03/2011

Heat-curing DELOMONOPOX Adhesives

AIPI – Milano, 15 May 2014

DELO – Stefano Farina

03/2011

Contents

� Product description

� Reaction mechanism

� Adhesive properties

03/2011

Heat-curing DELOMONOPOX adhesives

� One-component

� Heat-curing- Casting resins at 100 – 150 °C - Adhesives at 130 – 180 °C

� High Young’s modulus (> 2500)

� Low elongation at tear (< 2 %)

� Low shrinkage (0.5 – 1 %)

� Very high tensile strength (> 40 MPa)

� Excellent bond strength to many materials

� High temperature range of use (up to 200 °C)

� Excellent chemical resistance

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Subgroups and their properties

Structural adhesives

Aminic-curing

� Curing in 15 min (180 °C) to 75 min (130 °C)

� High-viscous to pasty

� Mostly filled

� Containers: 310 ml cartridge or hobbock

� Examples: DELOMONOPOX AD295, AD296, AD297

Bonding of honing tools

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Subgroups and their properties

Casting resins

Aminic-curing

� Curing in 10 min (150 °C) to 30 min (130 °C)

� Low-viscous to medium-viscous

� Mostly unfilled

� Containers: 310 ml cartridge or hobbock

� Examples: DELOMONOPOX 6093, 6095

Bonding and sealing of the housing of a gear control unit

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Subgroups and their properties

Fast-curing electronic adhesives

Aminic-curing or cationic-curing, mCD

� Curing in 5 – 10 s (thermode)

� Temperatures from 80 °C and up

� Partly electrically conductive

� Containers: 10 ml or 30 ml cartridge

� Examples: DELOMONOPOX 1097, MK055, NU355, AC265, AC365

Bonding and electrical contacting of a flip-chip with DELOMONOPOX MK055 to an RFID label

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Subgroups and their properties

Highly reliable casting compounds

Anhydrides, cationic-curing

� Curing- Cationic: 130 °C / 5 min- Anhydrides: 150 °C / 40 min

� Low-viscous to pasty (e. g., also Dam&Fill)

� Containers: 30 ml or Euro cartridge

� Examples: DELOMONOPOX GE725, GE730, GE785, GE592 Casting of an IC for an oil sensor with

DELOMONOPOX GE720 / GE592

03/2011

Subgroups and their properties

Mobile phone assembly

Acrylates

� Curing- Oven: 130 °C/80 s- Thermode: 250 °C/6 s

� Impact-resistant, highly flexible (approx. 200 % elongation at tear)

� Containers: 30 ml or Semco cartridge

� Examples: DELOMONOPOX AD481, AD482

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Formation of hydroxyl groups

� Epoxy resins contain an epoxy ring as functional group

� Heat-curing epoxy resins include their hardener already which is activated by heat

� The reaction speed is mainly dependent on the hardener used

H H H Hl l l l

– C – C – H + H – X →→→→ – C – C – X\ / l lO HO H

Epoxy ring Hardener Hydroxyl group

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Curing process

Curing process at 150 °C, measured in the rheometer

DELOMONOPOX AD296

0

2

4

6

8

10

12

14

16

18

0 5 10 15 20 25 30 35 40 45

Time [min]

Vis

cosi

ty [k

Pa

s]

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Fillers

The major reasons for using fillers are:

� Reinforcement of the products � Increase in the cohesive properties der

� Reduction of shrinkage � Increase in dimensional stability and bond strength

� Specific setting of the electrical properties � Insulating to electrically conductive

� Increase in viscosity

� Improvement of the thermal conductivity

� Color

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Temperature properties

Temperature

Str

engt

h

Temperature stability ata defined temperature

Temperature range of use

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Temperature stability

Comparison of 1C and 2C epoxy resins

0

5

10

15

20

25

30

35

40

0 20 40 60 80 100 120 140 160 180 200 220

Temperature T [°C]

Ten

sile

she

ar s

tren

gth

[Mpa

]

DELOMONOPOX 1196

DELO-DUOPOX 1895