Digital Integrated Circuits · © Digital Integrated CircuitsEE141 2nd 4 Wires Wire Models...

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EE141 1© Digital Integrated Circuits2nd Wires

Digital Integrated Digital Integrated CircuitsCircuitsA Design PerspectiveA Design Perspective

The WireThe Wire

Jan M. RabaeyAnantha ChandrakasanBorivoje Nikolic

July 30, 2002

EE141 2© Digital Integrated Circuits2nd Wires

The WireThe Wire

transmitters receivers

schematics physical

EE141 3© Digital Integrated Circuits2nd Wires

Interconnect Impact on ChipInterconnect Impact on Chip

EE141 4© Digital Integrated Circuits2nd Wires

Wire ModelsWire Models

All-inclusive model Capacitance-only

EE141 5© Digital Integrated Circuits2nd Wires

Impact of Interconnect ParasiticsImpact of Interconnect Parasitics

Interconnect parasitics reduce reliability affect performance and power

consumption Classes of parasitics

Capacitive Resistive Inductive

EE141 6© Digital Integrated Circuits2nd Wires

10 100 1,000 10,000 100,000

Length (u)

No

of

net

s(L

og

Sc

ale)

Pentium Pro (R)

Pentium(R) II

Pentium (MMX)

Pentium (R)

Pentium (R) II

Nature of InterconnectNature of Interconnect

Local Interconnect

Global Interconnect

SLocal = STechnology

SGlobal = SDie

So

urc

e:

Inte

l

EE141 7© Digital Integrated Circuits2nd Wires

INTERCONNECTINTERCONNECT

EE141 8© Digital Integrated Circuits2nd Wires

Capacitance of Wire InterconnectCapacitance of Wire Interconnect

VDD VDD

VinVout

M1

M2

M3

M4Cdb2

Cdb1

Cgd12

Cw

Cg4

Cg3

Vout2

Fanout

Interconnect

VoutVin

CL

SimplifiedModel

EE141 9© Digital Integrated Circuits2nd Wires

Capacitance: The Parallel Plate ModelCapacitance: The Parallel Plate Model

Dielectric

Substrate

L

W

H

tdi

Electrical-field lines

Current flow

WLt

cdi

diint

ε=LL

Cwire SSS

SS

1=⋅

=

EE141 10© Digital Integrated Circuits2nd Wires

PermittivityPermittivity

EE141 11© Digital Integrated Circuits2nd Wires

Fringing CapacitanceFringing Capacitance

W - H/2H

+

(a)

(b)

EE141 12© Digital Integrated Circuits2nd Wires

Fringing versus Parallel PlateFringing versus Parallel Plate

(from [Bakoglu89])

EE141 13© Digital Integrated Circuits2nd Wires

Interwire CapacitanceInterwire Capacitance

fringing parallel

EE141 14© Digital Integrated Circuits2nd Wires

Impact of Interwire CapacitanceImpact of Interwire Capacitance

(from [Bakoglu89])

EE141 15© Digital Integrated Circuits2nd Wires

Wiring Capacitances (0.25 Wiring Capacitances (0.25 µµ m CMOS)m CMOS)

EE141 16© Digital Integrated Circuits2nd Wires

INTERCONNECTINTERCONNECT

EE141 17© Digital Integrated Circuits2nd Wires

Wire Resistance Wire Resistance

W

L

H

R = ρH W

L

Sheet ResistanceRo

R1 R2

EE141 18© Digital Integrated Circuits2nd Wires

Interconnect Resistance Interconnect Resistance

EE141 19© Digital Integrated Circuits2nd Wires

Dealing with ResistanceDealing with Resistance

Selective Technology Scaling Use Better Interconnect Materials

reduce average wire-length e.g. copper, silicides

More Interconnect Layers reduce average wire-length

EE141 20© Digital Integrated Circuits2nd Wires

Polycide Gate MOSFETPolycide Gate MOSFET

n+n+

SiO2

PolySilicon

Silicide

p

Silicides: WSi 2, TiSi 2, PtSi 2 and TaSi

Conductivity: 8-10 times better than Poly

EE141 21© Digital Integrated Circuits2nd Wires

Sheet ResistanceSheet Resistance

EE141 22© Digital Integrated Circuits2nd Wires

Modern InterconnectModern Interconnect

EE141 23© Digital Integrated Circuits2nd Wires

Example: Intel 0.25 micron ProcessExample: Intel 0.25 micron Process

5 metal layersTi/Al - Cu/Ti/TiNPolysilicon dielectric

EE141 24© Digital Integrated Circuits2nd Wires

INTERCONNECTINTERCONNECT

EE141 25© Digital Integrated Circuits2nd Wires

InterconnectInterconnectModelingModeling

EE141 26© Digital Integrated Circuits2nd Wires

The Lumped ModelThe Lumped Model

Vout

Driver

cwire

V i nC l u m p e d

R d r i v e rV o u t

EE141 27© Digital Integrated Circuits2nd Wires

The Lumped RC-ModelThe Lumped RC-ModelThe Elmore DelayThe Elmore Delay

EE141 28© Digital Integrated Circuits2nd Wires

The Ellmore DelayThe Ellmore DelayRC ChainRC Chain

EE141 29© Digital Integrated Circuits2nd Wires

Wire ModelWire Model

Assume: Wire modeled by N equal-length segments

For large values of N:

EE141 30© Digital Integrated Circuits2nd Wires

The Distributed RC-lineThe Distributed RC-line

EE141 31© Digital Integrated Circuits2nd Wires

Step-response of RC wire as a Step-response of RC wire as a function of time and spacefunction of time and space

0 0 .5 1 1 .5 2 2 .5 3 3 .5 4 4 .5 50

0 .5

1

1 .5

2

2 .5

tim e (n se c)

volta

ge (V

)

x = L /1 0

x = L /4

x = L /2

x= L

EE141 32© Digital Integrated Circuits2nd Wires

RC-ModelsRC-Models

EE141 33© Digital Integrated Circuits2nd Wires

Driving an RC-lineDriving an RC-line

V i n

R s V o u t

(rw,cw,L)

EE141 34© Digital Integrated Circuits2nd Wires

Design Rules of ThumbDesign Rules of Thumb

rc delays should only be considered when tpRC >> tpgate of the driving gate

Lcrit >> √ tpgate/0.38rc rc delays should only be considered when the

rise (fall) time at the line input is smaller than RC, the rise (fall) time of the line

trise < RC when not met, the change in the signal is slower

than the propagation delay of the wire

© MJIrwin, PSU, 2000

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