMOS compatible processes
24/7 monitoring / Long autonomy / Wearable
Low cost
Electrochemical sensor in one single chip
Ethyleen ( fruit ripening)
Low detection limits, low cost, low power consumption
COLLABORATION MODEL CONCEPTS
50 © IMEC 2012 / CONFIDENTIAL
ROADMAP CHALLENGES: COST INCREASE
MULTITUDE OF MATERIALS & CONCEPTS
NARROWING DOWN OPTIONS, COST SHARING & RISK MITIGATION ARE KEY
IMEC’s CMOS PROGRAM RATIONALE
COMPLEXITY INCREASE
© IMEC 2013
ROADMAPS CONTAIN RISKS, AND ECOSYSTEMS CHANGE: PARTNERING FOR COST-EFFECTIVE R&D Equipment, material, SW
suppliers System houses, IC manufacturers & Foundries
Collaborative
PROGRAMS & PROJECTS in a
unique R&D infrastructure
World-wide R&D Platforms
EU, Regional funding University Partnerships
Build critical mass Share Risk & R&D costs
OPEN INNOVATION with NEW BUSINESS MODELS
MULTI-FACETED BUSINESS MODEL
Services
Training
Spin-offs
Transfer & licenses
Joint R&D
Programs
Bi and tri lateral
DoD
Service
training
licensing
venturing
EVERY ACTIVITY...MARKET... ECOSYSTEM REQUIRES ADJUSTED COLLABORATION MODEL FOR R&D
MULTI-FACETED BUSINESS MODEL
DoD & Services
Training
Spin-offs
Transfer & licenses
Joint R&D
CORE PROGRAM STRATEGIC VALUE DRIVERS
• Feeding and downselecting the long term innovation pipeline for device & system scaling
• Explore novel materials & device architectures for logic / memory roadmaps
• 3D & OIO technology pathfinding
• Technology feasibility assessment on 300mm development equipment
• Advanced patterning & Process module readiness • Device/reliability feasibility demonstration
modeling & characterization
• Early design-technology co-optimization • System impact, system enablement • INSITE
FULL IP MEMBERSHIP AND LICENSING
JOINT DEVELOPMENT PROGRAMS
SYSTEM ORIENTED DELIVERABLES
IDM, FOUNDRY...
EQUIPMENT & MATERIAL SUPPLIERS, EDA...
FABLESS FABLITE SYSTEM
ONE “ACTIVITY”,THREE OFFERINGS
MULTI-FACETED BUSINESS MODEL
DoD & Services
Training
Spin-offs
Transfer & licenses
Joint R&D
CMORE / DOD TURN YOUR SILICON CONCEPT INTO A PRODUCT
1. Concept design
2. Process
development, Packaging, Testing,
Reliability
3. Product qualification
4. Prototyping, Low-volume
manufacturing @ imec
5. Transfer
6. High-volume
manufacturing @ foundry partner
(Co-)development
Prototyping Production
MULTI-FACETED BUSINESS MODEL
DoD & Services
Training
Spin-offs
Transfer & licenses
Joint R&D
© IMEC 2012 / CONFIDENTIAL
ENABLING YOU ON A TECHNOLOGY NODE
Documentation (e.g. test-chips, procedures, process flow)
Equipment selection (e.g. recipes, etc.)
Ground rules; specifications
Metrology; In-line monitoring
Consulting on-site
Modules (e.g. STI, gate, interconnect)
Reliability and characterization (e.g. structures, specs)
Training (e.g. contamination protocol)
Si-processing; co-development option
Tailoring based on your need
MULTI-FACETED BUSINESS MODEL
DoD & Services
Training
Spin-offs
Transfer & licenses
Joint R&D
© IMEC 2012 / CONFIDENTIAL
FOCUS ON TRAINING COMBINING TECH TRANSFER
Class Room and on-line training
Customized packages On-campus / on-site
Hands on individual training
Engineer training
Consulting on-site
Operator training
Long Term Student class training
Tailoring based on your need: ‘white box’ collboartion focused on long term
GREAT CHALLENGES AND OPPORTUNITIES....
ASPIRE INVENT
ACHIEVE
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