Rune Domsten, Domsten.dk og 3D Visionlab

EMBEDDED SYSTEMS FUTURE TRENDS

Rune Domsten May 22 2013

3D visionlab and Domsten.dk

About. Rune Domsten

Domsten.dk: Innova;on, Technology and Management

-‐ Electronics and Systems -‐ XS to XXL -‐ User understanding and user processes -‐ Sales and marke;ng of complex products

3D Visonlab:

-‐ 3D technology for smartphones and…… 3D visionlab and Domsten.dk


Trends in Embedded systems and connec@vity

-‐  Performance of electronics increases by 2X per 18 month or -‐  Cost decreases by 25% per 18 month per MIPS -‐  From single core to mul@ core -‐  ‘’Standard’’ speed is now 1GHz+ for mid range embedded CPU’s -‐  Addi@onal GPU’s is becoming standard in processor chips. -‐  100-‐500 MHz is normal in ‘’small’’ 32 bit controllers. -‐  Ethernet is standard. Wlan will soon be. -‐  FPGA’s has most advantage of comming sub-‐micron technologies -‐  FPGA’s also contains mul@ core ARM CPU’s

-‐  Linux/android system contains drivers for nearly all interfaces -‐ 5G is ready for 500.000.000 ac@ve devices in 2020.

Nyt miljø


A typical embedded system in the future

Today: one vacuum cleaner -‐ no coordina;on

Nye kolleger


Or is it the opposite way


The embedded system – is embedded in the network and Internet

Embedded real-‐;me Sensor interface

Cameras Actuators

-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐ Real-‐;me processing

Security, safety Stand alone func;ons Communica;ons

-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐ Processing power

op;ons CPU’s, FPGA, GPU,

DSP

Near by Server system CO-‐ processors

Back-‐up redundancy

-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐ Device coordina;on Process op;miza;on Processing power Real ;me System

model -‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐ Processing power CPU’s, FPGA, GPU,

DSP

Cloud Server system Addi;onal CO-‐ processors

Back-‐up Redundancy

-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐ Big data calcula;ons

Algorithm op;miza;on Test runs on historic data -‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐-‐

Processing power

CPU’s, FPGA, GPU, DSP


Quad 1GHz ARM GPU 1GB DDR3Ram 128 MB Flash SD card HDMI*2 etc. Linux, Android…

Dual 1GHz ARM FPGA area 1GB DDR3Ram 512 MB Flash Gigabit interfaces XX mill gates for Logic Linux, Android…

State of the art CPU/FPGA modules

68*31 mm www.karo-‐electronics.de www.enclustra.com


Rasberry Pi – Embedded Linux for everybody


FPGA+2xARM one chip – ext. DDR memory


XS – Credit card with FPGA technology

Source: Prevas and Memetech


XXL – 3D ultrasound scanner -‐ 320 FPGA’s – 64 boards

Source: DTU/CFU


The problems of the future……………………….