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03/2011
Heat-curing DELOMONOPOX Adhesives
AIPI – Milano, 15 May 2014
DELO – Stefano Farina
03/2011
Contents
� Product description
� Reaction mechanism
� Adhesive properties
03/2011
Heat-curing DELOMONOPOX adhesives
� One-component
� Heat-curing- Casting resins at 100 – 150 °C - Adhesives at 130 – 180 °C
� High Young’s modulus (> 2500)
� Low elongation at tear (< 2 %)
� Low shrinkage (0.5 – 1 %)
� Very high tensile strength (> 40 MPa)
� Excellent bond strength to many materials
� High temperature range of use (up to 200 °C)
� Excellent chemical resistance
03/2011
Subgroups and their properties
Structural adhesives
Aminic-curing
� Curing in 15 min (180 °C) to 75 min (130 °C)
� High-viscous to pasty
� Mostly filled
� Containers: 310 ml cartridge or hobbock
� Examples: DELOMONOPOX AD295, AD296, AD297
Bonding of honing tools
03/2011
Subgroups and their properties
Casting resins
Aminic-curing
� Curing in 10 min (150 °C) to 30 min (130 °C)
� Low-viscous to medium-viscous
� Mostly unfilled
� Containers: 310 ml cartridge or hobbock
� Examples: DELOMONOPOX 6093, 6095
Bonding and sealing of the housing of a gear control unit
03/2011
Subgroups and their properties
Fast-curing electronic adhesives
Aminic-curing or cationic-curing, mCD
� Curing in 5 – 10 s (thermode)
� Temperatures from 80 °C and up
� Partly electrically conductive
� Containers: 10 ml or 30 ml cartridge
� Examples: DELOMONOPOX 1097, MK055, NU355, AC265, AC365
Bonding and electrical contacting of a flip-chip with DELOMONOPOX MK055 to an RFID label
03/2011
Subgroups and their properties
Highly reliable casting compounds
Anhydrides, cationic-curing
� Curing- Cationic: 130 °C / 5 min- Anhydrides: 150 °C / 40 min
� Low-viscous to pasty (e. g., also Dam&Fill)
� Containers: 30 ml or Euro cartridge
� Examples: DELOMONOPOX GE725, GE730, GE785, GE592 Casting of an IC for an oil sensor with
DELOMONOPOX GE720 / GE592
03/2011
Subgroups and their properties
Mobile phone assembly
Acrylates
� Curing- Oven: 130 °C/80 s- Thermode: 250 °C/6 s
� Impact-resistant, highly flexible (approx. 200 % elongation at tear)
� Containers: 30 ml or Semco cartridge
� Examples: DELOMONOPOX AD481, AD482
03/2011
Formation of hydroxyl groups
� Epoxy resins contain an epoxy ring as functional group
� Heat-curing epoxy resins include their hardener already which is activated by heat
� The reaction speed is mainly dependent on the hardener used
H H H Hl l l l
– C – C – H + H – X →→→→ – C – C – X\ / l lO HO H
Epoxy ring Hardener Hydroxyl group
03/2011
Curing process
Curing process at 150 °C, measured in the rheometer
DELOMONOPOX AD296
0
2
4
6
8
10
12
14
16
18
0 5 10 15 20 25 30 35 40 45
Time [min]
Vis
cosi
ty [k
Pa
s]
03/2011
Fillers
The major reasons for using fillers are:
� Reinforcement of the products � Increase in the cohesive properties der
� Reduction of shrinkage � Increase in dimensional stability and bond strength
� Specific setting of the electrical properties � Insulating to electrically conductive
� Increase in viscosity
� Improvement of the thermal conductivity
� Color
03/2011
Temperature properties
Temperature
Str
engt
h
Temperature stability ata defined temperature
Temperature range of use
03/2011
Temperature stability
Comparison of 1C and 2C epoxy resins
0
5
10
15
20
25
30
35
40
0 20 40 60 80 100 120 140 160 180 200 220
Temperature T [°C]
Ten
sile
she
ar s
tren
gth
[Mpa
]
DELOMONOPOX 1196
DELO-DUOPOX 1895
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