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All company or product names referenced herein are trademarks or registered trademarks of their respective owners.
©2009 FUJITSU MICROELECTRONICS LIMITEDAll rights reserved.Printed in JapanAD00-00020-1E February, 2009
Fujitsu Microelectronics' technology and products help to preserve Earth's environment.
Green Business Process &Green Products Guide
FUJITSU MICROELECTRONICS LIMITEDShinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku,Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387http://jp.fujitsu.com/fml/en/
Technological advances make people’s lives easier and enrich society. But
resource consumption and emissions impact the environment, posing increasingly
serious issues for us all, such as global warming.
We are responding to these challenges with world-wide efforts to enhance our
contribution to the protection of the environment, with the goal of "Building a
Sustainable Global Society." We have many and varied environmental projects in
both the industrial and consumer sectors. We believe in the power of the people in
the semiconductor industry to contribute to a sustainable society, so that future
generations can inherit the beauty of Earth’s environment.
Fujitsu Microelectronics Limited was set up in March 2008 to drive the future of
Fujitsu Group's semiconductor business. We aim to nurture the trust we have built up
with existing customers of Fujitsu's electronic devices group, while developing digital
solutions with real value to meet the needs of both customers and society as a whole.
The ‘green’ perspective is becoming ever more vital to the future of business and
the global community. Over recent years, a common international goal has been set
to halve emissions of greenhouse gases, such as CO2, by 2050. At the Toyako
summit in Japan held in July 2008, negotiations made progress towards this aim of
a low-carbon society.
Meanwhile, we have a key mission to develop our electronic business with the
environment firmly in mind: by reducing the environmental impact of our factories, by
using less power, and by manufacturing small and light ICs (Integrated Circuit),
devices and applications. In addition, we ensure strict compliance with international
environmental standards, such as RoHS.
In short, we see it as our social responsibility to maintain our end of our customers’
supply chains, and we will work with them to help protect the world’s environment
towards achieving the day - in about 30 years’ time - of the low-carbon society.
I n t r o d u c t i o n
SEMICONDUCTORE C O i s i n o u r S E M I C O N D U C T O R s .
M a i n M e s s a g e
Working towards a business that delivers device solutions with real value for the needs of the Environmental Age.
Haruki Okada, President
With our customers, we contribute to the protection of a rich global environ-ment, using state-of-the-art technology to provide semiconductor devices with superior environmental characteristics.
By applying the following principles, we work to prevent pollution of the global environment and reduce the environmental burden of our products through-out their life cycles, including development, procurement, manufacture, sales, usage, and disposal:
Operation Principles
Fujitsu Microelectronics Limited Environmental Policy
Through aggressive promotion of Super Green Product development, we improve the environmental characteristics of our products and actively contribute to reduc-ing the burden on the global environment and for our customers.We aggressively promote measures to counteract global warming and reduce emissions of greenhouse gases (e.g. CO2, PFCs).We aggressively promote chemical management and reduced emissions of volatile organic compounds (VOCs).We aggressively promote waste reduction and appropriate recycling.We conform to environmental regulations around the world and keep our promises to customers.We work to improve the individual environmental consciousness of each of our employees, to help them become good environmental citizens.We expand the effectiveness and transparency of our environmental management system, driving continuous improvement and development.
1.
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3.
4. 5.
6.
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16 July 2008
Haruki OkadaPresident
Introduction
Main Message
Concept
Green Business Process
2
3
4
6
Green Products ASIC
Microcontrollers
Power Management ICs
Memory
ASSP
Topics
101213141516
18
C o n t e n t s
FU J I TSU MICROE LECTRONICS
Green Business Process & Green Products Guide 2 Fujitsu Microelectronics Limited 3
Green Business Process
Green Products
C o n c e p t
We work to reduce the burden to the environment and prevent
pollution of the global environment throughout the life cycles of our
semiconductor products, from the development and design stages,
through material procurement and manufacture (front-end wafer
manufacturing and back-end assembly processes), to distribution, sales
and usage.
In recent years, we have been increasingly focused on chemical
management. We respond quickly to domestic and international regula-
tions (such as those in Europe and China, including RoHS*1 and
REACH*2), complying with standards on substances prohibited or limited
in products and managing such regulated substances appropriately
through green procurement.
Preventing global warming, now becoming a serious problem, is also
a key aspect of our environmental operating principles. We are making
aggressive efforts to curtail greenhouse gas emissions, including switch-
ing to gases with lower global warming potential; adding equipment to
manufacturing lines to remove harmful gases; and saving energy -- e.g.
by changing boiler fuel from crude oil to gas, introducing Standard
Mechanical Inter Face type clean rooms, and using free cooling*3.
Additionally, in the manufacturing stage - which has the biggest
environmental impact over the life cycle - we are pushing forward with
"green process activities," with the goal of reducing energy consumption,
chemical usage, and waste.
*1 RoHS: A set of directives restricting the use of specified Harmful Substances contained in electric and electronic devices
*2 REACH: A regulation regarding the Registration, Evaluation, Authorisation, and Restriction of Chemicals
*3 Free cooling: A system taking advantage of low outside temperatures during winter to cool water
We are working to reduce the environmental burden across all our business activities
As the digital networked society develops, the performance of electron-
ics, such as communication devices, mobile devices and digital home
appliances, shows an exponential increase, with new products and
features appearing in rapid succession. The proliferation and expansion of
such wide-ranging electronic devices increases the environmental impact
from their use, such as increased power consumption.
Responding to this environment, we are promoting eco-design, commit-
ting ourselves to the development and sale of environmentally conscious
devices and solutions that reduce our customers' environmental impact.
For example, we are driving forward the energy efficiency, compactness,
and lightness of core products such as our ASICs, microcomputers,
power ICs, memory, and ASSPs. We have also been organizing a
framework to support the growth of environmentally conscious electron-
ics through the provision of "embedded system-on-chips." Thus, by
developing a wide variety of devices and unique system-on-chip solutions
with environmental awareness, we provide "eco-device solutions" in
which advanced functionality and reduced environmental impact co-exist.
Providing environmentally-conscious semiconductor solutions to support our customers' business
For our customers,for the environmentAs the digital networked society evolves, the functionality of our electronic devices
(e.g., mobile devices, digital home appliances, PCs, and automobiles)
constantly improves.
Meanwhile, with increased awareness of the need to protect our environment,
the demand for electronic devices that consider the environment has reached
unprecedented levels.
For better device technology, for greater convenience, and for global
environmental protection ----
we work to develop and supply semiconductor products with a low environmental
burden, using manufacturing processes with low environmental impact,
and to pursue higher semiconductor functionality, to build a bridge to a new
era of a "society of plenty."
Reduction of environmental burdenin business activities
A p p r o a c h 1
A p p r o a c h 2
Developing and providing environmentally conscious device solutions
Green Business Process & Green Products Guide 4 Fujitsu Microelectronics Limited 5
Fujitsu Microelectronics Limited(Akiruno Technology Center)
Fujitsu Electronics Inc.
Fujitsu VLSI Limited
Fujitsu Microelectronics Limited(Mie Plant/Aizu-Wakamatsu Plant/Iwate Plant)
Fujitsu Semiconductor Technology, Inc.
Fujitsu Facilities Engineering Limited
e-Shuttle, Inc.
Fujitsu Integrated Microtechnology Ltd.(Aizu Plant/Miyagi Plant/Kyushu Plant)
Fujitsu LSI Technology Limited
Fujitsu LSI Solutions Limited
Fujitsu Microelectronics Solutions Limited
Multiple power source design technology that reduces power consumption while active
Power gating design technology that reduces power consumption when idle
"RDF V3.0," a development system loaded with the features of multiple power source design and power gating design
Working with our partners to promote green procurement, under the Fujitsu Group green procurement standards
Supporting our partners' construction of CMS (central management systems) based on JGPSSI*1 "Guidelines for the Management of Chemical Substances in Products"
Saving energy to reduce CO2 emissions
Changing from PFC gas*3 to gases of low global warming potential, and installing manufacturing lines equipped with PFC gas harm removal equipment
Curtailing sludge waste emissions with the introduction of a "Fluorine Recovery and Reuse System"
Reducing emissions of VOC (volatile organic compounds)
Process improvement reducing the amount of chemicals and gas used
Reduction of process energy expenditure
Clarification of improvement priorities using the CG index*2
Reducing greenhouse gas emissions
Reducing waste emissions
Reducing emissions of VOC (volatile organic compounds)
Usage of specialized reusable boxes
Application of cobalt-chloride-free humid-ity indicators
Shipping with low CO2 emissions
Terminals installed on vehicles to improve fuel efficiency
Massive time-saving and productivity increases
Cooperation with our "green process activities"
Products adapted to our special environ-mental awareness standards
Products with improved environmental efficiency
Environmental improvement solutions using ICs of superior environmental performance
Akiruno Technology Center Fujitsu Electronics Fujitsu VLSI FujitsuMicroelectronics Solutions
Mie Plant Aizu-Wakamatsu Plant Iwate Plant Aizu Plant Miyagi Plant Kyushu Plant
*1 JGPSSI: Japan Green Procurement Survey Standardization Initiative
*2 Cost Green index. Fujitsu Group's unique index calculated by multiplying the following three factors: material input per unit of product, unit value, and degree of environmental impact.
*3 Perfluorocarbon gas. Used in the manufacturing of semiconductors; it has a global warming potential approximately 10,000 times higher than that of CO2.
Manufacturing bases (back-end)Manufacturing bases (front-end)Development and design bases
Low-power ICs
Green factories
Green processes
Green factories
Packing
Green distributionManufacturing renewal project (Toyota production system)
Green products and Super Green Products
Green procurement
Facilities in Japan
Development and design Material procurement Manufacturing (front-end) Manufacturing (back-end) Distribution and sales Usage
From development and design to manufacture and usage ----constructing a business process with low environmental impact across the whole lifecycle of the semiconductor product
Green BusinessProcess
A p p r o a c h Reduction of environmental burden in business activities1
Green Business Process & Green Products Guide 6 Fujitsu Microelectronics Limited 7
We have been at the forefront of using humidity indicators
that exclude the harmful substance cobalt chloride, under a
joint design with Kyodo Printing Co., Ltd., since August 2008.
Humidity indicators are used as one part of the packing
material to confirm the preservation state of semiconductor
products (such as IC packages) affected by humidity. We
used to use humidity indicators containing cobalt chloride, but
this is carcinogenic, and its use is restricted by an EU
Directive*. So cobalt-chloride-free humidity indicators were
needed.
Concerned for human health and the environment, we
Until recently, the Mie plant recycled its fluorine-containing
sludge as cement material. However, as the demand for cement
decreased, cement companies began to limit the amount of
sludge they would take in, and it became difficult to recycle.
So, we introduced a "Fluorine Recovery and Reuse System"
at the newly-established second 300mm fab, to reduce the
fluorine-containing sludge that formed most of the waste.
Introducing these facilities allows us to reduce the fluoride-
containing sludge by approximately 30%, recovering the
fluorine from waste hydrofluoric acid to create fluorite. We then
sell the fluorite to hydrofluoric acid manufacturers, who recycle
it as fluorine-based solvents, fluororesin, etc., so making good
use of a valuable resource. We eliminate the remaining
low-concentration fluorine, that we cannot recover, by coagula-
tive precipitation and high-degree adsorption treatments, again
lightening our burden on the environment. Now we have begun
to fluoritize the waste from the first 300mm fab. as well.
made this a top priority and, with Kyodo Printing Co., Ltd., we
helped in the development of HumiJudgeTM, a humidity indica-
tor without cobalt chloride. It is a key part of our mission to
consider the environment - even in the materials we use to
pack our products.* Council Directive 67/548/EEC of 27 June
1967 on “the approximation of laws,
regulations and administrative provisions
relating to the classification, packaging
and labelling of dangerous substances".
We are working hard to manage restricted substances
appropriately. We track changes in domestic and international
legal regulations for substances banned or restricted from
inclusion in products, and decisively eliminate banned
substances through green procurement.
In response to regulations like RoHS, we are perfecting our
chemical management in all processes from design to
shipping. Likewise, for the European Union Regulation REACH,
we promote discussion of the risk potential of chemicals and
the framework for managing them efficiently.
We see REACH's requirement for disclosure of chemicals in
products as a responsibility for the entire supply chain, so we
are participating in related industry groups such as JAMP* and
JGPSSI to discuss the building of the new framework for
chemical management.* JAMP: Japan Article Management Promotion-consortium
To reduce the environmental impact of our manufacturing
activities, we have decided to build "green factories."* These
revolve around the reduction of energy consumption and waste,
the perfection of chemical management, etc. For this purpose
we are driving forward our "green process activities."* This
project involves determining the priority and target values for
such subjects as energy from electricity and other sources,
resources and chemicals, using Fujitsu Group's unique CG
index, in order to reduce our environmental impact and optimize
allocation of such resources. We are also doing all we can to
switch to alternative chemicals for applications such as lithogra-
phy developer fluid, which have a lower-environmental burden.
To further the effectiveness of such activities, our "green
factory system," in effect since 2008, highlights each plant's
eco-friendliness level and independent efforts with comprehen-
sive evaluations. We have made it our goal that all plants reach
at least the 2-star level in this system by the end of FY 2009.
We are pushing through continuous improvements in our
environmental friendliness towards this goal.* The green factory and green process activities are systematized throughout the Fujitsu Group.
Fujitsu Group's framework for conforming to RoHS in procurement
Fujitsu
Confirmation of legality
Shipmentcheckingmeeting
Shipment confirmation
Supplier audit
Acceptance inspection
Cus
tom
er
In-house factory periodic inspection
Quality assurance department
ShippingProductdepartment
Sup
plie
r
Supply
Environmental department Determinationof legality
Exclusion requirement
Conformance verification
Purchasingdepartment
Green factory system (certification level image)
3 stars
2 stars
1 star
Independent workplace accomplishments earn
additional honors
Meets targets and fulfills standard levels for the
required items(Each item is rated
on a scale of 1 to 5.)
Greenfactory
Greenoffice
Independentaccomplishment
examples
Required items
examples
Resource conservation(materials, water, natural energy, paperless)
Local communication
Safe handling (environmental risk)
Environmental education
Green purchasing
Land/groundwatermeasures
Energy conservation, CO2 emission reduction
Waste reduction (zero-emission, recycling)
Chemicals,greenhouse gases
Social contribution projects
Independentmanagement standards
ISO14001 certification(building and carrying out EMS), observance of legal regulations
Confirmation
HumiJudgeTM
G r e e n B u s i n e s s P r o c e s s A p p r o a c h 1
Addressing regulated chemicals in products
Procurement Programs
Fluorine Recovery and Reuse System The fluorite generated (powder)
Introducing a "Fluorine Recovery and Re-use System" -propelling the efficient use of resources
Manufacturing Programs
Driving forward "green process activities" and carrying out "green factory systems"
Manufacturing Programs
Worldwide pioneers in developing cobalt-chloride-free humidity indicators
Distribution Programs
Introducing our environmental protection projects in procurement, manufacturing, and distribution
Green Business Process & Green Products Guide 8 Fujitsu Microelectronics Limited 9
Putting together design technology with high functionality
that considers the environment, we offer the low-power
consumption ICs suited for customer's needs.
As digital networking technology evolves, the
functionality of electronics devices constantly
improves. As we find more ways to use electronics,
we also increase our power consumption.
In such an environment, we are working hard to
advance the functionality of electronics with device
solutions that conserve energy.
Recent years have seen demand for smaller and
thinner electronics devices, such as mobile devices
and digital home appliances. Shrinking the size of
such devices both makes them more convenient for
users and helps conserve resources.
We help conserve resources and protect the
environment by using our highly functional and
varied semiconductor lineup and unique packaging
technology to advance the functionality of electron-
ics devices and to offer device solutions that lead
the industry in compactness and lightness.
DC brushless motor control MCUFR80 CPU core
Main products
Our abundant product lineup makes high-speed processing
with low power consumption a reality.
Digital television power ICUltra-mobile PC power ICDigital camera power IC
Main products
Discrete FRAM memory ICsConsumer FCRAM
Main products
We respond to our customers' rising performance needs and
make it possible for their products to achieve better power
efficiency and miniaturization.
We offer to minimize the size of PCB in customer's product
to enable flexible and small product design, and to reduce
CO2 emission dramatically.
We offer sophisticated ICs for every application:
automobiles, communications, imaging, office equipment,
and more.
V i s i on1 Contributions to energy-saving
We provide eco-device solutions, combining various devices to help reduce the environmental burden
V i s i on2Contributions to shrinking and lightening
Power Management ICsProducts Category 3
MemoryProducts Category 4
G r e e n P r o d u c t s
ASICProducts Category 1
MicrocontrollersProducts Category 2
ASSPProducts Category 5
A p p r o a c h Developing and providing environmentally conscious device solutions2
Green Business Process & Green Products Guide 10 Fujitsu Microelectronics Limited 11
VOICE VOICE
"Power gating design" is a design method that vastly reduces power
consumption during idle time by shutting off power supply to resting
circuits in the IC by a switch. Power gating allows idle power consump-
tion to be reduced to as little as 1/1,000*.
"Multiple power source design" is a design method that supplies
power of different voltage to each circuit inside an IC. It reduces
power during active times by supplying a low-voltage power to a
circuit that runs in low frequency and a high-voltage power to a
circuit that runs in high frequency. Power consumption during idle
time is reduced at the same time.
ASICs that are incorporated into rapidly-evolving electronic
devices, need advances both in design efficacy and in
handling increasing functionality. Our ASICs not only
reduce the number of parts by combining multiple semicon-
ductors onto one chip, but also are ready with state-of-the-
art process technology, high-functionality IP and high-
density packaging. We work with IC specification requests
to achieve in full the design services and quality our
customers need.
The "RDF V3.0" development system, loaded with design functionality that reduces power consumption
We have established a unique ASIC development system,
"RDF V3.0," that reduces power consumption both when the
IC is active and when it is idle. This system is packed with
design functions such as "clock gating" and "multiple power
source design" which reduce power consumption when active.
Design functions such as "multi-Vth" and "power gating"
reduce power consumption when idle, thus helping to reduce
the power consumption of ICs.
(For AC power reduction)Effective in reducing power consumption in clock distribution systems and FFs of sophisticated ICs
Placed around macros
Retains FF's memory contents even when power is off
Reduces power noise when turned on or off
Used when signals are distributed through Powered-off domains
(Possible to place power switch in standard cell block)
Power Switch
(For reducing leak power)Three types of thresholds can be used for cellsNo constraints on placement of cells with different thresholds
Low Leak Tr Cell Critical Path Standard Tr Cell
(Multi-Vdd)
(Wide Vdd range)
A high-performance FR80 CPU core in a microcontroller.
Ready for home digital appliances to which new features
are added with each new model, raising the amount of
processing needed. Wide product lineup available.
We have released the MB91480 series, capable of
inverter control of two DC brushless motors*1 with one
chip. It makes the motors of high-performance air condi-
tioners, washer-dryers, etc. smooth and silent.
Fan motor diagram
12
10
8
6
2
4
0
FR60 CPU core(our previous model)
FR80 CPUcore
50% reduction*2 in power consumption!
(Unit: kg/day)
DVD
Fan motor
Digitalcamera
Approx. 30%reduction
Power Switch
Power on/off area
Poweron/off area
Always-on area
D.R.E
CK
Enable
Enable
Retention FF
Leve
l Shi
fter
& ls
olat
ion
9.52
6.61
MicrocontrollersProducts Category 2
"Power gating design" reduces power when idle
Point 2
50% reduction in power consumption*2
"Multiple power source design" reduces power when active
Point 1
Environmental features
ASICProducts Category 1
We develop and provide products that help reduce the environmental impact of electronic devices, through reducing power consumption, size and weight.
G r e e n P r o d u c t s A p p r o a c h 2
Clock gating
Ring PowerSwitch
Retention FF Multiple power source design
Cells for with low voltageLow power SRAM (Multi-mode SRAM)
Rush CurrentControl
Always-OnBuffer
Column PowerSwitch
Level Shifter,lsolation Cell
Multi-Vth
* Compared with circuits without the power gating
*1 Motors with semiconductor switches in place of brushes*2 Reduction in inverter-control microcomputer components*3 Corresponds to the area of one microcontroller
* Compared to our previous products
Point 1
196 mm2 reduction in component mounting surface area*3
Point 2
CO2 emissions
CO2 emissions-reduction effect
Approx. 50%reduction*2
CO2 emissions-reduction effect
Approx. 30%reduction*
DC brushless motor control MCU[MB91480 series]
FR80 CPU core[MB91635 series] [MB91640/645 series] [MB91660 series]
Demands for IC design to reduce power consumption are becoming
intense. Lately, in addition to companies working to save energy and reduce
CO2 emissions, demands are intensifying - with standards for electrical
products being set by the top-runner system*1.
We developed methods such as "multiple power source design" and "power
gating design" as we drove forward to incorporate CPF*2 into our ASIC
development design system RDF.
We also solved the issues that crop up with these methods such as rush
current*3, so that our customers can use our products without concern.
We hope to continue pushing forward the implementation of power-
consumption reducing technology, such as ASV*4, as we support our custom-
ers' ecology efforts.
*1 The standards for energy conservation in electrical products are being set by the level of the most efficient products*2 An IC power data description format, standardized and promoted by the U.S. EDA (Electronic Design Automation) vendor Cadence Design Systems, Inc.*3 Large current that flows when the power switch is turned on*4 A technology for adjusting power voltage according to variations of device
To limit power consumption while operating at high speeds ---- that was
the task assigned to us for developing the MB91480 series. A major point
regarding power consumption is, "Make the clock tree small." So, to make
the clock tree small, we went through a lot of trial and error with the floorplan
layout (physical placement). Finally, we managed to get that compactness
and hold down the power consumption. We asked the Flash Design
Department if they could bring down the power consumption of the flash
memory used in the chip, and their help also enabled us to control the power
consumed.
Our company has excellent semiconductor design technology and
process technology developed over many years, and we also have excellent
development and design engineers. By combining these resources
organically, we will continue to design and produce quality products - both for
our customers and for the global environment.
Low-Power design system development team Tsutomu Nakamori, Manager(Design Innovation Engineering Dept. ENVM Technology Development & Products Engineering Div.)
DC brushless motor control MCU development team Akio Hara (MCU Design Dept. I Security & Ecology Business Div.)
Environmental features
CPUs enabling high-speed processing, by shortening processing time, reduce power consumption by 30%*
Point 1
The internal circuits, except the I/O pins, operate at 1.8 V for a 20% reduction in power consumption*
Point 2
Environmental features
Green Business Process & Green Products Guide 12 Fujitsu Microelectronics Limited 13
VOICEVOICEVOICE
To limit the rise in power consumption accompanying the increased size of flat-screen TVs, components need to be more energy-efficient. We have been able to conserve energy through high conversion efficiency with our 2-channel step-down converter IC*1 "MB39A136."
These ICs are not only highly integrated, but also reduce cross converter*1 power loss. They allow internal power supply to achieve the small size and high efficiency demanded by portable devices such as digital cameras.
FRAM is memory using ferroelectrics*1. It can read and rewrite at high speeds, and can retain data even with the power off. It can also be substituted for BBSRAM*2. It is being used in a wide range of applications, such as in office automation devices.
Consumer FCRAM features high data bandwidth and low power consumption to enable a SiP(System in Package) solution ideal for digital consumer electronics. 256Mbit Consumer FCRAM enables data transfer capabilities equivalent to two DDR2 SDRAM*1 devices, while keeping power consumption low.
We have, for the first time in the industry, consolidated a 6-channel DC/DC converter controller circuit*1 with in-built peripherals into one chip. Now, for ultra-mobile PCs, the long-life battery drive and the miniaturization of power substrate area are possible.
100
80
85
90
95
10 2 3 4 5
15% reduction in CO2 emissions*2
Power circuit
BatteryBBSRAM
FRAM
Digitaltelevision
Personal computer
Digitalcamera
Digitaltelevision
DigitalTV etc.
Digitalcamera
30
20
10
0
UsingSDRAM
UsingFCRAM
(units: kilotons)
27.328
8.064
Approx. 70%reduction
Power Management ICsProducts Category 3
MemoryProducts Category 4
Green P roduc t s A p p r o a c h 2
Digital television power management IC[MB39A136]
CO2 emissions-reduction effect
4,278 tCO2/year*2
CO2 emissions-reduction effect
Approx. 15%reduction*2
CO2 emissions-reduction effect
Approx. 70%reduction*2
CO2 emissions-reduction effect
Approx. 65%reduction*3
*1 An IC that converts high voltage into low voltage*2 Calculated based on 2007 actual shipping
results of previous similar product (power consumption-emission factor: 0.000407t CO2/kWh)
*3 Compared to our previous IC*4 Microampere ---- One-millionth of an ampere
Conversion efficiency-load current characteristics
Point 1Power consumption when used was reduced 3%*3 by raising the voltage conversion efficiency
Point 2Power consumption when idle was brought to 0 A*4 through creative circuit design
Point 2Halving power loss of cross converter
Digital camera power management IC
*1 Function for raising/lowering voltage*2 Compared to our previous products
Ultra-mobile PC power management IC
*1 Circuit that converts direct-current voltage to a different voltage
*2 Comparison with power consumed when used with the previous UMPC power supply’s substrate area
*3 Comparison with UMPC using single power IC, without using MB39C308
Discrete FRAM memory IC
CO2 emissions
Conversion efficiency (%)
Load current (A)
MB39A116AMB39A136Board miniaturization image
Small form-factor chips for digital cameras
Device design concept is to improve memory performance with low
power consumption considering the reduction of environmental
burden. Since the 64-bit data bus width enables high data bandwidth
at a relatively low operating frequency, termination resistors are not
required. Therefore, this product contributes I/O power saving in
systems level. This 256Mbit FCRAM provides the highest bandwidth
which I've ever evaluated.
The most difficult problem in product evaluation was how to minimize
the variation of setup timing and hold timing of data input and output to
meet the target timing specs. We took as much date as possible to find
the root cause of timing variation and gave feedback the evaluation result
to circuit design team. Finally when we
confirmed the revised circuit design met the
target specs, we got a great sense of accom-
plishment.
We continue to work to meet more difficult
target specs to realize the higher-performance
and lower-power memory products.
The strength of FRAM is that it is a "green" memory. Power is
saved because it can complete write processes in a short time.
Customers can extend the battery life of their products by using
FRAM; so perhaps it would be better called "power-saving
memory."
Every day we consider how we can design FRAM that saves even
more power and how we can reduce the environmental impact,
including in the memory manufacturing process. We also work to
create designs that will open up new applications to our customers.
We shall continue to develop new FRAM with an even smaller
environmental impact. This should allow us both to make life easier
and to hand down the beauty of nature
forever. Please enjoy our FRAM green
memory.
The market for light, easy-to-carry, ultra-mobile PCs is expanding. We
developed the MB39C308 as the power source for the high-efficiency
platform demanded in ultra-mobile PCs.
In development, we wracked our brains to work out how we could
simultaneously achieve miniaturization, higher efficiency, and lower cost
in a power system through which a large current (several amperes)
would flow through multiple channels. After much discussion, we
concluded that the best solution was single conversion - converting six
channels' voltage with one chip.
To do this, we developed an FBGA package capable of low-heat
resistance, and used LDMOS technology to achieve low-temperature
resistance. We also built into the product a
high-performance switching FET that could
drive even at high current.
The result, compared to the previous single
power IC, the mounting footprint has shrunk to
1/3, and the conversion efficiency in total has
increased to over 90% in actual use.
[MB39C309 ]Super Green Product Super Green Product
Consumer FCRAM[MB81EDS256545 ][MB85R2001/2,MB85R1001/2,
MB85R256H,MB85R256S ]
[MB39C308 ]Super Green Product
Environmental features
*1 A type of DRAM (dynamic random access memory); the present mainstream DRAM*2 Compared to two DDR2 SDRAMs with equivalent bandwidth*3 Calculated assuming FCRAM used for 20% of digital TV's worldwide shipments in 2008 (estimated)*4 Compared to conventional on-board solution using two DDR2 SDRAMs
*1 Material whose internal electric polarity changes when voltage is added*2 Battery backup SRAM; saves SRAM data using battery power*3 Comparison with 50% writing and 50% reading
Point 170% reduction in power consumption and CO2 emission (19,264t-CO2 annually*3)
Point 2SiP solution minimizes the number of PCB layers and PCB mounting space*4
Environmental features
Point 1Shrinking of power circuit substrate area
Point 265% reduction in CO2 emissions by not needing a battery
Environmental features
Point 138% reduction in chip area by highly integrated ICs
Environmental features
Point 24% reduction in power consumption from increase in power supply efficiency*2
Point 166% power substrate area reduction, 69% weight reduction*3
Environmental features
CO2 emissions-reduction effect
Approx. 4%reduction*2
256 Mbit FCRAM development teamShinichiro Suzuki (FCRAM Design & Characterization Dept. ASSP Business Unit, Infotainment Solution Div.)
Ultra-mobile PC power management IC MB39C308 development teamAtsushi Tsurumaru (Analog Products Marketing & Application Eng. Dept. Analog Product Division)
Super Green Product
FRAM development teamKathy Shieh(FRAM Product Design Dept. Security & Ecology Business Div.)
Green Business Process & Green Products Guide 14 Fujitsu Microelectronics Limited 15
The problems of oil energy depletion and the acceleration of
global warming by CO2 from exhaust gas are getting serious,
increasing demand for lighter cars and more energy-efficient
car electronics. We have developed an "IDB1394" IC that
combines the physical and logic layers onto one chip with
Fujitsu Laboratories Limited's unique image compression
technology "SmartCODEC," allowing for fast transmission of
high-quality video and audio on one car LAN. We have also
developed controller ICs with the next-generation car network
protocol FlexRay to replace mechanical controls (such as oil
pressure) with electronic controls. Subsequently, automobile
harnesses* and electronic components can be reduced.
ICs with proprietary technology and next-generation technology reduce automobile components
The fast and stable next-generation wireless broadband
technology, "Mobile WiMAX"*1 is expected to be widely
incorporated into portable devices, such as PCs and portable
game devices. Mobile WiMAX terminal baseband ICs*2 need
to get smaller and reduce power consumption. We have used
65 nm generation CMOS process technology to reduce our
products' active power consumption by approximately 36%
and substrate area by approximately 45%.
65 nm generation CMOS process technology reduces power consumption 36% and chip substrate area 45%
Process technology, power management, and SiP* combine for low power consumption and miniaturized size
Handles security protocols with ultra-high-speed network processing and low power consumption.
ASSPProducts Category 5
Green P roduc t s A p p r o a c h 2
* Bundles of wires to operate an automobile's equipment
For automobiles
Controller ICs with FlexRay automobile network protocol
For imaging
Video and image processing ICs
*1 Mobile wireless standard conforming to IEEE802.16e-2005*2 ICs for communication processing in wireless networks
For communications
Baseband ICs for mobile WiMAX terminals
Ultra-high-speed security processors
For office devices
Video and image processing ICs are constantly expected
to process ever higher-quality video date. It is expected that
the scale of the circuits needed will expand drastically.
However, the needs for miniaturized packages and low
power consumption are also rising. We have applied 90 nm
and 65 nm process technology, while making great use of
our own power management techniques, to achieve low
power consumption. In addition, we have combined that with
SiP to make the package even more compact.
* System in Package, a technology for building systems with various semiconductor devices such as logic ICs and memory all included in one package
Corporate LANS and the Internet now need a security
protocol like IPsec between their bases to guard data using
encryption, along with accelerated communication. Our
MB86C60 is a security processor that allows ultra-high-
speed network processing compatible with numerous
security protocols, including IPsec. With power consump-
tion of only 600 mW while operating, our security processor
brings full wire speed of 1 Gbps in both directions regard-
less of packet length.
Green Business Process & Green Products Guide 16 Fujitsu Microelectronics Limited 17
Iwate Plant
Green Power Certificate
Award ceremony
PET bottle cap collection promotion posters
In February 2008, the Iwate Plant received the Excellence
Award at the "2007 PRTR* Awards." Held by the Center for
Environmental Information Science, the PRTR Awards serve to
honor companies that take proactive steps in chemical
management and risk communication.
The Iwate Plant was highly praised for reducing chemical use
and waste in manufacturing through the use of the Fujitsu
Group's unique index as part of its green process activities, as
well as for an initiative to explain to local residents what the
plant was doing for the environment.
Iwate Plant wins Excellence Award at "2007 PRTR Awards"
The head office of Fujitsu Microelectronics Europe GmbH
(FME), a design and sales company based in Germany, has been
purchasing green power* with a low environmental impact since
January 2008. They explained: "We want to contribute to the
protection of the environment, for the sake of future genera-
tions." FME is purchasing hydroelectric power from Norway. This
move away from dependence on fossil fuels reduces annual
emissions by 467 tons of CO2.
Germany-based Fujitsu Microelectronics Europe GmbH purchases green power
* Power generated by natural energy such as wind, water, or sunlight
In December 2007, our Chinese subsidiary, Fujitsu
Microelectronics (Shanghai) Co. Ltd., entered the ultra-mobile
PC power IC MB39C308 (see page 14) into the "3rd China
Power Product Design Contest." The IC, which was praised for
its miniaturization and power supply efficiency, won the
"Structural Design First Prize" in the digital product design
solution category. It was a national contest held by the power
specialist committee of the public industrial organization China
Information Industry Department together with the China
Electronic Commerce Chamber and the Beijing Municipal Power
Product Consortium.
Ultra-mobile PC power management IC MB39C308 wins "Structural Design First Prize" at "China Power Product Design Contest"
The Fujitsu Microelectronics Group collects PET bottle caps
and uses the profits earned from recycling to advance our
project for providing vaccines to the children around the world.
Many lives are saved by preventative inoculation of children
who lack adequate medical care.
Recycling caps also means reducing the CO2 emitted in
disposal by burning. Our Group plans to continue expanding
the scope of this project.
The Iwate, Aizu-Wakamatsu, and Mie Plants awarded Director General Prize of Agency of Natural Resources and Energy, and Director General Prize of Regional Bureau of Economy, Trade and Industry
We collect PET bottle caps to fund vaccines for the children of the world
We reduce emissions of PFC gases, which have high global warming potential
The Iwate, Aizu-Wakamatsu, and Mie Plants, receiving praise
for their comprehensive energy efficiency improvements, were
honored as plants of outstanding energy management in the
years 2005 to 2007.
PFC gases, used in cleaning and etching during semiconduc-
tor manufacture, are greenhouse gases, and their global warm-
ing potential is said to be approximately 10,000 times that of
CO2. With assistance from NEDO*, we plan to set up PFC gas
processing equipment to render the gas harmless at the Mie
and Aizu-Wakamatsu plants, as well as to promote the use of
alternatives to PFC.
Also, with assistance from NEDO, we have decided to increase
energy efficiency in the Aizu-Wakamatsu Plant through the
introduction of energy-saving equipment such as high-efficiency
turbo freezers and miniature once-through boilers.
Plant Award
Iwate Plant
Director General Prize of Agency of Natural Resources and Energy for FY 2005 (Thermal Category*)
Director General Prize of Tohoku Bureau of Economy, Trade and Industry for FY 2005 (Electric Category*)
*The thermal and electric categories were merged in FY 2006.
Director General Prize of Agency of Natural Resources and Energy for FY 2006
Director General Prize of Chubu Bureau of Economy, Trade and Industry for FY 2007
Aizu-Wakamatsu Plant
Mie Plant
T o p i c s
* PRTR: Pollutant Release and Transfer Registers (a system for tabulating and publicizing emission rates of harmful chemicals into the environment)
* The New Energy and Industrial Technology Development organization, an independent administrative agency in Japan
Green Business Process & Green Products Guide 18 Fujitsu Microelectronics Limited 19
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